CN219534473U - Bonding head and bonding equipment - Google Patents

Abstract

The utility model belongs to the technical field of chip bonding, and discloses a bonding head and bonding equipment, wherein the bonding head comprises a mounting substrate, a floating module and a pressure control module, and the mounting substrate is arranged on a Z-axis moving module; the floating module comprises a floating plate and a bonding shaft, wherein the floating plate is slidably arranged on the mounting substrate along the Z direction, and the bonding shaft is used for attaching the chip to the carrier plate at preset pressure F0; the pressure control module comprises a fixed end connected to the mounting substrate and a movable end connected to the floating plate, wherein the movable end is movably connected to the fixed end along the Z direction, and is used for applying an additional force F1 along the Z direction to the floating module when the bonding shaft holding chip is attached to the carrier plate; the total weight of the floating module and the movable end is G, g+f1=f0. The pressure control module can apply stable additional force F1 to be overlapped with the total weight force of the floating module and the movable end to generate preset pressure F0, so that the bonding head can accurately control the bonding pressure of the chip and improve the bonding qualification rate of the chip.

Description

Bonding head and bonding equipment

Technical Field

The utility model relates to the technical field of chip bonding, in particular to a bonding head and bonding equipment.

Background

One of the steps of the chip bonding process is to bond the chip to a carrier, for example, to a PCB, so that the structural density can be increased, the volume can be reduced, and the electronic device can be reduced in weight and made ultra-thin. Specifically, the bonding device is provided with a bonding head, and the bonding head is used for picking up the chip and downwards moving and attaching the chip to the carrier plate.

Generally, the bonding head comprises a mounting substrate, a floating plate and a bonding shaft, wherein the mounting substrate is connected with the triaxial module, the floating plate is slidably connected onto the mounting substrate through a guide rail unit, the bonding shaft is connected onto the floating plate, and a suction nozzle for adsorbing chips is arranged at the lower end of the bonding shaft, so that the pick-up and bonding work of the chips is realized. The floating plate and all components mounted thereon form a floating weight that is a constant value. When the bonding head moves along the Z axis and the chip adsorbed below the suction nozzle is bonded on the carrier plate, the pressure born by the chip is the floating gravity value.

However, in the chip bonding process, when chips with different thicknesses and different bonding technologies are bonded on the carrier, the chips correspond to different bonding pressures, and the thinner the chips, the higher the requirement on the pressure precision of the chips is, so as to ensure that the chips are bonded without damage. In addition, the bonding head has higher speed requirement for picking up and attaching the chip, and the problem that the chip bonding process takes longer time and delays the next process is avoided.

The prior art has the following defects: when the bonding head in the prior art is attached to the chip, the pressure born by the chip is always a constant value, and the attaching pressure of the chip cannot be accurately controlled according to the thickness and the process of the chip, so that the chip is not firmly attached or the chip is damaged due to overlarge pressure.

Therefore, a new bonding head and bonding apparatus are needed to solve the above-mentioned problems.

Disclosure of Invention

The utility model aims to provide a bonding head and bonding equipment, which can accurately control the bonding pressure of a chip according to the thickness and the process of the chip and improve the bonding qualification rate of the chip.

In order to achieve the above purpose, the utility model adopts the following technical scheme:

in one aspect, a bonding head is provided, comprising:

a mounting substrate configured to be mounted to the Z-axis moving module;

the floating module comprises a floating plate and a bonding shaft, wherein the floating plate is slidably arranged on the mounting substrate along the Z direction, and the bonding shaft is arranged on the floating plate and extends downwards and is used for bonding a bonded piece on the carrier plate at preset pressure F0;

the pressure control module comprises a fixed end and a movable end, wherein the fixed end is connected with the mounting substrate, the movable end is connected with the floating plate and is movably connected with the fixed end along the Z direction so as to apply an additional force F1 to the floating module;

the total gravity of the floating module and the movable end is G, g+f1=f0.

As the preferable scheme of the bonding head provided by the utility model, the floating module further comprises a rotary driving piece arranged on the floating plate, and the output end of the rotary driving piece is in transmission connection with the bonding shaft so as to adjust the bonding angle of the bonded piece on the bonding shaft on the carrier plate.

As a preferred solution of the bonding head provided by the present utility model, the floating module further includes:

the vacuum chamber is arranged at the top end of the rotary driving piece and is connected with the floating plate;

the suction nozzle is connected to the lower end of the bonding shaft;

the rotary driving piece is provided with a first air passage along the Z direction, the bonding shaft is provided with a second air passage opposite to the first air passage along the Z direction, and the vacuum chamber is communicated with the suction nozzle through the first air passage and the second air passage.

As the preferable scheme of the bonding head provided by the utility model, the output end of the rotary driving piece is sleeved with the bonding shaft and is clamped with a first sealing piece;

the suction nozzle is sleeved with the bonding shaft and is clamped with a second sealing piece.

As a preferred embodiment of the bonding head provided by the present utility model, the floating plate includes:

the mounting base plate is provided with a guide rail along the Z direction, the sliding plate is in sliding connection with the mounting base plate through the guide rail, and one guide rail or a plurality of guide rails are arranged at intervals along the horizontal direction;

the bearing plate is vertically connected with the sliding plate, the rotary driving piece is installed on the bearing plate, and the bonding shaft is rotationally connected with the bearing plate through a bearing.

As the preferable scheme of the bonding head provided by the utility model, the bonding head further comprises a connecting plate, the connecting plate is connected with the mounting substrate and the Z-axis moving module, and levelness of the connecting plate relative to the X direction and the Y direction is adjustable.

As a preferable scheme of the bonding head provided by the utility model, the connecting plate comprises a first plate and a second plate which are vertically connected;

the first plate is provided with a first fixing hole and a first positioning hole, the first positioning hole is arc-shaped, the circle center of the first positioning hole coincides with the circle center of the first fixing hole, a first fastener is arranged in the first fixing hole in a penetrating manner, a first positioning piece is arranged in the first positioning hole in a penetrating manner, the first fastener and the first positioning piece are both connected with the mounting substrate, the position of the first positioning piece in the first positioning hole is adjustable, and one or a plurality of first positioning holes are arranged around the first fixing hole;

the second plate is relative the mounting substrate upwards stretches in a cantilever mode, second fixed orifices and second positioning holes are formed in the second plate, the second positioning holes are arc-shaped, the circle centers of the second positioning holes coincide with the circle centers of the second fixed orifices, second fasteners are arranged in the second fixed orifices in a penetrating mode, second positioning pieces are arranged in the second positioning holes in a penetrating mode, the second fasteners and the second positioning pieces are connected with the Z-axis moving module, the positions of the second positioning pieces in the second positioning holes are adjustable, and one second positioning hole or a plurality of second positioning holes are formed in the second fixing holes in a surrounding mode.

As the preferred scheme of the bonding head provided by the utility model, the bonding head further comprises a position detection module, wherein the position detection module is arranged on the mounting substrate and is used for detecting the Z-axis coordinate of the bonding head.

As a preferred embodiment of the bonding head provided by the present utility model,

the device further comprises a servo driver for applying an input current I to the pressure control module, so that the movable end applies an additional force F1 to the floating module, wherein the additional force F1 is proportional to the input current I;

the fixed end and the movable end are respectively a stator and a rotor of one of a voice coil motor, a bar-shaped linear motor and a U-shaped linear motor.

On the other hand, a bonding device is provided, which comprises the bonding head, and the Z-axis moving module, the X-axis moving module and the Y-axis moving module which are connected with each other, wherein the bonding head is installed on the Z-axis moving module.

The utility model has the beneficial effects that:

the utility model provides a bonding head and bonding equipment comprising the same, which are used for picking up a chip, bonding the chip on a carrier plate with preset pressure F0, wherein a floating unit with total gravity G is formed by a floating module and a movable end of a pressure control module, the gravity G is constant, in addition, when the movable end moves along the Z direction relative to a fixed end, a constant Z-direction additional force F1 can be applied to the floating module, the preset pressure F0 and the gravity G are both known values, so that the specific value of the additional force F1 can be determined according to a force balance principle G+F1=F0. When the chip is bonded, the calculated additional force F1 is applied to the floating module through the movable end, and when the chip contacts the carrier plate, the pressure born by the chip is equal to the superposition value of the gravity G and the additional force F1, namely F0, and the bonding pressure requirement of the chip is just met. For chips with different thicknesses and different processes, the preset pressure F0 is different, and the additional force F1 is only required to be adjusted through the pressure control module, so that F0 is obtained after F1 and G are overlapped, and the bonding qualification rate of the chips is effectively improved. Moreover, the pressure applied to the chip when contacting the carrier plate is not influenced by the height of the bonding head, the bonding head moves at any height position of the module along the Z axis, the bonding pressure is unchanged when the chip is bonded, and the bonding consistency is good.

Drawings

FIG. 1 is a schematic diagram illustrating the installation of a bonding head and a Z-axis movement module according to an embodiment of the present utility model;

FIG. 2 is a first isometric view of a bonding head provided in accordance with an embodiment of the present utility model;

FIG. 3 is an exploded view of a bonding head provided in accordance with an embodiment of the present utility model;

FIG. 4 is a first cross-sectional view of a bonding head provided in accordance with an embodiment of the present utility model;

FIG. 5 is a second cross-sectional view of a bonding head provided in accordance with embodiments of the present utility model;

FIG. 6 is a second isometric view of a bonding head provided in accordance with an embodiment of the present utility model;

FIG. 7 is a schematic diagram of a bonding head picking up and bonding a chip according to an embodiment of the present utility model;

FIG. 8 is an isometric view of a connection plate provided in accordance with an embodiment of the present utility model;

fig. 9 is a plan view of a connection plate according to an embodiment of the present utility model.

In the figure:

1. a mounting substrate; 2. a floating module; 3. a pressure control module; 4. a guide rail; 5. a connecting plate; 6. a position detection module; 7. a fixing plate;

11. a via hole; 12. a spacer block;

21. a floating plate; 22. bonding shaft; 23. a rotary driving member; 24. a vacuum chamber; 25. a suction nozzle; 26. a first seal; 27. a second seal; 28. a bearing; 29. an origin sensor; 210. a sleeve;

211. a sliding plate; 212. a carrying plate;

221. a second airway; 231. a first airway; 241. an air tap; 251. a plug bush;

31. a fixed end; 32. a movable end;

41. a first rail; 42. a second rail;

51. a first plate; 52. a second plate;

511. a first fixing hole; 512. a first positioning hole;

521. a second fixing hole; 522. a second positioning hole;

61. a first fastener; 62. a first positioning member; 63. a second fastener; 64. a second positioning member;

100. a Z-axis moving module; 200. a chip; 300. a carrier plate; 400. a wafer ring;

101. a Z-axis mounting plate; 102. a drag chain.

Detailed Description

The utility model is described in further detail below with reference to the drawings and examples. It is to be understood that the specific embodiments described herein are merely illustrative of the utility model and are not limiting thereof. It should be further noted that, for convenience of description, only some, but not all of the structures related to the present utility model are shown in the drawings.

In the description of the present utility model, unless explicitly stated and limited otherwise, the terms "connected," "connected," and "fixed" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communicated with the inside of two elements or the interaction relationship of the two elements. The specific meaning of the above terms in the present utility model will be understood in specific cases by those of ordinary skill in the art.

In the present utility model, unless expressly stated or limited otherwise, a first feature "above" or "below" a second feature may include both the first and second features being in direct contact, as well as the first and second features not being in direct contact but being in contact with each other through additional features therebetween. Moreover, a first feature being "above," "over" and "on" a second feature includes the first feature being directly above and obliquely above the second feature, or simply indicating that the first feature is higher in level than the second feature. The first feature being "under", "below" and "beneath" the second feature includes the first feature being directly under and obliquely below the second feature, or simply means that the first feature is less level than the second feature.

In the description of the present embodiment, the terms "upper", "lower", "left", "right", and the like are orientation or positional relationships based on those shown in the drawings, merely for convenience of description and simplicity of operation, and do not indicate or imply that the apparatus or elements referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as limiting the utility model. Furthermore, the terms "first," "second," and the like, are used merely for distinguishing between descriptions and not for distinguishing between them.

In the bonding process of the chip 200, when the chips 200 with different thicknesses and different bonding processes are bonded on the carrier plate 300, corresponding to different bonding pressures, and the thinner the chip 200 is, the higher the requirement on the pressure precision of the chip 200 is, so as to ensure that the chip 200 is bonded without damage. When bonding the chip 200, the bonding head in the prior art always has a constant pressure applied to the chip 200, and the bonding pressure of the chip 200 cannot be precisely controlled according to the thickness and the process of the chip 200, so that the chip 200 is not firmly bonded or the chip 200 is damaged due to overlarge pressure.

Based on the above-mentioned problems, as shown in fig. 1, 2 and 3, the present embodiment provides a bonding head for picking up a chip 200 and attaching the chip 200 to a carrier 300 with a preset pressure F0. The bonding head comprises a mounting substrate 1, a floating module 2 and a pressure control module 3.

Referring to fig. 1, a mounting substrate 1 is configured to be mounted on a Z-axis movement module 100 to effect movement of the entire bonding head in the Z-direction. Referring to fig. 2 and 3, the floating module 2 includes a floating plate 21 and a bonding shaft 22, the floating plate 21 is slidably disposed on the mounting substrate 1 along the Z direction, the bonding shaft 22 is disposed on the floating plate 21 and extends downward, the lower end of the bonding shaft 22 can pick up a bonded piece (taking a chip 200 as an example in the present embodiment), and when the bonding head moves downward along the Z direction, the bonding shaft 22 can attach the chip 200 held at the lower end to the carrier 300. The pressure control module 3 includes a fixed end 31 and a movable end 32, the fixed end 31 is connected to the mounting substrate 1, the movable end 32 is connected to the floating plate 21, and the movable end 32 is movably connected to the fixed end 31 in the Z direction, when the movable end 32 moves relative to the fixed end 31, it can apply an additional force F1 to the floating module 2; further, the larger the relative movement amount, the larger the additional force F1 is applied. The total weight of the float module 2 and the movable end 32 is G, and the applied additional force F1 should be such that: g+f1=f0, and can achieve that bonding shaft 22 bonds the bonded piece to carrier 300 with a preset pressure F0.

In the bonding head provided in this embodiment, the floating module 2 and the movable end 32 of the pressure control module 3 form a floating unit with a total gravity G, the gravity G is constant, in addition, when the movable end 32 moves along the Z direction relative to the fixed end 31, a constant Z-direction additional force F1 can be applied to the floating module 2, and the preset pressure F0 and the gravity G are both known values, so that the specific value of the additional force F1 can be determined according to the force balance principle g+f1=f0. When bonding the chip 200, the calculated additional force F1 is applied to the floating module 2 through the movable end 32, and when the chip 200 contacts the carrier 300, the pressure applied to the chip 200 is equal to the superposition value of the gravity G and the additional force F1, namely F0, and exactly meets the bonding pressure requirement of the chip 200.

For chips 200 with different thicknesses and different processes, the preset pressure F0 is different, and the additional force F1 is only required to be adjusted through the pressure control module 3, so that F0 is obtained after F1 and G are overlapped, and the bonding qualification rate of the chips 200 is effectively improved.

Moreover, the pressure applied when the chip 200 contacts the carrier 300 is not affected by the height of the bonding head, and the bonding head is at any height position of the Z-axis moving module 100, so that the bonding pressure is unchanged when the chip 200 is bonded, and the bonding consistency is better.

Optionally, in this embodiment, the pressure control module 3 is a voice coil motor, the fixed end 31 is a stator of the voice coil motor, the movable end 32 is a rotor of the voice coil motor, and the voice coil motor is driven by a servo driver.

Specifically, the servo driver is configured to apply an input current I to the mover of the voice coil motor, so that the mover applies an additional force F1 to the floating module 2, where the additional force F1 may be an upward lifting force or a downward pushing force, and is determined according to a difference between the gravity G and a preset pressure F0. The additional force F1 is proportional to the input current I, the larger the additional force F1. The servo driver can output a stable current I to the voice coil motor in a current loop mode, so that an additional force F1 with an error within 0.001N is generated, and when the chip 200 is attached to the carrier plate 300, a constant attaching pressure can be generated according to the force balance principle.

Illustratively, the combined weight G of the float module 2 and the stator is 150 grams and the weight is 1.47N. If the preset pressure F0 meeting the current bonding requirement of the chip 200 is 1N, the voice coil motor needs to provide an additional force F1 of 0.47N, and the force is opposite to the gravity G. The additional force F1 of 0.47N needs to be achieved by controlling the magnitude of the input current I.

Specifically, the input current I may be set in a parameter of the servo driver, a pressure sensor is externally arranged below the bonding shaft 22, and the Z-axis moving module 100 drives the bonding head to move, so that the lower end of the bonding shaft 22 touches the pressure sensor, and the fed-back pressure value can be read out through a digital display meter electrically connected with the pressure sensor. Comparing the pressure value with 0.47N, and adjusting up or down the current parameter of the servo driver according to the comparison result until the pressure value displayed by the digital display meter is 0.47N, wherein the corresponding current parameter is the input current I required by the current voice coil motor.

It can be understood that after the required additional force F1 is calculated, the output current parameter of the servo driver is adjusted by matching with the pressure sensor to obtain the required input current I value. Then, in the motion process of the bonding head, the servo driver always provides input current I for the voice coil motor, and the voice coil motor can apply constant additional force F1 meeting the calculation requirement to the floating module 2. That is, the total force G of the floating module 2 and the stator is constant, and the current provided by the servo driver to the voice coil motor is constant during the movement of the bonding head, so that the bonding pressure of the bonding head when bonding the chip 200 at different heights of the Z-axis moving module 100 is constant.

In addition, since the input current I value is constant, it is not necessary to monitor the current level at any time, and the bonding efficiency of the chip 200 can be improved. In this embodiment, the Z-axis moving module 100 is driven by a linear motor, and the acceleration a can reach 10g (the gravitational acceleration g is 9.8m/s ² ). The mounting substrate 1 is specifically connected with the Z-axis moving module 100 in the triaxial moving module, as shown in fig. 7, the wafer ring 400 is fully covered with the chip 200 to be bonded, the triaxial moving module can drive the bonding head to move to the position of the wafer ring 400 to pick up the chip 200 and move to the position right above the carrier plate 300, the distance between the carrier plate 300 and the bonding head at the moment is set to be 10mm, the overpressure is 1mm when the chip 200 is bonded, the single-pass displacement of the bonding head is 11mm, and the motion displacement of the chip 200 is 22mm when the bonding head is bonded once (including downward movement of the bonding chip 200 and upward movement of the bonding head in situ two strokes). According to the displacement formula s=at ² The movement time t of the bonding head is 0.021s (seconds). In the bonding process, the bonding head is regarded as an elastic mechanism with constant elastic force, so that when the chip 200 contacts the carrier 300, the pressure applied to the chip 200 is always the preset pressure F0.

In the embodiment, the stroke of the rotor of the voice coil motor is 5mm, and the forward and reverse additional force F1 of 0-11.2N can be output, and the model of the voice coil motor can be adaptively selected in other embodiments.

Illustratively, the stator of the voice coil motor is fixedly connected with the mounting substrate 1 by screws, and the mover is fixedly mounted with the floating plate 21 by screws, ensuring firm connection.

In other embodiments, the pressure control module 3 may be one of a bar-shaped linear motor and a U-shaped linear motor. That is, the fixed end 31 and the movable end 32 are a stator and a mover of one of the rod-shaped linear motor and the U-shaped linear motor, respectively, and the additional force F1 applied to the floating module 2 may be adjusted by adjusting the current parameter.

Referring to fig. 2, the floating plate 21 includes a vertically coupled sliding plate 211 and a bearing plate 300, the sliding plate 211 being slidably coupled to the mounting substrate 1, the bearing plate 300 being used for mounting the bonding shaft 22 and for coupling with a mover of the voice coil motor.

Referring to fig. 2 and 3, the floating module 2 further includes a rotation driving member 23 disposed on the floating plate 21, where the rotation driving member 23 is specifically disposed above the carrier 300, and an output end of the rotation driving member is in transmission connection with the bonding shaft 22 below the carrier 300, and when the chip 200 is picked up by the lower end of the bonding shaft 22, the rotation driving member 23 can drive the bonding shaft 22 to rotate, so as to adjust a bonding angle of the chip 200 on the carrier 300, and ensure that a direction of the chip 200 after bonding meets design requirements.

Further, the carrier 300 is provided with an origin sensor 29, the bonding shaft 22 is provided with a sensing area, and the origin sensor 29 can sense the sensing area to obtain a rotation origin of the bonding shaft 22, so as to obtain a rotation angle of the bonding shaft 22 relative to the rotation origin, and the attaching angle of the chip 200 after rotation reaches the requirement.

In this embodiment, the rotary driving member 23 is a stepper motor, which is used in cooperation with the origin sensor 29 as a mature technology in the prior art, and will not be described herein.

As shown in fig. 2 and 3, the top end of the rotary driving member 23 is fixedly connected with a vacuum chamber 24 by a screw, and the vacuum chamber 24 is connected to the sliding plate 211 by a screw to fix the rotary driving member 23 to the floating plate 21. The lowermost end of the bonding shaft 22 is connected with a suction nozzle 25, and the vacuum chamber 24 is used for providing negative pressure for the suction nozzle 25 to adsorb the chip 200.

Specifically, referring to fig. 4, an air tap 241 is connected to the outside of the vacuum chamber 24, and the air tap 241 is used to connect with a vacuum apparatus to form or release a vacuum in the vacuum chamber 24. The rotation driving member 23 is provided with a first air passage 231 along the Z direction, and the bonding shaft 22 is provided with a second air passage 221 opposite to the first air passage 231 along the Z direction, and the vacuum chamber 24 communicates with the suction nozzle 25 through the first air passage 231 and the second air passage 221, so that the suction nozzle 25 generates negative pressure, thereby sucking the chip 200. The suction nozzle 25 is made of flexible materials such as rubber, so as to avoid damage to the chip 200.

Further, in this embodiment, referring to fig. 4, the output shaft of the rotary driving member 23 is sleeved with the bonding shaft 22, a jack is provided at the upper end of the bonding shaft 22, the output shaft of the rotary driving member 23 is inserted into the jack, and a first sealing member 26 is sandwiched between the outer wall of the output shaft and the inner wall of the jack, so as to ensure tightness after the first air duct 231 and the second air duct 221 are butted. The suction nozzle 25 is sleeved with the bonding shaft 22, a plug bush 251 is arranged at the upper end of the suction nozzle 25, a jack is also arranged at the lower end of the bonding shaft 22, the plug bush 251 is inserted into the jack, and a second sealing piece 27 is clamped between the inner wall of the jack and the outer wall of the plug bush 251, so that the tightness of the second air channel 221 and the inner cavity of the suction nozzle 25 after the butt joint is ensured. By providing the first seal 26 and the second seal 27, it is possible to ensure good air passage tightness between the vacuum chamber 24 and the suction nozzle 25, and to avoid air leakage so that negative pressure cannot be formed in the suction nozzle 25.

In other embodiments, the suction nozzle 25 may be directly adhered to the lower end of the bonding shaft 22.

With continued reference to fig. 4, the carrier 300 is provided with a through hole, in which a bearing 28 is disposed, and the bonding shaft 22 is rotatably connected to the carrier 300 through the bearing 28, so as to ensure smooth rotation.

Referring to fig. 5, in another new embodiment, a sleeve 210 may be used to connect the output end of the rotary driving member 23 with the bonding shaft 22, where the sleeve 210 is disposed through the inner ring of the bearing 28, and one end of the sleeve is sleeved with the output end of the rotary driving member 23, and the other end of the sleeve is sleeved with the bonding shaft 22. Further, the bonding shaft 22 and the suction nozzle 25 may be integrally formed, and may be selected according to design requirements.

As shown in fig. 3 and 6, the mounting substrate 1 is provided with a guide rail 4 along the Z direction, and the sliding plate 211 is slidably connected with the mounting substrate 1 through the guide rail 4, so that the floating plate 21 and the components connected thereto form a floating unit, and the floating unit has high accuracy and does not deflect when moving along the Z direction. Alternatively, the guide rail 4 is a cross roller guide rail, which is a rolling friction, small in resistance and stable. The cross roller guide rail comprises a first rail 41 and a second rail 42 which are in sliding fit, wherein the first rail 41 is connected with the sliding plate 211 through a screw, the second rail 42 is connected with the sliding plate 211 through a screw, and when the floating module 2 moves up and down, the first rail 41 is driven to synchronously move relative to the second rail 42.

Referring to fig. 6, the mounting substrate 1 is provided with a via hole 11, and the via hole 11 is opposite to a screw on the first rail 41, and the screw is conveniently screwed during maintenance to fasten the first rail 41 and the sliding plate 211.

Further, the guide rail 4 is provided with one or a plurality of guide rails at intervals in the horizontal direction. In this embodiment, two guide rails 4 are provided to improve the moving accuracy of the floating plate 21, referring to fig. 3, a spacer 12 is provided on the mounting substrate 1, the two guide rails 4 are separately provided on two sides of the spacer 12, and the spacer 12 can block the guide rails 4 from deflecting.

In other embodiments, the guide rail 4 may be a linear guide rail, a ball bushing, or other sliding mechanism.

Referring to fig. 2 and 3, the bonding head further includes a position detection module 6, where the position detection module 6 is disposed on the mounting substrate 1 and is configured to detect a Z-axis coordinate of the bonding head, so as to obtain a distance between the bonding head and the carrier 300, and determine a movement stroke of the bonding head.

Illustratively, with continued reference to fig. 2 and 3, the position detection module 6 is a combination of a grating scale and a reading head. The grating ruler is arranged along the Z direction, the reading head is loaded on a fixed plate 7, and the fixed plate 7 is connected to the mounting substrate 1 through screws. The reading head moves along with the bonding head along the Z direction, and can acquire the coordinates of the bonding head by matching with the grating ruler.

Referring to fig. 1 and 2, in the present embodiment, the bonding head is mounted on a Z-axis mounting plate 101 of the Z-axis moving module 100 through a connecting plate 5, and the Z-axis mounting plate 101 is slidably engaged with a sliding rail on the Z-axis moving module 100. Moreover, the levelness of the connecting plate 5 relative to the X direction and the Y direction is adjustable, so that the levelness of the bonding head is ensured.

Specifically, referring to fig. 2 and 8, the connection plate 5 includes a first plate 51 and a second plate 52 that are vertically connected. The first plate 51 is used for connection with the mounting board 1, and the second plate 52 is used for connection with the Z-axis mounting board 101.

The first plate 51 is provided with a first fixing hole 511 and a first positioning hole 512, the first fixing hole 511 is circular, the first positioning hole 512 is arc-shaped, and the center of the first positioning hole coincides with the center of the first fixing hole 511, as shown in fig. 9 (a). Referring to fig. 2, a first fastening member 61 is disposed in the first fixing hole 511, a first positioning member 62 is disposed in the first positioning hole 512, the first fastening member 61 and the first positioning member 62 are both connected with the mounting substrate 1, and the position of the first positioning member 62 in the first positioning hole 512 is adjustable. The first fastening member 61 and the first positioning member 62 may be screws, and when the levelness of the bonding head in the X direction is adjusted, the screws are not tightened, and at this time, the connecting plate 5 may rotate by a slight angle with respect to the first fastening member 61 until the level is adjusted, and then the screws are locked.

The first positioning hole 512 is provided with one or a plurality of first fixing holes 511. As shown in fig. 9 (a), the first plate 51 is provided with two first positioning holes 512 around the first fixing hole 511, so as to ensure the adjustment accuracy and the stability after being fixed to the mounting substrate 1.

Referring to fig. 2, the second plate 52 is cantilevered upward relative to the mounting base plate 1 so as to be connected to the Z-axis mounting plate 101. Referring to fig. 8 and 9 (b), the second plate 52 is provided with a second fixing hole 521 and a second positioning hole 522, and the second positioning hole 522 is arc-shaped and has a center overlapping with the center of the second fixing hole 521. The second fixing hole 521 is internally provided with a second fastening piece 63 in a penetrating way, the second positioning hole 522 is internally provided with a second positioning piece 64 in a penetrating way, the second fastening piece 63 and the second positioning piece 64 are both connected with the Z-axis moving module 100, and the position of the second positioning piece 64 in the second positioning hole 522 is adjustable. The second fastening member 63 and the second positioning member 64 may be screws, when the levelness of the bonding head in the Y direction is adjusted, the connection plate 5 and the bonding head are considered as a whole, the screws are not tightened during adjustment, and at this time, the connection plate 5 can rotate by a small amount relative to the second fastening member 63 until the bonding head is adjusted horizontally, and then the screws are locked.

The second positioning hole 522 is provided with one or a plurality of second fixing holes 521. As shown in fig. 9 (b), four second positioning holes 522 are provided around the second fixing hole 521 on the second plate 52, so that accuracy of leveling in the Y direction and firmness after fixing with the Z-axis mounting plate 101 are ensured.

The first fastener 61 and the second fastener 63 are preferably equal-height screws (driving screws), which have high hardness and toughness and can effectively prevent axial and radial play.

In this embodiment, the Z-axis moving module 100 is driven by a linear motor, or may be driven by a combination of a motor and a screw module. Referring to fig. 1, a drag chain 102 is disposed between a Z-axis mounting plate 101 and a fixed sliding table of a Z-axis moving module 100, and an inner cavity of the drag chain 102 is used for accommodating a wire harness, so that the wire harness is prevented from being pulled and damaged.

The present embodiment also provides a bonding device, including the bonding head and the connected Z-axis moving module 100, X-axis moving module and Y-axis moving module (i.e. three-axis moving module), where the bonding head is mounted on the Z-axis moving module 100. The bonding equipment can pick up the chip 200, the movable end 32 of the pressure control module 3 applies the target additional force F1 to the floating module 2 by adjusting the current parameter of the servo driver, the additional force F1 is overlapped with the total gravity G of the floating module 2 and the movable end 32 to form the preset bonding pressure F0 of the chip 200, when the chip 200 is in contact with the carrier plate 300, the pressure born by the chip 200 is F0 according to the force balance principle, and the bonding pressure requirement of the chip 200 is met.

For chips 200 with different thicknesses and different processes, the preset pressure F0 is different, and the additional force F1 can be adjusted only by adjusting the current parameters of the servo driver, so that the preset bonding pressure F0 of the chip 200 is obtained after the F1 and the G are overlapped, and the bonding qualification rate of the chip 200 is effectively improved.

The above examples of the present utility model are only illustrative of the present utility model and are not intended to limit the embodiments of the present utility model. Various obvious changes, rearrangements and substitutions can be made by those skilled in the art without departing from the scope of the utility model. It is not necessary here nor is it exhaustive of all embodiments. Any modification, equivalent replacement, improvement, etc. which come within the spirit and principles of the utility model are desired to be protected by the following claims.

Claims (10)

1. Bonding head, its characterized in that includes:

a mounting substrate (1) configured to be mounted on the Z-axis movement module (100);

the floating module (2) comprises a floating plate (21) and a bonding shaft (22), wherein the floating plate (21) is slidably arranged on the mounting substrate (1) along the Z direction, and the bonding shaft (22) is arranged on the floating plate (21) and extends downwards and is used for bonding a bonded piece on the carrier plate (300) under a preset pressure F0;

the pressure control module (3) comprises a fixed end (31) and a movable end (32), wherein the fixed end (31) is connected to the mounting substrate (1), and the movable end (32) is connected to the floating plate (21) and is movably connected to the fixed end (31) along the Z direction so as to apply an additional force F1 to the floating module (2);

the total weight of the floating module (2) and the movable end (32) is G, g+f1=f0.

2. The bonding head according to claim 1, wherein the floating module (2) further comprises a rotary driving member (23) disposed on the floating plate (21), and an output end of the rotary driving member (23) is in transmission connection with the bonding shaft (22) so as to adjust a bonding angle of the bonded member on the bonding shaft (22) on the carrier plate (300).

3. Bonding head according to claim 2, characterized in that the floating module (2) further comprises:

a vacuum chamber (24) which is provided at the top end of the rotation driving member (23) and is connected to the floating plate (21);

a suction nozzle (25) connected to the lower end of the bonding shaft (22);

the rotary driving piece (23) is provided with a first air passage (231) along the Z direction, the bonding shaft (22) is provided with a second air passage (221) opposite to the first air passage (231) along the Z direction, and the vacuum chamber (24) is communicated with the suction nozzle (25) through the first air passage (231) and the second air passage (221).

4. The bonding head of claim 3, wherein,

the output end of the rotary driving piece (23) is sleeved with the bonding shaft (22) and is clamped with a first sealing piece (26);

the suction nozzle (25) is sleeved with the bonding shaft (22) and is clamped with a second sealing piece (27).

5. Bonding head according to claim 2, characterized in that the floating plate (21) comprises:

the mounting substrate (1) is provided with a guide rail (4) along the Z direction, the sliding plate (211) is in sliding connection with the mounting substrate (1) through the guide rail (4), and one guide rail (4) or a plurality of guide rails are arranged at intervals along the horizontal direction;

the bearing plate (212) is vertically connected with the sliding plate (211), the rotary driving piece (23) is installed on the bearing plate (212), and the bonding shaft (22) is rotatably connected with the bearing plate (212) through a bearing (28).

6. The bonding head according to any one of claims 1-5, further comprising a connection board (5), wherein the connection board (5) connects the mounting substrate (1) and the Z-axis moving module (100), and wherein levelness of the connection board (5) with respect to the X-direction and the Y-direction is adjustable.

7. Bonding head according to claim 6, characterized in that the connection plate (5) comprises a first plate (51) and a second plate (52) connected vertically;

the first plate (51) is provided with a first fixing hole (511) and a first positioning hole (512), the first positioning hole (512) is arc-shaped, the circle center of the first positioning hole is coincident with that of the first fixing hole (511), a first fastening piece (61) is arranged in the first fixing hole (511) in a penetrating mode, a first positioning piece (62) is arranged in the first positioning hole (512) in a penetrating mode, the first fastening piece (61) and the first positioning piece (62) are connected with the mounting substrate (1), the position of the first positioning piece (62) in the first positioning hole (512) is adjustable, and the first positioning hole (512) is provided with one or a plurality of first fixing holes (511) in a surrounding mode;

the second plate (52) is upwards overhanging relative to the mounting substrate (1), be provided with second fixed orifices (521) and second positioning hole (522) on the second plate (52), second positioning hole (522) are the arc and place centre of a circle with the centre of a circle of second fixed orifices (521) coincide, wear to be equipped with second fastener (63) in second fixed orifices (521), wear to be equipped with second positioning piece (64) in second positioning hole (522), second fastener (63) and second positioning piece (64) all with Z axle removes module (100) and be connected, second positioning piece (64) are in the position adjustable in second positioning hole (522), second positioning hole (522) are provided with one or are encircleed second fixed orifices (521) are provided with a plurality of.

8. The bonding head according to any one of claims 1-5, further comprising a position detection module (6), wherein the position detection module (6) is disposed on the mounting substrate (1) and is configured to detect a Z-axis coordinate of the bonding head.

9. Bonding head according to any one of claims 1-5, further comprising a servo driver for applying an input current I to the pressure control module (3) such that the movable end (32) applies an additional force F1 to the floating module (2), the additional force F1 being proportional to the input current I;

the fixed end (31) and the movable end (32) are respectively a stator and a rotor of one of a voice coil motor, a rod-shaped linear motor and a U-shaped linear motor.

10. Bonding equipment, characterized in that it comprises a bonding head according to any one of claims 1-9, and a Z-axis movement module (100), an X-axis movement module and a Y-axis movement module connected to each other, said bonding head being mounted to said Z-axis movement module (100).