CN219552952U - Air-cooled radiator for processor and computer - Google Patents
Air-cooled radiator for processor and computer Download PDFInfo
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- CN219552952U CN219552952U CN202320615853.0U CN202320615853U CN219552952U CN 219552952 U CN219552952 U CN 219552952U CN 202320615853 U CN202320615853 U CN 202320615853U CN 219552952 U CN219552952 U CN 219552952U
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
- Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management
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- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The present disclosure relates to an air-cooled radiator for a processor and a computer, the air-cooled radiator including a heat conductive plate, a heat dissipation fin, and a fan, the lower surface of the heat conductive plate being for heat conductive contact with the processor, the heat dissipation fin being disposed on the upper surface of the heat conductive plate, the fan being located above the heat dissipation fin and being for blowing air to the heat dissipation fin and the upper surface of the heat conductive plate; wherein, the upper surface of heat-conducting plate forms to the cambered surface, and the upper surface of heat-conducting plate is formed with the guiding gutter. The air-cooled radiator has better heat radiation capacity, the upper surface of the heat conducting plate of the air-cooled radiator is formed into an arc surface, and the diversion trench formed on the upper surface of the heat conducting plate can increase the heat radiation area of the air-cooled radiator and air convection heat exchange, so that the heat radiation efficiency of the processor is improved.
Description
Technical Field
The present disclosure relates to the field of heat dissipation technologies for processors, and in particular, to an air-cooled heat sink for a processor and a computer.
Background
The computer processor is a functional unit for interpreting and executing instructions, and is easy to store heat due to smaller volume, and the performance of the computer processor is easy to be affected by high temperature along with the running time, so that the computer is halted or destroyed. In the related art, an air-cooled heat sink (e.g., a desktop CPU down-pressure heat sink disclosed in patent application publication No. CN109358735 a) is generally used to dissipate heat from a computer processor. The air-cooled radiator generally takes away the heat of the processor by blowing the fan to the structures such as the radiating fins, and the contact area of the air and the structures such as the radiating fins is limited, so that the radiating efficiency is limited, and the radiating efficiency cannot be further improved.
Disclosure of Invention
An object of the present disclosure is to provide an air-cooled radiator for a processor and a computer to solve technical problems in the related art.
In order to achieve the above object, according to a first aspect of the present disclosure, there is provided an air-cooled radiator for a processor, including a heat conductive plate, a heat dissipation fin, and a fan, the lower surface of the heat conductive plate being for heat-conductive contact with the processor, the heat dissipation fin being disposed on an upper surface of the heat conductive plate, the fan being located above the heat dissipation fin and being for blowing air to the heat dissipation fin and the upper surface of the heat conductive plate;
wherein, the upper surface of heat-conducting plate forms to the cambered surface, and the upper surface of heat-conducting plate is formed with the guiding gutter.
Optionally, the upper surface of the heat conducting plate is formed as an upwardly convex cambered surface.
Alternatively, the heat conductive plate is formed in a circular shape in cross section, and the upper surface of the heat conductive plate is formed in a spherical crown surface protruding upward.
Optionally, the heat dissipation fins include a plurality of first heat dissipation fins, the plurality of first heat dissipation fins are arranged at intervals along the circumferential direction of the heat conduction plate, and the plurality of first heat dissipation fins are arranged in a radial manner;
the plurality of guide grooves are arranged at intervals along the circumferential direction of the heat conducting plate and are radially distributed;
the heat dissipation device comprises a heat conduction plate, a plurality of first heat dissipation fins and a plurality of diversion trenches, wherein the plurality of first heat dissipation fins and the plurality of diversion trenches are arranged in a staggered mode along the circumferential direction of the heat conduction plate, so that at least one first heat dissipation fin can be arranged between every two adjacent diversion trenches.
Optionally, the heat dissipation fins further include a plurality of second heat dissipation fins, the plurality of first heat dissipation fins encircle the outer sides of the plurality of second heat dissipation fins, the plurality of second heat dissipation fins are arranged at intervals along the circumferential direction of the heat conduction plate, and the plurality of second heat dissipation fins are arranged in a radial manner;
wherein the number of the first radiating fins is greater than the number of the second radiating fins.
Optionally, the number of the first heat radiating fins is at least 2 times the number of the second heat radiating fins.
Optionally, the cross section of the heat dissipation fin is formed in a diamond shape.
Optionally, the heat conduction plate includes heat conduction plate body and heat conduction silica gel, radiating fin with the guiding gutter sets up the upper surface of heat conduction plate body, the upper surface of heat conduction plate body forms to the cambered surface, the lower surface of heat conduction plate body is formed with stores up the gluey groove, heat conduction silica gel fill in store up gluey groove and be used for with the heat conduction of treater contacts.
Optionally, the air-cooled radiator further includes a fan mounting structure, the fan mounting structure includes a mounting ring and a mounting rod connected with the mounting ring, the mounting ring is located above the heat radiating fins and connected with the heat radiating fins, the mounting rod is located inside the mounting ring and extends along the radial direction of the mounting ring, and the fan is rotatably mounted on the mounting rod.
According to a second aspect of the present disclosure, there is provided a computer including a processor and the above-described air-cooled heat sink for a processor, a lower surface of a heat-conducting plate of the air-cooled heat sink being in heat-conducting contact with the processor.
Through the technical scheme, heat generated during operation of the processor can be transferred to the heat conducting plate and the radiating fins arranged on the upper surface of the heat conducting plate, the fan blows air to the upper surfaces of the radiating fins and the heat conducting plate, so that the heat convection efficiency of the upper surface of the heat conducting plate and the outer surface of the radiating fins and air can be improved, and the heat dissipation of the processor is realized. Because the upper surface of the heat conducting plate is formed into the cambered surface, the heat radiating area of the heat conducting plate can be increased to a certain extent, and the heat exchanging efficiency of the heat conducting plate and air is improved. The heat dissipation area of the heat conduction plate can be increased by the diversion grooves formed on the upper surface of the heat conduction plate, the heat exchange efficiency of the heat conduction plate and air is improved, and the flow direction of wind can be guided on the other hand, so that the wind flows along the extending direction of the diversion grooves and can quickly flow out of the heat dissipation fins and the heat conduction plate.
Therefore, compared with the technical scheme that the upper surface of the heat conducting plate is a plane in the related art, the heat radiating area of the heat conducting plate can be increased, the heat exchanging efficiency of the heat conducting plate and air is improved by forming the upper surface of the heat conducting plate into the cambered surface and forming the diversion trench on the upper surface of the heat conducting plate, the heat radiating capability of the air cooling radiator provided by the present disclosure is further improved, the heat radiating efficiency of a processor is improved, and the possibility that the processor is damaged due to the influence of high temperature is reduced.
Additional features and advantages of the present disclosure will be set forth in the detailed description which follows.
Drawings
The accompanying drawings are included to provide a further understanding of the disclosure, and are incorporated in and constitute a part of this specification, illustrate the disclosure and together with the description serve to explain, but do not limit the disclosure. In the drawings:
fig. 1 is a schematic perspective view of an air-cooled heat sink for a processor provided in an exemplary embodiment of the present disclosure;
fig. 2 is a schematic perspective view of an air-cooled heat sink for a processor (different from the view of fig. 1) provided in accordance with an exemplary embodiment of the present disclosure;
FIG. 3 is a schematic perspective view of a partial structure of an air-cooled heat sink for a processor provided in an exemplary embodiment of the present disclosure;
fig. 4 is a schematic perspective view of a heat conducting plate of an air-cooled heat sink for a processor according to an exemplary embodiment of the present disclosure, wherein flow guide grooves are shown.
Description of the reference numerals
100-an air-cooled radiator; 110-a heat-conducting plate; 111-a heat conduction plate body; 112-a glue storage groove; 113-fixing lugs; 120-radiating fins; 121-first heat radiating fins; 122-second heat radiating fins; 130-a fan; 140-diversion trenches; 150-a fan mounting structure; 151-mounting ring; 152-mounting bar.
Detailed Description
In the present disclosure, unless otherwise indicated, terms such as "inner and outer" are used to refer to the inner and outer of the outline of each component, and "upper and lower" are defined in the directions of the drawings of fig. 1 and 2, and referring specifically to fig. 1 and 2, terms such as "first" and "second" are used only to distinguish one element from another element, and do not have order or importance. Additionally, the above-used directional terms are merely used to facilitate description of the present disclosure, and are not meant to indicate or imply that the devices or elements referred to must have a particular orientation, be constructed and operate in a particular orientation, and are not to be construed as limiting the present disclosure.
In the related art, an air-cooled radiator generally includes a heat-conducting plate and heat-dissipating fins disposed on the heat-conducting plate, for example, a desktop computer CPU down-pressing radiator disclosed in patent application publication No. CN109358735a may be referred to, and the heat-dissipating area of the air-cooled radiator is the sum of the areas of the upper surface of the heat-conducting plate and the outer surfaces of the heat-dissipating fins.
In view of this, as shown in fig. 1 to 4, according to a first aspect of the present disclosure, there is provided an air-cooled radiator 100 for a processor, including a heat conductive plate 110, a heat dissipation fin 120, and a fan 130, wherein a lower surface of the heat conductive plate 110 is configured to be in heat conductive contact with the processor, the heat dissipation fin 120 is disposed on an upper surface of the heat conductive plate 110, the fan 130 is located above the heat dissipation fin 120 and configured to blow air to the heat dissipation fin 120 and the upper surface of the heat conductive plate 110, the upper surface of the heat conductive plate 110 is formed as a cambered surface, and a flow guide groove 140 is formed on the upper surface of the heat conductive plate 110.
Through the above technical scheme, the heat generated during the operation of the processor can be transferred to the heat conducting plate 110 and the heat radiating fins 120 arranged on the upper surface of the heat conducting plate 110, and the fan 130 blows air to the heat radiating fins 120 and the upper surface of the heat conducting plate 110, so that the heat convection efficiency between the upper surface of the heat conducting plate 110 and the outer surface of the heat radiating fins 120 and the air can be increased, and the heat dissipation of the processor can be realized. Since the upper surface of the heat conductive plate 110 is formed as a cambered surface, the heat dissipation area of the heat conductive plate 110 can be increased to a certain extent, and the heat exchange efficiency of the heat conductive plate 110 and air can be improved. The flow guide groove 140 formed on the upper surface of the heat conducting plate 110 can increase the heat dissipation area of the heat conducting plate 110, improve the heat exchange efficiency between the heat conducting plate 110 and the air, and guide the flow direction of the wind, so that the wind flows along the extending direction of the flow guide groove 140 and can quickly flow out of the heat dissipation fins 120 and the heat conducting plate 110.
Therefore, compared with the technical scheme that the upper surface of the heat conducting plate is planar in the related art, the heat radiating area of the heat conducting plate 110 can be increased, the heat exchanging efficiency of the heat conducting plate 110 and air is improved by forming the upper surface of the heat conducting plate 110 into the cambered surface and forming the diversion trench 140 on the upper surface of the heat conducting plate 110, and further the heat radiating capability of the air-cooled radiator 100 provided by the disclosure is improved, the heat radiating efficiency of a processor is improved, and the possibility that the processor is damaged due to the influence of high temperature is reduced.
Alternatively, the upper surface of the heat conductive plate 110 may be formed as an upwardly convex arc surface. Since the fan 130 is located above the heat-conducting plate 110, and the fan 130 can blow air to the upper surface of the heat-conducting plate 110, the upper surface of the heat-conducting plate 110 is formed into an upwardly convex arc surface, so that the air flow carrying heat can flow from the upper side of the arc surface to the lower side of the arc surface, thereby being beneficial to improving the heat dissipation performance of the air-cooled radiator 100 and improving the heat dissipation effect and heat dissipation efficiency of the processor.
The present disclosure is not limited to the specific shape of the heat conductive plate 110 and the specific shape of the arc surface formed on the heat conductive plate 110. As an alternative embodiment, the cross section of the heat conductive plate 110 may be formed in a circular shape, and the upper surface of the heat conductive plate 110 may be formed in a spherical cap surface protruding upward. In other embodiments, the cross section of the heat conductive plate 110 may be formed in a rectangular shape, and the upper surface of the heat conductive plate 110 may be formed in an upwardly convex ellipsoid.
Alternatively, as shown in fig. 1 to 3, the heat dissipation fins 120 may include a plurality of first heat dissipation fins 121, the plurality of first heat dissipation fins 121 may be disposed along a circumferential direction of the heat conduction plate 110 at intervals, the plurality of first heat dissipation fins 121 may be arranged radially, the plurality of flow guide grooves 140 may be disposed along the circumferential direction of the heat conduction plate 110 at intervals, and the plurality of flow guide grooves 140 may be arranged radially, and the plurality of first heat dissipation fins 121 and the plurality of flow guide grooves 140 may be arranged in a staggered manner along the circumferential direction of the heat conduction plate 110, so that at least one first heat dissipation fin 121 may be disposed between every two adjacent flow guide grooves 140.
The plurality of first radiating fins 121 and the plurality of diversion trenches 140 are beneficial to increasing the radiating area of the air-cooled radiator 100 provided by the disclosure, improving the radiating efficiency and protecting the processor. The plurality of first radiating fins 121 and the plurality of diversion trenches 140 are arranged in a radial manner, the first radiating fins 121 and the diversion trenches 140 are staggered, and the first radiating fins 121 and the diversion trenches 140 can be arranged in a limited space as much as possible, so that the radiating efficiency is improved.
Alternatively, as shown in fig. 1 and 3, the heat dissipation fins 120 may further include a plurality of second heat dissipation fins 122, the plurality of first heat dissipation fins 121 may surround the outer sides of the plurality of second heat dissipation fins 122, the plurality of second heat dissipation fins 122 may be disposed at intervals along the circumference of the heat conduction plate 110, and the plurality of second heat dissipation fins 122 may be radially arranged, and the number of first heat dissipation fins 121 may be greater than the number of second heat dissipation fins 122.
The plurality of second heat dissipation fins 122 can further increase the heat dissipation area of the air-cooled heat sink 100 provided by the present disclosure, and the plurality of second heat dissipation fins 122 are located at the inner sides of the plurality of first heat dissipation fins 121, so that the air flow carrying heat can flow through the outer surfaces of the second heat dissipation fins 122 and then through the outer surfaces of the first heat dissipation fins 121, thereby being beneficial to improving the heat dissipation efficiency.
It will be appreciated that, as shown in fig. 1 and 3, the flow guiding groove 140 may be disposed at a position near the outer side of the heat conducting plate 110, that is, near the first heat dissipating fin 121, so that the flow guiding groove 140 can be located at the outer side of the second heat dissipating fin 122, so as to facilitate disposing a plurality of second heat dissipating fins 122 on the heat conducting plate 110. The ends of the diversion trenches 140 arranged in a radial manner, which are far away from the second heat dissipation fins 122, can be communicated with the air outside the heat conduction plate 110, so that the hot air flowing along the extending direction of the diversion trenches 140 can flow out to the outside of the heat conduction plate 110 rapidly.
Alternatively, the number of the first heat radiating fins 121 may be at least 2 times that of the second heat radiating fins 122, thereby facilitating improvement of the heat radiating efficiency of the air-cooled heat radiator 100 provided by the present disclosure.
The specific shape of the heat radiating fins 120 is not limited in this disclosure. Alternatively, in one embodiment, as shown in fig. 3, the cross section of the heat dissipation fin 120 may be formed in a diamond shape, that is, two opposite sidewalls of the heat dissipation fin 120 are protruded outward, so that the heat dissipation area of the heat dissipation fin 120 may be increased, and the heat exchange efficiency of the heat dissipation fin 120 and air may be improved, thereby further improving the heat dissipation efficiency of the air-cooled heat sink 100. In other embodiments, the heat radiating fins 120 may also be formed in a wave shape.
Alternatively, as shown in fig. 2, the heat conductive plate 110 may include a heat conductive plate body 111 and heat conductive silica gel (not shown), the heat dissipation fins 120 and the flow guide grooves 140 may be disposed on an upper surface of the heat conductive plate body 111, the upper surface of the heat conductive plate body 111 may be formed as a cambered surface, a lower surface of the heat conductive plate body 111 may be formed with a glue storage groove 112, and the heat conductive silica gel may be filled in the Chu Jiao groove 112 and used for heat conductive contact with the processor. The arrangement of the glue storage groove 112 can prevent the heat-conducting silica gel from being extruded and discharged to a certain extent, which is beneficial to enabling the heat-conducting silica gel to be completely positioned between the heat-conducting plate 111 and the processor, thereby being beneficial to improving the heat-conducting effect of the heat-conducting plate 110 on the processor.
It will be appreciated that in order to enhance the heat transfer between the heat-conducting plate 110 and the processor, the glue reservoir 112 may be filled with a sufficient amount of heat-conducting silicone so that the entire lower surface of the heat-conducting plate 110 can conform to the surface of the processor.
Optionally, as shown in fig. 1 to 4, the heat conducting plate 110 may further include a fixing lug 113 connected to the heat conducting plate 111, where the fixing lug 113 is used for connecting with a computer, so as to fix the position of the air-cooled radiator 100 in the computer.
Alternatively, as shown in fig. 1 and 2, the air-cooled radiator 100 may further include a fan mounting structure 150, the fan mounting structure 150 may include a mounting ring 151 and a mounting rod 152 connected to the mounting ring 151, the mounting ring 151 may be located above the heat radiating fins 120 and connected to the heat radiating fins 120, the mounting rod 152 may be located inside the mounting ring 151 and extend in a radial direction of the mounting ring 151, and the fan 130 may be rotatably mounted to the mounting rod 152.
Since the mounting ring 151 for mounting the fan 130 may be connected with the heat dissipation fins 120, heat of the heat dissipation fins 120 can be transferred to the mounting ring 151, thereby facilitating an increase in heat dissipation area of the air-cooled radiator 100 and an increase in heat dissipation efficiency. The fan 130 may be electrically connected to a power source, and may increase the flow rate and flow of air flowing through the air-cooled radiator 100 during rotation, which is beneficial to enhancing the heat dissipation capacity of the air-cooled radiator 100.
According to a second aspect of the present disclosure, there is provided a computer including a processor and the above-described air-cooled heat sink 100 for a processor, a lower surface of a heat-conductive plate 110 of the air-cooled heat sink 100 being in heat-conductive contact with the processor.
The preferred embodiments of the present disclosure have been described in detail above with reference to the accompanying drawings, but the present disclosure is not limited to the specific details of the above embodiments, and various simple modifications may be made to the technical solutions of the present disclosure within the scope of the technical concept of the present disclosure, and all the simple modifications belong to the protection scope of the present disclosure.
In addition, the specific features described in the foregoing embodiments may be combined in any suitable manner, and in order to avoid unnecessary repetition, the present disclosure does not further describe various possible combinations. Moreover, any combination between the various embodiments of the present disclosure is possible as long as it does not depart from the spirit of the present disclosure, which should also be construed as the disclosure of the present disclosure.
Claims (10)
1. An air-cooled radiator for a processor is characterized by comprising a heat conducting plate, a heat radiating fin and a fan, wherein the lower surface of the heat conducting plate is used for being in heat conducting contact with the processor, the heat radiating fin is arranged on the upper surface of the heat conducting plate, and the fan is positioned above the heat radiating fin and used for blowing air to the heat radiating fin and the upper surface of the heat conducting plate;
wherein, the upper surface of heat-conducting plate forms to the cambered surface, and the upper surface of heat-conducting plate is formed with the guiding gutter.
2. An air-cooled heat sink for a processor according to claim 1, wherein the upper surface of the heat-conducting plate is formed as an upwardly convex cambered surface.
3. An air-cooled heat sink for a processor according to claim 1 wherein the cross-section of the heat-conducting plate is formed in a circular shape and the upper surface of the heat-conducting plate is formed as an upwardly convex spherical cap surface.
4. The air-cooled heat sink for a processor of claim 1, wherein the heat dissipating fins comprise a plurality of first heat dissipating fins, the plurality of first heat dissipating fins are arranged at intervals along the circumference of the heat conducting plate, and the plurality of first heat dissipating fins are arranged in a radial manner;
the plurality of guide grooves are arranged at intervals along the circumferential direction of the heat conducting plate and are radially distributed;
the heat dissipation device comprises a heat conduction plate, a plurality of first heat dissipation fins and a plurality of diversion trenches, wherein the plurality of first heat dissipation fins and the plurality of diversion trenches are arranged in a staggered mode along the circumferential direction of the heat conduction plate, so that at least one first heat dissipation fin can be arranged between every two adjacent diversion trenches.
5. The air-cooled heat sink for a processor of claim 4 wherein the heat sink fins further comprise a plurality of second heat sink fins, the plurality of first heat sink fins surround the outer sides of the plurality of second heat sink fins, the plurality of second heat sink fins are spaced apart along the circumference of the heat conductive plate, and the plurality of second heat sink fins are arranged radially;
wherein the number of the first radiating fins is greater than the number of the second radiating fins.
6. An air-cooled heat sink for a processor according to claim 5 wherein the number of first heat dissipating fins is at least 2 times the number of second heat dissipating fins.
7. An air-cooled heat sink for a processor according to any of claims 1-6 wherein the heat radiating fins are diamond shaped in cross section.
8. An air-cooled heat sink for a processor according to any one of claims 1-6 wherein the heat conductive plate comprises a heat conductive plate body and heat conductive silicone, the heat dissipating fins and the flow guiding grooves are provided on an upper surface of the heat conductive plate body, the upper surface of the heat conductive plate body is formed as a cambered surface, and a glue storage groove is formed on a lower surface of the heat conductive plate body, and the heat conductive silicone is filled in the glue storage groove and is used for heat conductive contact with the processor.
9. An air-cooled heat sink for a processor according to any of claims 1-6 further comprising a fan mounting structure comprising a mounting ring and a mounting bar connected to the mounting ring, the mounting ring being located above and connected to the heat dissipating fins, the mounting bar being located inside and extending radially of the mounting ring, the fan being rotatably mounted to the mounting bar.
10. A computer comprising a processor and the air-cooled heat sink for a processor of any one of claims 1-9, a lower surface of a heat-conducting plate of the air-cooled heat sink being in heat-conducting contact with the processor.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320615853.0U CN219552952U (en) | 2023-03-24 | 2023-03-24 | Air-cooled radiator for processor and computer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320615853.0U CN219552952U (en) | 2023-03-24 | 2023-03-24 | Air-cooled radiator for processor and computer |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219552952U true CN219552952U (en) | 2023-08-18 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202320615853.0U Active CN219552952U (en) | 2023-03-24 | 2023-03-24 | Air-cooled radiator for processor and computer |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN219552952U (en) |
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- 2023-03-24 CN CN202320615853.0U patent/CN219552952U/en active Active
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