CN219617226U

CN219617226U - Vacuum adsorption workbench

Info

Publication number: CN219617226U
Application number: CN202320518595.4U
Authority: CN
Inventors: 李金龙; 吴后强
Original assignee: Youguang Intelligent Semiconductor Technology Shenzhen Co ltd
Current assignee: Youguang Intelligent Semiconductor Technology Shenzhen Co ltd
Priority date: 2023-03-07
Filing date: 2023-03-07
Publication date: 2023-09-01
Anticipated expiration: 2033-03-07

Abstract

The utility model relates to a vacuum adsorption workbench, which belongs to the field of chip automatic processing and is mainly applied to enabling an adsorption area to be self-adaptive to the chip area, and comprises a shell base with a vacuum cavity and a gas through pipe which is arranged on the shell base and is used for communicating a vacuum pump, wherein the shell base is provided with a plurality of through holes which can be communicated with the vacuum cavity, and each through hole is connected with a gas control valve which is selectively communicated with the vacuum cavity; the pneumatic control valve comprises an atmospheric positive pressure section communicated with the through hole, a vacuum negative pressure section communicated with the vacuum cavity and an elastic opening and closing piece arranged between the atmospheric positive pressure section and the vacuum negative pressure section, and the diameter of the vacuum negative pressure section is smaller than that of the atmospheric positive pressure section; when the negative pressure is absorbed, the elastic opening and closing piece blocks the vacuum negative pressure section under the action of pressure difference, so that a tool is not required to cover redundant through holes during money exchange, and money exchange operation of chips with multiple sizes is facilitated.

Description

Vacuum adsorption workbench

Technical Field

The utility model relates to the field of chip automatic processing, in particular to a vacuum adsorption workbench.

Background

In the field of automatic processing of semiconductor chips, a vacuum adsorption workbench is often used for carrying out vacuum adsorption on the chips so as to position the chips, the vacuum adsorption workbench in the related technical means comprises a shell base and a gas through pipe which is arranged on the shell base and is used for communicating a vacuum pump, a plurality of through holes are formed in the top wall of the shell base, the peripheral wall of the shell base and the bottom wall are enclosed to form a vacuum cavity which is used for uniformly distributing vacuum gas passing through the gas through pipe to the plurality of through holes, and the plurality of through holes are communicated with the vacuum cavity to form an adsorption air channel for adsorbing the chips. After the chip is placed on the adsorption table, the through holes are covered, so that the adsorption air passage forms a sealed state to adsorb the chip under negative pressure.

According to the related art means, when the surface area of the chip to be positioned cannot completely cover all the through holes, the redundant through holes must be covered with paper, film, tape, etc., so that there is a problem in that the multi-size chip money exchange operation is inconvenient.

Disclosure of Invention

In order to solve the problem that the related technical means cannot adapt to chips with various sizes due to the fact that the adsorption area is not suitable for the chip with various sizes, the utility model provides a vacuum adsorption workbench.

The utility model provides a vacuum adsorption workbench, which adopts the following technical scheme.

The vacuum adsorption workbench comprises a shell base with a vacuum cavity and a gas through pipe arranged on the shell base and used for communicating a vacuum pump, wherein a plurality of through holes capable of communicating the vacuum cavity are formed in the top wall of the shell base, and each through hole is connected with a gas control valve selectively communicating the vacuum cavity; when the through hole is covered, the pneumatic control valve arranged corresponding to the through hole is communicated with the vacuum cavity.

By adopting the technical scheme, when the through hole is covered by the chip, the pneumatic control valve arranged corresponding to the through hole is communicated with the vacuum cavity, so that the chip is subjected to vacuum adsorption; otherwise, when the through hole is not covered by the chip, the pneumatic control valve arranged corresponding to the through hole closes the communication air passage, so that negative pressure gas in the vacuum cavity cannot leak. The adsorption area is self-adaptive to the chip area, so that paper, films, adhesive tapes and the like are not required to cover redundant through holes during money exchange, and the problem that the related technical means cannot adapt to chips with various sizes due to the adsorption area, so that money exchange operation of the chips with various sizes is inconvenient is solved.

Optionally, each pneumatic control valve is provided with a solenoid valve capable of being controlled by electric signal connection.

By adopting the technical scheme, the pneumatic control valve is controlled to be opened and closed through the electromagnetic valve electric signal, so that the effect of selectively communicating the through hole with the vacuum cavity is achieved.

Optionally, the pneumatic control valve comprises an atmospheric positive pressure section communicated with the through hole, a vacuum negative pressure section communicated with the vacuum cavity, and an elastic opening and closing piece fixedly arranged between the atmospheric positive pressure section and the vacuum negative pressure section, wherein the diameter of the vacuum negative pressure section is smaller than that of the atmospheric positive pressure section; when in negative pressure adsorption, the elastic opening and closing piece blocks the vacuum negative pressure section under the action of pressure difference.

By adopting the technical scheme, after the chip is placed, the vacuum pump is started, and the uncovered through hole conveys external atmosphere into the atmosphere positive pressure section, so that pressure difference is formed between the uncovered through hole and the vacuum negative pressure section, and then the elastic opening and closing piece blocks the vacuum negative pressure section with smaller diameter; the pneumatic control valve at the covered through hole is isolated from the outside atmosphere, so that the elastic opening and closing piece has no pressure difference up and down, and the air passage in the pneumatic control valve is in a communicating state to adsorb the chip.

Optionally, the pneumatic control valve still is provided with diameter and position all be in the atmospheric pressure section with the butt annular between the vacuum negative pressure section, the elasticity is opened and close the piece and is greater than including bolt cap diameter butt annular and slide set up in automatic butt in the atmospheric pressure section is tied, the outer periphery wall of the bolt of automatic butt is provided with the resilience pressure spring around, resilience pressure spring butt set up in between the bolt cap of automatic butt with the butt annular diapire.

By adopting the technical scheme, when negative pressure is absorbed, the automatic abutting bolt at the position which is not covered by the chip is subjected to the up-down pressure difference to overcome the elasticity of the rebound pressure spring to slide downwards, so that the abutting annular groove is shielded to block the vacuum negative pressure section; when the adsorption is completed, the automatic abutting bolt is automatically rebounded and reset by the elastic potential energy stored by the rebounding pressure spring.

Optionally, the elastic opening and closing member is an elastic film with an edge fixed to the inner peripheral wall of the pneumatic control valve.

By adopting the technical scheme, when the chip is not covered, the elastic film blocks the vacuum negative pressure section by utilizing the elasticity of the elastic film when the chip is adsorbed by negative pressure, so that the whole structure is simple, and the technology processing and the assembly are convenient.

Optionally, the casing base includes supporting the drain pan and can dismantle fixed set up in the absorption platform that supports the drain pan.

By adopting the technical scheme, the bottom shell is conveniently supported to be assembled on the adsorption table in a processing way, and the pneumatic control valve is convenient to maintain and replace.

Optionally, the supporting bottom shell is provided with a plurality of boss supporting blocks extending vertically, and the boss supporting blocks are abutted to the bottom wall of the adsorption platform.

By adopting the technical scheme, the adsorption table is supported by multiple points to ensure the flatness of the upper surface of the adsorption table, so that the problem that the adsorption table is concavely deformed under negative pressure adsorption is solved.

Optionally, the supporting bottom shell is provided with a plurality of mounting holes for mounting the air-through pipe.

By adopting the technical scheme, the installation position of the gas through pipe is convenient to adjust according to the change of the adsorption position, so that the negative pressure gas is uniformly distributed at the through holes covered by the chip; and a plurality of air through pipes can be installed selectively according to the requirement.

1. The adsorption area can be self-adaptive to the chip area. Each through hole is connected with a pneumatic control valve which is selectively communicated with the vacuum cavity. When the through hole is covered, the pneumatic control valve corresponding to the through hole is communicated with the vacuum cavity, so that the chip is subjected to vacuum adsorption; when the through hole is not covered by the chip, the pneumatic control valve arranged corresponding to the through hole closes the communication air passage, so that negative pressure gas in the vacuum cavity cannot leak. The adsorption area is self-adaptive to the chip area, so that paper, films, adhesive tapes and the like are not required to cover redundant through holes during money exchange.

2. The operation is convenient. The adsorption table can be arranged in a detachable mode, so that the whole processing and assembling and the subsequent maintenance and replacement of the pneumatic control valve are convenient. Simultaneously, support the drain pan and be provided with a plurality of mounting hole sites that the air feed siphunculus was installed to make the position and the quantity of air feed siphunculus all can adjust according to actual need, convenient operation.

Drawings

FIG. 1 is a perspective view showing the overall structure of embodiment 1 of the present utility model;

FIG. 2 is an exploded view showing the whole structure of embodiment 1 of the present utility model;

FIG. 3 is a cross-sectional view showing a part of the structure of embodiment 2 of the present utility model;

fig. 4 is a cross-sectional view showing a part of the structure of embodiment 3 of the present utility model.

Reference numerals illustrate:

100. a housing base; 110. a supporting bottom case; 111. a boss support block; 120. an adsorption table; 121. a through hole; 200. a gas-through pipe; 300. a pneumatic control valve; 310. an atmospheric positive pressure section; 320. abutting the ring groove; 330. a vacuum negative pressure section; 340. an elastic opening and closing member; 341. automatically abutting the bolt; 342. a rebound compression spring; 343. an elastic film.

Detailed Description

The present utility model will be described in further detail with reference to the accompanying drawings.

Example 1

The embodiment of the utility model discloses a vacuum adsorption workbench. Referring to fig. 1, a vacuum adsorption workbench includes a housing base 100 having a vacuum chamber, and a gas pipe 200 disposed on the housing base 100 and used for communicating with a vacuum pump, wherein a plurality of through holes 121 capable of communicating with the vacuum chamber are formed in a top wall of the housing base 100, and negative pressure gas is uniformly distributed in each through hole 121 through guiding of the vacuum chamber. In the embodiment of the utility model, the vacuum adsorption workbench is set to be cuboid, and can be practically designed to be cylindrical, polygonal and other shapes according to the needs.

Referring to fig. 2, it should be noted that each through hole 121 is screwed with a pneumatic control valve 300 selectively connected to the vacuum chamber, each pneumatic control valve 300 is provided with a solenoid valve (not shown) capable of being controlled by electric signal connection, and the solenoid valve (not shown) is used for controlling the opening and closing of the pneumatic control valve 300 by electric signal to realize the effect of selectively connecting the through hole 121 with the vacuum chamber. When the through hole 121 is covered, the air control valve 300 provided corresponding to the through hole 121 communicates with the vacuum chamber, thereby vacuum-adsorbing the chip; in contrast, when the through-hole 121 is not covered by the chip, the air control valve 300 provided correspondingly closes the communication air passage, so that the negative pressure gas in the vacuum chamber does not leak. The adsorption area is self-adaptive to the chip area, so that paper, films, adhesive tapes and the like are not required to cover redundant through holes 121 during money exchange, and the problem that the related technical means cannot adapt to chips with various sizes due to the adsorption area, so that money exchange operation of the chips with various sizes is inconvenient is solved.

Referring to fig. 2, the housing base 100 includes a supporting bottom case 110 and an adsorption table 120 mounted on an upper surface of the supporting bottom case 110 by screws, and a plurality of through holes 121 are uniformly formed in the adsorption table 120, thereby facilitating the overall process assembly and maintenance and replacement of the air control valve 300. The inner bottom wall of the supporting bottom shell 110 is provided with a plurality of boss supporting blocks 111 extending vertically upwards, and the upper surfaces of the boss supporting blocks 111 and the upper surface of the peripheral wall of the supporting bottom shell 110 are positioned on the same horizontal plane, so that the bottom wall of the supporting bottom shell 120 can be abutted to be arranged for supporting the bottom wall of the supporting bottom shell at multiple points, and the concave deformation of the bottom wall of the supporting bottom shell is ensured to be placed by the adsorption flatness. Further, the side wall of the supporting bottom shell 110 is provided with a plurality of mounting holes for mounting the air supply through pipe 200, so that a plurality of air through pipes 200 can be selectively mounted according to actual needs, and meanwhile, only one air through pipe 200 can be mounted, so that when the adsorption position of the adsorption table 120 changes, the mounting position of the air through pipe 200 can be timely adjusted, and negative pressure air can be conveniently distributed at the through holes 121 in a working state. It should be noted that, when only one air tube 200 is installed, the redundant installation hole is shielded by a bolt or a rubber tube.

Example 2

Referring to fig. 3, this embodiment differs from comparative example 1 in that: it is not necessary to install a solenoid valve (not shown) corresponding to each of the pneumatic control valves 300, but the redundant through-holes 121 are isolated from communication with the vacuum chamber by the structure of the pneumatic control valve 300 itself. The air control valve 300 includes an atmospheric positive pressure section 310 provided in communication with the through hole 121, an abutment ring groove 320 in communication with the atmospheric positive pressure section 310, and a vacuum negative pressure section 330 provided in communication with the vacuum chamber, which are sequentially provided from above to below, the diameters of which are sequentially reduced.

Referring to fig. 3, an elastic opening and closing member 340 is slidably disposed in the abutment ring groove 320, and the elastic opening and closing member 340 includes an automatic abutment plug 341 with a plug cap diameter larger than that of the abutment ring groove 320, and a resilient compression spring 342 is disposed around the outer peripheral wall of the plug body of the automatic abutment plug 341, and the resilient compression spring 342 is disposed between the plug cap of the automatic abutment plug 341 and the bottom wall of the abutment ring groove 320 in an abutting manner. After the chip is placed, the vacuum pump is started, the uncovered through hole 121 conveys the external atmosphere into the atmosphere positive pressure section 310 to form pressure intensity with the vacuum negative pressure section 330, the automatic abutting plug 341 overcomes the elasticity of the rebound pressure spring 342 to slide downwards under the up-down pressure intensity difference, and the abutting annular groove 320 is shielded to block the vacuum negative pressure section 330; the pneumatic control valve 300 at the covered through hole 121 is isolated from the outside air, so that the elastic opening and closing member 340 has no pressure difference between up and down, and the air passage in the pneumatic control valve 300 is in a communicating state to adsorb the chip; when the adsorption is completed, the automatic abutting plug 341 is automatically rebound and reset by elastic potential energy stored by the rebound pressure spring 342.

Example 3

Referring to fig. 4, the difference between the embodiment 1 and the embodiment 2 is that the pneumatic control valve 300 of the present embodiment only needs to provide the positive air pressure section 310 and the negative vacuum pressure section 330, and the elastic opening and closing member 340 is provided as an elastic film 343 with edges fixed to the inner peripheral wall of the positive air pressure section 310, and the elastic film 343 is made of a porous film with micropores. When negative pressure is absorbed, the elastic film 343 is inwards sunken, so that the vacuum negative pressure section 330 with smaller diameter is shielded, and the vacuum negative pressure section can automatically rebound and reset after the work is completed, and the structure is simpler and the processing and the assembly are convenient.

The foregoing are preferred embodiments of the present utility model, and are not intended to limit the scope of the present utility model. Wherein like parts are designated by like reference numerals. It should be noted that the words "front", "back", "left", "right", "upper" and "lower" used in the above description refer to directions in the drawings, and the words "inner" and "outer" refer to directions toward or away from, respectively, the geometric center of a particular component. Therefore: all equivalent changes in structure, shape and principle of the utility model should be covered in the scope of protection of the utility model.

Claims

1. The vacuum adsorption workbench comprises a shell base (100) with a vacuum cavity and a gas through pipe (200) which is arranged on the shell base (100) and is used for being communicated with a vacuum pump, and is characterized in that a plurality of through holes (121) which can be communicated with the vacuum cavity are formed in the top wall of the shell base (100), and each through hole (121) is connected with a gas control valve (300) which is selectively communicated with the vacuum cavity; when the through hole (121) is covered, a pneumatic valve (300) provided in correspondence with the through hole (121) communicates with the vacuum chamber.

2. Vacuum adsorption table according to claim 1, wherein each of the pneumatic control valves (300) is provided with an electrically controllable solenoid valve.

3. The vacuum adsorption workbench according to claim 1, wherein the pneumatic control valve (300) comprises an atmospheric positive pressure section (310) communicated with the through hole (121), a vacuum negative pressure section (330) communicated with the vacuum cavity, and an elastic opening and closing member (340) fixedly arranged between the atmospheric positive pressure section (310) and the vacuum negative pressure section (330), wherein the diameter of the vacuum negative pressure section (330) is smaller than that of the atmospheric positive pressure section (310); when in negative pressure adsorption, the elastic opening and closing piece (340) blocks the vacuum negative pressure section (330) under the action of pressure difference.

4. A vacuum adsorption workbench according to claim 3, wherein the pneumatic control valve (300) is further provided with an abutting annular groove (320) with the diameter and the position both between the atmospheric positive pressure section (310) and the vacuum negative pressure section (330), the elastic opening and closing piece (340) comprises an automatic abutting bolt (341) with the bolt cap diameter larger than the abutting annular groove (320) and slidingly arranged in the atmospheric positive pressure section (310), a rebound compression spring (342) is arranged around the outer peripheral wall of the bolt body of the automatic abutting bolt (341), and the rebound compression spring (342) is abutted between the bolt cap of the automatic abutting bolt (341) and the bottom wall of the abutting annular groove (320).

5. A vacuum adsorption table according to claim 3 wherein the resilient shutter (340) is provided as a resilient membrane (343) secured at an edge to the inner peripheral wall of the pneumatic valve (300).

6. The vacuum suction table according to claim 1, wherein the housing base (100) includes a support bottom case (110) and a suction table (120) detachably fixedly provided to the support bottom case (110).

7. The vacuum suction table as claimed in claim 6, wherein the support bottom shell (110) has a plurality of vertically extending boss support blocks (111), the boss support blocks (111) being disposed in abutment with the suction table (120) bottom wall.

8. Vacuum suction table according to claim 6, characterized in that the support pan (110) is provided with a plurality of mounting holes for the mounting of the gas tube (200).