CN219610141U

CN219610141U - Thick film chip resistor with anti-drop structure

Info

Publication number: CN219610141U
Application number: CN202320313457.2U
Authority: CN
Inventors: 张天仁
Original assignee: Dayi Technology Electronic Dongguan Co ltd
Current assignee: Dayi Technology Electronic Dongguan Co ltd
Priority date: 2023-02-25
Filing date: 2023-02-25
Publication date: 2023-08-29
Anticipated expiration: 2033-02-25

Abstract

The utility model relates to the technical field of resistors, in particular to a thick film wafer resistor with an anti-falling structure, which comprises a substrate, wherein two sliding grooves are formed in the bottom surface of the substrate, sliding holes are formed in the inner walls of the sliding grooves, and limit grooves are formed in one side of each sliding groove; the bottom end of the tinning layer is provided with a cutting matched with the limit groove in an inserting way, and the cutting is provided with a clamping hole; the clamping rod is clamped with the clamping hole and limits the cutting in the limiting groove; under the action of the spring, the guide rod, the clamping rod and the like: under the action of the elasticity of the spring, the tail end of the clamping rod is clamped into the clamping hole by abutting against the sliding block, the cutting is limited in the limiting groove under the limitation of the clamping rod, the tin plating layer and the nickel plating layer can be firmly and stably installed at the two ends of the base body by matching with the inserting connection between the cutting and the limiting groove, the connection stability between the tin plating layer and the nickel plating layer and the base body is ensured, and the normal use of the thick film wafer resistor is ensured.

Description

Thick film chip resistor with anti-drop structure

Technical Field

The utility model relates to the technical field of resistors, in particular to a thick film wafer resistor with an anti-falling structure.

Background

The thick film chip resistor is a resistor printed by a thick film process, the thick film resistor layer is a mixture of metal oxides, and the surface-mounted chip resistor is provided with an electrotinned external terminal and is used for welding a circuit board; the thick film chip resistor mainly comprises a substrate, a nickel plating layer, a tin plating layer, a resistor layer, an electrode and the like.

Currently, in order to protect the silver electrode, a protective layer is required to be electroplated on the outer side of the thick film chip resistor, and in general, the protective layer is a nickel layer and a tin layer, however, in the process of using the thick film chip resistor, the nickel layer and the tin layer are easily separated from the substrate under the influence of temperature and service time, so that the normal use of the thick film chip resistor is adversely affected, and in view of the above, we propose a thick film chip resistor with an anti-falling structure.

Disclosure of Invention

The utility model aims to provide a thick film wafer resistor with an anti-falling structure, so as to solve the problem that the nickel and tin layers in the background art are easy to separate from the substrate, thereby adversely affecting the normal use of the thick film wafer resistor.

In order to achieve the above purpose, the present utility model provides the following technical solutions:

the thick film chip resistor with the anti-falling structure comprises a thick film chip resistor;

the thick film chip resistor comprises a substrate, wherein two sliding grooves are formed in the bottom surface of the substrate, sliding holes are formed in the inner wall of each sliding groove, and limit grooves are formed in one side of each sliding groove; both ends of the matrix are provided with tinning layers, the bottom ends of the tinning layers are provided with cutting bars which are spliced and matched with the limit grooves, and the cutting bars are provided with clamping holes;

the sliding groove is internally provided with a sliding block in a sliding way, one side wall of the sliding block is provided with a guide rod which is in sliding connection with the sliding hole, the guide rod is sleeved with springs for propping against the sliding block, the other side wall of the sliding block is provided with a clamping rod, and the clamping rod is clamped with the clamping hole and limits the cutting in the limiting groove.

Preferably, an outer protective layer is arranged on the top surface of the substrate, and a resistor layer is arranged in the outer protective layer; the inner wall of the tin plating layer is provided with a nickel plating layer, the inner wall of the nickel plating layer is provided with a side electrode, the inner wall of the side electrode is provided with two electrodes, and the electrode positioned above the side electrode is inserted into the resistor layer.

Preferably, the sliding block is tightly adhered with the guide rod and the clamping rod respectively, and the sliding block, the guide rod and the clamping rod are all manufactured products made of plastic materials.

Preferably, the size of the cutting is matched with the size of the limit groove, and the cutting and the tinning layer are ceramic finished products.

Preferably, the whole shape of the tin plating layer is U-shaped, and the nickel plating layer is embedded on the inner wall of the tin plating layer.

Preferably, a poking hole is formed in the bottom surface of the sliding block, and the poking hole is circular in cross section.

Compared with the prior art, the utility model has the beneficial effects that:

under the action of the spring, the guide rod, the clamping rod and the like: under the action of the elasticity of the spring, the tail end of the clamping rod is clamped into the clamping hole by abutting against the sliding block, the cutting is limited in the limiting groove under the limitation of the clamping rod, the tin plating layer and the nickel plating layer can be firmly and stably installed at the two ends of the base body by matching with the inserting connection between the cutting and the limiting groove, the connection stability between the tin plating layer and the nickel plating layer and the base body is ensured, and the normal use of the thick film wafer resistor is ensured.

Drawings

FIG. 1 is a schematic diagram of the overall structure of the present utility model;

FIG. 2 is a second schematic diagram of the overall structure of the present utility model;

FIG. 3 is a cross-sectional view of a thick film wafer resistor in accordance with the present utility model;

FIG. 4 is an enlarged schematic view of the portion A of FIG. 3 according to the present utility model;

FIG. 5 is a schematic view of the structure of the substrate according to the present utility model;

fig. 6 is a cross-sectional view of a portion of the structure of a thick film wafer resistor in accordance with the present utility model.

In the figure:

1. a thick film chip resistor; 10. an outer protective layer; 101. a resist layer; 11. a base; 111. a chute; 112. a limit groove; 113. a slide hole; 12. a slide block; 13. a guide rod; 14. a spring; 15. a clamping rod; 16. tinning; 161. cutting; 1611. a clamping hole; 17. a nickel plating layer; 18. a side electrode; 19. an electrode.

Detailed Description

The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.

The embodiment provides a technical scheme:

referring to fig. 1-6, a thick film chip resistor with anti-drop structure includes a thick film chip resistor 1. The thick film chip resistor 1 comprises a substrate 11, wherein an outer protective layer 10 is arranged on the top surface of the substrate 11, and a resistor layer 101 is arranged in the outer protective layer 10; the inner wall of the tin plating layer 16 is provided with a nickel plating layer 17, the inner wall of the nickel plating layer 17 is provided with a side electrode 18, the inner wall of the side electrode 18 is provided with two electrodes 19, and the electrode 19 positioned above is inserted into the resistor layer 101;

further, two sliding grooves 111 are formed in the bottom surface of the base 11, sliding holes 113 are formed in the inner wall of the sliding groove 111, and limit grooves 112 are formed in one side of the sliding groove 111; both ends of the base body 11 are provided with tin plating layers 16, the bottom ends of the tin plating layers 16 are provided with cutting 161 which are in plug-in fit with the limit grooves 112, and the cutting 161 is provided with a clamping hole 1611; a sliding block 12 is slidably arranged in the sliding groove 111, a guide rod 13 which is slidably connected with the sliding hole 113 is arranged on one side wall of the sliding block 12, springs 14 for propping up the sliding block 12 are sleeved on the guide rod 13, a clamping rod 15 is arranged on the other side wall of the sliding block 12, and the clamping rod 15 is clamped with the clamping hole 1611 and limits the cutting 161 in the limiting groove 112; the tail end of the clamping rod 15 is clamped into the clamping hole 1611, the cutting 161 is limited in the limiting groove 112 under the limitation of the clamping rod 15, and the tin plating layer 16 and the nickel plating layer 17 can be firmly and stably installed at the two ends of the base body 11 by matching the inserting connection between the cutting 161 and the limiting groove 112.

In this embodiment, the slider 12 is tightly adhered to the guide rod 13 and the clamping rod 15, and the slider 12, the guide rod 13 and the clamping rod 15 are all made of plastic materials, so that the connection in an adhering and fixing manner is firm and stable, and meanwhile, the plastic materials have the advantages of insulation and low production cost, and are relatively applicable.

In this embodiment, the size of the cutting 161 is matched with the size of the limiting groove 112, and the cutting 161 and the tin plating layer 16 are integrally formed, so that the integrally formed structure has better structural strength, the stability of the tin plating layer 16 is improved, and the cutting 161 can be stably matched with the limiting groove 112.

In this embodiment, the substrate 11 is a ceramic product, and the ceramic product has good insulation performance, so that the stability of the thick film chip resistor 1 after packaging can be improved.

In this embodiment, the overall shape of the tin plating layer 16 is U-shaped, and the nickel plating layer 17 is embedded on the inner wall of the tin plating layer 16, which is convenient for installing the tin plating layer 16 and the nickel plating layer 17 at both ends of the substrate 11, and improves the installation stability.

In this embodiment, the bottom surface of the slider 12 is provided with a poking hole, and the cross-sectional shape of the poking hole is circular, so that the slider 12 can be conveniently poked to move horizontally through the poking hole, so that the clamping rod 15 is conveniently separated from the limit groove 112, and the tin plating layer 16 and the nickel plating layer 17 can be conveniently installed.

When the tin plating device is specifically used, a user firstly inserts the cutting 161 in alignment with the limiting groove 112, simultaneously inserts the cutting 161 into the poking hole by using a screwdriver and the like and pokes the sliding block 12 to slide along the sliding groove 111, the guide rod 13 slides along the sliding hole 113, the spring 14 is compressed by the sliding block 12, and meanwhile the clamping rod 15 is separated from the limiting groove 112, at the moment, the cutting 161 is continuously pushed so that the cutting 161 moves along the limiting groove 112, when the clamping hole 1611 aligns with the clamping rod 15, under the elastic action of the spring 14, the clamping rod 15 is inserted into the clamping hole 1611, and at the moment, the tin plating layer 16 is installed and fixed at two ends of the base body 11.

The foregoing has shown and described the basic principles, principal features and advantages of the utility model. It will be understood by those skilled in the art that the present utility model is not limited to the above-described embodiments, and that the above-described embodiments and descriptions are only preferred embodiments of the present utility model, and are not intended to limit the utility model, and that various changes and modifications may be made therein without departing from the spirit and scope of the utility model as claimed. The scope of the utility model is defined by the appended claims and equivalents thereof.

Claims

1. The thick film chip resistor with the anti-falling structure comprises a thick film chip resistor (1), and is characterized in that:

the thick film chip resistor (1) comprises a base body (11), wherein two sliding grooves (111) are formed in the bottom surface of the base body (11), sliding holes (113) are formed in the inner wall of each sliding groove (111), and limit grooves (112) are formed in one side of each sliding groove (111); both ends of the base body (11) are provided with tin plating layers (16), the bottom ends of the tin plating layers (16) are provided with cutting bars (161) which are in plug-in fit with the limit grooves (112), and the cutting bars (161) are provided with clamping holes (1611);

the sliding groove (111) is internally provided with a sliding block (12), one side wall of the sliding block (12) is provided with a guide rod (13) which is in sliding connection with the sliding hole (113), the guide rod (13) is sleeved with springs (14) which are used for propping up the sliding block (12), the other side wall of the sliding block (12) is provided with a clamping rod (15), and the clamping rod (15) is clamped with the clamping hole (1611) and limits the cutting (161) in the limiting groove (112).

2. The thick film chip resistor with anti-pull-off structure of claim 1, wherein: an outer protective layer (10) is arranged on the top surface of the substrate (11), and a resistor layer (101) is arranged in the outer protective layer (10); the inner wall of the tin plating layer (16) is provided with a nickel plating layer (17), the inner wall of the nickel plating layer (17) is provided with a side electrode (18), the inner wall of the side electrode (18) is provided with two electrodes (19), and the electrode (19) positioned above is inserted into the resistor layer (101).

3. The thick film chip resistor with anti-pull-off structure of claim 1, wherein: the sliding block (12) is tightly adhered to the guide rod (13) and the clamping rod (15) respectively, and the sliding block (12), the guide rod (13) and the clamping rod (15) are all manufactured products made of plastic materials.

4. The thick film chip resistor with anti-pull-off structure of claim 1, wherein: the size of the cutting (161) is matched with the size of the limiting groove (112), and the cutting (161) and the tin-plating layer (16) are of an integrated structure.

5. The thick film chip resistor with anti-pull-off structure of claim 1, wherein: the substrate (11) is a ceramic manufactured product.

6. The thick film chip resistor with anti-pull-off structure of claim 1, wherein: the whole shape of the tinning layer (16) is U-shaped, and the nickel plating layer (17) is embedded on the inner wall of the tinning layer (16).

7. The thick film chip resistor with anti-pull-off structure of claim 1, wherein: the bottom surface of the sliding block (12) is provided with a poking hole, and the cross section of the poking hole is circular.