CN219597651U

CN219597651U - Chip packaging dustproof structure

Info

Publication number: CN219597651U
Application number: CN202320669499.XU
Authority: CN
Inventors: 冯学裕
Original assignee: Chengtian Weiye Ningbo Chip Technology Co ltd
Current assignee: Chengtian Weiye Ningbo Chip Technology Co ltd
Priority date: 2023-03-22
Filing date: 2023-03-22
Publication date: 2023-08-29
Anticipated expiration: 2033-03-22

Abstract

The utility model provides a chip packaging dustproof structure, which comprises a disassembly and assembly component, wherein the disassembly and assembly component comprises a packaging box, a packaging cover, a rectangular hole, a dustproof plate, two mounting blocks, two fixing blocks, two connecting rods and two pulling blocks; the packaging cover is rotationally connected to the packaging box, the rectangular hole is formed in the packaging cover, the dustproof plate is movably connected to the packaging cover, and the two mounting blocks are fixedly mounted on the dustproof plate. According to the utility model, the connecting rod is driven to move by pulling the pull block, the connecting rod drives the fixed block to move, the fixed block slides on the positioning rod, and the fixed block compresses the first spring in the moving process, so that the fixed block does not shade the mounting block any more, and the movable dust guard drives the mounting block to be separated from the corresponding groove, so that a large amount of dust attached to the surface of the dust guard is cleaned, the dust guard is prevented from being blocked after long-time use, the heat generated by the chip is ensured to be dissipated in time, and the influence on the service life of the chip is further reduced.

Description

Chip packaging dustproof structure

Technical Field

The utility model relates to a dustproof structure, in particular to a chip packaging dustproof structure, and belongs to the technical field of electronic equipment.

Background

The chip packaging structure is a packaging structure which wraps the memory chip to avoid the contact between the chip and the outside and prevent the damage of the outside to the chip, impurities and dust in the air are attached to a precise circuit on the chip, so that the electrical performance is reduced, different packaging technologies are greatly different in terms of manufacturing procedures and processes, and the packaging technology plays a vital role in playing a role in the performance of the memory chip after packaging;

after the dust guard of the existing chip package is used for a long time, a large amount of dust blocked outside can adhere to the surface of the dust guard to block holes, so that heat generated by a chip cannot be timely dissipated, and the service life of the chip package is further influenced.

Disclosure of Invention

In view of the foregoing, it is desirable to provide a dustproof structure for chip package, which solves or alleviates the technical problems in the prior art, and at least provides a beneficial choice.

The technical scheme of the embodiment of the utility model is realized as follows: the chip packaging dustproof structure comprises a disassembly and assembly, wherein the disassembly and assembly comprises a packaging box, a packaging cover, a rectangular hole, a dustproof plate, two mounting blocks, two fixing blocks, two connecting rods and two pulling blocks;

the packaging cover is rotationally connected to the packaging box, the rectangular hole is formed in the packaging cover, the dust-proof plate is movably connected to the packaging cover, the two mounting blocks are fixedly mounted on the dust-proof plate, grooves with one side being an opening are formed in the inner walls of the two sides of the rectangular hole, the bottom of the mounting block is in movable contact with the inner wall of the bottom of the corresponding groove, two positioning rods are fixedly connected to the inner wall of one side of the groove, the two fixing blocks are respectively and slidably connected to the corresponding positioning rods, a first spring is welded between one side of the fixing block and the inner wall of one side of the corresponding groove, the first spring is movably sleeved on the corresponding positioning rods, the two connecting rods are respectively and fixedly connected to one side of the corresponding fixing block, the two pulling blocks are respectively and fixedly connected to the end parts of the corresponding connecting rods, and the fixing blocks are in movable contact with the corresponding mounting blocks.

Further preferably, two radiating fins are fixedly connected in the top of the packaging cover.

Further preferably, a fixing component is arranged on one side of the dismounting component, and the fixing component comprises a limiting rod, a moving rod, a square rod and a clamping rod;

the utility model discloses a sealing box, including sealing box, square pole, locating lever, movable rod, square pole, clamping rod, sealing box, locating lever fixed connection in the front side of sealing box, movable rod sliding connection in on the locating lever, square pole fixed connection in the front end of movable rod, clamping rod fixed connection in the rear side of square pole.

Further preferably, a second spring is welded between the rear end of the moving rod and the front side of the packaging box, and the second spring is movably sleeved on the limiting rod.

Further preferably, the front side of the packaging cover is fixedly connected with a rectangular block, a clamping groove is formed in the rectangular block, and the clamping groove is clamped with the clamping rod.

Further preferably, a circular hole is formed in the inner wall of one side of the groove, and the inner wall of the circular hole is in sliding connection with the outer side of the corresponding connecting rod.

Further preferably, the fixing block is provided with two limiting grooves, and the inner walls of the limiting grooves are in sliding connection with the outer sides of the corresponding positioning rods.

Further preferably, the moving rod is provided with a through hole, and the inner wall of the through hole is slidably connected with the outer side of the limiting rod.

By adopting the technical scheme, the embodiment of the utility model has the following advantages:

according to the utility model, the connecting rod is driven to move by pulling the pull block, the connecting rod drives the fixed block to move, the fixed block slides on the positioning rod, and the fixed block compresses the first spring in the moving process, so that the fixed block does not shade the mounting block any more, and the movable dust guard drives the mounting block to be separated from the corresponding groove, so that a large amount of dust attached to the surface of the dust guard is cleaned, the dust guard is prevented from being blocked after long-time use, the heat generated by the chip is ensured to be dissipated in time, and the influence on the service life of the chip is further reduced.

The foregoing summary is for the purpose of the specification only and is not intended to be limiting in any way. In addition to the illustrative aspects, embodiments, and features described above, further aspects, embodiments, and features of the present utility model will become apparent by reference to the drawings and the following detailed description.

Drawings

In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings that are necessary for the description of the embodiments or the prior art will be briefly described, it being obvious that the drawings in the following description are only some embodiments of the utility model and that other drawings can be obtained according to these drawings without inventive effort for a person skilled in the art.

FIG. 1 is a perspective view of the present utility model;

FIG. 2 is a perspective view showing the connection of the package cover and the dust-proof plate according to the present utility model;

FIG. 3 is a perspective view showing the connection of the dust guard and the mounting block of the present utility model;

FIG. 4 is an enlarged block diagram of area A of FIG. 1 in accordance with the present utility model;

fig. 5 is an enlarged block diagram of the area B of fig. 1 according to the present utility model.

Reference numerals: 1. disassembling and assembling the assembly; 2. packaging the box; 3. a package cover; 4. a rectangular hole; 5. a dust-proof plate; 6. a mounting block; 7. a groove; 8. a positioning rod; 9. a fixed block; 10. a first spring; 11. a connecting rod; 12. pulling blocks; 13. a heat radiation fin; 14. a fixing assembly; 15. a limit rod; 16. a moving rod; 17. square rods; 18. a clamping rod; 19. a second spring; 20. rectangular blocks; 21. a clamping groove.

Detailed Description

Hereinafter, only certain exemplary embodiments are briefly described. As will be recognized by those of skill in the pertinent art, the described embodiments may be modified in various different ways without departing from the spirit or scope of the present utility model. Accordingly, the drawings and description are to be regarded as illustrative in nature and not as restrictive.

Embodiments of the present utility model will be described in detail below with reference to the accompanying drawings.

As shown in fig. 1-5, the embodiment of the utility model provides a chip packaging dustproof structure, which comprises a dismounting assembly 1, wherein the dismounting assembly 1 comprises a packaging box 2, a packaging cover 3, a rectangular hole 4, a dustproof plate 5, two mounting blocks 6, two fixing blocks 9, two connecting rods 11 and two pull blocks 12;

the packaging cover 3 is rotationally connected to the packaging box 2, the rectangular hole 4 is formed in the packaging cover 3, the dust-proof plate 5 is movably connected to the packaging cover 3, the two mounting blocks 6 are fixedly mounted on the dust-proof plate 5, grooves 7 with one sides being provided with openings are formed in the inner walls of the two sides of the rectangular hole 4, the bottoms of the mounting blocks 6 are movably contacted with the inner walls of the bottoms of the corresponding grooves 7, two positioning rods 8 are fixedly connected to the inner walls of one side of the grooves 7, two fixing blocks 9 are respectively and slidably connected to the corresponding positioning rods 8, a first spring 10 is welded between one side of each fixing block 9 and the inner wall of one side of the corresponding groove 7, the first spring 10 is movably sleeved on the corresponding positioning rod 8, two connecting rods 11 are respectively and fixedly connected to one side of the corresponding fixing blocks 9, the two pulling blocks 12 are respectively and fixedly connected to the end parts of the corresponding connecting rods 11, and the fixing blocks 9 are in movable contact with the corresponding mounting blocks 6.

In one embodiment, two heat dissipation fins 13 are fixedly connected in the top of the package cover 3, and heat is dissipated through the dust-proof plate 5 by the heat dissipation fins 13.

In one embodiment, one side of the dismounting assembly 1 is provided with a fixing assembly 14, and the fixing assembly 14 comprises a limiting rod 15, a moving rod 16, a square rod 17 and a clamping rod 18;

the gag lever post 15 fixed connection is in the front side of encapsulation box 2, and movable rod 16 sliding connection is on gag lever post 15, and square rod 17 fixed connection is in the front end of movable rod 16, and card pole 18 fixed connection is in the rear side of square rod 17.

In one embodiment, a second spring 19 is welded between the rear end of the moving rod 16 and the front side of the packaging box 2, and the second spring 19 is movably sleeved on the limiting rod 15.

In one embodiment, the front side of the packaging cover 3 is fixedly connected with a rectangular block 20, a clamping groove 21 is formed in the rectangular block 20, the clamping groove 21 is clamped with the clamping rod 18, under the action of the elastic force of the second spring 19, the second spring 19 drives the moving rod 16 to move, and the moving rod 16 drives the clamping rod 18 to be clamped with the clamping groove 21 through the square rod 17, so that the packaging cover 3 can be fixed.

In one embodiment, a circular hole is formed in an inner wall of one side of the groove 7, the inner wall of the circular hole is slidably connected with the outer side of the corresponding connecting rod 11, and the connecting rod 11 is limited through the circular hole, so that when the pull block 12 is pulled, the pull block 12 can only drive the corresponding connecting rod 11 to move left and right, and no offset phenomenon occurs.

In one embodiment, two limiting grooves are formed in the fixing block 9, the inner walls of the limiting grooves are slidably connected with the outer sides of the corresponding positioning rods 8, and the limiting grooves are used for limiting the fixing block 9, so that the connecting rods 11 drive the corresponding fixing block 9 to move, and the fixing block 9 can only move left and right.

In one embodiment, the moving rod 16 is provided with a through hole, the inner wall of the through hole is slidably connected with the outer side of the limiting rod 15, and the limiting rod 15 is used for limiting the moving rod 16, so that when the square rod 17 is pulled, the square rod 17 drives the moving rod 16 to move, and the phenomenon of deviation cannot occur.

The utility model works when in work: during the use, pulling square rod 17, square rod 17 drives movable rod 16 and slides on gag lever post 15, movable rod 16 carries out the extension to second spring 19 at the in-process that removes, square rod 17 drives clamping rod 18 and draw-in groove 21 looks separation, immediately rotate encapsulation lid 3 and place the chip in encapsulation box 2, immediately close encapsulation lid 3, and loosen the pulling force to square rod 17, second spring 19 under the tensile state at this moment resets, under the effect of second spring 19 self elasticity, second spring 19 drives movable rod 16 and removes, movable rod 16 drives clamping rod 18 and draw-in groove 21 looks cartridge through square rod 17 and is fixed encapsulation lid 3, through encapsulation box 2 and encapsulation lid 3 to encapsulate it, dispel the heat through radiating fin 13, dispel the heat through dust guard 5, simultaneously prevent dust through dust guard 5, when needs take down dust guard 5, pulling piece 12 drive corresponding connecting rod 11 remove, connecting rod 11 drive corresponding fixed block 9, fixed block 9 slides on corresponding locating lever 8, fixed block 9 is in the effect of second spring 19 self elasticity, the corresponding piece 10 of moving is compressed by corresponding piece 10, and then prevent to install the time of getting down the corresponding chip 5, thereby prevent the problem of getting down the dust guard 5 from being blocked up, and install the time is long time-out to prevent the dust guard 5 from getting down.

The foregoing is merely illustrative of the present utility model, and the present utility model is not limited thereto, and any person skilled in the art will readily recognize that various changes and substitutions are possible within the scope of the present utility model. Therefore, the protection scope of the present utility model shall be subject to the protection scope of the claims.

Claims

1. The utility model provides a chip package dustproof construction, includes dismouting subassembly (1), its characterized in that: the dismounting assembly (1) comprises a packaging box (2), a packaging cover (3), rectangular holes (4), a dust guard (5), two mounting blocks (6), two fixing blocks (9), two connecting rods (11) and two pulling blocks (12);

the utility model discloses a sealing device, including encapsulation box (2), encapsulation lid (3), rectangular hole (4) set up in on encapsulation lid (3), dust guard (5) swing joint in on encapsulation lid (3), two install piece (6) fixed mounting in on dust guard (5), recess (7) that one side set up for the opening have all been seted up on the both sides inner wall of rectangular hole (4), the bottom of install piece (6) with the bottom inner wall movable contact of recess (7) that corresponds, fixedly connected with two locating levers (8) on the inner wall of one side of recess (7), two fixed block (9) sliding connection respectively in on locating lever (8) that correspond, the welding has first spring (10) between one side of fixed block (9) and the one side inner wall of recess (7) that corresponds, first spring (10) movable sleeve is established on locating lever (8) that correspond, two connecting rod (11) are fixed connection respectively in corresponding to fixed block (9) one side of corresponding fixed block (12) respectively fixed connection with connecting rod (11).

2. The chip package dust-proof structure according to claim 1, wherein: two radiating fins (13) are fixedly connected in the top of the packaging cover (3).

3. The chip package dust-proof structure according to claim 1, wherein: one side of the dismounting assembly (1) is provided with a fixing assembly (14), and the fixing assembly (14) comprises a limiting rod (15), a moving rod (16), a square rod (17) and a clamping rod (18);

the limiting rod (15) is fixedly connected to the front side of the packaging box (2), the moving rod (16) is slidably connected to the limiting rod (15), the square rod (17) is fixedly connected to the front end of the moving rod (16), and the clamping rod (18) is fixedly connected to the rear side of the square rod (17).

4. A chip package dust-proof structure according to claim 3, wherein: a second spring (19) is welded between the rear end of the moving rod (16) and the front side of the packaging box (2), and the second spring (19) is movably sleeved on the limiting rod (15).

5. The chip package dust-proof structure according to claim 1, wherein: the front side of the packaging cover (3) is fixedly connected with a rectangular block (20), a clamping groove (21) is formed in the rectangular block (20), and the clamping groove (21) is clamped with the clamping rod (18).

6. The chip package dust-proof structure according to claim 1, wherein: a circular hole is formed in the inner wall of one side of the groove (7), and the inner wall of the circular hole is in sliding connection with the outer side of the corresponding connecting rod (11).

7. The chip package dust-proof structure according to claim 1, wherein: two limit grooves are formed in the fixing block (9), and the inner walls of the limit grooves are connected with the outer sides of the corresponding positioning rods (8) in a sliding mode.

8. A chip package dust-proof structure according to claim 3, wherein: the movable rod (16) is provided with a through hole, and the inner wall of the through hole is in sliding connection with the outer side of the limit rod (15).