CN219610412U - Chip packaging structure - Google Patents
Chip packaging structure Download PDFInfo
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- CN219610412U CN219610412U CN202320441710.2U CN202320441710U CN219610412U CN 219610412 U CN219610412 U CN 219610412U CN 202320441710 U CN202320441710 U CN 202320441710U CN 219610412 U CN219610412 U CN 219610412U
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- sealing ring
- chip
- inflatable sealing
- package structure
- liquid metal
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Abstract
The utility model discloses a chip packaging structure, and belongs to the technical field of chips. The chip packaging structure comprises a bottom plate, a chip, an air sealing ring, liquid metal and a radiator, wherein the chip is arranged on the bottom plate, the air sealing ring is arranged on the bottom plate, an inner ring of the air sealing ring is sleeved on the periphery of the chip, the height of the air sealing ring is higher than that of the chip in the axial direction of the air sealing ring, the liquid metal is arranged above the chip, the liquid metal is arranged inside the inner ring of the air sealing ring, and the radiator is arranged above the air sealing ring to seal the liquid metal. The chip packaging structure has the advantages of convenient installation, simple structure, convenient use and maintenance, and longer service life of the liquid metal.
Description
Technical Field
The utility model relates to the technical field of chip manufacturing, in particular to a chip packaging structure.
Background
In recent years, liquid metal has gained wide acceptance in the heat dissipation field by various technological companies, and packaging structures accompanying the application of liquid metal have also grown endlessly.
The current liquid metal packaging structure mainly adopts the organic combination of a plurality of layers of foam and sealant to prevent the oxidation and leakage of the liquid metal. Wherein, the multilayer foam structure is complicated, and the processing degree of difficulty is big. The foam is easy to compress, and support materials are needed to be added in the using process, so that the construction steps and the difficulty are increased.
Disclosure of Invention
The utility model aims to solve at least one of the technical problems in the related art to a certain extent, can improve the tightness of the liquid metal, reduce the construction difficulty, solve the oxidation and leakage phenomena of the liquid metal in the application process and ensure the excellent performance of the liquid metal as a heat conducting material on the premise of not influencing the heat radiation performance of the liquid metal.
For this purpose, an embodiment of the present utility model proposes a chip package structure.
The chip packaging structure according to the embodiment of the utility model comprises: the chip is arranged on the bottom plate; the inflatable sealing ring is arranged on the bottom plate, the inner ring of the inflatable sealing ring is sleeved on the periphery of the chip, and the height of the inflatable sealing ring is higher than that of the chip in the axial direction of the inflatable sealing ring; the liquid metal is arranged above the chip and is positioned inside the inner ring of the inflatable sealing ring; and the radiator is arranged above the inflatable sealing ring so as to seal the liquid metal.
According to the chip packaging structure provided by the embodiment of the utility model, the inflatable sealing ring is arranged on the bottom plate, the shape and the size of the inner ring of the inflatable sealing ring are approximately consistent with the peripheral outline of the chip, and the height of the inflatable sealing ring is higher than that of the chip. Thus, a notch structure can be formed over the chip. The liquid metal is arranged in the notch structure, the radiator is arranged above the air-filled sealing ring, and a closed space is formed among the radiator, the air-filled sealing ring and the chip, so that the sealing of the liquid metal is realized.
In some embodiments, the chip packaging structure further comprises an electronic component, the electronic component is arranged on the bottom plate, and the inflatable sealing ring is buckled above the electronic component.
In some embodiments, the chip packaging structure further comprises an insulating film, the insulating film is arranged above the electronic component, and the inflatable sealing ring is buckled above the insulating film.
In some embodiments, the material of the inflatable sealing ring is ethylene propylene diene monomer rubber, silicone rubber, nitrile rubber or fluororubber.
In some embodiments, one or more aeration nozzles are arranged on the inflatable sealing ring, and the inflatable sealing ring is inflated through the aeration nozzles.
In some embodiments, the gas within the inflatable sealing ring is one or more of nitrogen, helium, neon, argon, krypton, and xenon.
In some embodiments, the pressure of the inflatable sealing ring does not exceed 0.49MPa.
In some embodiments, the cross-sectional shape of the inflatable sealing ring is circular, rectangular, trapezoidal, D-shaped, C-shaped, V-shaped, or M-shaped.
In some embodiments, the chip packaging structure further comprises a fixing member, the radiator is disposed above the inflatable sealing ring, and the fixing member fixedly connects the radiator with the bottom plate.
In some embodiments, the securing member is a threaded member.
It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the disclosure. Other features and aspects of the present disclosure will become apparent from the following detailed description of exemplary embodiments, which proceeds with reference to the accompanying drawings.
Drawings
In order to more clearly illustrate the embodiments of the present utility model or the technical solutions in the prior art, the drawings that are needed in the description of the embodiments or the prior art will be briefly described, and it is obvious that the drawings in the description below are some embodiments of the present utility model, and other drawings can be obtained according to the drawings without inventive effort for a person skilled in the art.
Fig. 1 is a schematic diagram of a chip package structure according to one embodiment of the utility model.
Reference numerals:
the chip packaging structure 100 comprises gas 1, electronic components 2, chips 3, an insulating film 4, an inflatable sealing ring 5, liquid metal 6, a radiator 7 and a bottom plate 8.
Detailed Description
The technical solutions of the present utility model will be clearly and completely described in connection with the embodiments, and it is apparent that the described embodiments are some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.
The utility model aims to make the packaging structure of the liquid metal more convenient and practical, reduce the construction difficulty, solve the problems of oxidization and leakage of the liquid metal in the application process, ensure the excellent performance of the liquid metal as a heat conducting material and provide a choice for packaging the liquid metal.
The utility model aims to solve at least one of the technical problems in the related art to a certain extent, can improve the tightness of the liquid metal, reduce the construction difficulty, solve the oxidation and leakage phenomena of the liquid metal in the application process and ensure the excellent performance of the liquid metal as a heat conducting material on the premise of not influencing the heat radiation performance of the liquid metal.
For this purpose, an embodiment of the present utility model proposes a chip package structure.
As shown in fig. 1, fig. 1 is a schematic diagram of a chip package structure according to an embodiment of the present utility model.
The chip package structure 100 according to an embodiment of the present utility model includes a bottom plate 8, a chip 3, an air-packing ring 5, a liquid metal 6, and a heat sink 7.
The chip 3 is arranged on the bottom plate 8, the inflatable sealing ring 5 is arranged on the bottom plate 8, the inner ring of the inflatable sealing ring 5 is sleeved on the periphery of the chip 3, and the height of the inflatable sealing ring 5 is higher than that of the chip 3 in the axial direction of the inflatable sealing ring 5.
Specifically, as shown in fig. 1, the bottom plate 8 has a substantially square flat plate structure, and the upper surface of the bottom plate 8 is a plane. The chip 3 is disposed on the upper surface of the bottom plate 8, and the air-packing ring 5 is also disposed on the upper surface of the bottom plate 8. Wherein, the chip 3 is located in the inner ring of the inflatable sealing ring 5, and the height of the inflatable sealing ring 5 is higher than the height of the chip 3 in the axial direction of the inflatable sealing ring 5, thereby forming a notch structure above the chip 3.
The liquid metal 6 is arranged above the chip 3, the liquid metal 6 is positioned inside the inner ring of the inflatable sealing ring 5, and the radiator 7 is arranged above the inflatable sealing ring 5 to seal the liquid metal 6.
It is understood that liquid metal refers to an amorphous metal, which can be considered as a mixture of a positive ionic fluid and free electron gas, and also an amorphous, flowable liquid metal.
In the utility model, the liquid metal 6 is arranged above the chip 3, and the liquid metal 6 can flow into the gap between the inner ring of the inflatable sealing ring 5 and the side wall of the chip 3, thereby further improving the sealing property and the structural stability of the chip 3.
According to the chip packaging structure 100 of the embodiment of the utility model, by disposing the air-filled sealing ring 5 on the bottom plate 8, the shape and the size of the inner ring of the air-filled sealing ring 5 are substantially consistent with the outline of the periphery of the chip 3, and the height of the air-filled sealing ring 5 is higher than that of the chip 3. Thereby, a recess structure can be formed above the chip 3. The liquid metal 6 is arranged in the notch structure, the radiator 7 is arranged above the inflatable sealing ring 5, and a closed space is formed among the radiator 7, the inflatable sealing ring 5 and the chip 3, so that the sealing of the liquid metal 6 is realized.
In some embodiments, as shown in fig. 1, the chip package structure 100 further includes an electronic component 2, the electronic component 2 is disposed on the bottom plate 8, and the air-filled sealing ring 5 is fastened above the electronic component 2.
Specifically, as shown in fig. 1, a plurality of electronic components 2 may be disposed around the chip 3, the shape of the air-packing 5 is substantially a flip-flop structure, the air-packing 5 is disposed on the bottom plate 8, and the air-packing 5 is flip-flop on the electronic components 2. Thereby, the firmness of the inflatable sealing ring 5 and the electronic component 2 is further improved, and the overall stability of the chip packaging structure 100 is improved.
In some embodiments, as shown in fig. 1, the chip package structure 100 further includes an insulating film 4, the insulating film 4 is disposed above the electronic component 2, and the air-filled sealing ring 5 is fastened above the insulating film 4.
It will be appreciated that during the packaging process, the operator first needs to clean the upper surface of the electronic component 2, after the cleaning is completed. An operator attaches an insulating film 4 to the upper surface of the electronic component 2. Wherein, insulating film 4 has carried out insulating treatment to electronic components 2 effectively, and secondly, insulating film 4 has improved the planarization of electronic components 2 upper surface, is favorable to installing inflatable seal 5 in electronic components 2 top.
In some embodiments, as shown in fig. 1, the material of the inflatable sealing ring 5 is ethylene propylene diene monomer rubber, silicone rubber, nitrile rubber or fluororubber.
It will be appreciated that the material of the inflatable sealing ring 5 is different and the application environment is also different, and in the present utility model, a designer may select the inflatable sealing ring 5 with different material according to different application environments.
For example, fluororubber has high temperature resistance, can be used in an environment of-30 ℃ to +250 ℃, and has strong oxidant resistance, oil resistance and acid and alkali resistance. Is generally used in high temperature, high vacuum and high pressure environments, and is suitable for oil environments. Because of various excellent properties, fluororubber is widely used in the departments of petroleum, chemical industry, aviation, aerospace and the like.
The silicone rubber has outstanding high and low temperature resistance, keeps good use elasticity in the temperature range of-70 ℃ to +260 ℃, has the advantages of ozone resistance, weather resistance, aging resistance and the like, and is suitable for being used as a sealing gasket in a thermal machine. Can be used for manufacturing heat insulation, insulating products and medical rubber products because of no toxicity.
Nitrile rubber has excellent oil resistance, aromatic solvent and other properties, but does not resist ketone, ester, chloridized channel and other mediums, so that the oil-resistant sealing product mainly adopts nitrile rubber.
The neoprene rubber has good oil resistance, solvent resistance, chemical medium resistance and other properties, but does not resist aromatic oil, and is characterized by excellent weather aging resistance and ozone aging resistance. In the production process, the door and window sealing strip, the diaphragm and the general vacuum sealing product are usually made of neoprene;
ethylene propylene diene monomer rubber has good temperature resistance, weather aging resistance and ozone aging resistance, and is generally most widely used in door and window sealing strips and automobile industry.
The polytetrafluoroethylene composite rubber is a novel sealing material compounded by using polytetrafluoroethylene and high-quality fully-finished rubber as materials and adopting a special production process, integrates the respective excellent characteristics of the polytetrafluoroethylene and the rubber, and ensures that the product has excellent corrosion resistance, high temperature resistance, no toxicity, anti-sticking property and good elasticity and sealing property.
In some embodiments, as shown in fig. 1, the matched air charging device of the chip packaging structure 100 is an air compressor (not shown), and one or more air charging nozzles are arranged on the air charging sealing ring 5, so that the air compressor can charge air into the air charging sealing ring 5 through the air charging nozzles.
It is understood that an air compressor, collectively referred to as an air compressor, is a device for compressing a gas. In the utility model, the air compressor can compress and inject the air into the inflatable sealing ring 5, thereby being beneficial to improving the performance of the inflatable sealing ring 5 for preventing thermal expansion and contraction and improving the sealing effect of the inflatable sealing ring 5.
In particular, in the present utility model, the heat sink 7 applies a pressure to the inflatable sealing ring 5 in the non-operating state of the chip 3, ensuring that the liquid metal 6 does not leak out of the inflatable sealing ring 5. The temperature of the chip 3 rises in the working process, the gas 1 in the inflatable sealing ring 5 expands, and the pressure of the radiator 7 on the inflatable sealing ring 5 is added, so that the sealing performance is better.
In some embodiments, as shown in fig. 1, the gas 1 within the inflatable sealing ring 5 is one or more of nitrogen, helium, neon, argon, krypton, and xenon.
It is understood that the rare gas or inert gas refers to group 18 elements of the periodic table of elements. At normal temperature and pressure, they are colorless and odorless monoatomic gases, and chemical reactions are difficult to carry out. There are six naturally occurring rare gases, namely helium (He), neon (Ne), argon (Ar), krypton (Kr), xenon (Xe) and radioactive radon (Rn).
In the utility model, radioactive radon (Rn) is not selected, and other naturally-occurring rare gases and nitrogen are selected as the gases in the inflatable sealing ring 5, so that the harm of the inflatable sealing ring 5 is reduced.
In some embodiments, the matched inflator of the chip package 100 further includes a pressure limiting valve (not shown) disposed at the air outlet end of the air compressor, and the air compressor charges the air sealing ring 5 through the pressure limiting valve and the air vent.
It will be appreciated that the wall thickness of the inflatable sealing ring 5 is relatively thin and that the inflatable sealing ring 5 is easily damaged when the inflation pressure is too high. In the present utility model, the inflation pressure of the air compressor can be limited by the pressure limiting valve.
In some embodiments, as shown in FIG. 1, the inflation pressure of the pressure limiting valve is between 0MPa and 0.49MPa.
Further, in the utility model, the inflation pressure of the pressure limiting valve is between 0MPa and 0.49MPa, which is beneficial to improving the safety of the inflatable sealing ring 5 in the inflation process.
In some embodiments, as shown in FIG. 1, the cross-sectional shape of the inflatable sealing ring 5 is circular, rectangular, trapezoidal, D-shaped, C-shaped, V-shaped, or M-shaped.
It will be appreciated that in actual production, the shape, structure and dimensions of the chip 3 are varied, and the operator can design the shape, structure and dimensions of the inflatable sealing ring 5 accordingly according to the actual situation.
In some embodiments, as shown in fig. 1, the chip package structure 100 further includes a fixing member (not shown), where the heat spreader 7 is disposed above the inflatable sealing ring 5, and the fixing member fixedly connects the heat spreader 7 with the bottom plate 8, and preferably, the fixing member is a screw member.
It will be appreciated that in the present utility model, the fixing member is used to fix the heat sink 7.
In the description of the present utility model, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings are merely for convenience in describing the present utility model and simplifying the description, and do not indicate or imply that the device or element being referred to must have a specific orientation, be configured and operated in a specific orientation, and therefore should not be construed as limiting the present utility model.
Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include at least one such feature. In the description of the present utility model, the meaning of "plurality" means at least two, for example, two, three, etc., unless specifically defined otherwise.
In the present utility model, unless explicitly specified and limited otherwise, the terms "mounted," "connected," "secured," and the like are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally formed; may be mechanically connected, may be electrically connected or may be in communication with each other; either directly or indirectly, through intermediaries, or both, may be in communication with each other or in interaction with each other, unless expressly defined otherwise. The specific meaning of the above terms in the present utility model can be understood by those of ordinary skill in the art according to the specific circumstances.
In the present utility model, unless expressly stated or limited otherwise, a first feature "up" or "down" a second feature may be the first and second features in direct contact, or the first and second features in indirect contact via an intervening medium. Moreover, a first feature being "above," "over" and "on" a second feature may be a first feature being directly above or obliquely above the second feature, or simply indicating that the first feature is level higher than the second feature. The first feature being "under", "below" and "beneath" the second feature may be the first feature being directly under or obliquely below the second feature, or simply indicating that the first feature is less level than the second feature.
For purposes of this disclosure, the terms "one embodiment," "some embodiments," "example," "a particular example," or "some examples," etc., mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the utility model. In this specification, schematic representations of the above terms are not necessarily directed to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Furthermore, the different embodiments or examples described in this specification and the features of the different embodiments or examples may be combined and combined by those skilled in the art without contradiction.
While embodiments of the present utility model have been shown and described above, it will be understood that the above embodiments are illustrative and not to be construed as limiting the utility model, and that variations, modifications, alternatives and variations may be made to the above embodiments by one of ordinary skill in the art within the scope of the utility model.
Claims (10)
1. A chip package structure, comprising:
the chip is arranged on the bottom plate;
the inflatable sealing ring is arranged on the bottom plate, the inner ring of the inflatable sealing ring is sleeved on the periphery of the chip, and the height of the inflatable sealing ring is higher than that of the chip in the axial direction of the inflatable sealing ring;
the liquid metal is arranged above the chip and is positioned inside the inner ring of the inflatable sealing ring;
and the radiator is arranged above the inflatable sealing ring so as to seal the liquid metal.
2. The chip packaging structure of claim 1, further comprising an electronic component disposed on the base plate, the inflatable sealing ring being fastened above the electronic component.
3. The chip packaging structure according to claim 2, further comprising an insulating film disposed above the electronic component, wherein the air-filled sealing ring is fastened above the insulating film.
4. The chip package structure of claim 1, wherein the semiconductor package structure comprises a plurality of semiconductor chips,
the inflatable sealing ring is made of ethylene propylene diene monomer rubber, silicon rubber, nitrile rubber or fluororubber.
5. The chip packaging structure according to claim 1, wherein one or more aeration nozzles are provided on the inflatable sealing ring, and the inflatable sealing ring is inflated through the aeration nozzles.
6. The chip package structure of claim 5, wherein,
the gas in the inflatable sealing ring is any one of nitrogen, helium, neon, argon, krypton and xenon.
7. The chip package structure of claim 6, wherein the semiconductor package structure comprises a plurality of semiconductor chips,
the pressure of the inflatable sealing ring is not more than 0.49MPa.
8. The chip package structure of claim 1, wherein the semiconductor package structure comprises a plurality of semiconductor chips,
the cross section of the inflatable sealing ring is circular, rectangular, trapezoidal, D-shaped, C-shaped, V-shaped or M-shaped.
9. The chip package structure of claim 1, further comprising a fixing member disposed above the inflatable sealing ring, the fixing member fixedly connecting the heat sink with the bottom plate.
10. The chip package structure of claim 9, wherein the fixing member is a screw member.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320441710.2U CN219610412U (en) | 2023-03-09 | 2023-03-09 | Chip packaging structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320441710.2U CN219610412U (en) | 2023-03-09 | 2023-03-09 | Chip packaging structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219610412U true CN219610412U (en) | 2023-08-29 |
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ID=87743809
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202320441710.2U Active CN219610412U (en) | 2023-03-09 | 2023-03-09 | Chip packaging structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN219610412U (en) |
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2023
- 2023-03-09 CN CN202320441710.2U patent/CN219610412U/en active Active
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