CN219553620U - Water-cooling radiator applied to power module - Google Patents
Water-cooling radiator applied to power module Download PDFInfo
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- CN219553620U CN219553620U CN202321081673.5U CN202321081673U CN219553620U CN 219553620 U CN219553620 U CN 219553620U CN 202321081673 U CN202321081673 U CN 202321081673U CN 219553620 U CN219553620 U CN 219553620U
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Abstract
The utility model discloses a water-cooling radiator applied to a power module, which comprises a radiating substrate and radiating columns densely distributed on the radiating substrate, wherein the radiating columns are in a boss structure, the cross section of the boss is one or a combination of a plurality of ellipse, diamond or circle, the radiating columns are vertically arranged on the radiating substrate, the lower surfaces of the radiating columns are parallel to the lower surface of the radiating substrate, the included angle between the side surfaces of the radiating columns and the radiating substrate is 60-90 degrees, and the height of the radiating columns is 1-10 mm. The radiator overcomes the defect of poor cooling effect of the traditional radiating substrate, greatly improves the cooling effect of the radiating substrate on the power module chip through the optimization of the radiating column structure, reduces the flow resistance of cooling liquid flowing through the radiating substrate, effectively reduces the working temperature of the power module, and improves the reliability and the service life of the power module.
Description
Technical Field
The present disclosure relates to heat dissipation devices, and particularly to a water-cooled heat sink for a power module.
Background
Along with the gradual increase of the market share of the electric automobile, an electric control system of the electric automobile is also rapidly developed, and a power module in the electric control system is used as a core component of the electric automobile and plays a vital role in the reliability, safety and stability of the electric automobile. But the running safety of the electric automobile can be influenced by the heat generated by the power module in operation, so that the power module is well heat-dissipation designed, the working temperature of the power module can be reduced, and the reliability and the service life of the power module are improved. In general, a direct liquid cooling mode is adopted for the power module, and a cooling liquid flows from a water inlet to a water outlet of a heat dissipation substrate of the power module, so that the temperature of the power module is reduced by taking away the heat of the heat dissipation substrate, and the normal operation of a chip of the power module is ensured. At present, the power module for the vehicle is mainly a three-phase bridge type power module, the three-phase power modules are uniformly distributed with the same number of chips, and the higher the power consumption of the chips is, the higher the temperature of the chips is. However, the heat dissipation post structure on the lower surface of the existing heat dissipation substrate is in a regular shape, the heights of the heat dissipation posts are consistent, the heat dissipation performance of the heat dissipation substrate is limited, and the flow resistance of the cooling liquid flowing through the heat dissipation substrate is overlarge, so that the cooling effect of the heat dissipation substrate on the power module chip is affected.
Disclosure of Invention
The utility model aims to solve the technical problem of providing a water-cooling radiator applied to a power module, which overcomes the defect of poor cooling effect of the traditional heat-radiating substrate, greatly improves the cooling effect of the heat-radiating substrate on a power module chip through the optimization of a heat-radiating column structure, reduces the flow resistance of cooling liquid flowing through the heat-radiating substrate, effectively reduces the working temperature of the power module, and improves the reliability and the service life of the power module.
In order to solve the technical problems, the water-cooling radiator applied to the power module comprises a radiating substrate and radiating columns densely distributed on the radiating substrate, wherein the radiating columns are in a boss structure, the cross section of each boss is one or a combination of a plurality of ellipse, diamond or round, the radiating columns are vertically arranged on the radiating substrate, the lower surfaces of the radiating columns are parallel to the lower surface of the radiating substrate, an included angle between the side surfaces of the radiating columns and the radiating substrate is 60-90 degrees, and the height of each radiating column is 1-10 mm.
Further, the ratio of the major axis to the minor axis of the ellipse is between 2:1 and 5:1, four sides of the rhombus are equal in length, and the length is 0.5-5 mm.
Further, the heights of the heat dissipation columns at the water inlet and the water outlet of the heat dissipation substrate are smaller than the heights of the heat dissipation columns at other positions of the heat dissipation substrate.
Further, the heights of the heat dissipation columns are equal along the direction from the water inlet to the water outlet of the heat dissipation base plate.
Further, the height of the heat dissipation column near the water inlet of the heat dissipation substrate changes gradually, and the height of the heat dissipation column near the water outlet of the heat dissipation substrate changes gradually.
Further, the heat dissipation columns are arranged at intervals according to the positions of the power module chips arranged on the heat dissipation substrate, the cross sections of the heat dissipation columns in adjacent areas are identical or different, and the cross sections of the heat dissipation columns in the same area are one or more of oval, diamond or circular.
Further, when the cross section of the heat dissipation column is elliptical, the heat dissipation column is arranged along the major axis direction of the ellipse, and the major axis direction of the ellipse is parallel to the flow direction of the cooling liquid.
Further, when the cross section of the heat dissipation column is diamond, the heat dissipation column is arranged along the longer direction of the diagonal line of the diamond, and the longer direction of the diagonal line of the diamond is parallel to the flow direction of the cooling liquid.
Further, the heat dissipation substrate is a pure copper plate, a copper alloy plate, a pure aluminum plate, an aluminum alloy plate, a copper aluminum alloy plate or a steel plate.
Because the water-cooling radiator applied to the power module adopts the technical scheme, namely the radiator comprises a radiating substrate and radiating columns densely distributed on the radiating substrate, wherein the radiating columns are in a boss structure, the cross section of each boss is one or a combination of a plurality of ellipse, diamond or circle, the radiating columns are vertically arranged on the radiating substrate, the lower surfaces of the radiating columns are parallel to the lower surface of the radiating substrate, the included angle between the side surfaces of the radiating columns and the radiating substrate is 60-90 degrees, and the height of each radiating column is 1-10 mm. The radiator overcomes the defect of poor cooling effect of the traditional radiating substrate, greatly improves the cooling effect of the radiating substrate on the power module chip through the optimization of the radiating column structure, reduces the flow resistance of cooling liquid flowing through the radiating substrate, effectively reduces the working temperature of the power module, and improves the reliability and the service life of the power module.
Drawings
The utility model is described in further detail below with reference to the attached drawings and embodiments:
FIG. 1 is a schematic diagram of a water-cooled radiator applied to a power module according to the present utility model;
FIG. 2 is a schematic view of a heat dissipating stud of the heat sink with an elliptical cross section;
FIG. 3 is a schematic diagram of a heat dissipation column with a diamond cross section in the heat dissipation device;
FIG. 4 is a schematic view of a heat dissipation post with a circular cross section in the heat dissipation device;
FIG. 5 is a schematic diagram showing an angle between a side surface of a heat dissipation post and a heat dissipation substrate in the heat dissipation device;
FIG. 6 is a schematic diagram showing the arrangement of heat dissipation columns at the water inlet and water outlet of a heat dissipation substrate in the heat dissipation device;
FIG. 7 is a schematic view showing the incremental and decremental arrangement of heat dissipation columns at the water inlet and water outlet of a heat dissipation substrate in the heat dissipation device;
FIG. 8 is a schematic view showing the same cross-sectional shape of heat dissipation columns of adjacent sections in the heat sink;
FIG. 9 is a schematic diagram showing different cross-sectional shapes of heat dissipation columns of adjacent sections in the heat sink;
FIG. 10 is a schematic diagram of a heat dissipating substrate, heat dissipating studs and power module chip layout in the present heat spreader;
fig. 11 is a schematic diagram of heat conduction of a power module through a heat dissipating substrate.
Detailed Description
As shown in fig. 1 to 5, the water-cooled radiator applied to a power module of the present utility model includes a heat dissipation substrate 1 and heat dissipation columns 2 densely distributed on the heat dissipation substrate 1, the heat dissipation columns 2 are bosses, the cross section of each boss is one or a combination of several of ellipse, diamond or circle, the heat dissipation columns 2 are vertically arranged on the heat dissipation substrate 1, the lower surface 21 of the heat dissipation columns 2 is parallel to the lower surface 11 of the heat dissipation substrate 1, an included angle between the side surface of the heat dissipation columns 2 and the heat dissipation substrate 1 is 60-90 °, and the height of the heat dissipation columns 2 is 1-10 mm.
Preferably, the ratio of the major axis to the minor axis of the ellipse is between 2:1 and 5:1, four sides of the rhombus are equal in length, and the length is 0.5-5 mm.
Preferably, as shown in fig. 6, the height of the heat dissipation post 2 at the water inlet and the water outlet of the heat dissipation substrate 1 is smaller than the height of the heat dissipation post 2 at other positions of the heat dissipation substrate 1. Namely the height of the heat dissipation column near the water inlet and the water outlet is h 1 The heights of the rest heat dissipation columns are h 2 ，h 2 ＞h 1 The flow resistance of the cooling liquid at the water inlet can be reduced by reducing the height of the cooling column close to the water inlet, the flow speed of the cooling liquid can be further improved by reducing the height of the cooling column close to the water outlet, the scale formation rate of the surface of the cooling substrate can be reduced by increasing the flow speed of the cooling liquid, and the service life of the power module is prolonged.
Preferably, the height of the heat dissipation post 2 is equal along the direction from the water inlet to the water outlet of the heat dissipation substrate 1.
Preferably, as shown in fig. 7, the height of the heat dissipation post 2 near the water inlet of the heat dissipation substrate 1 increases, and the height of the heat dissipation post 2 near the water outlet of the heat dissipation substrate 1 decreases. And in addition, the flow resistance of the cooling liquid can be reduced due to the change of the height of the heat dissipation column, the flow velocity of the cooling liquid is increased, the generation rate of scale on the surface of the heat dissipation substrate is reduced, and the service life of the power module is prolonged.
Preferably, as shown in fig. 8, 9 and 10, the heat dissipation columns 2 are arranged at intervals according to the positions of the power module chips 3 arranged on the heat dissipation substrate 1, the cross-sectional shapes of the heat dissipation columns in adjacent areas are the same or different, and the cross-sectional shapes of the heat dissipation columns in the same area are one or more of oval, diamond or circular.
The power module chip is generally arranged on the heat dissipation substrate according to the phase A, the phase B and the phase C, the heat dissipation columns 2 are respectively arranged in the phase A region, the phase B region and the phase C region of the heat dissipation substrate, and adjacent regions are arranged at intervals.
q=m×C p ×△T
Wherein, the liquid crystal display device comprises a liquid crystal display device,qfor the heat (J) carried away by the cooling liquid in unit time, m is the mass flow rate (kg/s) of the cooling liquid in unit time, C p The specific heat capacity (J/kg.K) of the cooling liquid is shown as delta T, and the delta T is the temperature difference (K) of the cooling liquid from the water inlet to the water outlet;
the radiator optimizes the structure that the radiating columns are arranged on the surfaces of all radiating substrates in the traditional radiator, and the radiating columns are arranged on the radiating substrates in a partition mode, so that better radiating performance is obtained.
Meanwhile, in adjacent subareas or the same subareas, the structural shapes of the heat dissipation columns can be different, and various combination forms exist, and the heat dissipation capacities of the heat dissipation columns with different cross-sectional shapes are different, so that the heat dissipation columns with better heat dissipation capacity can be arranged in the areas with higher heat dissipation demands, and the phenomenon of unbalanced heat dissipation among different subareas is avoided.
Preferably, when the cross section of the heat dissipation column 2 is elliptical, the heat dissipation column 2 is arranged along the major axis direction of the ellipse, and the major axis direction of the ellipse is parallel to the flow direction of the cooling liquid. Because the flow resistance coefficient of the ellipse is lower, and the turbulent flow effect on the fluid is better, the heat exchange performance of the radiator can be improved.
Preferably, when the cross section of the heat dissipation column 2 is diamond, the heat dissipation column 2 is arranged along the longer direction of the diagonal line of the diamond, and the longer direction of the diagonal line of the diamond is parallel to the flow direction of the cooling liquid.
Preferably, the heat dissipation substrate 1 is a pure copper plate, a copper alloy plate, a pure aluminum plate, an aluminum alloy plate, a copper aluminum alloy plate, or a steel plate.
As shown in fig. 11, in the electric control system of an electric automobile, a power module chip 3 is a heat generating source, heat flow is vertically and downwardly transferred from the end of the chip 3 to the upper surface of a heat dissipating substrate 1, and then is transferred from the lower surface of the heat dissipating substrate 1 to a heat dissipating post, the heat flow has a heat transverse conduction phenomenon in the transfer process, and the effective heat transferring area can be gradually increased. Thereby improving the reliability and operating life of the power module.
Claims (9)
1. The utility model provides a be applied to water-cooling radiator of power module, includes radiating basal plate and densely arranged in radiating post of radiating basal plate, its characterized in that: the heat dissipation column is characterized in that the heat dissipation column is of a boss, the cross section of the boss is one or a combination of several of ellipse, diamond or circle, the heat dissipation column is vertically arranged on the heat dissipation substrate, the lower surface of the heat dissipation column is parallel to the lower surface of the heat dissipation substrate, an included angle between the side surface of the heat dissipation column and the heat dissipation substrate is 60-90 degrees, and the height of the heat dissipation column is 1-10 mm.
2. The water-cooled heat sink for a power module of claim 1, wherein: the ratio of the major axis to the minor axis of the ellipse is 2:1-5:1, four sides of the rhombus are equal in length, and the length is 0.5-5 mm.
3. The water-cooled heat sink for a power module of claim 1, wherein: the heights of the heat dissipation columns at the water inlet and the water outlet of the heat dissipation substrate are smaller than those of the heat dissipation columns at other positions of the heat dissipation substrate.
4. The water-cooled heat sink for a power module of claim 1, wherein: the heights of the heat dissipation columns are equal along the direction from the water inlet to the water outlet of the heat dissipation base plate.
5. The water-cooled heat sink for a power module of claim 1, wherein: the height of the heat dissipation column near the water inlet of the heat dissipation substrate changes gradually, and the height of the heat dissipation column near the water outlet of the heat dissipation substrate changes gradually.
6. The water-cooled heat sink for a power module of claim 1, wherein: the heat dissipation columns are arranged at intervals according to the positions of the power module chips arranged on the heat dissipation substrate, the cross sections of the heat dissipation columns in adjacent areas are identical or different, and the cross sections of the heat dissipation columns in the same area are one or more of oval, diamond or circular.
7. The water-cooled heat sink for a power module of claim 1, wherein: when the cross section of the heat dissipation column is elliptical, the heat dissipation column is arranged along the major axis direction of the ellipse, and the major axis direction of the ellipse is parallel to the flow direction of the cooling liquid.
8. The water-cooled heat sink for a power module of claim 1, wherein: when the cross section of the heat dissipation column is diamond, the heat dissipation column is arranged along the longer direction of the diagonal line of the diamond, and the longer direction of the diagonal line of the diamond is parallel to the flow direction of the cooling liquid.
9. The water-cooled heat sink for a power module of claim 1, wherein: the heat dissipation substrate is a pure copper plate, a copper alloy plate, a pure aluminum plate, an aluminum alloy plate, a copper aluminum alloy plate or a steel plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321081673.5U CN219553620U (en) | 2023-05-08 | 2023-05-08 | Water-cooling radiator applied to power module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321081673.5U CN219553620U (en) | 2023-05-08 | 2023-05-08 | Water-cooling radiator applied to power module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219553620U true CN219553620U (en) | 2023-08-18 |
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ID=87704023
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202321081673.5U Active CN219553620U (en) | 2023-05-08 | 2023-05-08 | Water-cooling radiator applied to power module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN219553620U (en) |
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2023
- 2023-05-08 CN CN202321081673.5U patent/CN219553620U/en active Active
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