CN218111532U - Injection mold of hot melt adhesive spare for electronic product - Google Patents
Injection mold of hot melt adhesive spare for electronic product Download PDFInfo
- Publication number
- CN218111532U CN218111532U CN202221477776.9U CN202221477776U CN218111532U CN 218111532 U CN218111532 U CN 218111532U CN 202221477776 U CN202221477776 U CN 202221477776U CN 218111532 U CN218111532 U CN 218111532U
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- China
- Prior art keywords
- fixedly connected
- air
- hot melt
- melt adhesive
- box
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- 239000004831 Hot glue Substances 0.000 title claims abstract description 26
- 238000002347 injection Methods 0.000 title claims abstract description 23
- 239000007924 injection Substances 0.000 title claims abstract description 23
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 46
- 238000007664 blowing Methods 0.000 claims abstract description 28
- 238000001816 cooling Methods 0.000 claims abstract description 13
- 241000883990 Flabellum Species 0.000 claims abstract description 7
- 238000009434 installation Methods 0.000 claims abstract description 4
- 239000000428 dust Substances 0.000 claims description 8
- 239000007788 liquid Substances 0.000 claims description 5
- 239000004033 plastic Substances 0.000 claims description 5
- 229920003023 plastic Polymers 0.000 claims description 5
- 238000000465 moulding Methods 0.000 claims description 4
- 238000001914 filtration Methods 0.000 claims 2
- 230000000694 effects Effects 0.000 abstract description 9
- 230000008901 benefit Effects 0.000 abstract description 5
- 230000001737 promoting effect Effects 0.000 abstract description 3
- 238000001746 injection moulding Methods 0.000 description 3
- 239000007921 spray Substances 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 239000002826 coolant Substances 0.000 description 2
- 238000001704 evaporation Methods 0.000 description 2
- 230000008020 evaporation Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 230000004075 alteration Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 231100000252 nontoxic Toxicity 0.000 description 1
- 230000003000 nontoxic effect Effects 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 230000009967 tasteless effect Effects 0.000 description 1
- 238000009692 water atomization Methods 0.000 description 1
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- Moulds For Moulding Plastics Or The Like (AREA)
Abstract
The utility model discloses an injection mold of hot melt adhesive spare for electronic product, the power distribution box comprises a box body, fixedly connected with mesh plate between the both sides of inner chamber of the box body, the top fixedly connected with heat-conducting plate of mesh plate, the bottom fixedly connected with fin of heat-conducting plate, the bottom of fin runs through to the bottom of mesh plate, the top fixedly connected with lower mould of heat-conducting plate, the top of lower mould runs through to the outside of box, the top of lower mould is provided with the mould, the fixed frame of rear side fixedly connected with at box top. The utility model discloses a set up mesh board, heat-conducting plate, fin, air-blowing board, fan, water tank, water pump, atomizer, air-blowing shell, cooling tube, installation piece, motor and flabellum, it is poor to have solved the injection mold radiating effect of current hot melt adhesive spare for the electronic product, problem long consuming time, this injection mold of hot melt adhesive spare for the electronic product possesses the good advantage of radiating effect, is worth promoting.
Description
Technical Field
The utility model relates to a hot melt adhesive spare production technical field specifically is an injection mold of hot melt adhesive spare for electronic product.
Background
The hot melt adhesive is a plastic adhesive, the physical state of the hot melt adhesive changes along with the temperature change in a certain temperature range, the chemical property is unchanged, the hot melt adhesive is non-toxic and tasteless, the hot melt adhesive belongs to an environment-friendly chemical product, and the hot melt adhesive is popular due to the advantages of convenience in packaging, transportation, storage, simple production process, high adhesive strength, high speed and the like.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide an injection mold of hot melt adhesive spare for electronic product possesses the good advantage of radiating effect, and it is poor to have solved the injection mold radiating effect of current hot melt adhesive spare for electronic product, problem long consuming time.
In order to achieve the above purpose, the utility model provides a following technical scheme: the utility model provides an injection mold of hot melt adhesive spare for electronic product, includes the box, fixedly connected with mesh plate between the both sides of box inner chamber, the top fixedly connected with heat-conducting plate of mesh plate, the bottom fixedly connected with fin of heat-conducting plate, the bottom of fin runs through to the bottom of mesh plate, the top fixedly connected with lower mould of heat-conducting plate, the top of lower mould runs through to the outside of box, the top of lower mould is provided with the mould, the fixed frame of rear side fixedly connected with at box top, the equal fixedly connected with cylinder in both sides at fixed frame top, the bottom of cylinder output run through fixed frame and with last mould fixed connection, the equal fixedly connected with blowing board in both sides at box top, the equal fixedly connected with fan in one side opposite of two blowing boards, the air outlet and the blowing board intercommunication at fan top, the bottom fixedly connected with water tank of box, the bottom fixedly connected with water pump of water tank inner chamber, the delivery port at top runs through the box and has atomizer, the bottom of box both sides all is provided with the blowing shell, and the one side that two blowing shells are relative runs through to the box inner chamber, there is the cooling pipe at the top of blowing shell, the equal fixedly connected with motor output of fixed connection with the motor piece, and the top of two fixed connection with the motor is all installed.
Preferably, one side of the motor, which is far away from the fan blades, is provided with a dust filter plate, and the top and the bottom of the dust filter plate are fixedly connected with the inner wall of the blowing shell.
Preferably, the bottom of the water tank is fixedly connected with a supporting plate, the left side of the water tank is communicated with a water injection pipe, and the bottom of the front surface of the box body is communicated with a water discharge pipe.
Preferably, the left side of the water pump is communicated with a water suction pipe, the bottom of the fan is communicated with an air inlet pipe, and the top of the box body is provided with an opening matched with the lower die for use.
Preferably, the top intercommunication of going up the mould has the pipe of moulding plastics, and the top of moulding plastics the pipe runs through to the outside of fixed frame, the top of box both sides all communicates with the exhaust pipe.
Preferably, a liquid level observation window is arranged on the left side of the front surface of the water tank, and a control panel is arranged on the top of the front surface of the tank body.
Compared with the prior art, the beneficial effects of the utility model are as follows:
1. the utility model discloses a set up mesh board, heat-conducting plate, fin, air-blowing board, fan, water tank, water pump, atomizer, air-blowing shell, cooling tube, installation piece, motor and flabellum, it is poor to have solved the injection mold radiating effect of current hot melt adhesive spare for the electronic product, problem long consuming time, this injection mold of hot melt adhesive spare for the electronic product possesses the good advantage of radiating effect, is worth promoting.
2. The utility model discloses a set up heat-conducting plate and fin, can derive the heat in the lower mould, through setting up the cylinder, can with the use height of fixed frame cooperation control mould, through setting up board and fan of blowing, can blow off the cooling air to the upper mould, through setting up water pump and atomizer, can spray the coolant liquid in the water tank to the fin surface, through setting up the dirt board of straining, can filter the dust in the air, through setting up the exhaust pipe, can be with the hot-blast discharge in the box, through setting up motor and flabellum, can blow off the cooling air to the fin.
Drawings
FIG. 1 is a schematic structural view of the present invention;
FIG. 2 is a front view of the structure of the present invention;
fig. 3 is a partially enlarged view of a in fig. 1 according to the present invention.
In the figure: 1. a box body; 2. a mesh plate; 3. a heat conducting plate; 4. a heat sink; 5. a lower die; 6. an upper die; 7. a fixing frame; 8. a cylinder; 9. a blowing plate; 10. a fan; 11. a water tank; 12. a water pump; 13. an atomizing spray head; 14. blowing the shell; 15. a cooling pipe; 16. mounting blocks; 17. a motor; 18. a fan blade; 19. a dust filter plate; 20. a support plate; 21. an exhaust duct; 22. a water injection pipe.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts all belong to the protection scope of the present invention.
Referring to fig. 1-3, an injection mold for a hot melt adhesive part for an electronic product comprises a box body 1, a mesh plate 2 is fixedly connected between two sides of an inner cavity of the box body 1, a heat conducting plate 3 is fixedly connected to the top of the mesh plate 2, a heat radiating fin 4 is fixedly connected to the bottom of the heat conducting plate 3, the bottom of the heat radiating fin 4 penetrates to the bottom of the mesh plate 2, a lower die 5 is fixedly connected to the top of the heat conducting plate 3, the top of the lower die 5 penetrates to the outer side of the box body 1, an upper die 6 is arranged on the top of the lower die 5, a fixing frame 7 is fixedly connected to the rear side of the top of the box body 1, air cylinders 8 are fixedly connected to two sides of the top of the fixing frame 7, the bottom of the output end of the air cylinders 8 penetrates through the fixing frame 6, air blowing plates 9 are fixedly connected to two sides of the top of the box body 1, a blower 10 is fixedly connected to the air blowing plate 9, a water tank 11 is fixedly connected to the bottom of the inner cavity of the box body 1, a water pump 12 is fixedly connected to the water tank 14, a water tank 14 is connected to a water filter block 16 connected to the inner cavity of the air blowing plate, and a water tank 14 is connected to the inner wall of the water tank 14, the bottom of the front surface of the box body 1 is communicated with a drain pipe, the left side of the water pump 12 is communicated with a water suction pipe, the bottom of the fan 10 is communicated with an air inlet pipe, the top of the box body 1 is provided with an opening matched with the lower die 5 for use, the top of the upper die 6 is communicated with an injection molding pipe, the top of the injection molding pipe penetrates to the outer side of the fixed frame 7, the tops of the two sides of the box body 1 are communicated with exhaust pipes 21, the left side of the front surface of the water tank 11 is provided with a liquid level observation window, the top of the front surface of the box body 1 is provided with a control panel, heat in the lower die 5 can be led out by arranging a heat conduction plate 3 and a radiating fin 4, the air cylinder 8 can be matched with the fixed frame 7 to control the use height of the upper die 6, the air blowing plate 9 and the fan 10 are arranged to blow cooling air to the upper die 6, and the water pump 12 and the atomizing nozzle 13 are arranged, can spray the coolant liquid in the water tank 11 to fin 4 surface, through setting up dust filter 19, can filter the dust in the air, through setting up exhaust pipe 21, can be with the hot-blast discharge in the box 1, through setting up motor 17 and flabellum 18, can blow off the cooling air to fin 4, through setting up mesh plate 2, heat-conducting plate 3, fin 4, blow out board 9, fan 10, water tank 11, water pump 12, atomizer 13, blow out shell 14, cooling tube 15, mounting block 16, motor 17 and flabellum 18, the injection mold radiating effect that has solved current hot melt adhesive spare for the electronic product is poor, problem long when consuming time, this injection mold of hot melt adhesive spare for electronic product, possess the advantage that the radiating effect is good, be worth promoting.
During the use, pour into the raw materials into to last mould 6 and lower mould 5 through the injection molding pipe, open fan 10 afterwards, fan 10 carries outside air to blowing board 9, blowing board 9 blows wind to last mould 6, make and go up mould 6 rapid cooling, lower mould 5 derives the heat to heat-conducting plate 3 and fin 4, open water pump 12 afterwards, water pump 12 cooperates with atomizer 13 and spouts the water atomization to fin 4, carry out the work of dispelling the heat to lower mould 5, open motor 17 simultaneously, motor 17 cooperates with flabellum 18 and carries outside air to blowing shell 14 in, cooling air spouts to fin 4 through cooling tube 15 afterwards, make the water rapid evaporation on fin 4 surface, the heat is taken away in the evaporation of moisture, hot-blast box 1 of discharging through exhaust pipe 21, through the air that flows fast, make the temperature of lower mould 5 reduce, increase the radiating effect.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (6)
1. The utility model provides an injection mold of hot melt adhesive spare for electronic product, includes box (1), its characterized in that: the box is characterized in that a mesh plate (2) is fixedly connected between two sides of an inner cavity of the box body (1), a heat-conducting plate (3) is fixedly connected to the top of the mesh plate (2), radiating fins (4) are fixedly connected to the bottom of the heat-conducting plate (3), the bottom of the radiating fins (4) penetrates through the bottom of the mesh plate (2), a lower die (5) is fixedly connected to the top of the heat-conducting plate (3), the top of the lower die (5) penetrates through the outer side of the box body (1), an upper die (6) is arranged at the top of the lower die (5), a fixed frame (7) is fixedly connected to the rear side of the top of the box body (1), air cylinders (8) are fixedly connected to the two sides of the top of the fixed frame (7), the bottom of the output end of each air cylinder (8) penetrates through the fixed frame (7) and is fixedly connected with the upper die (6), an air blowing plate (9) is fixedly connected to the two sides of the top of the box body (1), a fan (10) is fixedly connected to one side opposite to the two air blowing plates (9), an air outlet of the top of the air fan (10) is communicated with an air outlet (9), a water tank (11) is fixedly connected with a water pump (12) and an atomizing water tank (12) penetrates through the top of the water tank (1), the bottom of box (1) both sides all is provided with air-blowing shell (14), and two air-blowing shell (14) relative one sides all run through to box (1) inner chamber, the top intercommunication of air-blowing shell (14) has cooling tube (15), the equal fixedly connected with installation piece (16) in top and bottom of air-blowing shell (14) inner chamber, fixedly connected with motor (17) between two installation pieces (16), the equal fixedly connected with flabellum (18) of output of two relative one sides of motor (17).
2. The injection mold of the hot melt adhesive member for the electronic product as claimed in claim 1, wherein: one side of the motor (17) far away from the fan blades (18) is provided with a dust filtering plate (19), and the top and the bottom of the dust filtering plate (19) are fixedly connected with the inner wall of the blowing shell (14).
3. The injection mold of the hot melt adhesive member for the electronic product as claimed in claim 1, wherein: the bottom fixedly connected with backup pad (20) of water tank (11), the left side intercommunication of water tank (11) has water injection pipe (22), the bottom intercommunication on box (1) positive surface has the drain pipe.
4. The injection mold of the hot melt adhesive member for the electronic product as claimed in claim 1, wherein: the left side of the water pump (12) is communicated with a water suction pipe, the bottom of the fan (10) is communicated with an air inlet pipe, and the top of the box body (1) is provided with an opening matched with the lower die (5) for use.
5. The injection mold of the hot melt adhesive member for the electronic product as claimed in claim 1, wherein: the top intercommunication of going up mould (6) has the pipe of moulding plastics, and the top of moulding plastics the pipe runs through to the outside of fixed frame (7), the top of box (1) both sides all communicates exhaust pipe (21).
6. The injection mold of the hot melt adhesive member for the electronic product as claimed in claim 1, wherein: the left side of the front surface of the water tank (11) is provided with a liquid level observation window, and the top of the front surface of the tank body (1) is provided with a control panel.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221477776.9U CN218111532U (en) | 2022-06-14 | 2022-06-14 | Injection mold of hot melt adhesive spare for electronic product |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221477776.9U CN218111532U (en) | 2022-06-14 | 2022-06-14 | Injection mold of hot melt adhesive spare for electronic product |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN218111532U true CN218111532U (en) | 2022-12-23 |
Family
ID=84516503
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202221477776.9U Active CN218111532U (en) | 2022-06-14 | 2022-06-14 | Injection mold of hot melt adhesive spare for electronic product |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN218111532U (en) |
-
2022
- 2022-06-14 CN CN202221477776.9U patent/CN218111532U/en active Active
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| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |