CN219555459U - Cabinet with auxiliary heat dissipation air duct - Google Patents
Cabinet with auxiliary heat dissipation air duct Download PDFInfo
- Publication number
- CN219555459U CN219555459U CN202223508558.XU CN202223508558U CN219555459U CN 219555459 U CN219555459 U CN 219555459U CN 202223508558 U CN202223508558 U CN 202223508558U CN 219555459 U CN219555459 U CN 219555459U
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- Prior art keywords
- cabinet
- heat dissipation
- wall
- air duct
- hollowed
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02B—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO BUILDINGS, e.g. HOUSING, HOUSE APPLIANCES OR RELATED END-USER APPLICATIONS
- Y02B30/00—Energy efficient heating, ventilation or air conditioning [HVAC]
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- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model relates to the technical field of cabinet heat dissipation, in particular to a cabinet with an auxiliary heat dissipation air duct, which comprises a cabinet, wherein a heat dissipation air duct is arranged between the inner wall and the outer wall of the left side of the cabinet, a fan for conveying air in the cabinet into the heat dissipation air duct is arranged on the inner wall of the left side of the cabinet near the top end of the cabinet, a plurality of exhaust holes communicated with the inside of the heat dissipation air duct are formed in the inner wall of the bottom end of the cabinet, a semiconductor refrigerating sheet is arranged on the inner wall of the top end of the heat dissipation air duct, and the cabinet further comprises: the moisture absorption component is used for absorbing moisture in the gas flowing in the radiating air duct; and the controller is used for controlling the switch of the semiconductor refrigerating sheet and the fan. According to the utility model, the heat dissipation air duct is arranged between the inner wall and the outer wall of the side edge of the cabinet, and the semiconductor refrigerating sheet and the fan are matched for use in high-temperature weather, so that the gas and the cold air in the cabinet are mixed in the heat dissipation air duct, and the gas is cooled and then re-enters the cabinet, so that the auxiliary cooling treatment of the cabinet is realized.
Description
Technical Field
The utility model relates to the technical field of cabinet heat dissipation, in particular to a cabinet with an auxiliary heat dissipation air duct.
Background
Cabinets are a common device for housing various types of electrical components, particularly in some data centers, requiring a large number of cabinets to be configured. The data center can generate a large amount of high heat in the working process because of the need of processing a large amount of data information, and the equipment can be damaged if the data is not timely scattered. The utility model provides an anti-overheating data center cabinet with the publication number of CN216700803U, which comprises a cabinet body, wherein a baffle is fixedly connected to the inner wall of one side of the cabinet body, a mounting rack is fixedly connected to the outer wall of the top of the baffle and the inner wall of the bottom of the cabinet body, rectangular holes which are distributed equidistantly are formed in the positions of the inner wall of one side of the cabinet body above and below the baffle, an adjusting component is rotationally connected to the inner wall of one side of the rectangular hole, an adjusting box is fixedly connected to the outer wall of one side of the cabinet body, and two transmission components for driving the adjusting components to work are slidingly connected to the inner wall of one side of the adjusting box; according to the utility model, the space inside the cabinet body can be equally divided through the partition board, the adjusting plates above and below the partition board rotate to different degrees through the operation of the adjusting assembly, so that the flow rate of gas passing through the rectangular holes above and below the partition board is changed, the air inlet quantity above and below the partition board is inconsistent, and the high-temperature area is quickly cooled;
although the utility model well solves the problem of poor heat dissipation effect of the traditional cabinet, in the specific use process, the low-temperature air flow generated by the air blowing device is conveyed into the regulating box through the cooperation of the air blowing device and the air inlet pipe, and the temperature of the air flow generated by the air blowing device is only lower than the temperature in the cabinet body, so that the temperature in the cabinet body is consistent with the external temperature to realize heat dissipation, and in high-temperature weather, when the difference between the temperature of the external environment and the temperature in the cabinet body is smaller, even if the heat dissipation treatment of the air in the cabinet body is not realized due to the fact that the flow velocity of the air in the cabinet body is accelerated, the use is limited.
Disclosure of Invention
In order to make up for the defects, the utility model provides a cabinet with an auxiliary heat dissipation air duct.
The technical scheme of the utility model is as follows:
the utility model provides a take rack in supplementary heat dissipation wind channel, includes the rack, set up the heat dissipation wind channel that is L shape and opening up between the left inner wall of rack and the outer wall, the left side inner wall of rack just is close to the top be equipped with the inside gaseous conveying of rack extremely fan in the heat dissipation wind channel, the bottom inner wall of rack set up a plurality of with the inside communicating exhaust hole in heat dissipation wind channel, the top inner wall in heat dissipation wind channel is equipped with the semiconductor refrigeration piece, still includes:
a heat radiation component for radiating the heat radiation surface of the semiconductor refrigerating plate;
the moisture absorption component is used for absorbing moisture in the gas flowing in the heat dissipation air duct;
and the controller is used for carrying out switch control on the semiconductor refrigerating sheet and the fan.
As the preferable technical scheme, the heat radiation component comprises a heat radiation aluminum plate tightly attached to the heat radiation surface of the semiconductor refrigerating plate, and a plurality of heat radiation fins which are arranged in a rectangular array are arranged on one side, away from the semiconductor refrigerating plate, of the heat radiation aluminum plate.
As the preferable technical scheme, the moisture absorption component is provided with a plurality of moisture absorption cotton which are distributed on the longitudinal axis of the heat dissipation air duct at equal intervals, and the moisture absorption component comprises a hollowed-out plate and moisture absorption cotton which is movably inserted into the hollowed-out plate.
As the preferable technical scheme, the side walls of the longitudinal axis of the heat dissipation air duct and the left and right sides of the hollowed-out plate are symmetrically distributed with limiting plates for limiting the position of the hollowed-out plate.
As the preferable technical scheme, the front side of fretwork board passes the inner wall of rack and is equipped with the curb plate, the curb plate is close to one side of rack and is located the upper and lower both sides of fretwork board inlay and are equipped with symmetric distribution's metal embedding strip.
As the preferable technical scheme, the adsorption magnetic strips which are adsorbed and fixed with the metal embedded strips are embedded in the front side of the cabinet and the positions corresponding to the metal embedded strips.
As an optimal technical scheme, a fan for accelerating the flow rate of gas in the heat dissipation air duct is arranged on the inner wall of the top of the longitudinal axis of the heat dissipation air duct.
Compared with the prior art, the utility model has the beneficial effects that:
1. according to the utility model, the heat dissipation air duct is arranged between the inner wall and the outer wall of the side edge of the cabinet, and under the high-temperature weather, the semiconductor refrigerating sheet and the fan are matched for use, so that the gas and the cold air in the cabinet are mixed in the heat dissipation air duct, and the gas is cooled and then re-enters the cabinet to realize auxiliary cooling treatment of the cabinet;
2. the temperature sensor and the controller are matched for use, so that the semiconductor refrigerating sheet, the fan and other components are controlled to be switched according to the actual condition of the gas temperature in the cabinet, and a large amount of power resources are consumed because the semiconductor refrigerating sheet and the fan continuously work when the cabinet does not need to radiate heat;
3. according to the utility model, the plurality of moisture absorption components are arranged in the heat dissipation air duct so as to absorb moisture of the gas flowing in the heat dissipation air duct, and the adverse effect of moisture in the gas on electrical components mounted in the cabinet due to the moisture entering the cabinet is avoided.
Drawings
FIG. 1 is a schematic diagram of the overall structure of the present utility model;
FIG. 2 is a schematic view of the whole structure of a cabinet in the present utility model;
FIG. 3 is a schematic view of a part of a cabinet in the present utility model;
FIG. 4 is a schematic diagram of a portion of a cabinet in the present utility model;
FIG. 5 is a cross-sectional view of a cabinet of the present utility model;
fig. 6 is a schematic structural view of an absorbent assembly according to the present utility model.
The meaning of each reference numeral in the figures is:
1. a cabinet; 11. a heat dissipation air duct; 12. an exhaust hole; 13. a partition plate; 14. a limiting plate; 15. a fan; 16. adsorbing the magnetic stripe;
2. a blower;
3. a controller;
4. an absorbent assembly; 41. a hollowed-out plate; 42. absorbent cotton; 43. a side plate; 431. a metal embedded strip;
5. a semiconductor refrigeration sheet; 51. a heat-dissipating aluminum plate; 511. a heat radiation fin;
6. a temperature sensor.
Detailed Description
The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.
Referring to fig. 1-6, the present utility model provides the following technical solutions:
the utility model provides a take rack in supplementary heat dissipation wind channel, including rack 1, set up the heat dissipation wind channel 11 that is L shape and opening up between the inner wall in rack 1 left side and the outer wall, the left side inner wall of rack 1 just is close to the top and is equipped with the fan 2 that carries the inside gas of rack 1 to in the heat dissipation wind channel 11, a plurality of and the inside communicating exhaust hole 12 in heat dissipation wind channel 11 have been seted up to the bottom inner wall of rack 1, the top inner wall in heat dissipation wind channel 11 is equipped with semiconductor refrigeration piece 5, semiconductor refrigeration piece 5 is equipped with two and symmetric distribution at the top of heat dissipation wind channel 11 and is close to the front and back both sides, the refrigeration face of semiconductor refrigeration piece 5 is down, through the refrigeration of semiconductor refrigeration piece 5 towards the inside refrigeration in heat dissipation wind channel 11, still include:
the heat dissipation assembly is used for dissipating heat of the heat dissipation surface of the semiconductor refrigeration piece 5 and comprises a heat dissipation aluminum plate 51 closely attached to the heat dissipation surface of the semiconductor refrigeration piece 5, and a plurality of heat dissipation fins 511 arranged in a rectangular array are arranged on one side of the heat dissipation aluminum plate 51 away from the semiconductor refrigeration piece 5;
further, a heat conducting silicone grease is arranged between the heat radiating aluminum plate 51 and the heat radiating surface of the semiconductor refrigeration piece 5, and is used for improving the heat transfer speed of the heat radiating surface of the semiconductor refrigeration piece 5, and the top ends of the heat radiating fins 511 extend to the outside, so that part of heat on the heat radiating fins 511 can be taken away when external air flows, heat radiation of the heat radiating fins 511 is realized, and the heat radiating surface of the semiconductor refrigeration piece 5 is subjected to heat radiation treatment through the cooperation of the heat radiating fins 511 and the heat radiating aluminum plate 51, so that the working efficiency of the heat radiating surface of the semiconductor refrigeration piece 5 is improved.
The moisture absorption components 4 are used for absorbing moisture in the gas flowing in the heat dissipation air duct 11, the moisture absorption components 4 are provided with a plurality of moisture absorption cotton 42 which are distributed on the longitudinal axis of the heat dissipation air duct 11 at equal intervals, and each moisture absorption component 4 comprises a hollowed-out plate 41 and moisture absorption cotton 42 which is movably inserted in the hollowed-out plate 41;
the controller 3 for performing switch control on the semiconductor refrigeration piece 5 and the fan 2 is supplemented by the fact that a temperature sensor 6 is arranged on the side wall of the cabinet 1 and close to the top end, the temperature sensor 6 is electrically connected with the controller 3 through a wire, so that the temperature inside the cabinet 1 and close to the top end is detected through the temperature sensor 6, detection data are fed back into the controller 3, and then the controller 3 performs switch control on the semiconductor refrigeration piece 5 and the fan 2;
further, a partition 13 is disposed on the side wall of the cabinet 1 and below the temperature sensor 6, specifically, when the gas flowing in the heat dissipation air duct 11 is exhausted through the exhaust hole 12 and is blocked by the partition 13 when flowing in the cabinet 1, the gas is prevented from directly contacting the temperature sensor 6 when flowing, and thus, the detection data of the temperature sensor 6 is prevented from being affected.
It should be noted that, the electronic components in the components such as the semiconductor refrigeration sheet 5, the fan 2, the controller 3, and the temperature sensor 6 in this embodiment are all common standard components or components known to those skilled in the art, and the structures and principles thereof are all known to those skilled in the art through technical manuals or through routine experimental methods, which are not described herein.
As a preference of this embodiment, the side walls of the longitudinal axis of the heat dissipation air duct 11 and the left and right sides of the hollow plate 41 are symmetrically distributed with limiting plates 14 for limiting the position of the hollow plate 41, the limiting plates 14 are in a U shape and open towards one side of the hollow plate 41, and the hollow plate 41 is slidably connected with the corresponding limiting plate 14.
As a preference of the embodiment, the front side of the hollowed-out plate 41 passes through the inner wall of the cabinet 1 and is provided with a side plate 43, the side plate 43 is close to one side of the cabinet 1 and is positioned on the upper side and the lower side of the hollowed-out plate 41, symmetrically distributed metal embedded strips 431 are embedded in the side plate, an adsorption magnetic strip 16 which is fixedly adsorbed with the metal embedded strips 431 is embedded in the front side of the cabinet 1 and corresponds to the metal embedded strips 431, and the positions of the side plate 43, the hollowed-out plate 41 and other parts are fixed through the adsorption fixation of the metal embedded strips 431 and the adsorption magnetic strips 16;
specifically, when the metal embedded strip 431 and the adsorption magnetic stripe 16 are fixed by adsorption, one side of the side plate 43 close to the hollowed-out plate 41 is tightly attached to the outer wall of the cabinet 1, and at this time, one end of the hollowed-out plate 41 far away from the side plate 43 is abutted against the inner wall of the rear side of the heat dissipation air duct 11.
As a preferred embodiment, the top inner wall of the longitudinal axis of the heat dissipation air duct 11 is provided with a fan 15 for accelerating the air flow rate inside the heat dissipation air duct 11, and the fan 15 is electrically connected with the controller 3 through a wire so as to switch and control the fan 15 through the controller 3.
When the cabinet with the auxiliary cooling air duct is used, as hot air rises and sinks, the hot air can be converged at the top end of the interior of the cabinet 1, then the temperature of the interior of the cabinet 1, which is close to the top end, is detected by the temperature sensor 6, detection data are fed back to the controller 3, when the temperature of the interior of the cabinet 1 is too high, the controller 3 starts the fan 15, the fan 2 and the semiconductor cooling sheet 5, so that the fan 2 conveys gas in the interior of the cabinet 1 to the interior of the cooling air duct 11, meanwhile, the cooling surface of the semiconductor cooling sheet 5 faces the interior of the cooling air duct 11 for cooling, then the fan 15 accelerates the flow rate of the gas in the interior of the cooling air duct 11, so that the gas conveyed by the fan 2 and the cooling air made of the semiconductor cooling sheet 5 are fully contacted, then the cooled gas passes through the hollowed holes in the hollowed-out plate 41 and is in contact with the moisture absorption cotton 42 movably spliced in the interior of the cabinet, and then the moisture in the gas is adsorbed, the gas after the moisture treatment flows through the guide of the cooling air duct 11 and reenters into the interior of the cabinet 1 through the exhaust hole 12, thus the internal circulation of the gas in the cabinet 1 is realized, and the temperature of the gas in the cabinet 1 is gradually increased along with the temperature of the cabinet 1 and the temperature of the cabinet 1 is reduced, and the temperature of the semiconductor cooling sheet 5 is controlled by the temperature sensor 3 when the temperature sensor is controlled to be turned off, and the temperature of the cabinet 3 is controlled to be lower, and the temperature of the cabinet 3 is gradually reaches the temperature controller 3;
after long-term use, the adsorption force of the moisture-absorbing cotton 42 reaches saturation, then the side plate 43 is pulled to move towards the side far away from the cabinet 1, so that the metal embedded strip 431 is separated from the corresponding adsorption magnetic strip 16, then the hollowed-out plate 41 is moved between the two limiting plates 14 corresponding to the metal embedded strip 431, the hollowed-out plate 41 is pulled away from the inside of the heat dissipation air duct 11, then the moisture-absorbing cotton 42 is pulled away from the inside of the hollowed-out plate 41 corresponding to the hollowed-out plate 41 and replaced, and parts such as the hollowed-out plate 41 are reset after replacement is completed, so that the subsequent repeated use is realized.
The foregoing has shown and described the basic principles, principal features and advantages of the utility model. It will be understood by those skilled in the art that the present utility model is not limited to the above-described embodiments, and that the above-described embodiments and descriptions are only preferred embodiments of the present utility model, and are not intended to limit the utility model, and that various changes and modifications may be made therein without departing from the spirit and scope of the utility model as claimed. The scope of the utility model is defined by the appended claims and equivalents thereof.
Claims (7)
1. Cabinet in supplementary heat dissipation wind channel in area, including cabinet (1), its characterized in that: the utility model discloses a heat dissipation wind channel (11) that is L shape and opening up has been seted up between inner wall and the outer wall of rack (1) left side, the left side inner wall of rack (1) just is close to the top be equipped with the inside gaseous fan (2) in rack (1) carry extremely in heat dissipation wind channel (11), a plurality of with inside communicating exhaust hole (12) in heat dissipation wind channel (11) have been seted up to the bottom inner wall of rack (1), the top inner wall of heat dissipation wind channel (11) is equipped with semiconductor refrigeration piece (5), still includes:
a heat radiation component for radiating the heat radiation surface of the semiconductor refrigerating sheet (5);
the moisture absorption component (4) is used for absorbing moisture in the gas flowing in the radiating air duct (11);
and the controller (3) is used for carrying out switch control on the semiconductor refrigerating sheet (5) and the fan (2).
2. The cabinet with auxiliary cooling duct of claim 1, wherein: the heat dissipation assembly comprises a heat dissipation aluminum plate (51) tightly attached to the heat dissipation surface of the semiconductor refrigerating sheet (5), and a plurality of heat dissipation fins (511) which are arranged in a rectangular array are arranged on one side, away from the semiconductor refrigerating sheet (5), of the heat dissipation aluminum plate (51).
3. The cabinet with auxiliary cooling duct of claim 1, wherein: the moisture absorption component (4) is provided with a plurality of moisture absorption cotton (42) which are distributed on the longitudinal axis of the heat dissipation air duct (11) at equal intervals, and the moisture absorption component (4) comprises a hollowed-out plate (41) and moisture absorption cotton (42) which are movably inserted into the hollowed-out plate (41).
4. The cabinet with auxiliary cooling duct of claim 3, wherein: limiting plates (14) used for limiting the position of the hollowed-out plate (41) are symmetrically distributed on the left side and the right side of the longitudinal axis of the heat dissipation air duct (11) and located on the left side and the right side of the hollowed-out plate (41).
5. The cabinet with auxiliary cooling duct of claim 4, wherein: the front side of the hollowed-out plate (41) penetrates through the inner wall of the cabinet (1) and is provided with a side plate (43), and the side plate (43) is close to one side of the cabinet (1) and is located on the upper side and the lower side of the hollowed-out plate (41) and is embedded with symmetrically distributed metal embedded strips (431).
6. The cabinet with auxiliary cooling duct of claim 5, wherein: and the adsorption magnetic strips (16) which are adsorbed and fixed with the metal embedded strips (431) are embedded in the positions, corresponding to the metal embedded strips (431), of the front side of the cabinet (1).
7. The cabinet with auxiliary cooling duct of claim 1, wherein: the top inner wall of the longitudinal axis of the heat dissipation air duct (11) is provided with a fan (15) for accelerating the flow rate of air in the heat dissipation air duct (11).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202223508558.XU CN219555459U (en) | 2022-12-28 | 2022-12-28 | Cabinet with auxiliary heat dissipation air duct |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202223508558.XU CN219555459U (en) | 2022-12-28 | 2022-12-28 | Cabinet with auxiliary heat dissipation air duct |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219555459U true CN219555459U (en) | 2023-08-18 |
Family
ID=87733167
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202223508558.XU Active CN219555459U (en) | 2022-12-28 | 2022-12-28 | Cabinet with auxiliary heat dissipation air duct |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN219555459U (en) |
-
2022
- 2022-12-28 CN CN202223508558.XU patent/CN219555459U/en active Active
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