CN219520840U - Device for forming electrode by laser for integrated chip inductor - Google Patents

Abstract

The utility model provides a device for forming an electrode by laser of an integrated chip inductor, which comprises a laser cutting and grinding station arranged above the rear side of a machine, wherein a vibrator is arranged at the front side of the machine, a discharger is obliquely arranged at the outlet of the vibrator, two sides of the machine are provided with a conveying unit, a receiving unit is arranged on the conveying unit, two sides of the vibrator are provided with a receiving unit, and the receiving unit is matched with the conveying unit. The scheme is controlled by an external system, and the laser position of the chip inductor can be dynamically sharpened.

Description

Device for forming electrode by laser for integrated chip inductor

Technical Field

The utility model relates to the technical field of inductors, in particular to a device for forming an electrode by laser for integrated chip inductors.

Background

The existing material-free integrated inductor is characterized in that a coil is mostly bent or built-in, a lead copper sheet of the bent integrated inductor is bent to the bottom from the side edge of a product at right angles, and finally a contact is formed from the outgoing line of the bottom, so that grinding at the contact is a very critical and important step in an inductor preparation process, products are orderly arranged in a jig by traditional grinding, a high-precision grinding machine is used for grinding the products, the copper wire section (contact) of the end part of the products is exposed after grinding, the high-precision grinding machine has higher requirements on the jig and the arrangement mode of the inductor, and meanwhile, due to small volume of the inductor, time and labor are wasted when the arrangement is carried out in the jig, and the grinding production efficiency is low.

Disclosure of Invention

The utility model aims to overcome the defects of the prior art and provides a device for forming an electrode by laser for integrated chip inductance.

In order to achieve the above purpose, the technical scheme provided by the utility model is as follows: the device comprises a laser cutting and grinding station arranged above the rear side of a machine, wherein a vibrator is arranged at the front side of the machine, a discharger is obliquely arranged at the outlet of the vibrator, two sides of the machine are provided with a conveying unit, a receiving unit is arranged on the conveying unit, two sides of the vibrator are provided with a receiving unit, and the receiving unit is matched with the conveying unit; the receiving unit comprises a supporting seat, a receiving plate and a guide plate, wherein the supporting seat is arranged on the conveying unit, one end of the guide plate is fixedly connected with the top of the supporting seat, the other end of the guide plate is provided with a guide groove penetrating up and down, the guide groove is spirally overlooked, a guide shaft is movably installed in the guide groove, a distributing motor is installed in the supporting seat, a transmission shaft of the distributing motor is upwards connected with the bottom of a power guide rod, the top of the power guide rod is provided with a strip-shaped power guide groove, the bottom of the guide shaft is positioned in the power guide groove, and the top of the guide shaft extends out of the guide groove and is connected with the bottom of the receiving plate.

The conveying unit comprises a front linear driving module and a rear linear driving module, a left linear driving module and a right linear driving module, wherein the front linear driving module and the rear linear driving module are fixed on the machine table from front to back, the left linear driving module and the right linear driving module are installed on the front linear driving module and the rear linear driving module, the installed left linear driving module and the rear linear driving module are in a cross shape or a T shape in overlook, one end of the left linear driving module and the right linear driving module extends to the lower part of the laser sharpening station, and the material receiving unit is installed on the left linear driving module and the right linear driving module.

The collecting unit comprises a collecting box, a sweeping cylinder, a sweeping linear driving module and a collecting hopper, wherein the collecting hopper is fixed on a side column at the edge of a machine table, the collecting box is positioned below an outlet at the bottom of the collecting hopper, an opening at one side of the top of the collecting hopper forms a collecting inlet, the collecting inlet is opposite to the direction of the front-back linear driving module, the sweeping linear driving module is arranged on the machine table at one side of the collecting hopper, a sweeping supporting side plate is arranged on the sweeping linear driving module, the top of the sweeping supporting side plate is provided with the sweeping cylinder along the vertical direction, a connecting plate is arranged on a piston rod of the sweeping cylinder, a sweeping plate is arranged at the bottom of the outer end of the connecting plate, and the sweeping plate is positioned above the collecting inlet.

After the scheme is adopted, the chip inductor vibration material is sent into the discharger through the vibrator to carry out discharging and material control, the conveying units are used alternately, one group of material receiving units are arranged on each group of conveying units, when the chip inductor vibration material conveying device works, one group of material receiving units process the chip inductor through a laser grinding station, the other group of material receiving units are driven by the corresponding driving module to descend to the lower part of the discharger and discharge through the discharger, the processed material receiving units are driven by the corresponding driving module to descend to the material receiving units, and the chip inductor is scanned into the material receiving box through the material scanning plate, so that the whole processing process is completed.

Drawings

Fig. 1 is a schematic diagram of the overall structure of the present utility model.

Fig. 2 is a side view of the present utility model.

Fig. 3 is a schematic diagram of a material receiving unit according to the present utility model.

Fig. 4 is a schematic view of the guide shaft installation of the present utility model.

Fig. 5 is a schematic structural diagram of a receiving unit according to the present utility model.

Fig. 6 is a schematic view of a power guiding groove structure of the present utility model.

Detailed Description

The utility model is further described below with reference to all drawings, in which preferred embodiments of the utility model are: referring to fig. 1 to 6, a device for forming electrodes for integrated chip inductors by laser according to the present embodiment includes a laser grinding station 201 mounted above a rear side of a machine 202, a vibrator 203 mounted on a front side of the machine 202, a discharger 204 mounted at an outlet of the vibrator 203 in an inclined manner, two sides of the machine 202 being provided with a conveying unit, a receiving unit being disposed on the conveying unit, receiving units being mounted on the machine 202 on two sides of the vibrator 203, the receiving units being matched with the conveying unit; the receiving unit comprises a material supporting seat 207, a material receiving plate 208 and a guide plate 215, wherein the material supporting seat 207 is arranged on the conveying unit, one end of the guide plate 215 is fixedly connected with the top of the material supporting seat 207, the other end of the guide plate 215 is provided with a guide groove 216 penetrating up and down, the guide groove 216 is spirally shaped in overlooking, a guide shaft 217 is movably arranged in the guide groove 216, a material distributing motor is arranged in the material supporting seat 207, a transmission shaft of the material distributing motor is upwards connected with the bottom of a power guide rod 218, the top of the power guide rod 218 is provided with a strip-shaped power guide groove 219, the bottom of the guide shaft 217 is positioned in the power guide groove 219, and the top of the guide shaft 217 extends out of the guide groove 216 and is connected with the bottom of the material receiving plate 208.

The conveying unit comprises a front-back linear driving module 205 and a left-right linear driving module 206, wherein the front-back linear driving module 205 is fixed on the machine table 202 from front to back, the left-right linear driving module 206 is installed on the front-back linear driving module 205, the installed left-right linear driving module 206 and the front-back linear driving module 205 are in a cross shape or a T shape in overlook, one end of the left-right linear driving module 206 extends to the lower side of the laser sharpening station 201, and the material receiving unit is installed on the left-right linear driving module 206.

The collecting unit comprises a collecting box 209, a sweeping cylinder 210, a sweeping linear driving module 211 and a collecting hopper 212, wherein the collecting hopper 212 is fixed on a side column at the edge of the machine table 202, the collecting box 209 is positioned below an outlet at the bottom of the collecting hopper 212, an aggregate inlet is formed in an opening at one side of the top of the collecting hopper 212, the sweeping linear driving module 211 is installed on the machine table 202 at one side of the collecting hopper 212, the sweeping linear driving module 211 is opposite to the direction of the front-back linear driving module 205, a sweeping supporting side plate 213 is installed on the sweeping linear driving module 211, the sweeping cylinder 210 is installed at the top of the sweeping supporting side plate 213 along the vertical direction, a connecting plate is installed on a piston rod of the sweeping cylinder 210, a sweeping plate 214 is installed at the bottom of the outer end of the connecting plate, and the sweeping plate 214 is positioned above the aggregate inlet.

During operation, the chip inductance vibration material is sent into the discharger to discharge and control the material, the front and back linear driving modules drive the left and right linear driving modules to move to the front side of the machine, the left and right linear driving modules drive the material supporting seat, the material receiving seat is driven to move below the outlet of the discharger, the discharger starts discharging, the material distributing motor positively rotates to drive the power guide rod to rotate through the transmission shaft while discharging, the power guide rod rotationally drives the guide shaft to move, the guide shaft performs spiral movement along the direction of the guide groove under the limit action of the guide groove, so that the material receiving plate synchronously performs spiral movement, the discharger is used for arranging the inductance on the material receiving plate in a spiral way, the material distributing motor reversely rotates to drive the material receiving plate to reversely move for resetting after the material receiving is completed, the front and back linear driving modules are matched with the left and right linear driving modules to drive the material supporting seat to enable the material receiving plate to move below the laser grinding work position to grind through the laser grinding work position, after finishing grinding, the front-back linear driving module and the left-right linear driving module are matched to drive the material supporting seat to enable the material receiving plate to move to the material collecting inlet of the material collecting hopper, the original material sweeping plate is driven by the material sweeping cylinder to rise to the position above the material receiving plate, when the material supporting seat moves to the material collecting inlet, the material sweeping linear driving module drives the material sweeping supporting side plate, the material sweeping plate and other parts to move to the other side of the material receiving plate opposite to the material collecting inlet, the material sweeping cylinder piston rod stretches and contracts to drive the material sweeping plate to descend, the bottom of the material sweeping plate (the bottom of the material sweeping plate is provided with hairbrush strips) is contacted with the surface of the material receiving plate, the material sweeping linear driving module drives the material sweeping supporting side plate to move towards the direction of the material collecting hopper, the inductance processed on the material receiving plate is swept into the material collecting hopper through the material collecting hopper, and the inductance is guided into the material collecting box through the material collecting hopper to be collected, the two groups of conveying units of the scheme are alternately used, one group is used for carrying out laser grinding, and the other group is used for receiving and discharging materials.

The above-mentioned embodiments are only preferred embodiments of the present utility model, and are not intended to limit the scope of the present utility model, so that all changes made in the shape and principles of the present utility model are covered by the scope of the present utility model.

Claims (3)

1. The utility model provides a device of integrated chip inductance with laser formation electrode, it includes installs laser grinding station (201) in board (202) rear side top, and vibration glassware (203) are installed to board (202) front side, and discharge ware (204) are installed in the exit slope of vibration glassware (203), its characterized in that: the two sides of the machine table (202) are provided with conveying units, the conveying units are provided with receiving units, the machine table (202) at the two sides of the vibrator (203) is provided with receiving units, and the receiving units are matched with the conveying units; the material receiving unit comprises a material supporting seat (207), a material receiving plate (208) and a guide plate (215), wherein the material supporting seat (207) is installed on the conveying unit, one end of the guide plate (215) is fixedly connected with the top of the material supporting seat (207), the other end of the guide plate (215) is provided with a guide groove (216) penetrating up and down, the guide groove (216) is spirally overlooked, a guide shaft (217) is movably installed in the guide groove (216), a material distributing motor is installed in the material supporting seat (207), a transmission shaft of the material distributing motor is upwards connected with the bottom of a power guide rod (218), a strip-shaped power guide groove (219) is formed in the top of the power guide rod (218), the bottom of the guide shaft (217) is located in the power guide groove (219), and the top of the guide shaft (217) extends out of the guide groove (216) and is connected with the bottom of the material receiving plate (208).

2. The device for forming an electrode for integrated chip inductance by laser light according to claim 1, wherein: the conveying unit comprises a front linear driving module (205) and a rear linear driving module (206), wherein the front linear driving module (205) and the rear linear driving module (205) are fixed on a machine table (202) from front to back, the front linear driving module (205) and the rear linear driving module (205) are provided with the left linear driving module (206), the mounted left linear driving module (206) and the front linear driving module (205) are in a cross shape or a T shape in overlook mode, one end of the left linear driving module (206) and one end of the right linear driving module (206) extend to the lower side of a laser sharpening station (201), and the left linear driving module (206) is provided with a material receiving unit.

3. The device for forming an electrode for integrated chip inductance by laser light according to claim 1, wherein: the collecting unit comprises a collecting box (209), a sweeping cylinder (210), a sweeping linear driving module (211) and a collecting hopper (212), wherein the collecting hopper (212) is fixed on a side column at the edge of a machine table (202), the collecting box (209) is located below an outlet at the bottom of the collecting hopper (212), an opening at one side of the top of the collecting hopper (212) forms an aggregate inlet, the aggregate inlet is opposite to the direction of the front-back linear driving module (205), the machine table (202) at one side of the collecting hopper (212) is provided with the sweeping linear driving module (211), the sweeping linear driving module (211) is provided with a sweeping supporting side plate (213), the top of the sweeping supporting side plate (213) is provided with the sweeping cylinder (210) along the vertical direction, a piston rod of the sweeping cylinder (210) is provided with a connecting plate, the bottom of the outer end of the connecting plate is provided with the sweeping plate (214), and the sweeping plate (214) is located above the aggregate inlet.