CN219582517U

CN219582517U - Polishing device for monocrystalline silicon rod sample wafer

Info

Publication number: CN219582517U
Application number: CN202320132307.1U
Authority: CN
Inventors: 詹景涛; 韩存根; 张树峰
Original assignee: Inner Mongolia Zhonghuan Crystal Materials Co Ltd
Current assignee: Inner Mongolia Zhonghuan Crystal Materials Co Ltd
Priority date: 2023-01-17
Filing date: 2023-01-17
Publication date: 2023-08-25
Anticipated expiration: 2033-01-17

Abstract

The utility model belongs to the technical field of semiconductors, and relates to a polishing device for a monocrystalline silicon rod sample wafer, which comprises a chassis, a clamping assembly, a polishing assembly and a first linear unit, wherein the chassis is connected with the clamping assembly through the first linear unit and is connected with the polishing assembly, the first linear unit can drive the clamping assembly to clamp a silicon wafer to displace along the length direction of the silicon wafer, and the polishing assembly can polish the silicon wafer. The utility model has the beneficial effects that the polishing component and the clamping component are connected with the chassis through the linear units, so that the running process of the equipment is more stable and safer; the first support is arranged, so that the silicon wafer can be driven to contact with the polishing wheel along a straight line to carry out double-sided polishing, the precision is higher, and the polishing quality is integrally improved; the first linear unit and the second linear unit which are perpendicular to each other are arranged, the rotary motion of the ball screw is converted into linear motion, the efficiency is higher, and the silicon wafer can be quickly driven to contact with the polishing wheel to carry out polishing operation.

Description

Polishing device for monocrystalline silicon rod sample wafer

Technical Field

The utility model belongs to the technical field of semiconductors, and relates to a polishing device for a monocrystalline silicon rod sample wafer.

Background

Oxygen and carbon are the most abundant impurities in silicon. The oxygen and carbon content index directly relates to the efficiency and the fragment rate of the cell, and the higher the oxygen content in silicon is, the lower the conversion efficiency of the cell is; the higher the carbon content, the greater the stress and the easier the fracture. The most commonly used method for measuring the oxygen and carbon content in silicon single crystals is the infrared absorption method. Besides the complexity of preparing samples, the method is relatively convenient to test and calculate, and is also a standard method for measuring the oxygen and carbon content in the silicon single crystal. Taking a silicon wafer with a thickness of 2-4 mm as an example, it is necessary to polish both sides of the sample to mirror surfaces. In the prior art, a manual operation electric grinder is generally adopted, sand paper is arranged at the clamping head of the electric grinder, the sand paper rotates at high speed under the drive of the clamping head of the electric grinder, the surface of a silicon wafer is polished by manual operation, and the surface of the silicon wafer is polished by 2cm ² After which the mirror portion is cleaned, the oxygen-carbon content of the silicon wafer can be detected on an infrared spectrometer. When the method is used for processing the polished silicon sample wafer, only one surface can be processed, after one surface is processed, the surface needs to be manually replaced, the operation is complex, and the displacement is easy to occur in the polishing process, so that the polishing quality is influenced, the efficiency is low, the practicability is low, and the sand paper needs to be frequently replaced; in the operation process, noise and dust pollution exist, and the health of operators is also not good. Therefore, a new polishing apparatus for a single crystal silicon rod wafer is required to solve the above-mentioned problems.

Disclosure of Invention

In order to solve the technical problems, the utility model provides a polishing device for a monocrystalline silicon rod sample wafer, which can replace manual operation, improve polishing quality and operation efficiency and save cost.

The technical scheme adopted by the utility model is as follows: a burnishing device for monocrystalline silicon stick sample wafer, its characterized in that: including chassis, clamping assembly, polishing assembly and first linear unit, the chassis pass through first linear unit with clamping assembly connects just polishing assembly connects, first linear unit can drive clamping assembly centre gripping silicon chip is along its length direction displacement, polishing assembly can be right the silicon chip polishes.

Further, the first linear unit comprises a first connecting frame, a first fixing block and a first ball screw, the chassis is connected with the first fixing block through the first connecting frame, and the first fixing block is connected with the first connecting frame and the clamping assembly through the first ball screw.

Further, the clamping assembly comprises a clamping support and a connecting block, wherein the clamping support is connected with the silicon wafer and is connected with the first fixing block through the connecting block.

Further, the clamping supports are symmetrically distributed on the connecting blocks to clamp the silicon wafers.

Further, the connecting block is connected with the first fixing block through a first bracket.

Furthermore, the polishing components are symmetrically arranged on two sides of the silicon wafer.

Further, each of the polishing assemblies is connected to the chassis by a second linear unit.

Further, the first linear unit is perpendicular to the second linear unit.

Further, the second straight line unit includes second link, second fixed block and second ball, the chassis pass through the second link with the second fixed block is connected, the second fixed block pass through the second ball with the second link is connected and with the polishing subassembly is connected.

Further, the polishing assembly comprises a polishing wheel, a second support and a driving motor, wherein the polishing wheel is connected with the second fixed block through the second support, and the driving motor is arranged on the second support and provides power for rotation of the polishing wheel.

The utility model has the advantages and positive effects that: the polishing component and the clamping component are connected with the chassis through the linear units, so that the running process of the equipment is more stable and safer; the first support is arranged, so that the silicon wafer can be driven to contact with the polishing wheel along a straight line to carry out double-sided polishing, the efficiency is higher, and the polishing quality is integrally improved; the ball screw polishing device has the advantages that the first linear unit and the second linear unit which are perpendicular to each other are arranged, the rotary motion of the ball screw is converted into linear motion, the precision is higher, the silicon wafer can be rapidly driven to be in contact with the polishing wheel and polishing operation is performed, manual operation is replaced, polishing quality and operation efficiency are improved, and cost is saved.

Drawings

Fig. 1 is a schematic structural view of an embodiment provided by the present utility model.

In the figure:

1. a chassis; 2. a clamping assembly; 21. a clamping bracket; 22. a connecting block; 3. a polishing assembly; 31. a polishing wheel; 32. a second bracket; 33. a driving motor; 4. a first linear unit; 41. a first connection frame; 42. a first fixed block; 43. a first ball screw; 5. a silicon wafer; 6. a first bracket; 7. a second straight line unit; 71. a first connection frame; 72. a first fixed block; 73. a first ball screw.

Detailed Description

The utility model will be further described with reference to the accompanying drawings and specific examples.

Referring to fig. 1, a polishing apparatus for a single crystal silicon rod wafer is characterized in that: including chassis 1, clamping assembly 2, polishing subassembly 3 and first linear unit 4, chassis 1 is connected and polishing subassembly 3 is connected with clamping assembly 2 through first linear unit 4, and first linear unit 4 can drive clamping assembly 2 centre gripping silicon chip 5 along its length direction displacement, and polishing subassembly 3 can polish silicon chip 5. The clamping assembly 2 is driven to displace along the length direction of the clamping assembly 2 through the first linear unit 4, and then the clamping assembly 2 clamps the silicon wafer 5 to displace, so that the silicon wafer 5 is close to or far away from the polishing assembly 3, double-sided polishing operation is conveniently carried out on the silicon wafer 5, polishing efficiency is improved, the polishing assembly 3 and the clamping assembly 2 are connected with the chassis 1, safety and stability in the polishing process are realized, no deviation occurs, polishing quality and efficiency are improved, and a large amount of cost is saved.

Preferably, the first linear unit 4 includes a first connection frame 41, a first fixing block 42, and a first ball screw 43, the chassis 1 is connected to the first fixing block 42 through the first connection frame 41, and the first fixing block 42 is connected to the first connection frame 41 and to the clamping assembly 2 through the first ball screw 43.

Preferably, the first ball screw 43 is connected to a first motor. In this embodiment, the first motor drives the first ball screw 43 to convert its rotation motion into linear motion, and further drives the clamping assembly 2 to clamp the silicon wafer 5 near or far from the polishing wheel 31.

Preferably, the clamping assembly 2 comprises a clamping bracket 21 and a connecting block 22, wherein the clamping bracket 21 is connected with the silicon wafer 5 and is connected with the first fixed block 42 through the connecting block 22. In this embodiment, the clamping bracket 21 has a U-shaped structure, and the end of the U-shaped groove is far away from the connecting block 22, so that when the clamping bracket 21 clamps the silicon wafer 5, the clamping force is in surface contact, so that the clamping force of the silicon wafer 5 can be uniformly distributed, and the area to be polished is exposed. The user can select an appropriate holding bracket 21 according to the area to be polished, and the size and material thereof are not particularly limited.

Preferably, the clamping brackets 21 are symmetrically distributed on the connecting blocks 22 to clamp the silicon wafer 5. In the embodiment, the two clamping brackets 21 clamp the silicon wafer 5, so that the center of the silicon wafer 5 coincides with the center of the connecting block 22, stable movement in the operation process is ensured, and the safety is improved.

Preferably, the side of the clamping support 21 connected to the silicon wafer 5 is provided with a soft spacer layer to prevent damage to the silicon wafer 5. In this embodiment, the opposite sides of the two clamping brackets 21 are respectively provided with a soft gasket layer, so that the contact area between the clamping brackets 21 and the silicon wafer 5 is increased, the holding force is uniformly distributed, the damage to the surface of the silicon wafer 5 is avoided, the instability of manual operation is overcome, the distance between the two clamping brackets 21 can be flexibly adjusted according to the thickness of the silicon wafer 5 by a user, the operation is simple, the labor intensity of site constructors is reduced, and the automation degree of the whole polishing process is improved.

Preferably, the connection block 22 is provided with a groove, which is connected with the clamping bracket 21 through the groove.

Preferably, the end of the clamping bracket 21 is provided with a protrusion matching the groove. In this embodiment, the left side of the clamping support 21 is provided with a protruding portion, the protruding portion is inserted into the groove, the protruding portion can horizontally move along the groove, the two protruding portions can be close to or far away from each other, a user can flexibly adjust the distance between the two clamping supports 21 according to the thickness of the silicon wafer 5, and the silicon wafer 5 is placed at the central position of the connecting block 22, so that stability in the running process is guaranteed, and polishing quality is improved.

Preferably, the connection block 22 is connected to the first fixing block 42 through the first bracket 6. In this embodiment, the top of the first bracket 6 is connected with the connecting block 22, the bottom thereof is connected with the first fixing block 42, and when the first ball screw 43 is driven, the first fixing block 42 drives the clamping assembly 2 to displace along the length direction of the first connecting frame 43 through the first bracket 6, so as to drive the silicon wafer 5 to pass through the polishing assembly 3, so as to facilitate polishing operation.

Preferably, the polishing components 3 are symmetrically arranged on both sides of the silicon wafer 5.

Preferably, each polishing assembly 3 is connected to the chassis 1 by a second linear unit 7.

Preferably, the first rectilinear unit 4 is disposed perpendicular to the second rectilinear unit 7.

Preferably, the chassis 1 is a Y-shaped bracket, the main body of which is connected to the first linear unit 4, and the branches of which are connected to the second linear unit 4. In this embodiment, the main body of the chassis 1 is connected to the first connecting frame 41, so that the first bracket 6 can drive the clamping assembly 2 to move steadily, which is more reliable.

Preferably, the second linear unit 7 includes a second connection frame 71, a second fixing block 72, and a second ball screw 73, the chassis 1 is connected to the second fixing block 72 through the second connection frame 71, and the second fixing block 72 is connected to the second connection frame 71 and to the polishing assembly 3 through the second ball screw 73.

Preferably, the second ball screw 73 is connected to a second motor. In this embodiment, the second ball screw 73 is driven by the second motor to convert its rotational motion into linear motion, thereby driving the two polishing members 3 toward or away from each other.

Preferably, the polishing assembly 3 includes a polishing wheel 31, a second bracket 32, and a driving motor 33, the polishing wheel 31 is connected with the second fixed block 72 through the second bracket 32, and the driving motor 33 is disposed on the second bracket 32 and provides power for rotation of the polishing wheel 31.

Preferably, the first motor, the second motor and the driving motor 33 are all connected with the main control box through sensors. The design can replace manual operation, realizes automatic polishing of the monocrystalline silicon sample wafer, reduces labor intensity and improves polishing processing efficiency. Meanwhile, the electric control part adopts a touch screen and a PLC, and can realize automatic feeding and discharging by combining a six-axis robot, and can realize an automatic polishing detection unit for monocrystalline silicon sample wafers.

Preferably, the first motor and the second motor are servo motors.

It should be noted that, the ball screw in the technical solution of the present utility model, including the first ball screw 43 and the second ball screw 73, the specific structure and the connection with the fixing block are conventional technical means in the field, and the detailed description is not repeated.

When the polishing device is used, the polishing wheels 31 and the clamping supports 21 with proper sizes can be selected according to the thickness of the silicon wafer 5 and the area to be polished, the two polishing wheels 31 are adjusted to proper positions and then fixed, then the distance between the two clamping supports 21 is adjusted, the silicon wafer 5 is clamped, and then the first motor is driven, so that the first support 6 drives the connecting block 22 to displace, and further the silicon wafer 5 is close to the polishing wheels. At the same time, the driving motor 33 is started, the polishing wheel 31 rotates at a high speed, and the silicon wafer 5 passes through the polishing wheel 31, so that the polishing of the two sides of the silicon wafer 5 is realized.

The foregoing describes the embodiments of the present utility model in detail, but the description is only a preferred embodiment of the present utility model and should not be construed as limiting the scope of the utility model. All equivalent changes and modifications within the scope of the present utility model are intended to be covered by the present utility model.

Claims

1. A burnishing device for monocrystalline silicon stick sample wafer, its characterized in that: including chassis, clamping assembly, polishing assembly and first linear unit, the chassis pass through first linear unit with clamping assembly connects just polishing assembly connects, first linear unit can drive clamping assembly centre gripping silicon chip is along its length direction displacement, polishing assembly can be right the silicon chip polishes.

2. The polishing apparatus for a single crystal silicon rod sample wafer according to claim 1, wherein: the first linear unit comprises a first connecting frame, a first fixing block and a first ball screw, the chassis is connected with the first fixing block through the first connecting frame, and the first fixing block is connected with the first connecting frame and the clamping assembly through the first ball screw.

3. The polishing apparatus for a single crystal silicon rod sample wafer according to claim 2, wherein: the clamping assembly comprises a clamping support and a connecting block, wherein the clamping support is connected with the silicon wafer and is connected with the first fixing block through the connecting block.

4. A polishing apparatus for a single crystal silicon rod sample as set forth in claim 3 wherein: the clamping supports are symmetrically distributed on the connecting blocks to clamp the silicon wafers.

5. A polishing apparatus for a single crystal silicon rod sample as set forth in claim 3 wherein: the connecting block is connected with the first fixed block through a first bracket.

6. The polishing apparatus for a single crystal silicon rod sample wafer according to claim 2, wherein: the polishing components are symmetrically arranged on two sides of the silicon wafer.

7. The polishing apparatus for a single crystal silicon rod sample wafer as set forth in claim 6, wherein: each polishing assembly is connected with the chassis through a second linear unit.

8. The polishing apparatus for a single crystal silicon rod sample wafer as set forth in claim 7 wherein: the first linear unit is arranged perpendicular to the second linear unit.

9. The polishing apparatus for a single crystal silicon rod sample wafer as set forth in claim 8 wherein: the second straight line unit comprises a second connecting frame, a second fixing block and a second ball screw, the chassis is connected with the second fixing block through the second connecting frame, and the second fixing block is connected with the second connecting frame and the polishing assembly through the second ball screw.

10. The polishing apparatus for a single crystal silicon rod sample wafer as set forth in claim 9 wherein: the polishing assembly comprises a polishing wheel, a second support and a driving motor, wherein the polishing wheel is connected with the second fixed block through the second support, and the driving motor is arranged on the second support and provides power for rotation of the polishing wheel.