CN219603673U - Silicon wafer carrier plate and coating device - Google Patents

Abstract

The application relates to a silicon chip carrier and a coating device. The silicon chip carrier includes a carrier body and a plurality of limiting components. The carrier body is provided with a coating window, and a plurality of limiting components are arranged at intervals around the periphery of the coating window, and the plurality of limiting components are jointly formed to accommodate In the coating area of the silicon wafer, each limiting component includes a flexible piece and an elastic piece, one end of the elastic piece is connected to the carrier body, and the other end of the elastic piece is connected to the flexible piece. The above-mentioned silicon chip carrier avoids the hard collision between the silicon chip and the flexible part during feeding, thereby avoiding the problem of edge chipping or scratching of the silicon chip, thereby improving the coating yield of the cell, reducing the number of reworks, and thus improving the battery life. film production efficiency.

Description

Silicon wafer carrier and coating device

technical field

The present application relates to the technical field of solar cells, in particular to a silicon chip carrier and a coating device.

Background technique

With the rapid development of science and technology, problems such as energy shortage are also coming one after another. Among the existing sustainable energy sources, solar energy is undoubtedly the cleanest, most common and most potential alternative energy source, so the solar cell industry is also developing rapidly. develop.

Solar cells are usually made of silicon wafers through processes such as washing and texturing, PVD (Physical Vapor Deposition, physical vapor deposition) coating, and screen printing. In the PVD coating process, the silicon wafer needs to be placed on the carrier plate, and the carrier plate is used as a carrier to hold the silicon wafer, and then the silicon wafer is coated with a thin film by the coating equipment. There are usually clamping points on the carrier plate, which are used to limit the position of the silicon wafer and prevent the silicon wafer from being displaced during the coating and conveying process. However, during the feeding or transportation process of silicon wafers, silicon wafers are prone to collide with stuck points, resulting in abnormal problems such as edge chipping or scratches on silicon wafers, which seriously affect the yield rate of cells and the production efficiency of cells.

Contents of the invention

Based on this, it is necessary to provide a silicon chip carrier and a coating device for how to improve the yield rate and production efficiency of the cell coating.

A silicon chip carrier, comprising a carrier body and a plurality of limiting components, the carrier body is provided with a coating window, a plurality of the limiting components are arranged at intervals around the periphery of the coating window, and a plurality of the The limiting components together form a coating area for accommodating silicon wafers, each of the limiting components includes a flexible piece and an elastic piece, one end of the elastic piece is connected to the carrier body, and the other end of the elastic piece is One end is connected with the flexible piece.

The technical scheme is further described below:

In one embodiment, a slope is formed on a side of the flexible member close to the coating window.

In one embodiment, the slope is coated with a smooth coating.

In one of the embodiments, a blind hole is opened on the carrier body, one end of the elastic member is disposed in the blind hole, and the other end of the elastic member passes through the blind hole and connects with the flexible member. file connection.

In one embodiment, each of the limiting components includes a plurality of elastic members, and the plurality of elastic members are arranged at intervals between the flexible member and the carrier body.

In one of the embodiments, at least two of the limiting components are arranged opposite to each other in the length direction of the coating window; and/or, at least two of the limiting components are arranged in the width direction of the coating window One by one relative settings.

In one of the embodiments, the distance between the two limiting components arranged oppositely in the width direction of the coating window is 105 mm to 106 mm; the width of the flexible member in the width direction of the coating window It is 5mm ~ 6mm.

In one of the embodiments, a retaining wall is provided around the outer periphery of the coating window, a plurality of the limiting components are arranged at intervals along the retaining wall, and the flexible member is against the retaining wall.

In one of the embodiments, the carrier body is provided with a plurality of the coating windows, and the periphery of each of the coating windows is provided with a plurality of the limiting components.

The present application also provides a film coating device, which includes the above-mentioned silicon chip carrier.

When the above-mentioned silicon wafer carrier and coating device are feeding silicon wafers, the silicon wafer first contacts with the flexible part, and the elastic part under the flexible part is squeezed and elastically compressed, and the flexible part is also elastically deformed, so that it can effectively buffer The force between the silicon wafer and the flexible part avoids the hard collision between the silicon wafer and the limit component during feeding, thereby avoiding chipping or scratching of the silicon wafer, improving the coating yield of the silicon wafer, and reducing rework The number of times, thereby improving the production efficiency of cells.

Description of drawings

The drawings constituting a part of the application are used to provide further understanding of the application, and the schematic embodiments and descriptions of the application are used to explain the application, and do not constitute an improper limitation to the application.

In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings that need to be used in the description of the embodiments will be briefly introduced below. Obviously, the drawings in the following description are only some embodiments of the present application. For those skilled in the art, other drawings can also be obtained based on these drawings without creative effort.

In addition, the drawings are not drawn on a 1:1 scale, and the relative sizes of the various elements are drawn in the drawings only as examples and not necessarily to true scale. In the attached picture:

FIG. 1 is a schematic structural diagram of a silicon wafer carrier according to an embodiment.

FIG. 2 is a cross-sectional view of the silicon chip carrier shown in FIG. 1 at section A-A.

FIG. 3 is a partial view of the silicon wafer carrier shown in FIG. 2 .

Explanation of reference signs:

10. Carrier body; 11. Coating window; 12. Retaining wall; 20. Limiting component; 21. Flexible part; 211. Slope; 22. Elastic part; 30. Silicon chip.

Detailed ways

In order to make the above-mentioned purpose, features and advantages of the present application more obvious and understandable, the specific implementation manners of the present application will be described in detail below in conjunction with the accompanying drawings. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the application. However, the present application can be implemented in many other ways different from those described here, and those skilled in the art can make similar improvements without departing from the connotation of the present application, so the present application is not limited by the specific embodiments disclosed below.

In the description of the present application, it should be understood that if any of these terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", " Front", "Back", "Left", "Right", "Vertical", "Horizontal", "Top", "Bottom", "Inner", "Outer", "Clockwise", "Counterclockwise", "Axial", "radial", "circumferential", etc., the orientation or positional relationship indicated by these terms is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the application and simplifying the description, rather than indicating Or imply that the device or element referred to must have a specific orientation, be constructed and operate in a specific orientation, and therefore should not be construed as limiting the application.

In addition, if these terms "first" and "second" appear, these terms are used for descriptive purposes only, and cannot be understood as indicating or implying relative importance or implicitly specifying the quantity of indicated technical features. Thus, the features defined as "first" and "second" may explicitly or implicitly include at least one of these features. In the description of the present application, if the term "plurality" appears, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise specifically defined.

In this application, unless otherwise clearly specified and limited, if any terms such as "mounted", "connected", "connected" and "fixed" appear, these terms should be interpreted in a broad sense. For example, it can be a fixed connection, or a detachable connection, or integrated; it can be a mechanical connection, or it can be an electrical connection; it can be a direct connection or an indirect connection through an intermediary, or it can be the internal communication of two components Or the interaction relationship between two elements, unless expressly defined otherwise. Those of ordinary skill in the art can understand the specific meanings of the above terms in this application according to specific situations.

In this application, unless otherwise clearly specified and limited, if there is a similar description that the first feature is "on" or "under" the second feature, the meaning may be that the first and second features are in direct contact, or The first and second features are in indirect contact through an intermediary. Moreover, "above", "above" and "above" the first feature on the second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. "Below", "beneath" and "beneath" the first feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is less horizontally than the second feature.

It should be noted that, if an element is referred to as being “fixed on” or “disposed on” another element, it may be directly on the other element or there may be an intervening element. If an element is considered to be "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. As used herein, the terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions are used for purposes of illustration only and are not intended to be exclusive implementation.

An embodiment of the present application provides a silicon chip carrier, which is used for carrying the silicon chip when the silicon chip is coated. Specifically, referring to FIG. 1 and FIG. 2 , a silicon wafer carrier of an embodiment includes a carrier body 10 and a plurality of limiting components 20, the carrier body 10 is provided with a coating window 11, and a plurality of limiting components 20 surround the coating window 11 is set at intervals, and a plurality of limit components 20 are jointly enclosed to form a coating area for accommodating the silicon wafer 30. Each limit component 20 includes a flexible piece 21 and an elastic piece 22, and one end of the elastic piece 22 is connected to the carrier. The board body 10 is connected, and the other end of the elastic member 22 is connected with the flexible member 21 .

Specifically, the flexible member 21 is made of flexible materials, such as flexible materials such as flexible fluorine rubber with low friction coefficient, high temperature resistance, and high pressure, which can produce reversible elastic deformation when the flexible member 21 is pressed. The elastic member 22 may be a spring, and when the flexible member 21 is pressed, the elastic member 22 is compressed and stores elastic potential energy.

Further, when the silicon wafer 30 is loaded, the silicon wafer 30 first contacts the flexible member 21, and the elastic member 22 located below the flexible member 21 is squeezed and elastically compressed, and at the same time the flexible member 21 is also elastically deformed, thereby effectively Buffering the force between the silicon wafer 30 and the flexible part 21 avoids the hard collision between the silicon wafer 30 and the flexible part 21 during feeding, thus avoiding the chipping or scratching of the silicon wafer 30 and improving the coating quality of the silicon wafer. The efficiency reduces the number of reworks, thereby improving the production efficiency of cells.

Referring to FIG. 2, in one embodiment, a slope 211 is formed on the side of the flexible member 21 close to the coating window 11, that is, along the direction close to the coating window 11, the thickness of the flexible member 21 in the direction perpendicular to the carrier body 10 gradually decreases. small, so that the silicon wafer 30 is not accurately placed in the coating area when the precision of the automation equipment is not enough, the silicon wafer 30 will first lean against the slope 211 of the flexible member 21, and the silicon wafer 30 will Under the influence of gravity, it slides down gradually along the slope 211 of the flexible part 21, and the elastic part 22 gradually recovers and lifts up the flexible part 21, thereby playing the role of regulating the position of the silicon wafer 30, so that the silicon wafer 30 can be accurately guided into the coating film. In the area, the problem of coating film deviation caused by the position deviation of the silicon wafer 30 is reduced, the yield rate of the film coating of the cell is further improved, the number of reworks is reduced, and the production efficiency of the cell is improved. Preferably, the slope 211 may be an arc or a slope.

Further, the slope 211 is coated with a smooth coating, thereby reducing the friction between the silicon wafer 30 and the slope 211 , so that the silicon wafer 30 can slide down the slope 211 into the coating area more smoothly. Preferably, the smooth coating can be a graphene coating. The graphene coating not only has a low friction coefficient, but also has corrosion resistance and heat resistance effects, which can effectively improve the service life of the flexible member 21 .

Optionally, in an embodiment, the carrier body 10 is provided with a blind hole, one end of the elastic member 22 is disposed in the blind hole, and the other end of the elastic member 22 passes through the blind hole and is connected to the flexible member 21 . The blind hole can pre-position the elastic member 22, so that a plurality of stop components 20 can be quickly installed on the periphery of the coating window 11, which improves production efficiency. This ensures the stability of the connection between the elastic member 22 and the carrier body 10 .

Further, each limiting assembly 20 includes a plurality of elastic members 22 , and the plurality of elastic members 22 are arranged at intervals between the flexible member 21 and the carrier body 10 , so as to improve the stability of the flexible member 21 moving up and down.

Further, at least two stop components 20 are arranged opposite to each other in the length direction of the coating window 11 (direction shown by arrow S1 in FIG. 1 ); The limiting components 20 on both sides are provided in one-to-one correspondence, so that the layout of the limiting components is more regular, which facilitates automatic assembly and improves the limiting effect on the silicon wafer 30 in the coating area. Understandably, in other embodiments, the position limiting components 20 distributed on both sides of the coating window 11 in the length direction may also be arranged in staggered positions.

Similarly, at least two stop components 20 are arranged opposite to each other in the width direction of the coating window 11 (direction shown by arrow S2 in FIG. 1 ); The position-limiting components 20 on both sides are provided in a one-to-one correspondence, which facilitates automatic manufacturing and improves the position-limiting effect on the silicon wafer 30 in the coating area. Understandably, in other embodiments, the position limiting components 20 distributed on both sides of the coating window 11 in the width direction may also be arranged in staggered positions.

Referring to FIG. 3 , preferably, the distance L1 between the two limiting components 20 disposed opposite to each other in the width direction of the coating window 11 is 105mm-106mm, preferably 105.8mm. The width L2 of the flexible member 21 in the width direction of the coating window 11 is 5 mm to 6 mm, preferably 5.2 mm. The stuck point of the traditional carrier board is integrally formed with the carrier body 10, and the material of the stuck point is generally an alloy material. In order to prevent collision between the stuck point and the silicon chip 30, it is usually necessary to set the relative The distance between the two card points is designed to be larger, generally greater than 106.2mm; the width of the card point also needs to be designed smaller, generally less than 5mm, so that there is enough space for the silicon wafer 30 in the coating area . However, the limiting assembly 20 of the present application is made of a flexible material, and a stretchable elastic member 22 is arranged under the flexible member 21, so as to buffer the active force when the flexible member 21 contacts the silicon chip 30, so the relative arrangement can be made. The distance between the two limiting components 20 is reduced to 105mm-106mm, and the width of the flexible member 21 is increased to 5mm-6mm. The distance between the limiting components 20 is reduced, which can have a better limiting effect on the silicon wafer 30, so that the silicon wafer 30 is less likely to shake during the coating transmission process, thereby making the film on the silicon wafer 30 more uniform. The thin film has better compactness, which greatly improves the electrical performance of the battery.

Preferably, the distance from the limiting component 20 to the edge of the coating window 11 is 0.1 mm˜0.5 mm, so as to facilitate the edge of the silicon wafer 30 to overlap the edge of the coating window 11 .

Further, referring to FIG. 2 , a retaining wall 12 is provided on the outer periphery of the coating window 11, and a plurality of stopper components 20 are arranged at intervals along the retaining wall 12, and the flexible member 21 abuts against the retaining wall 12, so that the flexible member 21 moves up and down keep steady.

Furthermore, the carrier body 10 is provided with a plurality of coating windows 11 , and a plurality of limiting components 20 are provided on the periphery of each coating window 11 , so that one carrier can carry multiple silicon wafers 30 at the same time, improving production efficiency.

Another aspect of the present application also provides a film coating device. Specifically, the film coating device in one embodiment includes the silicon wafer carrier of any one of the above embodiments, and the silicon wafer carrier is used to carry the silicon wafer 30 .

When the above-mentioned coating device feeds the silicon wafer 30, the silicon wafer 30 first contacts the flexible member 21, and the elastic member 22 located below the flexible member 21 is squeezed and elastically compressed, and the flexible member 21 is also elastically deformed, thereby effectively Buffering the force between the silicon wafer 30 and the flexible part 21 avoids the hard collision between the silicon wafer 30 and the flexible part 21 during feeding, thereby avoiding the chipping or scratching of the silicon wafer 30, thereby improving the coating performance of the cell. The yield rate is reduced, and the number of reworks is reduced, thereby improving the production efficiency of cells.

The technical features of the above-mentioned embodiments can be combined arbitrarily. To make the description concise, all possible combinations of the technical features in the above-mentioned embodiments are not described. However, as long as there is no contradiction in the combination of these technical features, should be considered as within the scope of this specification.

The above-mentioned embodiments only express several implementation modes of the present application, and the description thereof is relatively specific and detailed, but should not be construed as limiting the scope of the patent application. It should be noted that those skilled in the art can make several modifications and improvements without departing from the concept of the present application, and these all belong to the protection scope of the present application. Therefore, the scope of protection of the patent application should be based on the appended claims.

Claims (10)

1. A silicon wafer carrier, characterized in that it comprises a carrier body (10) and a plurality of stop components (20), the carrier body (10) is provided with a coating window (11), and a plurality of said The limiting components (20) are arranged at intervals around the periphery of the coating window (11), and a plurality of the limiting components (20) together form a coating area for accommodating the silicon wafer (30). The limiting components (20) all include a flexible piece (21) and an elastic piece (22), one end of the elastic piece (22) is connected to the carrier body (10), and the other end of the elastic piece (22) One end is connected with the flexible piece (21). 2 . The silicon wafer carrier according to claim 1 , characterized in that, a slope ( 211 ) is formed on a side of the flexible member ( 21 ) close to the coating window ( 11 ). 3 . 3. The silicon wafer carrier according to claim 2, characterized in that, the slope surface (211) is coated with a smooth coating. 4. The silicon wafer carrier according to claim 1, wherein a blind hole is provided on the carrier body (10), and one end of the elastic member (22) is arranged in the blind hole, so that The other end of the elastic piece (22) passes through the blind hole and is connected with the flexible piece (21). 5. The silicon chip carrier according to claim 1, characterized in that, each of the limiting components (20) includes a plurality of elastic members (22), and the plurality of elastic members (22) are spaced apart It is arranged between the flexible member (21) and the carrier body (10). 6. The silicon wafer carrier according to claim 1, characterized in that at least two of the limiting components (20) are arranged opposite to each other in the length direction of the coating window (11); and/or, At least two limiting components (20) are arranged opposite to each other in the width direction of the coating window (11). 7. The silicon wafer carrier according to claim 1, characterized in that, the distance between the two limiting components (20) arranged oppositely in the width direction of the coating window (11) is 105mm- 106mm; and/or, the width of the flexible member (21) in the width direction of the coating window (11) is 5mm-6mm. 8. The silicon wafer carrier according to claim 1, characterized in that, a retaining wall (12) is arranged around the outer periphery of the coating window (11), and a plurality of the limiting components (20) are arranged along the retaining wall. The walls (12) are arranged at intervals, and the flexible member (21) abuts against the retaining wall (12). 9. The silicon chip carrier according to any one of claims 1-8, characterized in that, the carrier body (10) is provided with a plurality of coating windows (11), each of the coating windows The periphery of (11) is provided with a plurality of said limiting components (20). 10. A coating device, characterized in that it comprises the silicon wafer carrier according to any one of claims 1-9.