CN219611917U - Camera head - Google Patents

Abstract

The utility model provides a camera, and relates to the technical field of camera shooting. The camera comprises a chip, a main board, a radiator and a first heat conduction piece; the chip is provided with a first connecting surface and a second connecting surface which are arranged at intervals along the thickness direction of the chip; the main board is connected with the second connecting surface of the chip; the radiator is provided with a heat conducting surface, the heat conducting surface is connected with the first connecting surface, and the radiator is made of aluminum profiles; the first heat conducting piece is located between the first connecting surface and the heat conducting surface. The radiator made of the aluminum profile has the characteristics of good heat conduction performance, high plasticity and high tensile property, and can be constructed to form a dense radiating structure under the condition of unchanged self size so as to enhance the radiating area and further improve the radiating effect. In the heat dissipation process, the radiator directly transmits the heat of the chip through the first heat conduction piece, so that the heat transmission effect on the chip is enhanced, and the heat dissipation of the chip is promoted. The chip is used as a main heating source of the main board, and the radiator directly radiates heat to the chip, so that the heat radiation effect of the whole main board is improved.

Description

Camera head

Technical Field

The utility model relates to the technical field of camera shooting, in particular to a camera.

Background

In some motoring processes, there is a need to use advanced driving assistance systems to enhance comfort and safety while driving. The camera system in the advanced driving assistance system can analyze scenes in videos and perform graphic processing, as the complexity of the scenes is continuously improved, the resolution and the accuracy of the camera are higher and higher, more heat can be necessarily generated by a circuit board of the camera, and the heat dissipation requirement is higher. In the related art, a heat sink radiates heat from a circuit board, and the heat is transferred to the heat sink by transferring the heat on the circuit board to the air, so as to radiate the heat from the circuit board. However, with the increase of heat dissipation requirements, the heat dissipation effect of the heat sink on the circuit board needs to be improved.

Disclosure of Invention

Based on this, it is necessary to provide a camera so as to meet higher heat dissipation requirements.

The camera comprises a chip, a main board, a radiator and a first heat conduction piece; the chip is provided with a first connecting surface and a second connecting surface which are arranged at intervals along the thickness direction of the chip; the main board is connected with the second connecting surface of the chip; the radiator is provided with a heat conducting surface, the heat conducting surface is connected with the first connecting surface, and the radiator is made of aluminum profiles; the first heat conducting piece is located between the first connecting surface and the heat conducting surface.

It will be appreciated that the motherboard mounts the chip for connection with other components. The radiator is used for radiating the chips on the main board, the radiator made of the aluminum profile has the characteristics of good heat conduction performance, high plasticity and high tensile property, and a dense radiating structure can be formed under the condition of unchanged size of the radiator, so that the radiating area is increased, and the radiating effect is improved. In the heat dissipation process, the radiator directly transmits the heat of the chip through the first heat conduction piece, so that the heat transmission effect on the chip is enhanced, and the heat dissipation of the chip is promoted. The chip is used as a main heating source of the main board, and the radiator directly radiates heat to the chip, so that the heat radiation effect of the whole main board is improved.

In one embodiment, the camera further comprises a second heat conducting piece, and the second heat conducting piece is connected with the main board and is located at one side of the main board, which is away from the chip; and along the thickness direction of the chip, the projection areas of the first heat conduction piece and the second heat conduction piece are respectively overlapped with the projection area of the chip at least partially.

It can be appreciated that the second heat conducting member can further transfer heat on the chip outwards based on the first heat conducting member, so as to enhance the heat dissipation effect on the chip.

In one embodiment, the projected area of the first heat conducting element and the projected area of the second heat conducting element respectively occupy 80% -120% of the projected area of the chip.

It will be appreciated that such an arrangement ensures that the first and second heat-conducting members can cover at least a substantial area of the chip, thereby ensuring a heat-conducting effect.

In one embodiment, the thickness of the first heat conducting member is 25% -55% of the thickness of the chip along the thickness direction of the chip; and/or, the thickness of the second heat conduction piece accounts for 60% -120% of the thickness of the chip along the thickness direction of the chip.

It is understood that by defining the thickness of the first heat conductive member and by the thickness of the second heat conductive member, it is ensured that the first heat conductive member and the second heat conductive member can sufficiently transfer heat.

In one embodiment, the number of the chips is at least two, the chips are arranged at intervals along the first direction, and the first heat conducting piece and the second heat conducting piece are correspondingly assembled on two sides of each chip along the thickness direction of the chip.

It can be understood that the plurality of chips can be used for processing more data, and each chip is provided with the first heat conducting piece and the second heat conducting piece, so that independent heat dissipation can be achieved for each chip, and a good heat dissipation effect is achieved.

In one embodiment, the camera comprises a first housing and a second housing connected to the first housing; the radiator is arranged in the first shell, and the main board is arranged in the second shell; the second shell is internally provided with a supporting bulge, and the supporting bulge is pressed on one side of the second heat conduction piece, which is away from the main board, along the thickness direction of the chip.

It can be understood that the first casing can support the radiator, and the second casing can support the mainboard, and simultaneously, the inside supporting bulge of second casing can press and locate the second heat conduction spare for the first casing compresses tightly the second heat conduction spare after being connected with the second casing, in order to strengthen the heat conduction effect.

In one embodiment, the heat radiator comprises a heat radiating substrate and a plurality of heat radiating protrusions protruding from the heat radiating substrate, and the heat radiating protrusions are distributed at intervals; and a side wall of the heat dissipation substrate, which is away from the heat dissipation protrusion, is defined as the heat conducting surface.

It can be understood that the heat-dissipating substrate is convenient to form a heat-conducting surface, so that the heat-conducting area is increased, the heat transferred by the first heat-conducting member is received, and the heat is transferred to the heat-dissipating protrusion; the heat dissipation bulge can disperse heat into air, and exchanges heat with the air, so that heat dissipation is realized.

In one embodiment, two sides of the heat dissipation substrate along the first direction and the second direction are respectively provided with a connecting part, and the connecting parts are connected with the first shell; the projection areas of the connecting parts are surrounded by a plurality of projection areas of the heat dissipation protrusions along the thickness direction of the chip; wherein the first direction and the second direction are arranged at an angle; the camera also comprises a conductive filling piece, wherein the conductive filling piece is filled between the connecting part and the first shell.

It is understood that the connection portion is convenient for the radiator to be connected with the first housing, and the conductive filler is filled between the radiator and the first housing to prevent static electricity from accumulating.

In one embodiment, each of the connection portions is configured with a connection hole penetrating in a thickness direction of the chip; the camera also comprises a first locking piece, wherein the first locking piece penetrates through the connecting hole to lock the connecting portion with the first shell, and one end of the first locking piece along the axial direction of the first locking piece is abutted to the connecting portion.

It can be appreciated that by providing the connecting hole, it is convenient to cooperate with the first locking member, and the first locking member can pass through the connecting hole to lock the radiator, so that the operation is simple and convenient.

In one embodiment, the first heat conducting member and the second heat conducting member are both provided as a heat conducting glue or a heat conducting pad; and/or the radiator is manufactured through extrusion molding, forging molding or die casting molding.

It can be understood that the first heat conducting piece and the second heat conducting piece are provided with the heat conducting piece or the heat conducting pad, so that the operation is simpler and more convenient. The radiator can be processed by different processes according to different working conditions so as to enhance the radiating effect.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments or the conventional techniques of the present utility model, the drawings required for the descriptions of the embodiments or the conventional techniques will be briefly described below, and it is apparent that the drawings in the following descriptions are only some embodiments of the present utility model, and other drawings may be obtained according to the drawings without inventive effort for those skilled in the art.

FIG. 1 is a cross-sectional view of a camera provided by the present utility model;

FIG. 2 is an enlarged view of a portion of FIG. 1 at A;

FIG. 3 is an exploded view of a camera provided by the present utility model;

fig. 4 is a schematic diagram of the internal structure of a second housing in the camera provided by the utility model;

fig. 5 is a schematic structural diagram of a first housing in the camera provided by the utility model.

Reference numerals: 100. a camera; 10. a chip; 20. a main board; 40. a heat sink; 60. a conductive filler; 70. a camera module; 80. a first locking member; 11. a first connection surface; 12. a second connection surface; 31. a first heat conductive member; 32. a second heat conductive member; 41. a heat-dissipating substrate; 42. a heat radiation protrusion; 51. a first housing; 52. a second housing; 411. a heat conducting surface; 412. a connection part; 521. a supporting protrusion; 4121. and a connection hole.

Detailed Description

In order that the above objects, features and advantages of the utility model will be readily understood, a more particular description of the utility model will be rendered by reference to the appended drawings. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present utility model. The present utility model may be embodied in many other forms than described herein and similarly modified by those skilled in the art without departing from the spirit of the utility model, whereby the utility model is not limited to the specific embodiments disclosed below.

It will be understood that when an element is referred to as being "mounted" or "disposed" on another element, it can be directly on the other element or intervening elements may also be present. When a component is considered to be "connected" to another component, it can be directly connected to the other component or intervening components may also be present. The terms "vertical", "horizontal", "upper", "lower", "left", "right" and the like are used in the description of the present utility model for the purpose of illustration only and do not represent the only embodiment.

Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include at least one such feature. In the description of the present utility model, the meaning of "plurality" means at least two, for example, two, three, etc., unless specifically defined otherwise.

In the present utility model, unless expressly stated or limited otherwise, a first feature "up" or "down" on a second feature may be that the first feature is in direct contact with the second feature, or that the first feature and the second feature are in indirect contact through intermedial media. Moreover, a first feature being "above," "over" and "on" a second feature may be a first feature being directly above or obliquely above the second feature, or simply indicating that the first feature is higher in level than the second feature. The first feature being "under", "below" and "beneath" the second feature may be the first feature being directly under or obliquely under the second feature, or simply indicating that the first feature is less level than the second feature.

Unless defined otherwise, all technical and scientific terms used in the specification of the present utility model have the same meaning as commonly understood by one of ordinary skill in the art to which this utility model belongs. The terminology used in the description of the utility model herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the utility model. The term "and/or" as used in the description of the present utility model includes any and all combinations of one or more of the associated listed items.

Referring to fig. 1 to 5, the present utility model provides a camera 100, wherein the camera 100 includes a chip 10, a motherboard 20, a heat sink 40, and a first heat conductive member 31; the chip 10 has a first connection face 11 and a second connection face 12 arranged at intervals in the thickness direction thereof; the main board 20 is connected with the second connecting surface 12 of the chip 10; the radiator 40 has a heat conducting surface 411, and the heat conducting surface 411 is connected with the first connection surface 11; the first heat conductive member 31 is located between the first connection face 11 and the heat conductive face 411.

In this way, the chip 10 is mounted on the motherboard 20 through the second connection surface 12, so as to perform line connection with other structures on the motherboard 20, thereby realizing the integration of the motherboard 20. During the operation of the chip 10, the heat sink 40 can dissipate heat from the chip 10, so that the chip 10 always keeps normal operation. Specifically, by connecting the first heat conducting member 31 between the heat conducting surface 411 of the heat spreader 40 and the first connection surface 11 of the chip 10, heat of the chip 10 can be quickly transferred to the heat spreader 40, so that a better heat conducting effect is achieved, and heat dissipation of the chip 10 by the heat spreader 40 is promoted. Since the chip 10 is used as the main heat source on the motherboard 20, the heat sink 40 directly dissipates heat to the chip 10, which is beneficial to improving the heat dissipation effect of the entire motherboard 20.

Further, the heat sink 40 is made of an aluminum profile, and the aluminum profile has good heat conductivity, so that the heat transferred from the first heat conductive member 31 can be quickly transferred to the outside, thereby realizing heat dissipation. Meanwhile, under the condition that the heat dissipation requirements are the same, the size of the radiator 40 made of the aluminum profile can be relatively smaller, and the occupied space of the radiator 40 can be reduced under the condition that the heat dissipation effect is unchanged.

As shown in fig. 1, 2, 3 and 5, in an alternative embodiment, the heat sink 40 includes a heat dissipation substrate 41 and a plurality of heat dissipation protrusions 42 protruding from the heat dissipation substrate 41, where the plurality of heat dissipation protrusions 42 are arranged at intervals; a side wall of the heat dissipating substrate 41 facing away from the heat dissipating protrusion 42 is defined as a heat conducting surface 411. In this way, the heat dissipation substrate 41 can provide support for the plurality of heat dissipation protrusions 42, and at the same time, can also be in contact with the first heat conductive member 31 in a large area to enhance the heat transfer effect. Further, the heat dissipating substrate 41 transfers heat to the plurality of heat dissipating protrusions 42, and the plurality of heat dissipating protrusions 42 dissipate the heat to the air for exchanging heat with the ambient air. In some specific embodiments, the heat dissipating protrusions 42 may be provided as heat dissipating teeth or fins, which are easy to manufacture.

In a further embodiment, the heat sink 40 is made by extrusion. The radiator 40 manufactured by extrusion molding has the characteristics of beautiful appearance, light weight and good heat radiation performance, and can realize a light design on the basis of ensuring the heat radiation effect. In other embodiments, the heat sink 40 may also be formed by forging or die casting.

As shown in fig. 1 to 3, in an alternative embodiment, the camera 100 further includes a second heat conducting member 32, where the second heat conducting member 32 is connected to the main board 20 and located on a side of the main board 20 facing away from the chip 10; the projected areas of the first heat conductive member 31 and the second heat conductive member 32 respectively overlap with the projected area of the chip 10 at least partially in the thickness direction of the chip 10. That is, in the thickness direction of the chip 10, the projection area of the first connection surface 11 overlaps at least the projection area of the first heat conductive member 31, and the projection area of the second connection surface 12 overlaps at least the projection area of the second heat conductive member 32. In this way, the second heat conducting member 32 is arranged on the basis of the first heat conducting member 31, so that both sides of the chip 10 along the thickness direction of the chip can quickly transfer heat outwards, and the heat dissipation effect on the chip 10 is accelerated. Specifically, a part of the heat of the chip 10 is transferred to the first heat conducting member 31, another part is transferred to the main board 20, the main board 20 is further transferred to the second heat conducting member 32, and the second heat conducting member 32 is further transferred to the outside.

In a further embodiment, the projected area of the first heat conducting member 31 and the projected area of the second heat conducting member 32 respectively occupy 80% -120% of the projected area of the chip 10. In this way, the first heat conducting member 31 can at least cover a large part of the area of the first connecting surface 11, and the second heat conducting member 32 can at least cover a large part of the area of the second connecting surface 12, so as to ensure that the first heat conducting member 31 and the second heat conducting member 32 have sufficient heat conducting area to ensure heat conducting speed and heat conducting effect. In some specific embodiments, the projected area of the first heat conducting member 31 and the projected area of the second heat conducting member 32 each occupy 80%, 100% or 120% of the projected area of the chip 10.

In an alternative embodiment, the thickness of the first heat conductive member 31 is 25% -55% of the thickness of the chip 10 in the thickness direction of the chip 10. Thus, the first heat conductive member 31 has a smaller thickness, which can reduce the obstruction of heat transfer, ensure the heat transfer effect, and transfer heat to the heat sink 40 through the heat radiation effect while transferring heat through the first heat conductive member 31, so that the heat transfer effect is better. In some embodiments, the thickness of the first heat conductive member 31 is 25%, 35% or 55% of the thickness of the chip 10 in the thickness direction of the chip 10.

In an alternative embodiment, the thickness of the second heat conducting member 32 is 60% -120% of the thickness of the chip 10 in the thickness direction of the chip 10. In this way, the chip 10 has a better heat transfer effect due to the thinner thickness of the second heat conducting member 32, and the second heat conducting member 32 has a thicker thickness than the first heat conducting member 31, so that the heat can be dissipated outwards as much as possible, and the residence on the motherboard 20 is reduced. In some embodiments, the thickness of the second heat conductive member 32 is 60%, 90% or 120% of the thickness of the chip 10 in the thickness direction of the chip 10.

In an alternative embodiment, the first heat conducting member 31 and the second heat conducting member 32 are both made of a heat conducting glue, and the heat conducting glue has good heat conducting performance and good adhesion, and when the heat sink 40 is pressed against the first heat conducting member 31, the first heat conducting member 31 has sufficient pressure-resistant capability, so that the gap between the first heat conducting member 31 and the heat sink 40 or between the first heat conducting member 31 and the chip 10 can be reduced, so as to achieve a better heat conducting effect. In other embodiments, the first heat conducting member 31 and the second heat conducting member 32 may be provided as heat conducting pads, respectively, and may be reused, and is convenient to install. Of course, one of the first heat conducting member 31 and the second heat conducting member 32 may be configured as a heat conducting glue, and the other may be configured as a heat conducting pad, which is specific to the actual working condition.

As shown in fig. 1 to 4, in an alternative embodiment, the number of chips 10 is at least two, and are arranged at intervals along the first direction, and each of the chips 10 is correspondingly equipped with a first heat conductive member 31 and a second heat conductive member 32 on both sides in the thickness direction thereof. In this manner, providing at least two chips 10 enables more data to be processed so that the camera head 100 can carry higher resolution and higher accuracy. When being provided with two at least chips 10, all set up first heat conduction spare 31 to every chip 10, make every chip 10 all obtain the heat dissipation, promote holistic radiating effect.

As shown in fig. 1, 3, 4 and 5, in an alternative embodiment, the camera 100 includes a first housing 51 and a second housing 52 connected to the first housing 51; the radiator 40 is mounted on the first housing 51 _。 In this way, the first housing 51 provides support for the heat sink 40, so that the connection between the heat sink 40 and the first heat conducting member 31 can be realized while the first housing 51 and the second housing 52 are connected, so that the heat dissipation of the heat sink 40 to the chip 10 can be realized conveniently. In a specific embodiment, the heat dissipating substrate 41 is located in the first housing 51, and the heat dissipating protrusions 42 protrude from the first housing 51 so as to dissipate heat into the surrounding air.

Further, the main board 20 is installed in the second housing 52; the second housing 52 is internally provided with a supporting protrusion 521, and the supporting protrusion 521 is pressed on one side of the second heat conducting member 32 away from the motherboard 20 along the thickness direction of the chip 10. In this way, the second housing 52 provides support for the motherboard 20, and further, the supporting protrusions 521 on the second housing 52 can generate a pressing force on the second heat conducting member 32 when the first housing 51 is connected with the second housing 52, so that the second heat conducting member 32 is tightly attached to the motherboard 20, reducing the gap between the second heat conducting member 32 and the motherboard 20, and facilitating the improvement of the heat conducting effect. Meanwhile, the supporting protrusions 521 can further transfer the heat transferred by the second heat conducting member 32 to the wall of the second housing 52, and the wall of the second housing 52 dissipates the heat to the air, thereby facilitating heat dissipation.

As shown in fig. 1, 2, 3 and 5, in an alternative embodiment, two sides of the heat dissipation substrate 41 along the first direction and the second direction are configured with connection portions 412, and the connection portions 412 are connected to the first housing 51; along the thickness direction of the chip 10, the projection area of the connection portion 412 encloses the projection areas of the plurality of heat dissipation protrusions 42, wherein the first direction and the second direction are disposed at an angle. In this way, the heat dissipating substrate 41 has a larger area for connection with the first housing 51, has a higher connection strength, and is more stable during installation.

As shown in fig. 2 and 3, in a specific embodiment, each connection portion 412 is configured with a connection hole 4121 penetrating in the thickness direction of the chip 10; the camera 100 further includes a first locking member 80, where the first locking member 80 is disposed through the connection hole 4121 to lock the connection portion 412 with the first housing 51, and one end of the first locking member 80 along the axial direction thereof abuts against the connection portion 412. In this way, the connecting hole 4121 is configured to facilitate the coupling portion 412 to cooperate with the first locking member 80, and the first locking member 80 is simultaneously inserted through the connecting hole 4121 and the first housing 51, so that the coupling portion 412 and the first housing 51 are in a coupling relationship. Specifically, the outer wall of the first locking member 80 is provided with an external thread, the first housing 51 is configured with a threaded hole, the first locking member 80 is in threaded connection with the hole wall of the threaded hole, and when the first locking member 80 is screwed to abut against the connecting portion 412, locking can be achieved.

As shown in fig. 1, 2, 3 and 5, in an alternative embodiment, the camera 100 further includes a conductive filler 60, and the conductive filler 60 is filled between the connection portion 412 and the first housing 51. In this way, the conductive filler 60 has conductivity, and can conduct electrons between the first housing 51 and the heat dissipation substrate 41, and meanwhile, since the first housing 51 and the second housing 52 are connected, the second housing 52 and the parts in the second housing 52 are all in electronic conduction with the first housing 51, so that the electronic conduction of the whole camera 100 is realized, and the effect of preventing static electricity is achieved.

As shown in fig. 1 and 4, in an alternative embodiment, the second housing 52 is configured with a receiving cavity, the camera 100 includes a camera module 70 for capturing images, one end of the camera module 70 is installed in the receiving cavity and electrically connected to the motherboard 20, and the other end extends out of the receiving cavity through the second housing 52. The camera module 70 and the motherboard 20 are electrically connected with Flexible Printed Circuit (FPC) usually, so that the image data acquired by the camera module 70 can be transmitted to the chip 10 on the motherboard 20 for analysis and processing.

The technical features of the above-described embodiments may be arbitrarily combined, and all possible combinations of the technical features in the above-described embodiments are not described for brevity of description, however, as long as there is no contradiction between the combinations of the technical features, they should be considered as the scope of the description.

The above examples illustrate only a few embodiments of the utility model, which are described in detail and are not to be construed as limiting the scope of the claims. It should be noted that it will be apparent to those skilled in the art that several variations and modifications can be made without departing from the spirit of the utility model, which are all within the scope of the utility model. Accordingly, the scope of the utility model should be determined from the following claims.

Claims (10)

1. A camera head, characterized in that the camera head (100) comprises:

a chip (10) having a first connection surface (11) and a second connection surface (12) which are arranged at intervals in the thickness direction thereof;

a main board (20) connected to the second connection surface (12) of the chip (10);

a heat sink (40) having a heat conducting surface (411), the heat conducting surface (411) being connected to the first connection surface (11), the heat sink (40) being made of an aluminum profile;

a first heat conducting member (31) located between the first connection surface (11) and the heat conducting surface (411).

2. The camera head according to claim 1, wherein the camera head (100) further comprises a second heat conducting member (32), the second heat conducting member (32) being connected to the main board (20) and being located on a side of the main board (20) facing away from the chip (10);

along the thickness direction of the chip (10), the projection areas of the first heat conducting piece (31) and the second heat conducting piece (32) are at least partially overlapped with the projection area of the chip (10) respectively.

3. The camera according to claim 2, characterized in that the projected area of the first heat conducting member (31) and the projected area of the second heat conducting member (32) each occupy 80% -120% of the projected area of the chip (10).

4. The camera according to claim 2, characterized in that the thickness of the first heat conducting member (31) is 25% -55% of the thickness of the chip (10) in the thickness direction of the chip (10); and/or, the thickness of the second heat conduction member (32) accounts for 60% -120% of the thickness of the chip (10) along the thickness direction of the chip (10).

5. The camera according to any one of claims 2 to 4, wherein the number of the chips (10) is at least two, and the chips are arranged at intervals along the first direction, and each of the chips (10) is provided with the first heat conductive member (31) and the second heat conductive member (32) on both sides in the thickness direction thereof.

6. The camera according to claim 2, characterized in that the camera (100) comprises a first housing (51) and a second housing (52) connected to the first housing (51); the radiator (40) is installed in the first shell (51), and the main board (20) is installed in the second shell (52);

the second shell (52) is internally provided with a supporting protrusion (521), and the supporting protrusion (521) is pressed on one side of the second heat conducting piece (32) which is away from the main board (20) along the thickness direction of the chip (10).

7. The camera according to claim 6, wherein the heat sink (40) comprises a heat dissipation substrate (41) and a plurality of heat dissipation protrusions (42) protruding from the heat dissipation substrate (41), and the plurality of heat dissipation protrusions (42) are arranged at intervals;

a side wall of the heat dissipation substrate (41) facing away from the heat dissipation protrusion (42) is defined as the heat conduction surface (411).

8. The camera head according to claim 7, wherein both sides of the heat dissipation substrate (41) in the first direction and the second direction are configured with connection portions (412), the connection portions (412) being connected with the first housing (51); along the thickness direction of the chip (10), the projection area of the connecting part (412) is surrounded by the projection areas of the plurality of heat dissipation bulges (42); wherein the first direction and the second direction are arranged at an angle;

the camera (100) further comprises a conductive filling member (60), and the conductive filling member (60) is filled between the connecting portion (412) and the first shell (51).

9. The camera head according to claim 8, wherein each of the connection portions (412) is configured with a connection hole (4121) penetrating in a thickness direction of the chip (10);

the camera (100) further comprises a first locking piece (80), the first locking piece (80) is arranged in the connecting hole (4121) in a penetrating mode so as to lock the connecting portion (412) with the first shell (51), and one end of the first locking piece (80) in the axial direction of the camera is abutted to the connecting portion (412).

10. The camera according to claim 2, characterized in that the first heat conducting member (31) and the second heat conducting member (32) are each provided as a heat conducting glue or a heat conducting pad; and/or the heat sink (40) is made by extrusion, forging or die casting.