CN219577654U - High-density circuit board with good heat dissipation performance - Google Patents
High-density circuit board with good heat dissipation performance Download PDFInfo
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- CN219577654U CN219577654U CN202320074501.9U CN202320074501U CN219577654U CN 219577654 U CN219577654 U CN 219577654U CN 202320074501 U CN202320074501 U CN 202320074501U CN 219577654 U CN219577654 U CN 219577654U
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- circuit board
- air box
- air
- heat dissipation
- good heat
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
- Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management
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Abstract
The utility model discloses a high-density circuit board with good heat dissipation performance, which relates to the field of circuit boards and aims to solve the technical problems that the heat dissipation effect of the middle part of a board surface is poor and a circuit is easy to damage of the traditional high-density circuit board is large.
Description
Technical Field
The utility model belongs to the field of circuit boards, and particularly relates to a high-density circuit board with good heat dissipation performance.
Background
The high-density circuit board is a new technology developed by the PCB industry, the circuit distribution is more precise, and if the traditional circuit board surface is adopted to passively dissipate heat during high-load operation, the heat dissipation effect is poor, and the circuit is easy to damage when in long-time hot working, so that the structural strength of the circuit board is ensured, and meanwhile, the high-density circuit board with good heat dissipation performance is designed.
For this reason, the current chinese patent with publication No. CN210112512U discloses a high density circuit board with good heat dissipation, which belongs to the technical field of circuit boards, and includes an HDI board body and a heat dissipation mechanism, the heat dissipation mechanism includes a receiving box, two symmetrically arranged air guide pipes fixed on one side of the receiving box, and a radiator fixed in the receiving box and communicated with the air guide pipes, sliding grooves arranged along the length direction of the air guide pipes and used for the movable insertion of the side edges of the HDI board body are respectively arranged on opposite inner side walls between the air guide pipes, clamping areas are formed between the sliding grooves for the HDI board body, exhaust holes uniformly distributed along the length direction of the air guide pipes are respectively arranged on two side positions of the sliding grooves on the inner side walls of the air guide pipes, one end of the air guide pipes extends into the receiving box and is provided with an opening, connecting pipes respectively communicated with one ends of the air guide pipes are arranged in the receiving box, the radiator is fixed at one side positions of the connecting pipes, and an air inlet communicated with an air outlet of the radiator is arranged on one side surface close to the radiator; the utility model has the advantages of compact structure and high heat dissipation efficiency. But in the heat dissipation process, the air blown out by the exhaust holes at two sides can be converged in the middle of the circuit board, so that the air is scattered away from the circuit board, and the heat dissipation effect in the middle of the circuit board is poor.
Therefore, aiming at the conditions that the high-density circuit board has large heating value and poor heat dissipation effect in the middle of the board surface and is easy to damage a circuit, a novel high-density circuit board is developed, and the heat dissipation efficiency of the circuit board is enhanced by utilizing a heat dissipation machine assembled with the circuit board into an integral structure.
Disclosure of Invention
(1) Technical problem to be solved
Aiming at the defects of the prior art, the utility model aims to provide a high-density circuit board with good heat dissipation performance, which aims to solve the technical problems that the heat productivity of the existing high-density circuit board is large, the heat dissipation effect in the middle of a board surface is poor and a circuit is easy to damage.
(2) Technical proposal
In order to solve the technical problems, the utility model provides a high-density circuit board with good heat dissipation performance, which comprises a circuit board body, a first air box arranged on the left side of the circuit board body, a second air box arranged on the right side of the circuit board body, wherein a plurality of heat dissipation fans are arranged at the upper end of the first air box, ventilation pipeline hollow plates communicated with the inside of the first air box are fixedly connected in the middle of the upper end and the middle of the lower end of the first air box, a plurality of air outlets are formed in the opposite side of the ventilation pipeline hollow plates, air inlets communicated with the inside of the second air box are formed in the middle of the upper end and the middle of the lower end of the second air box, and a plurality of air outlet holes are formed in the upper surface and the lower surface of the second air box, which is close to one side of the circuit board body, of the second air box is symmetrically formed.
When the high-density circuit board with good heat dissipation performance is used, a user puts the circuit board body between the first air box and the second air box, moves the first air box and the second air box oppositely, enables the left end and the right end of the circuit board body to enter the first clamping groove and the second clamping groove respectively, locks the circuit board through friction between the first gasket and the second gasket and the left end and the right end of the circuit board body, then starts the cooling fan, pumps outside cold air into the first air box through the exchange port, conveys the cold air into the second air box through the hollow ventilating duct, and flows out of the middle part of the upper surface and the lower surface of the circuit board body through the air outlet of the hollow ventilating duct, accelerates the heat dissipation of the board surface of the middle part, and the other air-cooled air enters the second air box through the air inlet and finally blows out from the air outlet, directly acts on other parts of the surface of the circuit board body, and accelerates the overall heat dissipation of the surface of the circuit board body.
Further, a draw-in groove has been seted up to a bellows right-hand member, a draw-in groove inboard is provided with a U type liner, circuit board body left end set up in a recess inboard of liner, a draw-in groove cooperation has a certain elasticity a liner wrap up the left end of circuit board body in, improves the frictional force with circuit board body surface, locks the left end of circuit board body.
Further, no. two draw-in grooves have been seted up to No. two bellows left ends, no. two draw-in grooves inboard is provided with the second liner of U type, circuit board body right-hand member set up in the recess inboard of No. two liners, no. two draw-in grooves cooperation have certain elastic second liner wrap up the right-hand member of circuit board body in, improve the frictional force with circuit board body surface, lock the right-hand member of circuit board body.
Further, two groups of middle support pads with a certain distance are arranged in the middle of the upper end and the middle of the lower end of the second bellows, side support pads are arranged on the front side and the rear side of the upper end of the second bellows and the front side and the rear side of the lower end of the second bellows, the middle support pads and the side support pads are used for supporting the second bellows, and when the second bellows and the first bellows are arranged on the same horizontal line.
Further, the middle support pad downside is provided with the spacing groove, both ends all fixedly connected with around the hollow board of air pipe with the card strip of spacing groove shape adaptation, the card strip set up in the spacing groove is inboard, the in-process that No. one bellows and No. two bellows opposite directions removed, the hollow board of air pipe moves right along the middle support pad, guarantees the hollow board of air pipe and removes stability through the joint between card strip and the spacing groove.
Further, the right end of the hollow ventilating duct board is arranged between the middle support pads, the middle support pads and the side support pad surfaces are provided with rubber gaskets, the right ends of the clamping strips are provided with expanding structures, and a limiting effect exists between the clamping strips and the clamping grooves to prevent the hollow ventilating duct board from falling out of the middle support pads.
Further, a plurality of exchange ports are formed in the left end of the first air box and are communicated with the inside, a wire mesh structure for dust-proof filtration is arranged on the inner side of each exchange port, and the cooling fan pumps outside air into the first air box through the exchange ports and flows to the second air box through the hollow plate of the ventilating duct.
(3) Advantageous effects
Compared with the prior art, the utility model has the beneficial effects that: according to the high-density circuit board with good heat dissipation performance, the heat dissipation mechanism assembled with the circuit board body is adopted, when the high-load operation is performed, air flows are blown from two sides of the surface of the board, heat dissipation of the surface of the board is accelerated, heat dissipation efficiency is improved, usability and safety of the high-density circuit board are guaranteed, and circuit damage is avoided; the first air box and the second air box which can move oppositely or reversely can be assembled with circuit board bodies with different sizes, so that the device is flexible to use and wide in applicability; the bellows structures on two sides are matched with the hollow plates of the ventilating ducts on the upper side and the lower side of the circuit board to form a high-strength integral structure which is used as an outer supporting structure of the circuit board, so that the circuit board is prevented from bending under the condition of external force.
Drawings
FIG. 1 is a schematic diagram of an assembled structure of an embodiment of a high-density circuit board with good heat dissipation performance according to the present utility model;
FIG. 2 is a schematic diagram showing an assembled structure of an embodiment of a high-density circuit board with good heat dissipation performance;
FIG. 3 is a schematic diagram of a first bellows structure of an embodiment of a high-density circuit board with good heat dissipation performance according to the present utility model;
FIG. 4 is a schematic diagram of a second bellows structure of an embodiment of a high-density circuit board with good heat dissipation performance according to the present utility model.
The marks in the drawings are: 1. a circuit board body; 2. a first bellows; 3. a heat radiation fan; 4. a hollow plate of a ventilation pipeline; 5. an air outlet; 6. a second bellows; 7. an air inlet; 8. an air outlet hole; 9. a first clamping groove; 10. a first gasket; 11. a second clamping groove; 12. a second gasket; 13. a middle support pad; 14. a side support pad; 15. a limit groove; 16. clamping strips; 17. a rubber gasket; 18. exchange port.
Detailed Description
This embodiment is a high-density circuit board that is used for a good heat dispersion, and its package structure schematic diagram is shown as fig. 1, and another state package structure schematic diagram is shown as fig. 2, and a bellows 2 structure schematic diagram is shown as fig. 3, and a bellows 6 structure schematic diagram is shown as fig. 4, this high-density circuit board include circuit board body 1, set up in a bellows 2 in the left side of circuit board body 1, set up in a bellows 6 in the right side of circuit board body 1, a plurality of radiator fans 3 are installed to bellows 2 upper end, a ventilation duct board 4 that is connected with in the middle of bellows 2 upper end and in the middle of the lower extreme is all fixedly connected with in a bellows 2 is inside be linked together, a plurality of air outlets 5 have been seted up to hollow cavity board 4 subtend one side, a plurality of air inlets 7 with be linked together in bellows 6 are all seted up in the middle of no bellows 6 upper end and the middle of lower extreme, no. 6 is close to circuit board body 1 one side surface symmetry has seted up a plurality of air outlet holes 8.
For the specific implementation mode, the circuit board body 1 adopts an epoxy glass cloth substrate or a phenolic resin glass cloth substrate as a substrate manufacturing material, a high-integration haul circuit structure is arranged, more electric element plug-in ends are carried, and a plurality of circuits are led out from the inside and the edge of the board to be in butt joint with electric equipment.
The right end of the first bellows 2 is provided with a first clamping groove 9, the inner side of the first clamping groove 9 is provided with a U-shaped first liner 10, the left end of the circuit board body 1 is arranged on the inner side of a groove of the first liner 10, the left end of the second bellows 6 is provided with a second clamping groove 11, the inner side of the second clamping groove 11 is provided with a U-shaped second liner 12, the right end of the circuit board body 1 is arranged on the inner side of a groove of the second liner 12, the first clamping groove 9 is matched with the first liner 10 with certain elasticity to wrap the left end of the circuit board body 1, friction force between the first clamping groove and the surface of the circuit board body 1 is improved, the right end of the circuit board body 1 is wrapped by the second liner 12 with certain elasticity, friction force between the second clamping groove 11 and the surface of the circuit board body 1 is improved, and the right end of the circuit board body 1 is locked.
Simultaneously, two sets of middle supporting pads 13 with certain interval are all installed in the middle of No. two bellows 6 upper end and the middle of the lower extreme, side supporting pads 14 are all installed to both sides around No. two bellows 6 upper end and both sides around the lower extreme, vent pipe hollow slab 4 right-hand member set up in between the middle supporting pads 13, middle supporting pads 13 with side supporting pads 14 surface all is provided with rubber gasket 17, and middle supporting pads 13 and side supporting pads 14 are used for supporting No. two bellows 6, and when installing, make No. two bellows 6 and No. one bellows 2 be in same horizontal line, and the card strip 16 right-hand member is provided with the expansion structure, has spacing effect between with draw-in groove 15, prevents vent pipe hollow slab 4 from deviating from middle supporting pads 13.
In addition, the middle supporting pad 13 downside is provided with spacing groove 15, both ends all fixedly connected with around the hollow board of air pipe 4 with the draw-in bar 16 of spacing groove 15 shape adaptation, draw-in bar 16 set up in spacing groove 15 inboard, no. one bellows 2 left end is provided with the inside exchange mouth 18 of a plurality of intercommunications, the wire mesh structure that is used for dustproof filteration is installed to exchange mouth 18 inboard, no. one bellows 2 and No. two bellows 6 opposite direction in-process, the hollow board of air pipe 4 moves rightwards along middle supporting pad 13, guarantees the hollow board of air pipe 4 mobility stability through the joint between draw-in bar 16 and the spacing groove 15, radiator fan 3 draws in No. one bellows 2 and flows to No. two bellows 6 through air pipe hollow board 4 through exchange mouth 18.
When the high-density circuit board with good heat dissipation performance is used, a user puts the circuit board body 1 between the first air box 2 and the second air box 6, moves the first air box 2 and the second air box 6 oppositely, enables the left end and the right end of the circuit board body 1 to enter the first clamping groove 9 and the second clamping groove 11 respectively, locks the circuit board through friction between the first gasket 10 and the second gasket 12 and the left end and the right end of the circuit board body 1, then starts the heat dissipation fan 3, pumps outside cold air into the first air box 2 through the exchange port 18 and conveys the cold air to the second air box 6 through the ventilation pipeline hollow board 4, one part of air-cooled air flowing out of the air outlet 5 through the ventilation pipeline hollow board 4 blows to the middle parts of the upper surface and the lower surface of the circuit board body 1, accelerates the heat dissipation of the board surface of the middle part, the other part of air-cooled air enters the second air box 6 through the air inlet 7 and finally blows out from the air outlet 8, and directly acts on other parts of the surface of the circuit board body 1 comprehensively accelerates the surface of the circuit board body 1.
Claims (7)
1. The high-density circuit board comprises a circuit board body, a first bellows arranged on the left side of the circuit board body, and a second bellows arranged on the right side of the circuit board body; the novel air duct type air conditioner is characterized in that a plurality of cooling fans are installed at the upper end of the first air box, the ventilating duct hollow plate communicated with the inside of the first air box is fixedly connected in the middle of the upper end of the first air box and in the middle of the lower end of the first air box, a plurality of air outlets are formed in one opposite side of the ventilating duct hollow plate, air inlets communicated with the inside of the second air box are formed in the middle of the upper end of the second air box and in the middle of the lower end of the second air box, and a plurality of air outlets are formed in the upper surface and the lower surface of one side of the second air box, which is close to the circuit board body, of the second air box in an up-down symmetry mode.
2. The high-density circuit board with good heat dissipation performance according to claim 1, wherein a first clamping groove is formed in the right end of the first air box, a U-shaped first liner is arranged on the inner side of the first clamping groove, and the left end of the circuit board body is arranged on the inner side of the groove of the first liner.
3. The high-density circuit board with good heat dissipation performance according to claim 1, wherein a second clamping groove is formed in the left end of the second air box, a U-shaped second gasket is arranged on the inner side of the second clamping groove, and the right end of the circuit board body is arranged on the inner side of the groove of the second gasket.
4. The high-density circuit board with good heat dissipation performance according to claim 1, wherein two groups of middle support pads with a certain interval are arranged in the middle of the upper end and the middle of the lower end of the second air box, and side support pads are arranged on the front side and the rear side of the upper end of the second air box and the front side and the rear side of the lower end of the second air box.
5. The high-density circuit board with good heat dissipation performance according to claim 4, wherein a limiting groove is formed in the lower side of the middle support pad, clamping strips matched with the limiting groove in shape are fixedly connected to the front end and the rear end of the hollow ventilating duct board, and the clamping strips are arranged on the inner side of the limiting groove.
6. The high-density circuit board with good heat dissipation performance according to claim 4, wherein the right end of the hollow ventilation pipeline board is arranged between the middle support pads, and rubber gaskets are arranged on the surfaces of the middle support pads and the side support pads.
7. The high-density circuit board with good heat dissipation performance according to claim 1, wherein a plurality of exchange ports communicated with the inside are arranged at the left end of the first air box, and a wire mesh structure for dust prevention and filtration is arranged at the inner side of each exchange port.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320074501.9U CN219577654U (en) | 2023-01-10 | 2023-01-10 | High-density circuit board with good heat dissipation performance |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320074501.9U CN219577654U (en) | 2023-01-10 | 2023-01-10 | High-density circuit board with good heat dissipation performance |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219577654U true CN219577654U (en) | 2023-08-22 |
Family
ID=87647127
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202320074501.9U Active CN219577654U (en) | 2023-01-10 | 2023-01-10 | High-density circuit board with good heat dissipation performance |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN219577654U (en) |
-
2023
- 2023-01-10 CN CN202320074501.9U patent/CN219577654U/en active Active
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