CN219603673U - Silicon wafer carrier plate and coating device - Google Patents

Abstract

The utility model relates to a silicon wafer carrier plate and a film plating device. The silicon wafer carrier plate comprises a carrier plate body and a plurality of limiting components, wherein the carrier plate body is provided with a coating window, the limiting components are arranged around the periphery of the coating window at intervals, the limiting components jointly enclose to form a coating region for accommodating the silicon wafer, each limiting component comprises a flexible piece and an elastic piece, one end of each elastic piece is connected with the carrier plate body, and the other end of each elastic piece is connected with the corresponding flexible piece. The silicon wafer carrier plate prevents the silicon wafer from hard collision with the flexible piece during feeding, and further avoids the problem of edge breakage or scratch of the silicon wafer, so that the film coating yield of the battery piece is improved, the reworking times are reduced, and the production efficiency of the battery piece is improved.

Description

Silicon wafer carrier plate and coating device

Technical Field

The utility model relates to the technical field of solar cells, in particular to a silicon wafer carrier plate and a film plating device.

Background

With the rapid development of technology, the problems of energy shortage and the like are also coming, and among the existing sustainable energy sources, solar energy is definitely the cleanest, most common and most potential alternative energy source, so the solar cell industry is also rapidly developing.

Solar cells are typically made from silicon wafers by cleaning, texturing, PVD (Physical Vapor Deposition ) coating, screen printing, and the like. In the PVD coating process, the silicon wafer is placed on a carrier, the carrier serves as a carrier to hold the silicon wafer, and then a film is coated on the silicon wafer through a coating device. The carrier plate is generally provided with a clamping point in a protruding mode for limiting the silicon wafer and preventing the silicon wafer from displacement in the film plating conveying process. However, during the process of silicon wafer feeding or conveying, the silicon wafer is easy to collide with the clamping point, so that the abnormal problems of edge breakage or scratch and the like of the silicon wafer are caused, and the yield and the production efficiency of the battery piece are seriously affected.

Disclosure of Invention

Based on this, it is necessary to provide a silicon wafer carrier and a coating device for improving the yield and the production efficiency of the coating of the battery piece.

The utility model provides a silicon chip carrier plate, includes carrier plate body and a plurality of spacing subassembly, the carrier plate body is equipped with the coating film window, a plurality of spacing subassembly centers on the peripheral interval setting of coating film window, and a plurality of spacing subassembly encloses jointly and closes the coating film region that forms to be used for the holding silicon chip, every spacing subassembly all includes flexible piece and elastic component, elastic component one end with carrier plate body coupling, the elastic component other end with the flexible piece is connected.

The technical scheme is further described as follows:

in one embodiment, a slope is formed on one side of the flexible member, which is close to the coating window.

In one embodiment, the ramp is coated with a lubricious coating.

In one embodiment, the carrier plate body is provided with a blind hole, one end of the elastic element is arranged in the blind hole, and the other end of the elastic element penetrates out of the blind hole and is connected with the flexible element.

In one embodiment, each of the limiting assemblies includes a plurality of elastic members, and the plurality of elastic members are disposed between the flexible member and the carrier body at intervals.

In one embodiment, at least two of the limiting assemblies are arranged in a one-to-one opposite manner in the length direction of the coating window; and/or, at least two limiting assemblies are arranged in a one-to-one opposite manner in the width direction of the coating window.

In one embodiment, the distance between the two limiting assemblies oppositely arranged in the width direction of the coating window is 105 mm-106 mm; the width of the flexible piece in the width direction of the coating window is 5 mm-6 mm.

In one embodiment, a retaining wall is arranged around the periphery of the coating window, a plurality of limiting assemblies are arranged at intervals along the retaining wall, and the flexible piece abuts against the retaining wall.

In one embodiment, the carrier plate body is provided with a plurality of coating windows, and the periphery of each coating window is provided with a plurality of limiting components.

The utility model also provides a coating device which comprises the silicon wafer carrier plate.

When the silicon wafer carrier plate and the film coating device are used for feeding the silicon wafer, the silicon wafer is firstly contacted with the flexible piece, the elastic piece below the flexible piece is extruded to be elastically compressed, and meanwhile, the flexible piece is elastically deformed, so that acting force between the silicon wafer and the flexible piece can be effectively buffered, hard collision between the silicon wafer and the limiting component during feeding is avoided, the problem that the silicon wafer is broken or scratched is avoided, the film coating yield of the silicon wafer is improved, reworking times are reduced, and the production efficiency of the battery piece is further improved.

Drawings

The accompanying drawings, which are included to provide a further understanding of the utility model and are incorporated in and constitute a part of this specification, illustrate embodiments of the utility model and together with the description serve to explain the utility model.

In order to more clearly illustrate the technical solutions of the embodiments of the present utility model, the drawings required for the description of the embodiments will be briefly described below, and it is apparent that the drawings in the following description are only some embodiments of the present utility model, and other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.

Moreover, the figures are not drawn to a 1:1 scale, and the relative sizes of various elements are merely exemplary in the figures, and are not necessarily drawn to true scale. In the drawings:

fig. 1 is a schematic structural diagram of a silicon wafer carrier according to an embodiment.

Fig. 2 is a cross-sectional view of the silicon wafer carrier shown in fig. 1 at section A-A.

Fig. 3 is a partial view of the silicon wafer carrier shown in fig. 2.

Reference numerals illustrate:

10. a carrier plate body; 11. a coating window; 12. a retaining wall; 20. a limit component; 21. a flexible member; 211. a slope; 22. an elastic member; 30. and (3) a silicon wafer.

Detailed Description

In order that the above objects, features and advantages of the utility model will be readily understood, a more particular description of the utility model will be rendered by reference to the appended drawings. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present utility model. The present utility model may be embodied in many other forms than described herein and similarly modified by those skilled in the art without departing from the spirit of the utility model, whereby the utility model is not limited to the specific embodiments disclosed below.

In the description of the present utility model, it should be understood that, if any, these terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., are used herein with respect to the orientation or positional relationship shown in the drawings, these terms refer to the orientation or positional relationship for convenience of description and simplicity of description only, and do not indicate or imply that the apparatus or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore should not be construed as limiting the utility model.

Furthermore, the terms "first," "second," and the like, if any, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include at least one such feature. In the description of the present utility model, the terms "plurality" and "a plurality" if any, mean at least two, such as two, three, etc., unless specifically defined otherwise.

In the present utility model, unless explicitly stated and limited otherwise, the terms "mounted," "connected," "secured," and the like are to be construed broadly. For example, the two parts can be fixedly connected, detachably connected or integrated; can be mechanically or electrically connected; either directly or indirectly, through intermediaries, or both, may be in communication with each other or in interaction with each other, unless expressly defined otherwise. The specific meaning of the above terms in the present utility model can be understood by those of ordinary skill in the art according to the specific circumstances.

In the present utility model, unless expressly stated or limited otherwise, the meaning of a first feature being "on" or "off" a second feature, and the like, is that the first and second features are either in direct contact or in indirect contact through an intervening medium. Moreover, a first feature being "above," "over" and "on" a second feature may be a first feature being directly above or obliquely above the second feature, or simply indicating that the first feature is level higher than the second feature. The first feature being "under", "below" and "beneath" the second feature may be the first feature being directly under or obliquely below the second feature, or simply indicating that the first feature is less level than the second feature.

It will be understood that if an element is referred to as being "fixed" or "disposed" on another element, it can be directly on the other element or intervening elements may also be present. If an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and the like as used herein, if any, are for descriptive purposes only and do not represent a unique embodiment.

An embodiment of the utility model provides a silicon wafer carrier plate which is used for carrying a silicon wafer when the silicon wafer is coated. Specifically, referring to fig. 1 and 2, the silicon wafer carrier in an embodiment includes a carrier body 10 and a plurality of limiting assemblies 20, the carrier body 10 is provided with a film coating window 11, the plurality of limiting assemblies 20 are disposed around the periphery of the film coating window 11 at intervals, and the plurality of limiting assemblies 20 jointly enclose to form a film coating area for accommodating the silicon wafer 30, each limiting assembly 20 includes a flexible member 21 and an elastic member 22, one end of the elastic member 22 is connected with the carrier body 10, and the other end of the elastic member 22 is connected with the flexible member 21.

Specifically, the flexible member 21 is made of a flexible material, for example, a flexible material such as a flexible fluorocarbon with a low friction coefficient, high temperature resistance and high pressure resistance, which can generate reversible elastic deformation when the flexible member 21 is pressed. The elastic member 22 may be a spring, and when the flexible member 21 is pressed, the elastic member 22 is compressed and stores elastic potential energy.

Further, when the silicon wafer 30 is fed, the silicon wafer 30 is firstly contacted with the flexible piece 21, the elastic piece 22 positioned below the flexible piece 21 is extruded to be elastically compressed, and meanwhile, the flexible piece 21 is elastically deformed, so that acting force between the silicon wafer 30 and the flexible piece 21 can be effectively buffered, hard collision between the silicon wafer 30 and the flexible piece 21 during feeding is avoided, the problem that the silicon wafer 30 is broken or scratched is avoided, the silicon wafer coating yield is improved, the reworking times are reduced, and the production efficiency of the battery piece is further improved.

Referring to fig. 2, in an embodiment, a slope 211 is formed on a side of the flexible member 21 near the film plating window 11, that is, along a direction near the film plating window 11, the thickness of the flexible member 21 in a direction perpendicular to the carrier plate body 10 is gradually reduced, so that when the film plating accuracy of the automated equipment is insufficient and the silicon wafer 30 is not accurately placed in the film plating area, the silicon wafer 30 will firstly lean against the slope 211 of the flexible member 21, and as the silicon wafer 30 gradually slides down along the slope 211 of the flexible member 21 under the influence of gravity, the elastic member 22 gradually recovers and lifts up the flexible member 21, thereby playing a role of regulating the position of the silicon wafer 30, accurately guiding the silicon wafer 30 into the film plating area, reducing the film plating offset problem caused by the position offset of the silicon wafer 30, further improving the film plating yield of the battery piece, reducing the reworking times, and further improving the production efficiency of the battery piece. Preferably, the slope 211 may be a cambered surface or a slope.

Further, the slope surface 211 is coated with a smooth coating, so that friction force between the silicon wafer 30 and the slope surface 211 is reduced, and the silicon wafer 30 can slide into a coating area along the slope surface 211 more smoothly. Preferably, the smooth coating can be a graphene coating, and the graphene coating has low friction coefficient, corrosion resistance and heat resistance, and can effectively prolong the service life of the flexible member 21.

Optionally, in an embodiment, the carrier body 10 is provided with a blind hole, one end of the elastic member 22 is disposed in the blind hole, and the other end of the elastic member 22 penetrates the blind hole and is connected to the flexible member 21. The blind hole can play the pre-positioning effect to the elastic piece 22 to can install a plurality of spacing subassemblies 20 in the periphery of coating film window 11 fast, improve production efficiency, simultaneously through setting up the elastic piece 22 in the blind hole, also improve the connection stability of elastic piece 22 and carrier plate body 10.

Further, each of the limiting assemblies 20 includes a plurality of elastic members 22, and the plurality of elastic members 22 are disposed between the flexible member 21 and the carrier body 10 at intervals, so as to improve the stability of the up-and-down movement of the flexible member 21.

Further, at least two limiting assemblies 20 are arranged in a one-to-one opposite manner in the length direction (the direction indicated by an arrow S1 in fig. 1) of the coating window 11; for example, in the present embodiment, all the limiting assemblies 20 distributed on both sides of the coating window 11 in the length direction are uniformly and correspondingly arranged, so that the layout of the limiting assemblies is more regular, the automatic assembly is convenient, and the limiting effect on the silicon wafer 30 in the coating region is improved. It will be appreciated that in other embodiments, the spacing members 20 may be disposed at two sides of the coating window 11 in the length direction.

Similarly, at least two limiting assemblies 20 are arranged in a one-to-one opposite manner in the width direction (the direction indicated by an arrow S2 in FIG. 1) of the coating window 11; for example, in the present embodiment, all the limiting members 20 distributed on both sides of the coating window 11 in the width direction are uniformly and correspondingly arranged, so that the automatic manufacturing is also facilitated, and the limiting effect on the silicon wafer 30 in the coating region is improved. It will be appreciated that in other embodiments, the spacing assemblies 20 distributed on both sides of the width direction of the coated window 11 may be positioned in a staggered manner.

Referring to fig. 3, it is preferable that the distance L1 between the two spacing members 20 disposed opposite in the width direction of the coating window 11 is 105mm to 106mm, preferably 105.8mm. The width L2 of the flexible member 21 in the width direction of the coating window 11 is 5mm to 6mm, preferably 5.2mm. The clamping points of the conventional carrier plate and the carrier plate body 10 are integrally formed, and the clamping points are generally made of alloy materials, so that the distance between two oppositely arranged clamping points is generally designed to be larger and is generally designed to be larger than 106.2mmm in order to prevent collision between the clamping points and the silicon wafer 30; the width of the stuck point also needs to be designed to be small, typically less than 5mm, so that there is sufficient space for the coated area to fit into the wafer 30. The spacing components 20 of the utility model are made of flexible materials, and the telescopic elastic piece 22 is arranged below the flexible piece 21, so that the acting force of the flexible piece 21 when contacting with the silicon wafer 30 can be buffered, the distance between the two spacing components 20 which are oppositely arranged can be reduced to 105 mm-106 mm, and the width of the flexible piece 21 is increased to 5 mm-6 mm. The distance between the limiting assemblies 20 is reduced, a better limiting effect can be achieved on the silicon wafer 30, the silicon wafer 30 is not easy to shake in the film plating transmission process, the film on the silicon wafer 30 is even, the film compactness is good, and the electric performance of the battery is greatly improved.

Preferably, the distance from the limiting component 20 to the edge of the coating window 11 is 0.1 mm-0.5 mm, so that the edge of the silicon wafer 30 is conveniently overlapped at the edge of the coating window 11.

Further, referring to fig. 2, a retaining wall 12 is provided around the periphery of the coating window 11, a plurality of limiting assemblies 20 are spaced along the retaining wall 12, and the flexible member 21 abuts against the retaining wall 12, so that the flexible member 21 is kept stable when moving up and down.

Further, the carrier plate body 10 is provided with a plurality of coating windows 11, and a plurality of limiting assemblies 20 are arranged on the periphery of each coating window 11, so that one carrier plate can bear a plurality of silicon wafers 30 at the same time, and the production efficiency is improved.

In another aspect, the present utility model further provides a film plating device, specifically, the film plating device in one embodiment includes the silicon wafer carrier in any one of the above embodiments, where the silicon wafer carrier is used to carry the silicon wafer 30.

When the silicon wafer 30 is fed by the coating device, the silicon wafer 30 is firstly contacted with the flexible piece 21, the elastic piece 22 positioned below the flexible piece 21 is extruded to be elastically compressed, and meanwhile, the flexible piece 21 is elastically deformed, so that acting force between the silicon wafer 30 and the flexible piece 21 can be effectively buffered, hard collision between the silicon wafer 30 and the flexible piece 21 during feeding is avoided, the problem that the silicon wafer 30 is broken or scratched is avoided, the coating yield of the battery piece is improved, the reworking times are reduced, and the production efficiency of the battery piece is further improved.

The technical features of the above-described embodiments may be arbitrarily combined, and all possible combinations of the technical features in the above-described embodiments are not described for brevity of description, however, as long as there is no contradiction between the combinations of the technical features, they should be considered as the scope of the description.

The above examples illustrate only a few embodiments of the utility model, which are described in detail and are not to be construed as limiting the scope of the claims. It should be noted that it will be apparent to those skilled in the art that several variations and modifications can be made without departing from the spirit of the utility model, which are all within the scope of the utility model. Accordingly, the scope of protection of the present utility model is to be determined by the appended claims.

Claims (10)

1. The utility model provides a silicon chip carrier plate, its characterized in that, includes carrier plate body (10) and a plurality of spacing subassembly (20), carrier plate body (10) are equipped with coating film window (11), a plurality of spacing subassembly (20) are around the peripheral interval setting of coating film window (11), and a plurality of spacing subassembly (20) enclose jointly and close the coating film region that forms to be used for holding silicon chip (30), every spacing subassembly (20) all include flexible piece (21) and elastic component (22), the one end of elastic component (22) with carrier plate body (10) are connected, the other end of elastic component (22) with flexible piece (21) are connected.

2. The silicon wafer carrier according to claim 1, wherein a slope (211) is formed on a side of the flexible member (21) adjacent to the coating window (11).

3. The silicon wafer carrier according to claim 2, wherein the ramp (211) is coated with a lubricious coating.

4. The silicon wafer carrier according to claim 1, wherein the carrier body (10) is provided with a blind hole, one end of the elastic member (22) is arranged in the blind hole, and the other end of the elastic member (22) penetrates out of the blind hole and is connected with the flexible member (21).

5. The silicon wafer carrier according to claim 1, wherein each of the limiting assemblies (20) comprises a plurality of elastic members (22), and the plurality of elastic members (22) are arranged between the flexible member (21) and the carrier body (10) at intervals.

6. The silicon wafer carrier according to claim 1, wherein at least two of the limit assemblies (20) are arranged in one-to-one opposition in the length direction of the coating window (11); and/or at least two limiting assemblies (20) are arranged in a one-to-one opposite manner in the width direction of the coating window (11).

7. The silicon wafer carrier according to claim 1, wherein a distance between the two spacing assemblies (20) oppositely arranged in the width direction of the coating window (11) is 105mm to 106mm; and/or the width of the flexible piece (21) in the width direction of the coating window (11) is 5 mm-6 mm.

8. The silicon wafer carrier according to claim 1, wherein a retaining wall (12) is arranged around the periphery of the coating window (11), a plurality of limiting assemblies (20) are arranged at intervals along the retaining wall (12), and the flexible piece (21) is abutted against the retaining wall (12).

9. The silicon wafer carrier according to any one of claims 1 to 8, wherein the carrier body (10) is provided with a plurality of coating windows (11), and a plurality of limiting assemblies (20) are arranged on the periphery of each coating window (11).

10. A coating device comprising a silicon wafer carrier as claimed in any one of claims 1 to 9.