CN219591424U - Semiconductor LED chip packaging structure with high heat dissipation - Google Patents

Abstract

The utility model relates to the technical field of semiconductor devices and discloses a high-heat-dissipation semiconductor LED chip packaging structure which comprises a base, wherein a heat dissipation block is arranged on the upper surface of the base, a heat conducting plate is fixedly connected to the upper surface of the heat dissipation block, an inner groove is formed in the upper surface of the heat dissipation block, a connecting groove is formed in the heat conducting plate, a heat dissipation fin is fixedly sleeved in the connecting groove, a chip is arranged on the heat dissipation fin, a transparent shell is fixedly connected to the upper surface of the heat dissipation fin, a fluorescent powder layer is coated on the chip, when the chip heats in use, heat is transferred to the heat dissipation block, external air extends into the inner groove through the ventilation groove, then the hot air in the inner groove is conducted out through the ventilation groove, the heat dissipation effect on the heat conducting plate is achieved, the cooling effect on the heat conducting plate is achieved synchronously, the heat radiation principle is influenced, the chip is cooled by the same principle, the operation process of the chip is more stable, and the service life of the chip is prolonged.

Description

Semiconductor LED chip packaging structure with high heat dissipation

Technical Field

The utility model relates to the technical field of semiconductor devices, in particular to a semiconductor LED chip packaging structure with high heat dissipation.

Background

The LED (light emitting diode) light source has advantages of high light efficiency, long service life, quick start and the like, so that the LED light source is increasingly applied to various lighting devices and display devices, the heart of the LED is a semiconductor wafer, the LED semiconductor light emitting diode package refers to the package of a light emitting chip, one end of the wafer is attached to a bracket, one end of the wafer is a negative electrode, and the other end of the wafer is connected with a positive electrode of a power supply, so that the whole wafer is packaged by epoxy resin.

But LED chip is packaged through epoxy, causes the heat that LED chip produced to be difficult to dispel, and the heat gathers and can destroy inside components and parts, and its service performance and stability of chip are weaker to when the chip does not have good heat radiation structure for a long time, its life also will receive very big influence, makes its life lower.

Disclosure of Invention

(one) solving the technical problems

Aiming at the defects of the prior art, the utility model provides a semiconductor LED chip packaging structure with high heat dissipation, which has the advantages that when a chip heats during use, heat is transferred to a heat dissipation block, external air extends into an inner groove through a ventilation groove, then hot air in the inner groove is conducted out through the ventilation groove, further the heat dissipation effect of a heat conducting plate is realized, the cooling effect of the heat conducting plate is synchronously realized, the influence of a heat radiation principle is realized, the chip is also subjected to heat dissipation and cooling by the same principle, the operation process of the chip is more stable, the service life of the chip is prolonged, and the like.

(II) technical scheme

In order to achieve the above purpose, the present utility model provides the following technical solutions: the utility model provides a high radiating semiconductor LED chip packaging structure, includes the base, the upper surface of base is provided with the radiating block, and the upper surface fixedly connected with heat conduction board of radiating block, the inside groove has been seted up to the upper surface of radiating block.

Preferably, the heat conducting plate is provided with a connecting groove, a radiating fin is fixedly sleeved in the connecting groove, and a chip is arranged on the radiating fin.

Preferably, the upper surface of the radiating fin is fixedly connected with a transparent shell, and a fluorescent powder layer is coated on the chip.

Preferably, a ventilation groove is formed in the outer surface of the radiating block, and the ventilation groove is communicated with the inner groove.

Preferably, the upper surface of the heat conducting plate is provided with an inclined groove extending out of the lower surface of the heat conducting plate, the inclined groove is obliquely arranged, and the inclined groove is communicated with the inner groove.

(III) beneficial effects

Compared with the prior art, the utility model provides a semiconductor LED chip packaging structure with high heat dissipation, which has the following beneficial effects:

1. this high radiating semiconductor LED chip packaging structure, when the chip generates heat when using, heat transfer gives the radiating block, and outside air extends into the inside groove through the ventilation groove, and then the hot air in the inside groove also conducts away through the ventilation groove, and then realizes the radiating effect to the heat-conducting plate, also realizes the cooling effect to the heat-conducting plate in step, and the principle influence of being heated radiation also dispels the heat to the chip with the principle for the operation process of chip is more stable, increases its life.

2. This high radiating semiconductor LED chip packaging structure, when the chip when producing heat when using, give the fin through the heat transfer of chip, increase radiating area through the fin to absorb and dispel the heat with the heat of chip in the heat conduction in-process, increase the radiating rate of chip, and then increase the radiating effect of chip, make the life of LED chip longer.

3. According to the high-heat-dissipation semiconductor LED chip packaging structure, the upper surface of the heat-conducting plate is provided with the inclined groove extending out of the lower surface of the heat-conducting plate, the inclined groove is obliquely arranged, the contact area between the inner wall of the inclined groove and air can be increased through the inclined arrangement of the inclined groove, the heat conduction speed is increased, and the heat dissipation speed of the chip is improved.

4. This high radiating semiconductor LED chip packaging structure, the phosphor powder layer has the heat dissipation effect, when the chip when producing heat when using, the heat on the chip can direct action with on the phosphor powder layer, the phosphor powder layer absorbs the heat of chip, and then cools down the chip, avoids the chip to cause the damage because of the heat is too high.

5. This high radiating semiconductor LED chip packaging structure sets up one deck phosphor powder layer of coating on the chip, and the phosphor powder layer has the heat dissipation effect, and when the chip produced the heat when using, the heat on the chip can directly act on with on the phosphor powder layer, and the phosphor powder layer absorbs the heat of chip, and then cools down the chip, avoids the chip to cause the damage because the heat is too high.

Drawings

FIG. 1 is a schematic diagram showing the overall structure of a semiconductor LED chip package with high heat dissipation;

FIG. 2 is a schematic plan view of a semiconductor LED chip package structure with high heat dissipation;

fig. 3 is a schematic view of the structure of the inner tank according to the present utility model.

In the figure: 1. a base; 2. a heat dissipation block; 3. a heat conductive plate; 4. a transparent housing; 5. a chip; 6. a phosphor layer; 7. a heat sink; 8. an inner tank; 9. a ventilation groove; 10. and an inclined groove.

Detailed Description

Reference will now be made in detail to the present embodiments of the present utility model, examples of which are illustrated in the accompanying drawings, wherein the accompanying drawings are used to supplement the description of the written description so that one can intuitively and intuitively understand each technical feature and overall technical scheme of the present utility model, but not to limit the scope of the present utility model.

In the description of the present utility model, it should be understood that references to orientation descriptions such as upper, lower, front, rear, left, right, etc. are based on the orientation or positional relationship shown in the drawings, are merely for convenience of description of the present utility model and to simplify the description, and do not indicate or imply that the apparatus or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus should not be construed as limiting the present utility model.

In the description of the present utility model, greater than, less than, exceeding, etc. are understood to exclude this number, and above, below, within, etc. are understood to include this number. The description of the first and second is for the purpose of distinguishing between technical features only and should not be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated or implicitly indicating the precedence of the technical features indicated.

In the description of the present utility model, unless explicitly defined otherwise, terms such as arrangement, installation, connection, etc. should be construed broadly and the specific meaning of the terms in the present utility model can be reasonably determined by a person skilled in the art in combination with the specific contents of the technical scheme.

Referring to fig. 1-3, the present utility model provides a new technical solution: the utility model provides a high radiating semiconductor LED chip packaging structure, including base 1, the upper surface of base 1 is provided with radiating block 2, radiating block 2 adopts the fine material of heat conduction carbon, increase its radiating effect, the last fixed surface of radiating block 2 is connected with heat conduction board 3, heat conduction board 3 adopts the silica gel material of high heat conduction, increase its radiating effect, the spread groove has been seted up on the heat conduction board 3, the fixed cover in spread groove is equipped with fin 7, be provided with chip 5 on the fin 7, the upper surface fixedly connected with transparent shell 4 of fin 7, set up one deck phosphor powder layer 6 of coating on the chip 5, phosphor powder layer 6 has the radiating effect, when chip 5 when producing heat in use, the heat on the chip 5 can directly act on phosphor powder layer 6, phosphor powder layer 6 absorbs the heat of chip 5, and then cool down chip 5, avoid chip 5 to cause the damage because the heat is too high.

Further, the radiating fin 7 is made of pure copper or aluminum alloy, the pure copper or aluminum alloy has good thermal conductivity, when the chip 5 generates heat in use, the heat transmitted through the chip 5 is transferred to the radiating fin, the radiating area is increased through the radiating fin, the heat of the chip 5 is absorbed and radiated in the heat transmission process, the radiating speed of the chip 5 is increased, the radiating effect of the chip 5 is further increased, the running process of the chip 5 is more stable, and the service life of the LED chip is longer.

Further, the upper surface of the heat dissipation block 2 is provided with the inner groove 8, the outer surface of the heat dissipation block 2 is provided with a plurality of ventilation grooves 9, the ventilation grooves 9 are communicated with the inner groove 8, the upper surface of the heat conduction plate 3 is provided with an inclined groove 10 extending out of the lower surface of the heat conduction plate, the inclined groove (10) is communicated with the inner groove (8), the inclined groove 10 is obliquely arranged, the contact area between the inner wall of the inclined groove 10 and air can be increased by obliquely arranging the inclined groove 10, the heat conduction speed is further increased, and the heat dissipation speed of the chip 5 is further improved, so that the running process of the chip 5 is more stable.

Further, when the chip generates heat when using, heat transfer gives the radiating block 2, and outside air extends into inside groove 8 through ventilation groove 9, and then the hot air in the inside groove 8 also conducts away through ventilation groove 9, and then realizes the radiating action to heat conduction board 3, also realizes the cooling effect to heat conduction board 3 in step, and the principle influence of being heated radiation also dispels the heat to chip 5 with the principle for the operation process of chip 5 is more stable, increases its life.

Working principle: when the device is used, the inner groove 8 is formed in the upper surface of the radiating block 2, the plurality of ventilation grooves 9 are formed in the outer surface of the radiating block 2, the ventilation grooves 9 are communicated with the inner groove 8, the inclined grooves 10 extending out of the lower surface of the upper surface of the heat conducting plate 3 are formed in the upper surface of the heat conducting plate, the inclined grooves 10 are arranged in an inclined mode, the contact area between the inner wall of the inclined grooves 10 and air can be increased, the heat conduction speed is increased, the radiating speed of the chip 5 is further increased, when the chip generates heat in use, heat is transferred to the radiating block 2, external air extends into the inner groove 8 through the ventilation grooves 9, then the hot air in the inner groove 8 is also conducted out through the ventilation grooves 9, the radiating effect on the heat conducting plate 3 is achieved, the cooling effect on the heat conducting plate 3 is achieved synchronously, the same principle is also achieved, the chip 5 is cooled down in a radiating mode, the running process of the chip 5 is more stable, the service life of the chip is prolonged, when the chip 5 generates heat in use, the heat through the chip 5 is transferred to the radiating fins, the radiating area is increased, the radiating speed of the chip 5 is increased, and the heat is absorbed and the chip 5 in the radiating process.

Although embodiments of the present utility model have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made therein without departing from the principles and spirit of the utility model, the scope of which is defined in the appended claims and their equivalents.

Claims (5)

1. The utility model provides a semiconductor LED chip packaging structure of high heat dissipation, includes base (1), its characterized in that: the upper surface of base (1) is provided with radiator block (2), and the upper surface fixedly connected with heat conduction board (3) of radiator block (2), and inside groove (8) have been seted up to the upper surface of radiator block (2).

2. The high heat dissipation semiconductor LED chip package according to claim 1, wherein: the heat conducting plate (3) is provided with a connecting groove, a radiating fin (7) is fixedly sleeved in the connecting groove, and a chip (5) is arranged on the radiating fin (7).

3. The high heat dissipation semiconductor LED chip package according to claim 2, wherein: the upper surface of the radiating fin (7) is fixedly connected with a transparent shell (4), and a fluorescent powder layer (6) is coated on the chip (5).

4. The high heat dissipation semiconductor LED chip package according to claim 1, wherein: the outer surface of the radiating block (2) is provided with a ventilation groove (9), and the ventilation groove (9) is communicated with the inner groove (8).

5. The high heat dissipation semiconductor LED chip package according to claim 4, wherein: the upper surface of the heat conducting plate (3) is provided with an inclined groove (10) extending out of the lower surface of the heat conducting plate, the inclined groove (10) is obliquely arranged, and the inclined groove (10) is communicated with the inner groove (8).