CN219592731U

CN219592731U - Chip mounting device for integrated circuit processing

Info

Publication number: CN219592731U
Application number: CN202320369900.8U
Authority: CN
Inventors: 吴银铭
Original assignee: Shenzhen Aodisai Design Co ltd
Current assignee: Shenzhen Aodisai Design Co ltd
Priority date: 2023-03-02
Filing date: 2023-03-02
Publication date: 2023-08-25
Anticipated expiration: 2033-03-02

Abstract

The utility model provides a chip mounting device for integrated circuit processing, comprising: the processing box is internally provided with a placement component, the placement component comprises two fixing plates, the interiors of the two fixing plates are provided with mounting grooves, the interiors of the two mounting grooves are provided with mounting blocks, and a placement seat is connected between the two mounting blocks; the hydraulic telescopic rod is arranged at the top of the processing box, and the bottom end of the hydraulic telescopic rod is connected with an extrusion plate. According to the patch device for integrated circuit processing, the fixing plates with the mounting grooves are arranged on the two sides of the inner wall of the processing box and matched with the placing seat with the mounting blocks, so that solder paste adhered on the inner wall of the placing seat can be cleaned conveniently after integrated circuit processing is finished.

Description

Chip mounting device for integrated circuit processing

Technical Field

The utility model relates to the field of integrated circuit processing, in particular to a patch device for integrated circuit processing.

Background

An integrated circuit is a miniature electronic device or component, which is made up by interconnecting the transistors, resistors, capacitors and inductors, etc. needed in a circuit and wiring together, and then making them into a miniature structure with needed circuit function by making them on a small or several small semiconductor wafers or dielectric substrates and then packaging them in a tube shell.

After the integrated circuit is manufactured, the circuit is required to be packaged, the packaging method is divided into two types, namely direct insertion type and patch type, the direct insertion type is that pins are made into pins which can be inserted into the pcb and then welded, and the patch type is that the pins are made into a small metal plate and are attached to the pcb by a high-temperature reflow welding method.

The patent application with the publication number of CN215682791U, it is through being provided with the work frame, through being provided with block groove and standing groove in work frame position, at first place the circuit board of waiting to process in the standing groove, place the printing plate in the connecting plate position afterwards, through bolt fixed connection, printing plate and circuit board location promptly, start the pneumatic cylinder later, promote printing plate entering block groove, and printing plate compresses tightly with the circuit board, afterwards, make the solder paste get into on the circuit board along the aperture of printing plate through brushing the solder paste, start the heating lamp through the banks later, wait to solidify the back, start the pneumatic cylinder, make the printing plate keep away from the block groove, and carry out the paster task, after accomplishing the paster, through starting the cylinder, with the circuit board ejecting, accomplish the task, its structure close fit, easy operation promotes work efficiency greatly, but can smear the solder paste now when the integrated circuit board paster operation, and the solder paste glues easily on the device when smearing, cause the later stage to be difficult to clear up.

Accordingly, there is a need to provide a chip mounter for integrated circuit processing that solves the above-mentioned problems.

Disclosure of Invention

The utility model provides a surface mounting device for integrated circuit processing, which solves the problems that solder paste is coated during surface mounting operation of an integrated circuit board, and the solder paste is easy to adhere to the device during coating, so that the later cleaning is difficult.

In order to solve the above technical problems, the present utility model provides a chip device for processing an integrated circuit, comprising:

the processing box is internally provided with a placement component, the placement component comprises two fixing plates, the interiors of the two fixing plates are provided with mounting grooves, the interiors of the two mounting grooves are provided with mounting blocks, and a placement seat is connected between the two mounting blocks;

the hydraulic telescopic rod is arranged at the top of the processing box, and the bottom end of the hydraulic telescopic rod is connected with an extrusion plate.

Preferably, the inside of placing the seat is provided with the dismantlement subassembly, the dismantlement subassembly is including dismantling the frame, dismantle the bilateral symmetry on frame surface and be connected with the locating piece.

Preferably, positioning grooves matched with the two positioning blocks are formed in two sides of the inner wall of the placement seat.

Preferably, a hydraulic rod is installed at the bottom of the processing box.

Preferably, one side of processing case surface is provided with coupling assembling, coupling assembling includes the slide bar, the both sides on slide bar surface all overlap and are equipped with the sliding sleeve, the surface connection of sliding sleeve has the connecting rod.

Preferably, the top of sliding sleeve is provided with the gim peg, a plurality of with gim peg looks adaptation's fixed orifices have been seted up to the surface of slide bar.

Preferably, a separation block is arranged at the center of the surface of the sliding rod.

Compared with the related art, the patch device for integrated circuit processing provided by the utility model has the following beneficial effects:

the utility model provides a paster device for integrated circuit processing, wherein fixing plates with mounting grooves are arranged on two sides of the inner wall of a processing box and matched with a placing seat with mounting blocks, so that solder paste adhered on the inner wall of the placing seat can be cleaned conveniently after the integrated circuit processing is finished.

Drawings

Fig. 1 is a schematic structural diagram of a first embodiment of a chip mounter for processing an integrated circuit according to the present utility model;

FIG. 2 is an enlarged schematic view of portion A shown in FIG. 1;

fig. 3 is a schematic structural diagram of a second embodiment of a chip mounter for processing an integrated circuit according to the present utility model;

fig. 4 is an enlarged schematic view of a portion B shown in fig. 3.

Reference numerals in the drawings: 1. the processing box is provided with a processing box,

2. a placement component 21, a fixing plate 22, a mounting groove 23, a mounting block 24 and a placement seat,

3. a disassembly component 31, a disassembly frame 32, a positioning block 33 and a positioning groove,

4. a hydraulic rod 5, a hydraulic telescopic rod 6 and a squeeze plate,

7. the connecting component 71, the sliding rod 72, the sliding sleeve 73, the connecting rod 74 and the fixing bolt,

8. a separation block.

Detailed Description

The utility model will be further described with reference to the drawings and embodiments.

First embodiment

Referring to fig. 1 and fig. 2 in combination, fig. 1 is a schematic structural diagram of a first embodiment of a chip mounter for processing an integrated circuit according to the present utility model; fig. 2 is an enlarged schematic view of a portion a shown in fig. 1. A chip device for integrated circuit processing, comprising:

the processing box 1, the inside of processing box 1 is provided with and places subassembly 2, place subassembly 2 includes two fixed plates 21, two the inside of fixed plate 21 has all been seted up mounting groove 22, two the inside of mounting groove 22 all is provided with installation piece 23, is connected with between two installation piece 23 and places seat 24;

the two fixing plates 21 are symmetrically connected to the two sides of the inner wall of the processing box 1, and the installation grooves 22 are provided with the matched installation blocks 23, so that the positioning function is realized when the placing seat 24 is installed.

The hydraulic telescopic rod 5, hydraulic telescopic rod 5 install in the top of processing case 1, hydraulic telescopic rod 5's bottom is connected with stripper plate 6.

The inside of placing seat 24 is provided with dismantles subassembly 3, dismantlement subassembly 3 is including dismantling frame 31, dismantle the bilateral symmetry on frame 31 surface and be connected with locating piece 32.

The use of dismantling frame 31 can change the size of dismantling frame 31, uses locating piece 32 and constant head tank 33 be convenient for play the effect of location when dismantling frame 31 installation, when the use when need dismantle frame 31 installation, at first will drive the locating piece 32 dismantle frame 31 and place the constant head tank 33 contact that the seat 24 surface was seted up, after locating piece 32 and constant head tank 33 contact, rethread promotes to dismantle frame 31 and drives locating piece 32 and place the inside constant head tank 33 coincidence of seting up of seat 24.

Positioning grooves 33 matched with the two positioning blocks 32 are formed on two sides of the inner wall of the placement seat 24.

The bottom of the processing box 1 is provided with a hydraulic rod 4.

The hydraulic stem 4 may be used to remove the integrated circuit board after the integrated circuit board is mounted on the mounting base 24.

The utility model provides a patch device for integrated circuit processing, which has the following working principle:

when in use, when the placing seat 24 needs to be cleaned, the placing seat 24 is pulled to move to the outer side of the processing box 1, and when the placing seat 24 moves, the mounting blocks 23 on two sides are driven to move in the mounting grooves 22 formed in the fixing plate 21, and when the placing seat 24 moves, the mounting blocks 23 are driven to be separated from the mounting grooves 22, so that the placing seat 24 can be cleaned.

the utility model provides a chip mounting device for integrated circuit processing, wherein fixing plates 21 with mounting grooves 22 are arranged on two sides of the inner wall of a processing box 1, and a placing seat 24 with mounting blocks 23 is matched for use, so that solder paste adhered on the inner wall of the placing seat 24 can be cleaned conveniently after integrated circuit processing is finished.

Second embodiment

Referring to fig. 3 and fig. 4 in combination, a first embodiment of the present utility model provides a chip mounter for processing an integrated circuit, and a second embodiment of the present utility model provides another chip mounter for processing an integrated circuit. The second embodiment is merely a preferred manner of the first embodiment, and implementation of the second embodiment does not affect the implementation of the first embodiment alone.

Specifically, the second embodiment of the present utility model provides a chip mounter for integrated circuit processing, which is different in that a connection assembly 7 is disposed on one side of a surface of the processing box 1, the connection assembly 7 includes a slide bar 71, sliding sleeves 72 are respectively sleeved on two sides of the surface of the slide bar 71, and a connecting rod 73 is connected to the surface of the sliding sleeve 72.

Both ends of slide bar 71 all are connected with the rectangle piece, and one side of rectangle piece is connected with one side of processing case 1 surface, uses slide bar 71 and sliding sleeve 72 be convenient for adjust the interval between two connecting rods 73 according to dismantling the size of frame 31, uses dead bolt 74 can fix sliding sleeve 72 on the surface of slide bar 71, prevents that connecting rod 73 from appearing the displacement when using.

The top of the sliding sleeve 72 is provided with a fixing bolt 74, and the surface of the sliding rod 71 is provided with a plurality of fixing holes matched with the fixing bolt 74.

A separation block 8 is arranged at the center of the surface of the sliding rod 71.

when the sliding sleeve 72 is used, the connecting rod 73 is pulled to drive the sliding sleeve 72 to move on the surface of the sliding rod 71, and after the connecting rod 73 moves to a proper position, the fixing bolt 74 penetrates through the surface of the sliding sleeve 72 and is connected with the fixing hole formed in the surface of the sliding rod 71.

the utility model provides a paster device for integrated circuit processing, wherein a slide bar 71 with a slide sleeve 72 is arranged on one side of the surface of a processing box 1 and matched with a connecting rod 73 for use, so that the paster device is beneficial to placing when a disassembly frame 31 is not used.

The foregoing description is only illustrative of the present utility model and is not intended to limit the scope of the utility model, and all equivalent structures or equivalent processes or direct or indirect application in other related technical fields are included in the scope of the present utility model.

Claims

1. A chip mounter for integrated circuit processing, comprising:

2. The chip mounter for integrated circuit processing according to claim 1, wherein a detaching assembly is provided inside said placement base, said detaching assembly includes a detaching frame, and positioning blocks are symmetrically connected to both sides of a surface of said detaching frame.

3. The chip mounter for integrated circuit processing according to claim 2, wherein positioning grooves adapted to two positioning blocks are formed on both sides of an inner wall of said placement base.

4. The chip mounter for integrated circuit processing according to claim 1, wherein a hydraulic rod is mounted to a bottom of said processing tank.

5. The chip mounter for integrated circuit processing according to claim 1, wherein a connecting component is arranged on one side of the surface of said processing box, said connecting component comprises a slide bar, sliding sleeves are respectively sleeved on two sides of the surface of said slide bar, and a connecting rod is connected to the surface of said sliding sleeve.

6. The chip mounter for integrated circuit processing according to claim 5, wherein a fixing bolt is provided at a top of said sliding sleeve, and a plurality of fixing holes adapted to said fixing bolt are provided on a surface of said sliding rod.

7. The chip mounter for integrated circuit processing according to claim 5, wherein a partition block is provided at a center position of a surface of said slide bar.