CN219553734U

CN219553734U - Circuit board heat radiation structure and lithium battery pack

Info

Publication number: CN219553734U
Application number: CN202320370621.3U
Authority: CN
Inventors: 张磊
Original assignee: Baiyi Lighting Shanghai Holdings Ltd
Current assignee: Baiyi Lighting Shanghai Holdings Ltd
Priority date: 2023-03-02
Filing date: 2023-03-02
Publication date: 2023-08-18
Anticipated expiration: 2033-03-02

Abstract

The utility model discloses a circuit board heat dissipation structure which is suitable for conducting heat of electronic components in a circuit board to a shell. The heat dissipation piece comprises a mounting part, a heat conduction part and a plurality of heat dissipation strips, wherein the mounting part is connected with the heat conduction part, the plurality of heat dissipation strips are parallel to the axial direction of the heat conduction part and are arranged on the heat conduction part at intervals, the mounting part is provided with a mounting surface, the heat conduction part is provided with a heat conduction surface, and the mounting surface is parallel to the heat conduction surface and is spaced by a preset distance. The fastener is provided to connect the mounting portion and the housing such that when the mounting portion is mounted to the housing by the fastener, the mounting surface is attached to an inner wall of the housing, and the heat conductive surface is attached to the electronic component of the circuit board.

Description

Circuit board heat radiation structure and lithium battery pack

Technical Field

The utility model relates to the technical field of battery heat dissipation, in particular to a circuit board heat dissipation structure and a lithium battery pack.

Background

The lithium battery has the remarkable advantages of high working voltage, high energy density, low self-discharge rate, no memory effect and the like, so that the space occupied by the battery pack can be saved, and the weight of the battery pack can be reduced.

The existing lithium battery pack comprises a shell, a lithium battery and a circuit board for regulating and controlling the operation of the lithium battery, wherein the lithium battery and the circuit board are arranged inside the shell. Because the energy density of lithium cell is big, very easy burning explosion, in order to ensure the stable work of lithium cell, current shell sealing level is higher, and partial shell still can accomplish waterproofing to avoid external foreign matter to influence the work of lithium cell. Because the lithium battery can generate heat in the charge and discharge process, in order to ensure the normal work of the lithium battery, the outside of the lithium battery pack is provided with a cooling component for cooling the shell. The existing lithium battery pack is not internally provided with a structure for radiating heat of the circuit board, the circuit board cannot be directly contacted with the shell, heat in the circuit board cannot be radiated through the shell, and components in the circuit board are easily damaged by heating, so that the circuit board cannot normally regulate and control the lithium battery, and normal charge and discharge of the lithium battery pack are affected.

Disclosure of Invention

The utility model has the advantages that the heat radiating structure of the circuit board and the lithium battery pack are provided, wherein the heat conducting surface is in contact with the electronic components in the circuit board, and the heat conducting part transfers heat to the shell, so that the heat generated by the electronic components is conveniently conducted outwards, and the temperature of the circuit board is conveniently reduced.

One advantage of the present utility model is to provide a circuit board heat dissipation structure and a lithium battery pack, wherein an auxiliary board is connected to the top of the heat conduction part and the housing, so that heat of the heat conduction part is quickly conducted to the housing.

To achieve at least one of the above advantages, the present utility model provides a circuit board heat dissipation structure adapted to conduct heat of electronic components in a circuit board to a housing, the circuit board heat dissipation structure comprising:

the heat dissipation part comprises a mounting part, a heat conduction part and a plurality of heat dissipation strips, wherein the mounting part is connected with the heat conduction part, the plurality of heat dissipation strips are parallel to the axial direction of the heat conduction part and are arranged on the heat conduction part at intervals, the mounting part is provided with a mounting surface, the heat conduction part is provided with a heat conduction surface, and the mounting surface is parallel to the heat conduction surface and is spaced by a preset distance; and

the fastening pieces are arranged to connect the mounting portions with the housing, so that when the mounting portions are mounted on the housing by the fastening pieces, the mounting faces are attached to the inner wall of the housing, and the heat conducting faces are attached to the electronic components of the circuit board.

According to an embodiment of the utility model, the fastener is configured to detachably connect the mounting portion and the housing, and the fastener includes a threaded rod and a nut, wherein the threaded rod is vertically disposed in the housing, wherein the nut is detachably disposed in the threaded rod, and the mounting portion is provided with a plurality of mounting holes along an axial direction of the threaded rod, and an inner diameter of the mounting holes is smaller than an outer diameter of the nut.

According to an embodiment of the utility model, the threaded rod is integrally made with the housing.

According to an embodiment of the present utility model, the mounting portion is provided with a first heat conduction hole along an axial direction thereof.

According to an embodiment of the present utility model, the heat conducting portion is provided with a second heat conducting hole along its own axial direction, and the heat dissipating strip is disposed on an inner wall of the second heat conducting hole.

According to an embodiment of the present utility model, the heat dissipating member further includes a connecting member configured to enhance a connection strength between the mounting portion and the heat conducting portion.

According to an embodiment of the present utility model, the heat dissipation member further includes an auxiliary board, the auxiliary board is in a bent shape, the auxiliary board has a horizontal portion and a vertical portion, one side of the vertical portion is disposed on the side wall of the housing, and one side of the horizontal portion is disposed on the top of the heat conducting portion in a fitting manner.

According to an embodiment of the present utility model, the circuit board is further provided with a transformer;

the height of the heat conduction part is flush with the height of the transformer, the side surface of the heat conduction part is attached to the transformer, and the horizontal part extends to the top of the transformer.

According to an embodiment of the present utility model, the heat conducting part is detachably connected to the circuit board.

To achieve at least one of the above advantages, the present utility model provides a lithium battery pack including:

a housing defining a receiving cavity;

a battery pack disposed in the receiving chamber;

a circuit board, the circuit board is arranged on the inner wall of the shell, and the circuit board is electrically connected with an external circuit and the battery pack; and

the circuit board heat dissipation structure according to the above embodiment is disposed in the accommodating cavity and is attached to the electronic component of the circuit board and the inner wall of the housing at the same time.

Drawings

Fig. 1 shows a schematic structure of a lithium battery pack according to the present utility model.

Fig. 2 is a perspective view showing the cooperation of the circuit board heat dissipation structure and the circuit board according to the present utility model.

Fig. 3 shows a partial cross-sectional view of the lithium battery pack according to the present utility model taken along A-A in fig. 1.

Detailed Description

The following description is presented to enable one of ordinary skill in the art to make and use the utility model. The preferred embodiments in the following description are by way of example only and other obvious variations will occur to those skilled in the art. The basic principles of the utility model defined in the following description may be applied to other embodiments, variations, modifications, equivalents, and other technical solutions without departing from the spirit and scope of the utility model.

It will be appreciated by those skilled in the art that in the present disclosure, the terms "longitudinal," "transverse," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," etc. refer to an orientation or positional relationship based on that shown in the drawings, which is merely for convenience of description and to simplify the description, and do not indicate or imply that the apparatus or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore the above terms should not be construed as limiting the present utility model.

It will be understood that the terms "a" and "an" should be interpreted as referring to "at least one" or "one or more," i.e., in one embodiment, the number of elements may be one, while in another embodiment, the number of elements may be plural, and the term "a" should not be interpreted as limiting the number.

Referring to fig. 1 to 3, a lithium battery pack according to a preferred embodiment of the present utility model will be described in detail below. The lithium battery pack includes a housing 900, a battery pack, a circuit board 800, and a circuit board heat dissipation structure.

The casing 900 forms a holding cavity 901, the group battery be set up in hold the cavity 901, the circuit board 800 set up in through at least one cushion 810 the inner wall of casing 900, through cushion 810 can avoid welding stitch in the circuit board 800 direct with the inner wall contact of casing 900 to avoid appearing the condition of short circuit electric leakage. As shown in fig. 2, the circuit board 800 is disposed at an inner bottom wall of the housing 900 through two pads 810, and the circuit board 800 is electrically connected to an external circuit and the battery pack, so that the battery pack can be charged or discharged to the external circuit through the circuit board 800. The circuit board heat dissipation structure is disposed in the accommodating cavity 901 and is attached to the electronic component of the circuit board 800 and the inner wall of the housing 900, and the circuit board heat dissipation structure is used for conducting the heat of the electronic component in the circuit board 800 to the housing 900, so as to reduce the temperature of the circuit board 800.

The circuit board heat dissipation structure comprises a heat dissipation member 10 and a plurality of fastening members 20, wherein the heat dissipation member 10 comprises a mounting portion 11, a heat conduction portion 12 and a plurality of heat dissipation strips 13, wherein the mounting portion 11 is connected with the heat conduction portion 12, the plurality of heat dissipation strips 13 are parallel to the axial direction of the heat conduction portion 12 and are arranged on the heat conduction portion 12 at intervals, and the plurality of heat dissipation strips 13 protrude out of the surface of the heat conduction portion 12. The mounting portion 11 has a mounting surface 1101, and the heat conductive portion 12 has a heat conductive surface 1201, and the mounting surface 1101 is parallel to the heat conductive surface 1201 and spaced apart from the heat conductive surface 1201 by a predetermined distance. The fastener 20 is provided to connect the mounting portion 11 and the housing 900. When the mounting portion 11 is mounted on the housing 900 by the fastener 20, the mounting surface 1101 is closely attached to the inner wall of the housing 900, and at the same time, the heat conductive surface 1201 is attached to the electronic component of the circuit board 800.

When the electronic component of the circuit board 800 heats, the electronic component is attached to the heat conducting surface 1201, and heat in the electronic component can be conducted to the heat conducting portion 12 through the heat conducting surface 1201, and is dissipated by means of the heat dissipating strip 13 disposed on the heat conducting portion 12, so that heat of the electronic component of the circuit board 800 is reduced, and since the cooling component is disposed outside the housing 900, the heat conducting portion 12 and the heat dissipating strip 13 facilitate rapid conduction of heat, and facilitate the cooling component to take away heat of the housing 900, and facilitate rapid reduction of internal temperature of the housing 900. In addition, the mounting surface 1101 of the mounting portion 11 is attached to the inner wall of the housing 900, and the mounting portion 11 is configured to transfer the heat in the heat conducting portion 12 to the housing 900, and radiate the heat in the heat conducting portion 12 outward through the housing 900, so that the temperature of the circuit board 800 is rapidly reduced, and the circuit board 800 is ensured to be in a good working state.

Specifically, as shown in fig. 3, the circuit board 800 is mounted to the inner bottom wall of the housing 900, and the mounting surface 1101 is spaced from the heat-conducting surface 1201 by the predetermined distance equal to the distance from the top surface of the circuit board 800 to the inner bottom wall of the housing 900. When the mounting portion 11 is fixed by the fastener 20, the heat conducting surface 1201 can be stably attached to the electronic component of the circuit board 800.

The fastener 20 is provided to detachably connect the mounting portion 11 and the housing 900. Each of the fasteners 20 includes a threaded rod 21 and a nut 22, wherein the threaded rod 21 is vertically disposed on the inner bottom wall of the housing 900, and wherein the nut 22 is detachably disposed on the outer wall of the threaded rod 21. The mounting portion 11 is provided with a plurality of mounting holes 1103 along the axial direction of the threaded rod 21, and the inner diameter of the mounting holes 1103 is smaller than the outer diameter of the nut 22. When fixing the mounting portion 11 and the housing 900, the nut 22 is removed in advance, the mounting portion 11 is fitted to the outside of the threaded rod 21 through the mounting hole 1103, the nut 22 is fitted to the threaded rod 21, and the nut 22 is rotated to press the nut 22 against the mounting portion 11, so that the mounting portion 11 is fixed to the housing 900 by the engagement of the nut 22 and the threaded rod 21.

The threaded rod 21 is integrally formed with the housing 900, specifically, the threaded rod 21 may be welded to an inner bottom wall of the housing 900, so that the purpose that the threaded rod 21 is integrally formed with the housing 900 is achieved, and a gap generated outside the housing 900 due to the fact that the threaded rod 21 is welded to the housing 900 can be avoided when the threaded rod 21 is installed.

The mounting portion 11 is provided with a first heat conducting hole 1102 along the axial direction of the mounting portion 11, the contact area between the mounting portion 11 and the air can be increased by arranging the first heat conducting hole 1102 on the mounting portion 11, the mounting portion 11 also has a heat dissipation function, and heat conducted from the heat conducting portion 12 can be transferred to the air.

The heat conducting portion 12 is provided with a second heat conducting hole 1202 along its own axial direction, the second heat conducting hole 1202 makes the inside of the heat conducting portion 12 hollow, and the second heat conducting hole 1202 increases the contact area between the heat conducting portion 12 and the air.

Preferably, the heat dissipating strip 13 is disposed on the inner wall of the second heat conducting hole 1202, so as to further increase the contact area between the heat conducting portion 12 and the air, and improve the heat dissipating efficiency of the heat conducting portion 12. It is further preferred that the heat dissipating strip 13 is disposed on a side of the second heat conducting hole 1202 near the heat conducting surface 1201, so that the heat dissipating strip 13 can quickly conduct heat in the heat conducting surface 1201 to the air.

Specifically, the two ends of the heat dissipation element 10 extend to contact with the side walls of the housing 900, where the two ends of the heat conduction portion 12 correspondingly abut against the opposite side walls of the housing 900, and the two ends of the heat dissipation strip 13 disposed on the heat conduction portion 12 correspondingly abut against the opposite side walls of the housing 900, and the heat dissipation strip 13 can directly transfer heat to the housing 900, so that the heat in the heat conduction portion 12 is dissipated outwards through the housing 900.

The mounting portion 11, the heat conducting portion 12 and the heat dissipating strip 13 are integrally formed, and the material of the mounting portion 11 and the heat conducting portion 12 may be aluminum or copper, which is favorable for rapid heat conduction between the two, and for reducing the heat of the circuit board 800 by the mounting portion 11 and the heat conducting portion 12.

The heat dissipation element 10 further includes a connecting element 14, and the connecting element 14 is configured to enhance the connection strength between the mounting portion 11 and the heat conducting portion 12. The connecting piece 14 is in a bent shape, one end of the connecting piece 14 is connected with the mounting portion 11, the other end of the connecting piece 14 is connected with the heat conducting portion 12, and the middle portion of the connecting piece 14 protrudes out of the mounting portion 11 and the heat conducting portion 12 due to the fact that the connecting piece 14 is in a bent shape. Therefore, the connector 14 can enhance the strength of the mounting portion 11 and the heat conducting portion 12, and can increase the contact area between the mounting portion 11 and the heat conducting portion 12 and the air, thereby enhancing the heat dissipation efficiency of the heat dissipation member 10.

Specifically, the two ends of the mounting portion 11 and the two ends of the connecting piece 14 are correspondingly abutted against the two opposite side walls of the housing 900, so that the contact area between the heat dissipation member 10 and the housing 900 can be increased by the mounting portion 11 and the connecting piece 14, and the heat transfer rate from the heat conduction portion 12 to the housing 900 can be increased.

The heat sink 10 further comprises an auxiliary plate 15. The auxiliary plate 15 is bent, the auxiliary plate 15 has a horizontal portion 151 and a vertical portion 152, one side of the vertical portion 152 is disposed on the side wall of the housing 900, and one side of the horizontal portion 151 is disposed on the top of the heat conducting portion 12 in a fitting manner.

The heat conducting part 12 contacts with the electronic component of the circuit board 800, the temperature of the heat conducting part 12 rises, the heat conducting part 12 can transfer heat to the bottom wall of the housing 900 through the mounting part 11, and can also transfer heat to the side wall of the housing 900 through the auxiliary plate 15, and the heat in the heat conducting part 12 can be conducted in two directions, so that the heat in the heat conducting part 12 can be stably conducted to the housing 900, and then the heat of the heat conducting part 12 is conducted outwards through the housing 900, so that a good working environment is provided for the circuit board 800.

The circuit board 800 is also provided with a transformer. The height of the heat conduction part 12 is flush with the height of the transformer, and the side surface of the heat conduction part 12 is attached to the side surface of the transformer. The horizontal portion 151 extends to the top of the transformer away from an end of the vertical portion 152. In this way, the horizontal portion 151 may be directly attached to the top of the transformer, and the heat of the transformer is directly conducted to the housing 900 through the horizontal portion 151 and the vertical portion 152, so that the heat of the transformer may be directly reduced, and the heat of the transformer may be quickly conducted to the horizontal portion 151, thereby quickly reducing the temperature of the circuit board 800.

Specifically, as shown in fig. 3, the horizontal portion 151 is directly fixed on the top of the heat conducting portion 12 by a bolt or a screw, so as to ensure that the horizontal portion 151 and the heat conducting portion 12 contact with a larger contact area, and facilitate heat transfer from the heat conducting portion 12 to the horizontal portion 151. The inner side wall of the housing 900 is provided with a U-shaped plate, the opening of which is provided to the side wall of the housing 900 toward the housing 900, and the vertical portion 152 is fixed to the U-shaped plate by bolts or screws, thereby fixing the vertical portion 152. The vertical portion 152 is fixed to the side wall of the housing 900 by means of the U-shaped plate and bolts or screws, so that the bolts or screws can be prevented from generating voids in the housing 900.

The heat conducting part 12 is detachably connected with the circuit board 800.

The circuit board 800 also includes a number of set screws. The circuit board 800 is provided with a plurality of positioning holes 801. The heat conducting portion 12 is provided with a plurality of threaded holes on the heat conducting surface 1201, and each positioning screw penetrates through one positioning hole 801 and is then in threaded connection with one threaded hole, so that the circuit board 800 is detachably connected with the heat conducting portion 12. Since the circuit board 800 is fixed to the heat conductive portion 12 by the positioning bolts, it is possible to ensure that the electronic component on the circuit board 800 is stably attached to the heat conductive surface 1201, so that the heat of the electronic component can be stably conducted to the heat conductive surface 1201.

Specifically, when the heat sink 10 and the circuit board 800 are mounted in the housing 900, the heat conductive part 12 and the circuit board 800 may be connected in advance by the set screw, and the heat sink 10 and the circuit board 800 assembled as one body may be mounted to the housing 900 by the fastener 20 and the spacer 810. The preassembly of the heat conductive part 12 and the circuit board 800 can ensure stable adhesion of the electronic component after mounting to the heat conductive surface 1201.

The heat conduction device comprises a mounting part 11, a heat conduction part 12, an auxiliary plate 15, a heat conduction part 12, a shell 900 and a heat conduction part 12, wherein the mounting part 11 and the heat conduction part 12 are fixed inside the shell 900, the heat of an electronic component in the circuit board 800 can be simultaneously conducted to the mounting part 11 and the auxiliary plate 15, the heat of the electronic component in the circuit board 800 is conducted to the shell 900 through the upper direction and the lower direction of the heat conduction part 12, and two ends of the heat conduction part 12 are directly abutted against the side wall of the shell 900, so that the heat of the heat conduction part 12 is further facilitated to be transferred to the shell 900.

It will be appreciated by persons skilled in the art that the embodiments of the utility model described above and shown in the drawings are by way of example only and are not limiting. The advantages of the present utility model have been fully and effectively realized. The functional and structural principles of the present utility model have been shown and described in the examples and embodiments of the utility model may be modified or practiced without departing from the principles described.

Claims

1. The circuit board heat radiation structure is suitable for conducting the heat of an electronic component in a circuit board to a shell, and is characterized in that the circuit board heat radiation structure comprises:

2. The circuit board heat dissipating structure of claim 1, wherein said fastener is configured to detachably connect said mounting portion and said housing, said fastener comprising a threaded rod and a nut, wherein said threaded rod is vertically disposed in said housing, wherein said nut is detachably disposed in said threaded rod, said mounting portion is axially provided with a plurality of mounting holes, and an inner diameter of said mounting holes is smaller than an outer diameter of said nut.

3. The circuit board heat dissipating structure of claim 2, wherein said threaded rod is integrally formed with said housing.

4. The heat dissipating structure of claim 1, wherein the mounting portion is provided with a first heat-conducting hole along its own axis.

5. The heat dissipating structure of claim 1, wherein the heat conducting portion is provided with a second heat conducting hole along its own axis, and the heat dissipating strip is disposed on an inner wall of the second heat conducting hole.

6. The circuit board heat dissipating structure of claim 1, wherein said heat dissipating member further comprises a connecting member configured to enhance a connection strength of said mounting portion and said heat conducting portion.

7. The circuit board heat dissipation structure according to claim 6, wherein the heat dissipation member further comprises an auxiliary board, the auxiliary board is bent, the auxiliary board has a horizontal portion and a vertical portion, one side of the vertical portion is disposed on the side wall of the housing, and one side of the horizontal portion is disposed on the top of the heat conducting portion in a fitting manner.

8. The circuit board heat dissipating structure of claim 7, wherein said circuit board is further provided with a transformer;

9. The circuit board heat dissipating structure of claim 1, wherein said thermally conductive portion is removably coupled to said circuit board.

10. Lithium battery, its characterized in that, lithium battery includes:

a housing defining a receiving cavity;

a battery pack disposed in the receiving chamber;

the circuit board heat dissipation structure as recited in any one of claims 1 to 9, being disposed in the accommodation chamber while being bonded to an electronic component of the circuit board and an inner wall of the housing.