CN219553614U - 一种半导体电路和散热器 - Google Patents
一种半导体电路和散热器 Download PDFInfo
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- CN219553614U CN219553614U CN202222501671.9U CN202222501671U CN219553614U CN 219553614 U CN219553614 U CN 219553614U CN 202222501671 U CN202222501671 U CN 202222501671U CN 219553614 U CN219553614 U CN 219553614U
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- radiating
- heat dissipation
- semiconductor circuit
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 54
- 239000000758 substrate Substances 0.000 claims abstract description 39
- 238000007789 sealing Methods 0.000 claims abstract description 23
- 230000017525 heat dissipation Effects 0.000 claims description 56
- 229910052751 metal Inorganic materials 0.000 claims description 5
- 239000002184 metal Substances 0.000 claims description 5
- 239000011248 coating agent Substances 0.000 claims 2
- 238000000576 coating method Methods 0.000 claims 2
- 238000012546 transfer Methods 0.000 abstract description 8
- 238000013461 design Methods 0.000 abstract description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 5
- 239000000463 material Substances 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 229910044991 metal oxide Inorganic materials 0.000 description 4
- 150000004706 metal oxides Chemical class 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 239000000945 filler Substances 0.000 description 3
- 238000012545 processing Methods 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- 239000004020 conductor Substances 0.000 description 2
- 238000005538 encapsulation Methods 0.000 description 2
- 230000020169 heat generation Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 230000003647 oxidation Effects 0.000 description 2
- 238000007254 oxidation reaction Methods 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 238000011084 recovery Methods 0.000 description 2
- 239000004576 sand Substances 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 229910001128 Sn alloy Inorganic materials 0.000 description 1
- CAVCGVPGBKGDTG-UHFFFAOYSA-N alumanylidynemethyl(alumanylidynemethylalumanylidenemethylidene)alumane Chemical compound [Al]#C[Al]=C=[Al]C#[Al] CAVCGVPGBKGDTG-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000033228 biological regulation Effects 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- QRJOYPHTNNOAOJ-UHFFFAOYSA-N copper gold Chemical compound [Cu].[Au] QRJOYPHTNNOAOJ-UHFFFAOYSA-N 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000007772 electroless plating Methods 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- -1 etc. Substances 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910021389 graphene Inorganic materials 0.000 description 1
- 239000004519 grease Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- CLDVQCMGOSGNIW-UHFFFAOYSA-N nickel tin Chemical compound [Ni].[Sn] CLDVQCMGOSGNIW-UHFFFAOYSA-N 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 238000001721 transfer moulding Methods 0.000 description 1
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- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
Description
Claims (9)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202222501671.9U CN219553614U (zh) | 2022-09-21 | 2022-09-21 | 一种半导体电路和散热器 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202222501671.9U CN219553614U (zh) | 2022-09-21 | 2022-09-21 | 一种半导体电路和散热器 |
Publications (1)
Publication Number | Publication Date |
---|---|
CN219553614U true CN219553614U (zh) | 2023-08-18 |
Family
ID=87731208
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN202222501671.9U Active CN219553614U (zh) | 2022-09-21 | 2022-09-21 | 一种半导体电路和散热器 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN219553614U (zh) |
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2022
- 2022-09-21 CN CN202222501671.9U patent/CN219553614U/zh active Active
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
GR01 | Patent grant | ||
GR01 | Patent grant | ||
TR01 | Transfer of patent right | ||
TR01 | Transfer of patent right |
Effective date of registration: 20240513 Address after: 710000 No.1-5, Jinye Road, Yanta District, Xi'an City, Shaanxi Province Patentee after: Zhu Shiping Country or region after: China Address before: 528000 one of No.10 Yangsheng Road, Xianhu resort, Danzao Town, Nanhai District, Foshan City, Guangdong Province Patentee before: Guangdong Huixin Semiconductor Co.,Ltd. Country or region before: China |
|
TR01 | Transfer of patent right |
Effective date of registration: 20240619 Address after: 710000, Room 3205, Building A, Qujiang, Wangzuo, Yanxiang Road, Qujiang New District, Xi'an City, Shaanxi Province Patentee after: Xi'an Zhongbaixin Investment Co.,Ltd. Country or region after: China Address before: 710000 No.1-5, Jinye Road, Yanta District, Xi'an City, Shaanxi Province Patentee before: Zhu Shiping Country or region before: China |