CN219618512U - 3D printer with ejection of compact cooling structure - Google Patents

Abstract

The utility model discloses a D printer with a discharging cooling structure, which comprises a water tank and an air blower, wherein a semiconductor refrigerating sheet is arranged on the surface of the water tank, a plurality of groups of guide plates are arranged in the water tank, an exhaust pipe is arranged on the upper surface of the water tank, the air blower is arranged on the surface of the water tank, an extension pipe inserted into the water tank is arranged at an air outlet of the air blower, an elastic cover is sleeved at the lower end of the extension pipe, a plurality of groups of air injection holes are arranged on the surface of the elastic cover, the semiconductor refrigerating sheet supports and reduces the temperature of the water tank and water, the air blower introduces air into the water tank, under the action of the elastic cover, the air enters the water in the form of small bubbles, the contact area with the water is large, the air temperature is reduced, the cooling effect on printing materials sprayed out of nozzles is good, the cooling efficiency of the printing materials is not influenced by the environmental temperature, the rapid solidification of the printing materials is ensured, the problem of the flow of the printing materials is avoided, and the quality of the finished product of the 3D printer is improved.

Description

3D printer with ejection of compact cooling structure

Technical Field

The utility model relates to the technical field of 3D printers, in particular to a 3D printer with a discharging cooling structure.

Background

At present, a 3D printer is used for extruding a printing material after heating and melting, and corresponding plastic parts are printed according to a preset model, so that a cooling structure is required to be added for the 3D printer in order to cool and solidify the melted printing material as soon as possible to form the plastic parts.

In the related art, the fan and the air guide pipe can be adopted and are arranged on the printing head of the 3D printer, so that the air guide pipe is aligned to the discharging part of the printing head, the discharged printing material is rapidly solidified, and deformation of the printed plastic part is avoided.

However, the cooling mode of the fan accelerating the air flow is easily affected by the ambient temperature, and when the ambient temperature increases, the cooling effect on the printing material is greatly reduced, and the printing material can leave waves on the surface of the plastic part because the cooling speed cannot be kept up.

Disclosure of Invention

The utility model aims to provide a 3D printer with a discharging cooling structure, so as to solve the problems in the background art.

In order to achieve the above purpose, the present utility model provides the following technical solutions: the 3D printer with the discharging cooling structure comprises a shell, wherein a nozzle is arranged in the shell and penetrates through the shell;

the water tank is arranged on the side surface of the shell, the surface of the water tank is provided with a semiconductor refrigerating sheet, a plurality of groups of guide plates are arranged in the water tank, the upper surface of the water tank is provided with an exhaust pipe, and the exhaust pipe is bent and aligned to the discharge position of the nozzle;

the air blower, the water tank surface is arranged in to the air blower, the air outlet of air blower is equipped with the extension pipe of intubate water tank inside, the cover of extension pipe lower extreme cover has the elasticity cover, elasticity cover surface is equipped with a plurality of groups fumaroles, and elasticity cover makes the fumaroles be closed state, and when the elasticity cover was strutted by the air, the fumaroles were open state.

Further, the vacuum insulation board is installed on the left side face of the shell, the water tank is fixedly connected with the vacuum insulation board, the inside of the vacuum insulation board is of a hollow structure, heat of the shell is prevented from being transferred to the water tank, the upper surface and the lower surface of the water tank are respectively provided with a water inlet and a water outlet, and the water inlet and the water outlet are both provided with sealing covers.

Further, the inner wall of the left side of the water tank is provided with a plurality of groups of heat exchange plates, and the heat exchange plates are positioned on the right side of the semiconductor refrigerating plate, so that the semiconductor refrigerating plate is beneficial to quickly reducing the water temperature.

Furthermore, the surface of the semiconductor refrigerating sheet is provided with a fan, so that the refrigerating effect of the semiconductor refrigerating sheet is kept stable.

Further, the guide plates are connected to the inner wall of the water tank in a layered mode, so that the upward flowing path of air is prolonged, the air is fully contacted with water, a partition plate is arranged between the two groups of guide plates, and a plurality of groups of through holes are formed in the surface of the partition plate, so that bubbles are smaller.

Further, the surface of the extension pipe is provided with a spherical shell, the spherical shell is covered outside the elastic cover to prevent the elastic cover from being broken, and the surface of the spherical shell is provided with a round hole.

Compared with the prior art, the utility model has the beneficial effects that: according to the utility model, the water is filled in the water tank, the semiconductor refrigerating sheet is used for supporting and reducing the temperature of the water tank and the water, the air is introduced into the water tank by the air blower, the air enters the water in the form of small bubbles under the action of the elastic cover, the contact area with the water is large, then the air flow is guided by the guide plate, the contact time of the air and the water is prolonged, the air temperature is reduced, and the cooling effect on printing materials sprayed out of the nozzle is good;

the air temperature is reduced in an active refrigeration mode, the cooling efficiency of the printing material is not affected by the ambient temperature, the rapid solidification of the printing material is ensured, the problem of flowing of the printing material is avoided, and the quality of a finished product of the 3D printer is improved.

Drawings

FIG. 1 is a schematic view of the connection of a housing to a tank of the present utility model;

FIG. 2 is a cross-sectional view of the water tank of the present utility model;

fig. 3 is a schematic structural view of the connection between the spherical shell and the elastic cover.

In the figure: 1. a housing; 2. a nozzle; 3. vacuum insulation panels; 4. a water tank; 5. a semiconductor refrigeration sheet; 6. a fan; 7. a blower; 8. an exhaust pipe; 9. a water inlet; 10. a water outlet; 11. a heat exchange plate; 12. a deflector; 13. a spherical shell; 14. a round hole; 15. an extension tube; 16. an elastic cover; 17. a gas injection hole; 18. a partition plate; 19. and a through hole.

Detailed Description

The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.

Referring to fig. 1-3, the present utility model provides a technical solution: the 3D printer with the discharging cooling structure comprises a shell 1, wherein a nozzle 2 is arranged in the shell 1;

the water tank 4 is arranged on the side surface of the shell 1, the water tank 4 is filled with water, the semiconductor refrigerating sheet 5 is arranged on the surface of the water tank 4 to reduce the water temperature, a plurality of groups of guide plates 12 are arranged in the water tank 4, the exhaust pipe 8 is arranged on the upper surface of the water tank 4, and the exhaust pipe 8 cools the melted printing material;

the air blower 7, the air blower 7 is arranged on the surface of the water tank 4, the air outlet of the air blower 7 is provided with an extension pipe 15 inserted into the water tank 4, the air blower 7 sends air into the water tank 4, the lower end of the extension pipe 15 is sleeved with an elastic cover 16, the surface of the elastic cover 16 is provided with a plurality of groups of air spraying holes 17, and the air spraying holes 17 enable the air to be in contact with water in a small bubble mode, so that the contact area is large.

As shown in fig. 1, the left side of the housing 1 is provided with a vacuum insulation board 3, the water tank 4 is fixedly connected with the vacuum insulation board 3, the vacuum insulation board 3 is internally vacuumized to block the housing 1 and the water tank 4 from heat exchange, the upper surface and the lower surface of the water tank 4 are respectively provided with a water inlet 9 and a water outlet 10, and the water outlet 10 is used for discharging water in the water tank 4.

As shown in fig. 2, the inner wall of the left side of the water tank 4 is provided with a plurality of groups of heat exchange plates 11, and the heat exchange plates 11 are positioned on the right side of the semiconductor refrigerating plate 5, so that the semiconductor refrigerating plate 5 is beneficial to reducing the water temperature.

The surface of the semiconductor refrigerating sheet 5 is provided with a fan 6, so that a cooling effect is provided for the semiconductor refrigerating sheet 5, and the semiconductor refrigerating sheet 5 has a better refrigerating effect.

As shown in FIG. 2, the baffle plates 12 are connected to the inner wall of the water tank 4 in a layered manner, so that air is prevented from flowing upwards directly, the contact time of water is long, a partition plate 18 is arranged between two groups of baffle plates 12, a plurality of groups of through holes 19 are formed in the surface of the partition plate 18, and the through holes 19 prevent air from forming large bubbles in water.

As shown in fig. 2, the surface of the extension pipe 15 is provided with a spherical shell 13, the spherical shell 13 is covered outside the elastic cover 16 to prevent the elastic cover 16 from expanding and cracking, and the surface of the spherical shell 13 is provided with a round hole 14.

Specifically, when in use, water is added into the water tank 4 through the water adding port 9, the temperature of the water tank 4 is reduced when the semiconductor refrigerating sheet 5 works, the water temperature is further reduced, the fan 6 dissipates heat for the semiconductor refrigerating sheet 5, the semiconductor refrigerating sheet 5 is kept in a high-efficiency refrigerating state, the air blower 7 sends air into the extension pipe 15, the air stretches the elastic cover 16, the air spraying holes 17 originally closed on the surface of the elastic cover 16 are opened, the air is introduced into the water in the form of small bubbles through the air spraying holes 17, the contact area between the air and low-temperature water is large, then the air flows along the channel formed by the guide plates 12, the contact time between the air and the water is long, the partition plates 18 between the adjacent guide plates 12 are provided with through holes 19, the large bubbles formed by the air flowing and converging in the water are extruded again through the through holes 19, the air is ensured to be cooled down by the water, the low-temperature air is blown to the discharging position of the nozzle 2 through the exhaust pipe 8, the printing material is cooled and solidified in time, and the quality of plastic pieces is improved.

Although embodiments of the present utility model have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made therein without departing from the principles and spirit of the utility model, the scope of which is defined in the appended claims and their equivalents.

Claims (6)

1. 3D printer with ejection of compact cooling structure, characterized in that includes:

a housing (1), wherein a nozzle (2) is installed inside the housing (1);

the water tank (4), the water tank (4) is arranged on the side face of the shell (1), the semiconductor refrigerating sheet (5) is arranged on the surface of the water tank (4), a plurality of groups of guide plates (12) are arranged in the water tank (4), and an exhaust pipe (8) is arranged on the upper surface of the water tank (4);

the water tank is characterized by comprising a blower (7), wherein the blower (7) is arranged on the surface of the water tank (4), an extension pipe (15) inserted into the water tank (4) is arranged at an air outlet of the blower (7), an elastic cover (16) is sleeved at the lower end of the extension pipe (15), and a plurality of groups of air spraying holes (17) are formed in the surface of the elastic cover (16).

2. A 3D printer with an outfeed cooling structure according to claim 1, wherein: the vacuum insulation board (3) is installed on the left side surface of the shell (1), the water tank (4) is fixedly connected with the vacuum insulation board (3), and water inlets (9) and water outlets (10) are respectively formed in the upper surface and the lower surface of the water tank (4).

3. A 3D printer with an outfeed cooling structure according to claim 1, wherein: the inner wall of the left side of the water tank (4) is provided with a plurality of groups of heat exchange plates (11), and the heat exchange plates (11) are positioned on the right side of the semiconductor refrigerating plate (5).

4. A 3D printer with an outfeed cooling structure according to claim 1, wherein: the surface of the semiconductor refrigerating sheet (5) is provided with a fan (6).

5. A 3D printer with an outfeed cooling structure according to claim 3, wherein: the guide plates (12) are connected to the inner wall of the water tank (4) in a layered mode, a partition plate (18) is arranged between two groups of the guide plates (12), and a plurality of groups of through holes (19) are formed in the surface of the partition plate (18).

6. A 3D printer with an outfeed cooling structure according to claim 1, wherein: the surface of the extension pipe (15) is provided with a spherical shell (13), the spherical shell (13) is covered outside the elastic cover (16), and the surface of the spherical shell (13) is provided with a round hole (14).