CN219611960U - Sound box - Google Patents

Sound box Download PDF

Info

Publication number
CN219611960U
CN219611960U CN202320225226.6U CN202320225226U CN219611960U CN 219611960 U CN219611960 U CN 219611960U CN 202320225226 U CN202320225226 U CN 202320225226U CN 219611960 U CN219611960 U CN 219611960U
Authority
CN
China
Prior art keywords
sound
shell
sound box
sound cavity
cavity
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN202320225226.6U
Other languages
Chinese (zh)
Inventor
樊建军
郭威
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Zhejiang Aikesi Elf Artificial Intelligence Technology Co ltd
Original Assignee
Zhejiang Aikesi Elf Artificial Intelligence Technology Co ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Zhejiang Aikesi Elf Artificial Intelligence Technology Co ltd filed Critical Zhejiang Aikesi Elf Artificial Intelligence Technology Co ltd
Priority to CN202320225226.6U priority Critical patent/CN219611960U/en
Application granted granted Critical
Publication of CN219611960U publication Critical patent/CN219611960U/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Landscapes

  • Details Of Audible-Bandwidth Transducers (AREA)

Abstract

The embodiment of the specification provides a loudspeaker box, which comprises: the sound box comprises a sound box shell, wherein a first space is defined by the sound box shell, and the sound box shell comprises a first welding part; the sound cavity shell is located in the first space and comprises a second welding part corresponding to the first welding part, the second welding part is welded with the first welding part, and the sound cavity shell and part of the sound box shell enclose a sound cavity. Through multiplexing the part of the sound box shell into the part of the shell of sound cavity, the cooperation sound cavity shell encloses into the sound cavity, has reduced the required casing size of enclosing into the sound cavity, also can have great space in the first space that makes up of sound box shell and be used for enclosing into above-mentioned sound cavity. Simultaneously sound cavity casing and audio amplifier shell pass through first butt fusion portion and second butt fusion portion welding, have guaranteed that the sound cavity has good leakproofness, and great sound cavity and good leakproofness provide the guarantee for the audio amplifier obtains good tone quality, less shell structure simultaneously and need not seal structure's welding mode, have reduced the audio amplifier cost.

Description

Sound box
Technical Field
The embodiment of the specification relates to the technical field of sound box equipment, in particular to a sound box.
Background
The audio amplifier is the equipment that converts audio signal into sound, along with technological level's continuous promotion, satisfies all kinds of audio amplifier of user's different demands and continuously emerges, and the competition in audio amplifier market also is increasingly strong.
At present, in order to occupy competitive advantages in the increasingly competitive sound box market, how to improve sound quality of the sound box is one of the directions of manufacturers of the sound box.
Disclosure of Invention
Various embodiments of the present disclosure provide a sound box to increase the volume of a sound cavity in a limited interior space of the sound box, thereby improving the sound quality of the sound box.
One embodiment of the present specification provides a sound box, including:
the sound box comprises a sound box shell, wherein a first space is defined by the sound box shell, and the sound box shell comprises a first welding part;
the sound cavity shell is located in the first space and comprises a second welding part corresponding to the first welding part, the second welding part is welded with the first welding part, and the sound cavity shell and part of the sound box shell enclose a sound cavity.
According to the multiple embodiments provided by the specification, the part of the sound box shell is multiplexed into the sound cavity, the sound cavity is enclosed by the part of the sound box shell, the number and the size of the sound cavity shells required for enclosing the sound cavity are reduced, the sound cavity can be enclosed by a larger space under the condition that the first space enclosed by the sound box shell is unchanged, and the large volume of the sound cavity is beneficial to improving the low-frequency characteristic of the sound box, so that the sound quality of the sound box is improved.
Simultaneously this audio amplifier midrange shell and audio amplifier shell pass through first butt fusion portion and second butt fusion portion welding, have guaranteed that the audio cavity has good leakproofness, and good leakproofness also provides the guarantee for the audio amplifier obtains good tone quality, and less shell structure in addition and the welding mode that need not seal structure have reduced the audio amplifier cost.
Drawings
Fig. 1 is a schematic application scenario diagram of an intelligent sound box according to an embodiment of the present disclosure;
fig. 2 is a schematic structural diagram of a sound box according to an embodiment of the present disclosure;
FIG. 3 is a schematic diagram illustrating a relationship between the sound chamber housing and the second housing in the sound box structure shown in FIG. 2;
fig. 4 is a schematic structural diagram of a sound box according to another embodiment of the present disclosure;
FIG. 5 is a schematic diagram illustrating a relationship between the sound chamber housing and the first housing in the sound box structure shown in FIG. 4;
FIG. 6 is a front view of a sound box provided in one embodiment of the present disclosure;
FIG. 7 is a schematic view of an ultrasonic welded structure of a convex structure and a concave structure according to an embodiment of the present disclosure;
FIG. 8 is a schematic view of the structures of the raised structures and the recessed structures provided in one embodiment of the present disclosure prior to ultrasonic welding;
fig. 9 is an assembly schematic diagram of a sound cavity housing and a speaker according to an embodiment of the present disclosure;
fig. 10 is a schematic connection diagram of a motherboard according to an embodiment of the present disclosure.
Detailed Description
SUMMARY
With the continuous improvement of the technological level, intelligent sound boxes integrated with multiple functions (such as a Bluetooth connection function, a voice/touch control function, a cloud interconnection function and the like) are becoming more and more popular, and through the intelligent sound boxes integrated with multiple functions, a user can utilize the intelligent sound boxes to realize weather forecast (for example, referring to fig. 1, the user can wake up the intelligent sound boxes through voice 'intelligent sound boxes, how weather is today' and initiate a weather forecast query task, the intelligent sound boxes can acquire weather information through channels such as the cloud and broadcast the weather information, such as 'today, the air temperature is 22-29 ℃, the air quality is excellent'), the functions of song ordering, shopping on the internet, carrying out linkage control on other intelligent devices and the like, so that the intelligent sound boxes become one of indispensable products in intelligent life of the user
The volume of current intelligent audio amplifier is comparatively small and exquisite mostly, mainly stands out the characteristics of intelligent audio amplifier "intelligence" and "interactive". The tone quality of the small-volume sound box is mainly ensured by arranging a larger sound cavity in a smaller space, and mainly because the low frequency is a basic tone in terms of the auditory characteristics of human ears, the low frequency part of the music sound has great influence on the tone quality perceived by the human ears, the lower frequency wave crest is more prominent the left, and a user can feel that the music sound is more pleasant subjectively. With the increase of the volume of the sound cavity (especially with the increase of the volume of the rear sound cavity), the low-frequency wave peak of the frequency response curve is enabled to continuously move leftwards, so that the low-frequency characteristic of the sound box can be improved, and the overall sound quality of the sound box is improved. Therefore, how to reserve more space as much as possible in the small-sized intelligent sound box to be used as a sound cavity so as to ensure that the sound quality of the intelligent sound box meets the requirements of most users becomes a major concern of a plurality of sound box manufacturers.
The interior space of the small-size sound box is limited, which is a constraint factor of the interior structural design of the small-size sound box, the sound cavity of the small-size sound box such as the intelligent sound box at present is mainly a suspension sound cavity, namely, the sound cavity is independently arranged in the shell of the sound box, the front shell and the rear shell of the sound cavity are independently disassembled, the structures such as a loudspeaker and a Passive Radiator (PR) are assembled on the front shell or the rear shell of the sound cavity, a sound cavity module is formed, then the sound cavity module is embedded into a silica gel shock pad and sleeved on four studs of the sound box shell, and the sound box shell and the sound cavity module are locked by screws. In the suspension sound cavity structure, the front and rear shells of the sound cavity, the loudspeaker, the passive radiator and other structures are modularized, so that the assembly process is simplified.
However, in this kind of audio amplifier, because the lock that needs structures such as silica gel shock pad, double-screw bolt and screw to realize sound cavity module and audio amplifier casing attaches, the front shell and the backshell that enclose into the sound cavity have also taken up the inside great space of audio amplifier, lead to the volume of sound cavity self less.
In order to improve the volume of the sound cavity and ensure that the sound box has better sound quality under the condition that the internal space of the sound box is unchanged, the inventor provides a sound box with a 'one-body cavity' structure through research. In this kind of audio amplifier, sound cavity joint is on the audio amplifier shell, and the multiplexing of a part of audio amplifier shell is preceding shell or the backshell in sound cavity, and the cooperation audio amplifier shell encloses into the sound cavity, has reduced a casing of audio amplifier in the structure, has reduced the casing and has taken up the inside volume of audio amplifier, under the condition that does not increase the inside volume of audio amplifier, has increased the volume in sound cavity relatively, has improved the tone quality of audio amplifier, and the guarantee audio amplifier satisfies most user's user demand. Meanwhile, in the loudspeaker box, as one part of the loudspeaker box shell is reused as the front shell or the rear shell of the sound cavity, the problem that the sound cavity collides with the loudspeaker box shell to produce sound due to vibration of the sound cavity is solved, a silica gel shock pad used for buffering vibration between the sound cavity and the loudspeaker box shell is not required to be arranged between the sound cavity and the loudspeaker box shell, and structures such as a stud, a screw and the like for fixing the silica gel shock pad on the loudspeaker box shell are also not required to be arranged, so that the loudspeaker box structure is simplified.
However, the inventor has found through further researches that, in the sound box with the above structure, after the sound cavity shell and the sound box shell are assembled by means of clamping and the like, the sealing performance of the connection part between the sound cavity shell and the sound box shell is poor, which may bring about problems of echo, noise and the like, so that the sound quality is reduced, therefore, in order to ensure that the sound cavity shell and the sound box shell have good sealing performance, a circle of sealing material (for example, EVA (Ethylene-Vinyl Acetate copolymer, ethylene-vinyl acetate copolymer)) needs to be additionally added at the contact position between the sound cavity shell and the sound box shell for sealing, so as to avoid the problem that the sound quality is affected by the echo, the noise and the like of the sound box due to the problem of the sealing performance between the sound cavity shell and the sound box shell.
In order to reduce the cost while guaranteeing the tone quality, the inventor has further provided the audio amplifier that this specification embodiment provided through further research, through multiplexing the part of audio amplifier shell into the part of sound cavity casing, the cooperation sound cavity casing encloses into the sound cavity, has reduced the required sound cavity casing quantity and the size of enclosing into the sound cavity, can have great space to be used for enclosing into above-mentioned sound cavity under the unchangeable circumstances of first space that the audio amplifier shell encloses, and great sound cavity volume is favorable to improving the low frequency characteristic of audio amplifier, thereby improves audio amplifier tone quality.
Simultaneously this audio amplifier midrange shell and audio amplifier shell pass through first butt fusion portion and second butt fusion portion welding, have guaranteed that the audio amplifier has good leakproofness, and good leakproofness also provides the guarantee for the audio amplifier obtains good tone quality, and less shell structure in addition and need not the welding mode of extra arrangement seal structure outside the audio amplifier, is favorable to reducing audio amplifier cost.
The sound box provided in the embodiments of the present specification will be exemplarily described with reference to the following specific drawings.
Exemplary Sound Box
One embodiment of the present disclosure provides a sound box, which may be an intelligent sound box as described above, may be a small sound box of other types, or may be a medium-sized or large sound box, or may be a sound box integrated into other devices.
Example 1
Referring to fig. 2 to 3, fig. 2 is a schematic diagram of a frame structure of a sound box, and fig. 3 is a schematic diagram of a relationship between a sound cavity housing 20 and a second housing 12 in the structure shown in fig. 2, where the sound box 100 may include:
the sound box shell 10, the sound box shell 10 encloses a first space, and the sound box shell 10 comprises a first welding part 13.
The sound cavity housing 20 is located in the first space, the sound cavity housing 20 includes a second welding portion 23 corresponding to the first welding portion 13, the second welding portion 23 is welded to the first welding portion 13, and the sound cavity housing 20 and a part of the sound box housing 10 enclose a sound cavity 60.
The weld refers to a joint of two members formed by welding or the like, the material of the weld generally undergoes a state change of melting, solidification, or the like during the welding process, the weld can firmly connect the two members connected thereto after solidification, and the gas tightness of the two members connected by the weld is generally better in the connection region due to the process of melting and resolidifying the weld of the two members. In the present embodiment, the welded portion on the sound box housing 10 is referred to as a first welded portion, and the welded portion on the sound chamber housing 20 is referred to as a second welded portion.
The sound box shell 10 mainly refers to a shell for providing a protective function for the sound box 100, and the function of the sound box shell 10 mainly comprises that the sound box 100 has a certain hardness, so that a setting space is provided for devices inside the sound box 100, and meanwhile, all device structures inside the sound box shell 10 are protected. In this embodiment, a part of the enclosure 10 is further multiplexed into a part of the sound cavity 60, that is, a part of the enclosure 10 participates in enclosing the sound cavity 60, which is beneficial to reducing the number and volume of the housings required for the overall enclosure 100.
The sound cavity housing 20 is a housing for enclosing the sound cavity 60 in the embodiment of the present specification, and the main difference with the sound box housing 10 is that the sound cavity housing 20 is located inside the sound box 100, and is mainly used for forming the sound cavity 60. In some embodiments, the sound chamber housing 20 may also be configured with a speaker 22 or the like.
Example two
In another embodiment, referring to fig. 4 and 5, fig. 4 is a schematic diagram of a frame structure of a sound box, and fig. 5 is a schematic diagram of a relation between a sound cavity housing 20 and a first housing 11 in the structure shown in fig. 4, unlike the first embodiment, in which the sound cavity housing 20 and the first housing 11 of the sound cavity housing 10 enclose a sound cavity 60, in the first embodiment, the sound cavity housing 20 and the second housing 12 of the sound cavity housing 10 enclose the sound cavity 60.
In both fig. 2 and 4, the acoustic cavity 60 is represented by a grid-hatched area. As can be seen from fig. 2 and 4, the first space enclosed by the enclosure 10 is a main space where devices such as the sound cavity 60 of the sound box, the speaker 22, the circuit board, the wires, and the casing enclosing the sound cavity are disposed, and the number of devices required to be disposed in the first space is reduced under the condition that the size of the first space is unchanged, so that the settable space of the sound cavity 60 can be increased to a certain extent. Therefore, in the sound box provided in the embodiment of the present disclosure, a part of the sound box casing 10 is multiplexed into a part of the casing of the sound cavity 60, so that the casing volume required to be set in the first space is reduced, so that a larger space can be used for setting the sound cavity 60, which is beneficial to realizing the purpose of increasing the volume of the sound cavity 60 and improving the sound quality of the sound box under the condition of keeping the whole volume of the sound box unchanged.
Meanwhile, the sound cavity housing 20 and the sound cavity housing 10 of the sound box 100 provided in the embodiment of the present disclosure are welded together through the first welding portion 13 and the second welding portion 23, so that the purpose of maintaining good sealing performance of the sound cavity 60 without auxiliary sealing of a sealing material is achieved, the number of sealing materials required in the sound box 100 and the number of cavities of the sound cavity 60 are reduced, and therefore the cost of the sound box 100 is reduced.
Fig. 2 and fig. 4 also show enlarged schematic views of a dashed frame, and a frame selection area of the dashed frame is a welding area of the first welding portion 13 and the second welding portion 23, where the first welding portion 13 and the second welding portion 23 may have a tooth structure as shown in fig. 2 and fig. 4, and the first welding portion 13 and the second welding portion 23 are welded after being meshed, so that a better welding effect is beneficial to obtain. Of course, the contact surface between the first welded portion 13 and the second welded portion 23 may have a planar shape, a cambered shape, or the like, which is not limited in the present specification.
As can be seen in fig. 3 and 5, the speaker housing 10 may include a first housing 11 and a second housing 12, and a first space is defined by the cooperation of the first housing 11 and the second housing 12, and the sound cavity housing 20 may cooperate with the first housing 11 to form a sound cavity 60, or cooperate with the second housing 12 to define the sound cavity 60. In fig. 2 and 3, an embodiment in which the sound cavity housing 20 cooperates with the first housing 11 to form the sound cavity 60 is shown, and as can be seen from fig. 3, the first welded portion 13 and the second welded portion 23 are distributed at the boundary position of the first housing 11 and the sound cavity housing 20 (i.e., at the position selected by the dashed frame in fig. 3). Similarly, fig. 4 and 5 illustrate an embodiment in which the acoustic chamber housing 20 cooperates with the second housing 12 to form a plurality 60, and as can be seen in fig. 5, the first and second welds 13, 23 are disposed at the interface of the second housing 12 and the acoustic chamber housing 20 (i.e., at the location indicated by the dashed box in fig. 5).
Referring to fig. 6, fig. 6 shows a front view of the sound box 100, showing the touch screen 91 in addition to the first housing 11 of the sound box enclosure 10. The area under the touch screen 91 is the sound emitting area of the speaker 22.
Example III
In order to improve the welding efficiency and reduce the adverse effect of welding on the sound chamber housing 20 and the sound box housing 10, in still another exemplary embodiment of the present specification, a viable structure of the first welding portion 13 and the second welding portion 23 is proposed, as shown in fig. 7, the first welding portion 13 includes a plurality of first welding units 131, the second welding portion 23 includes a plurality of second welding units 231, and the first welding units 131 are ultrasonically welded with the corresponding second welding units 231.
Ultrasonic welding (Ultrasonic Welding), which may also be referred to as ultrasonic welding or ultrasonic welding, is a quick, clean, efficient welding process that can be used to process welds between plastic articles, between plastic articles and metal fittings, and between other non-plastic materials. The ultrasonic welding utilizes high-frequency vibration waves to transmit to the upper surface and the lower surface of the shell to be welded, under the condition of pressurizing the jig, the surfaces of the two shells are rubbed with each other to form fusion between the molecular layers, a firm molecular chain is formed, the purpose of welding is achieved, and the welding strength of the two parts of the ultrasonic welding can be close to the strength of a raw material body. Obvious sparks can not be generated in the ultrasonic welding process, a ventilation device for dissipating smoke and heat is not required to be arranged, adverse effects can not be generated on other parts of the sound cavity shell 20 and the sound box shell 10 except the welding position, and the ultrasonic welding is easy to realize automatic production, so that the welding efficiency is improved.
Example IV
In order to obtain a good ultrasonic welding effect, in still another exemplary embodiment of the present specification, a feasible structure of a first welding unit 131 and a second welding unit 231 is proposed, still referring to fig. 7, the first welding unit 131 includes a first protrusion structure 1312, the second welding unit 231 includes a second recess structure 2312, and the first protrusion structure 1312 goes deep into the second recess structure 2312;
or (b)
The first welding unit 131 includes a first concave structure 1311, and the second welding unit 231 includes a second convex structure 2311, and the second convex structure 2311 penetrates into the first concave structure 1311.
In view of the processing characteristics of ultrasonic welding, a boss, which in some embodiments may also be referred to as an ultrasonic support, and a fused portion surrounding the boss, which refers to a region formed during ultrasonic welding that connects two components via a melt-solidification process, may be included in the boss structure. For example, in fig. 7, the second protrusion 2311 includes a second protrusion 23111 and a second melting portion 23112, and the first protrusion 1312 includes a first protrusion 13121 and a first melting portion 13122. Fig. 7 shows two ultrasonic welding cases, namely, a convex structure is arranged on the sound cavity shell 20, a concave structure is arranged on the sound box shell 10, or a concave structure is arranged on the sound cavity shell 20, and a convex structure is arranged on the sound box shell 10, which is not limited in this specification.
Fig. 7 is a schematic structural view of the sound box housing 10 and the sound cavity housing 20 after ultrasonic welding, and before ultrasonic welding, a certain gap is usually formed between the protruding portion and the concave structure of the protruding structure, and the molten portion of the protruding structure is a structure protruding from the top end of the protruding portion before ultrasonic welding, and at least part of the molten portion may also be called an ultrasonic boss, and the ultrasonic boss overlaps with the concave structure, after ultrasonic welding, melts and fills the gap between the protruding portion and the concave structure, and forms a structure as shown in fig. 7 after re-solidification, so as to realize firm connection of two components.
The inventor researches that in the ultrasonic welding process of the sound box shell 10 and the sound cavity shell 20 of the sound box, the dimension design of the protruding structure and the recessed structure can be optimized to a certain extent, and good welding strength is obtained. Still referring to fig. 8, parameters that may be involved in designing the concave and convex structures include groove wall thickness L, ultrasonic boss height H, ultrasonic boss root width t, ultrasonic gap G, ultrasonic boss fillet radius R, ultrasonic support height H, fit gap G of the concave and convex structures, draft angle R1, fit face c, ultrasonic support width L, and the like. Through optimal design, the range of the ultrasonic supporting width L can be 0.6-1.0 mm, the range of the ultrasonic supporting height H can be 0.80mm, the range of the ultrasonic boss root width t can be 0.4-0.6 mm, the range of the ultrasonic gap G can be 0.20mm, the range of the ultrasonic boss height H can be 0.6mm, the range of the ultrasonic boss top fillet radius can be 0.2mm, the range of the ultrasonic supporting draft angle r1 can be 3 degrees, the range of the ultrasonic supporting and concave structure fit gap G can be 0.15mm, the minimum value of the groove wall thickness L in the concave structure can be 0.70mm, and the range of the chamfer value of the concave structure and the support structure fit surface C can be C0.2-C0.3. The parameters are set in the above range, so that the ultrasonic bosses can be well filled in the ultrasonic gaps G after ultrasonic melting, good welding strength is obtained, the problem that the ultrasonic bosses cannot be fully filled in the ultrasonic gaps G after melting can be avoided, and the problem that the ultrasonic bosses overflow the ultrasonic gaps G after melting and have negative influence on the solidification effect can be avoided.
In order to accommodate the more shaped sound box structural design, some embodiments of the present disclosure also provide some possible sound box structures, still referring to fig. 2 and 4, the sound box housing 10 includes a first shell 11 and a second shell 12, where the first shell 11 and the second shell 12 enclose the first space, the first welding portion 13 is located on the first shell 11 or the second shell 12, and the sound cavity shell 20 encloses the sound cavity 60 with a part of the first shell 11 or a part of the second shell 12.
In this embodiment, the sound box housing 10 is composed of front and rear shells (i.e. the first shell 11 and the second shell 12), and according to different shape designs of the front and rear shells and arrangement requirements of internal devices, the sound cavity housing 20 and part of the first shell 11 can be enclosed into a sound cavity 60 (as shown in fig. 4), and the sound cavity housing 20 and part of the second shell 12 can be enclosed into a sound cavity 60 (as shown in fig. 2), so that different sound cavity 60 enclosing schemes can be provided for the sound box 100 with different design requirements, and the applicability of the sound box 100 is improved.
In the sound box 100 shown in fig. 4, the first welding portion 13 is located on the first housing 11, and the sound cavity housing 20 and a part of the first housing 11 enclose the sound cavity 60;
the speaker 22 of the sound box 100 is provided on the side of the first housing 11 facing the sound chamber 60.
In this embodiment, the speaker 22 is disposed on the first housing 11, the sound emitting surface of the speaker 22 faces the sound cavity 60, and the second housing 12 may include a protruding area protruding toward a side away from the first housing 11, so as to provide a larger disposition area for the sound cavity 60.
In this structure, the sound emitting surface of the speaker 22 is generally directed to the rear shell, that is, in this embodiment, the first shell 11 is used as the front shell of the sound box 100, the second shell 12 is used as the rear shell of the sound box 100, and the rear shell is further generally used for providing the structures such as the power supply base 32 and the power supply board 31, where the power supply board 31 needs to be electrically connected with the structures such as the main board 40 disposed in the first space through the power supply line 33, and the like, so that the enclosure scheme of the sound cavity 60 is designed, and the structures such as the power supply base 32 can be avoided outside the sound cavity 60 while multiplexing part of the first shell 11 as a part of the sound cavity 60, so that the connection requirement of the power supply line 33 can be satisfied without punching on the sound cavity shell 20, which is beneficial to improving the tightness of the sound cavity 60.
In the sound box 100 shown in fig. 4, in addition to the device structure of the sound box 100 described above, a key 51, a microphone and key board 52, a heat dissipation plate 70, and a passive radiator or air guide 21 may be included.
In the sound box 100 shown in fig. 2, the first welding portion 13 is located on the second housing 12, and the sound cavity housing 20 and a part of the second housing 12 enclose the sound cavity 60;
the speaker 22 of the sound chamber 100 is provided on the side of the first housing 11 facing the sound chamber 60.
In this structure, similarly, the first housing 11 serves as a front housing of the acoustic enclosure 100, the second housing 12 serves as a rear housing of the acoustic enclosure 100, and the multiplexed portions of the rear housing of the acoustic enclosure 20 collectively enclose the acoustic enclosure 60. When the power base 32 and the power board 31 are disposed in the sound cavity 60, holes can be punched in the sound cavity housing 20 to meet the requirement that the power cord 33 is electrically connected with the motherboard 40. The second housing 12 may include a protruding area protruding toward a side away from the first housing 11 to provide a larger arrangement area for the sound cavity 60. In the structure of the sound box 100 shown in fig. 2, the speaker 22 and the passive radiator or the air guide pipe 21 may be integrated on the sound cavity housing 20, and the speaker 22, the passive radiator or the air guide pipe 21 and the sound cavity housing 20 are assembled together as a speaker module, which is beneficial to improving the integration level of the sound box 100.
Example five
In order to reduce the adverse effect of the integration of the speaker 22 on the sound chamber housing 20 on the tightness of the sound chamber housing 20, in an alternative embodiment of the present disclosure, referring to fig. 9, fig. 9 is a schematic diagram of the assembly of the sound chamber housing 20 and the speaker 22, DR1 indicates the assembly direction of the speaker 22 to the sound chamber housing 20, the sound chamber housing 20 further includes a plurality of blind holes 24, and the speaker 22 includes a plurality of embedded structures 221, and the embedded structures 221 are embedded in the blind holes 24 corresponding to the embedded structures 221.
Because the blind hole 24 does not penetrate the sound cavity housing 20, the integrity and the tightness of the sound cavity housing 20 at the assembly position are ensured to be good, and the overall tightness of the sound cavity 60 is ensured to be good.
In order to ensure good sound quality of the sound box 100, as described above, in some embodiments of the present disclosure, a passive radiator or an air guide pipe may be disposed in the sound cavity, and the passive radiator and the air guide pipe are denoted by reference numeral 21 in the drawings. The passive radiator may be glued to the sound chamber housing 20 or the sound box housing 10 by dispensing, etc. The air guide pipe can be ultrasonically welded with the sound cavity shell or the sound box shell by utilizing an ultrasonic welding process. Either the passive radiator or the air duct may be used to improve the bass portion of the enclosure 100, thereby adjusting the overall tone of the enclosure 100. The passive radiator or air duct is driven by an active unit (e.g., speaker 22) in the enclosure 100 to passively sound.
Still referring to fig. 2 or fig. 4, some embodiments of the present disclosure provide a feasible setting position of a structure such as a motherboard, a power panel, a key board, etc. to improve the space utilization of the first space, and lay a foundation for ensuring that the sound cavity 60 can obtain a larger space. For example, the main board 40 is located in the first space and outside the sound cavity 60, the power board 31 and the power base 32 are located on the second housing 12, and the key board 51 is located in the first space and outside the sound cavity 60. In addition to the above devices, the sound box 100 in some embodiments may further include a touch display module, where the touch display module may be located on a side of the first housing 11 away from the first space. The main board 40 is electrically connected with the power board 31, the key board 51 and the touch display module, so as to realize signal transmission of the power board 31, the key board 51 and the touch display module.
In order to simplify the assembly process of the sound box 100, in an embodiment of the present disclosure, referring to fig. 10, fig. 10 is a schematic connection diagram of a main board 40 of the sound box 100, the main board 40 includes a plurality of first connectors 41, and the power panel 31, the keypad 52 and the touch display module each include a second connector 80, where the second connector 80 corresponds to one of the first connectors 41.
The first connector 41 and the corresponding second connector 80 are connected by a flexible conductive structure 90.
In this embodiment, the main board is plugged with the touch display screen module, the keypad 52, the power panel 31 and the like through connectors, and each control panel is plugged through the connectors, so that the assembly process of the sound box 100 is simplified.
In addition to the connection of the main board 40 to the touch display module, the keypad 52, the power panel 31, and other devices that may exist in the sound box 100, such as the camera module, the antenna module, and the speaker 22, in addition to the connection of the main board 40 to the touch display module, the keypad 52, and the power panel 31, the connection of other devices to the main board 40 may be illustrated in fig. 10 through the first connector 41.
In order to reduce the cost of the sound box 100, in one embodiment of the present disclosure, the flexible conductive structure includes a flexible flat cable or a flexible circuit board, and the flexible flat cable is used to connect the first connector and a second connector located on the key board or the power board.
The flexible circuit board is used for connecting the first connector with a second connector positioned on the touch display screen module.
That is, in the present embodiment, different flexible connection structures 90 are employed to connect the first connector 41 and the second connector 80 in consideration of different demands of respective device structures for signal transmission. Because the touch display screen module has higher performance requirements on signal transmission rate, stability and the like, the flexible circuit board is connected with the second connector on the touch display screen module and the first connector corresponding to the second connector, so that the electric connection between the main board 40 and the touch display screen module is realized. The power panel and the key panel have relatively low performance requirements for signal transmission rate, stability, and the like, so that the flexible flat cable can be used to electrically connect each control panel with the main board 40. Similarly, since the camera module has a high requirement for signal transmission performance, a flexible circuit board may be used to connect the camera module and the motherboard 40. For the speaker, it is considered to connect the speaker with the main board 40 using wires.
The first connector 41 and the second connector 80 may each be ZIF (Zero Insertion Force) connectors, and furthermore, the first connector 41 for connecting a speaker may be a dedicated horn connector.
It will be appreciated that the specific examples herein are intended only to assist those skilled in the art in better understanding the embodiments of the present description and are not intended to limit the scope of the embodiments of the present description.
It will be appreciated that the various embodiments described in this specification may be implemented either alone or in combination, and are not limited in this regard.
Unless defined otherwise, all technical and scientific terms used in the embodiments of this specification have the same meaning as commonly understood by one of ordinary skill in the art to which this specification belongs. The terminology used in the description is for the purpose of describing particular embodiments only and is not intended to limit the scope of the description. The term "and/or" as used in this specification includes any and all combinations of one or more of the associated listed items. As used in this specification and the appended claims, the singular forms "a," "an," and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise.
It will be clear to those skilled in the art that, for convenience and brevity of description, specific working procedures of the above-described system, apparatus and unit may refer to corresponding procedures in the foregoing method embodiments, and are not repeated herein.
In the several embodiments provided in this specification, it should be understood that the disclosed systems, apparatuses, and methods may be implemented in other ways. For example, the apparatus embodiments described above are merely illustrative, e.g., multiple units or components may be combined or may be integrated into another system, or some features may be omitted, or not performed. Alternatively, the coupling or direct coupling or communication connection shown or discussed with each other may be an indirect coupling or communication connection via some interfaces, devices or units, which may be in electrical, mechanical or other form.
The units described as separate units may or may not be physically separate, and units shown as units may or may not be physical units, may be located in one place, or may be distributed on a plurality of network units. Some or all of the units may be selected according to actual needs to achieve the purpose of the embodiment.
The foregoing is merely a specific embodiment of the present disclosure, but the scope of the embodiments of the present disclosure is not limited thereto, and any person skilled in the art who is skilled in the art can easily think about the changes or substitutions within the scope of the disclosure of the present disclosure, and it is intended to cover the changes or substitutions within the scope of the disclosure. Therefore, the protection scope of the embodiments of the present disclosure shall be subject to the protection scope of the claims.

Claims (11)

1. A sound box, comprising:
the sound box comprises a sound box shell, wherein a first space is defined by the sound box shell, and the sound box shell comprises a first welding part;
the sound cavity shell is located in the first space and comprises a second welding part corresponding to the first welding part, the second welding part is welded with the first welding part, and the sound cavity shell and part of the sound box shell enclose a sound cavity.
2. The sound box of claim 1, wherein the first weld comprises a plurality of first welding units and the second weld comprises a plurality of second welding units, the first welding units being ultrasonically welded to the corresponding second welding units.
3. The sound box of claim 2, wherein the first welding unit comprises a first raised structure and the second welding unit comprises a second recessed structure, the first raised structure extending into the second recessed structure;
or (b)
The first welding unit comprises a first concave structure, and the second welding unit comprises a second convex structure, and the second convex structure penetrates into the first concave structure.
4. The sound box of claim 1, wherein the sound box housing comprises a first shell and a second shell, the first weld being located on either the first shell or the second shell;
the sound cavity shell and part of the first shell or part of the second shell enclose the sound cavity.
5. The sound box of claim 4, wherein the first weld is located on the first housing, the sound cavity housing and a portion of the first housing enclosing the sound cavity;
and a loudspeaker of the sound box is arranged on one side of the first shell, which faces the sound cavity.
6. The sound box of claim 4, wherein the first weld is located on the second housing, the sound cavity housing and a portion of the second housing enclosing the sound cavity;
the loudspeaker of the sound box is arranged on the sound cavity shell, and the sound outlet surface of the loudspeaker faces the sound cavity.
7. The sound box of claim 6, wherein the sound cavity housing further comprises a plurality of blind holes, and the speaker comprises a plurality of embedded structures embedded in the blind holes corresponding to the embedded structures.
8. The sound box of any one of claims 1-7, further comprising:
a passive radiator or an air guide pipe positioned in the sound cavity;
the passive radiator is adhered to the sound cavity shell or the sound box shell;
the air guide pipe is ultrasonically welded with the sound cavity shell or the sound box shell.
9. The sound box of any of claims 4-7, further comprising:
the main board is positioned in the first space and outside the sound cavity;
a power panel on the second housing;
a key sheet located in the first space;
the touch display screen module is positioned at one side of the first shell far away from the first space;
the main board is electrically connected with the power panel, the key board and the touch display screen module.
10. The sound box according to claim 9, wherein the main board includes a plurality of first connectors, and the power panel, the key sheet, and the touch display module each include a second connector corresponding to one of the first connectors;
the first connector and the corresponding second connector are connected by a flexible conductive structure.
11. The sound box of claim 10, wherein the flexible conductive structure comprises a flexible flat cable or a flexible circuit board, the flexible flat cable for connecting the first connector with a second connector located on the keypad or the power panel;
the flexible circuit board is used for connecting the first connector with a second connector positioned on the touch display screen module.
CN202320225226.6U 2023-01-18 2023-01-18 Sound box Active CN219611960U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202320225226.6U CN219611960U (en) 2023-01-18 2023-01-18 Sound box

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202320225226.6U CN219611960U (en) 2023-01-18 2023-01-18 Sound box

Publications (1)

Publication Number Publication Date
CN219611960U true CN219611960U (en) 2023-08-29

Family

ID=87750251

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202320225226.6U Active CN219611960U (en) 2023-01-18 2023-01-18 Sound box

Country Status (1)

Country Link
CN (1) CN219611960U (en)

Similar Documents

Publication Publication Date Title
CN101212838B (en) Sound box structure and mobile electronic device employing the sound box structure
CN214708013U (en) Earphone set
CN205142508U (en) Loudspeaker box
CN107820171B (en) Loudspeaker module
CN101222784B (en) Loudspeaker box structure and mobile electronic equipments adopting the same
CN216122815U (en) Wireless earphone
CN219611960U (en) Sound box
CN216437414U (en) Electronic device
CN106028201A (en) Bone conduction earphone and production method thereof
CN214708007U (en) Earphone set
CN214708005U (en) Earphone set
CN214708018U (en) Earphone set
CN215773497U (en) Active noise reduction Bluetooth headset
CN204929227U (en) Earphone
CN215529218U (en) Stereo set hole, stereo set subassembly and blank all-in-one
CN220210559U (en) Super-bass sound box with passive radiator on two sound paths
CN114257672B (en) Sound production device and electronic equipment
CN218514473U (en) Improved microphone
CN218550134U (en) Wireless earphone with modular combined structure
CN216122816U (en) Wireless earphone
CN214707993U (en) Earphone set
CN214707995U (en) Earphone and ear-hang component thereof
CN214708004U (en) Earphone set
CN213783538U (en) Electronic device
CN215647335U (en) Loudspeaker module

Legal Events

Date Code Title Description
GR01 Patent grant
GR01 Patent grant