CN219514503U

CN219514503U - Edge computing node device with active heat dissipation device

Info

Publication number: CN219514503U
Application number: CN202320392415.2U
Authority: CN
Inventors: 宁盛创; 王一凡
Original assignee: Tianjin Semi Micro Technology Co ltd
Current assignee: Tianjin Semi Micro Technology Co ltd
Priority date: 2023-03-06
Filing date: 2023-03-06
Publication date: 2023-08-11
Anticipated expiration: 2033-03-06

Abstract

The utility model relates to the field of edge computing node devices, and provides an edge computing node device with an active heat dissipation device, which comprises: the heat radiation device comprises a heat radiation shell, a built-in active heat radiation device and an edge computing node main board, wherein a heat radiation grille is arranged on the upper side of the heat radiation shell, an air inlet area is arranged on the upper side of the side face of the heat radiation shell, the edge computing node main board is arranged in the heat radiation shell, the built-in active heat radiation device is arranged above the edge computing node main board, and the built-in active heat radiation device sucks external air through the air inlet area and discharges the air through the heat radiation grille.

Description

Edge computing node device with active heat dissipation device

Technical Field

The present utility model relates to the field of edge computing node devices, and in particular, to an edge computing node device with an active heat dissipation device.

Background

Edge computing refers to providing near-end services by adopting an open platform with integrated network, computing, storage and application core capabilities on the side close to the object or data source. The application program is initiated at the edge side, and faster network service response is generated, so that the basic requirements of the industry in the aspects of real-time service, application intelligence, security, privacy protection and the like are met. Edge computation is between a physical entity and an industrial connection, or at the top of a physical entity. The cloud computing can still access the historical data of the edge computing.

Edge computing devices can be designed to run in almost any situation and provide computing resources that optimize industrial work. Edge devices are considered entry points to the enterprise core network or any hardware that controls the flow of data between the two networks. Edge computing devices are intended to fulfill a particular role and to be equipped with applications needed to accomplish a particular task.

The application number is as follows: the utility model discloses a wireless mobile network edge computing node device, including ware body and top shell, ware body top is fixed with the top shell, send out the device to be installed to ware body one side, and the connector is installed to ware body opposite side, opening and shutting device is installed at top shell top, top shell internally mounted has the heat abstractor.

The existing edge computing node device is higher in integration, more in internal computing equipment and higher in heat generated during complex scene operation, so that the computing efficiency of internal elements is reduced due to overhigh temperature, and the overall working efficiency of the equipment is reduced.

Disclosure of Invention

In order to solve the problems that the integration of the existing edge computing node device is high, the number of internal computing devices is large, the heat generated during the operation in a complex scene is high, the computing efficiency of the internal elements is reduced due to overhigh temperature, and the overall working efficiency of the device is reduced, the utility model provides an edge computing node device with an active heat dissipation device, and the problem is solved.

In order to achieve the above purpose, the present utility model provides the following technical solutions:

an edge computing node device with active heat sink, comprising: the intelligent cooling device comprises a cooling shell, a built-in active cooling device and an edge computing node main board, wherein a cooling grid is arranged on the upper side of the cooling shell, an air inlet area is arranged on the upper portion of the side face of the cooling shell, the edge computing node main board is arranged in the cooling shell, the built-in active cooling device is arranged above the edge computing node main board, and the built-in active cooling device sucks external air through the air inlet area and discharges the air through the cooling grid.

Preferably, the built-in active heat dissipation device includes: built-in mounting bracket, vapor chamber, radiator fan and temperature sensor, built-in mounting bracket fixed mounting is in the heat dissipation casing, and built-in mounting bracket sets up in edge calculation node mainboard top, and the vapor chamber sets up the lower floor at built-in mounting bracket, and radiator fan sets up in built-in mounting bracket upper strata, and temperature sensor sets up in vapor chamber one side.

Preferably, the built-in mounting frame includes: mounting panel body, first supporting part and second supporting part, mounting panel body, first supporting part and second supporting part are integrated into one piece structure, first supporting part sets up in mounting panel body lower part, and the second supporting part sets up in first supporting part top, and soaking plate fixed mounting is in first supporting part upside, and radiator fan fixed mounting is on the second supporting part, and second supporting part downside fixed mounting has temperature sensor.

Preferably, the method further comprises: mounting plate, interface module and signal pole, mounting plate fixed mounting is in the heat dissipation casing bottom, and interface module sets up in the heat dissipation casing side, and the signal pole is provided with the multiunit, and multiunit signal pole sets up on the heat dissipation casing.

Preferably, the air inlet area is formed by arranging a plurality of groups of oblique slotted holes in a matrix mode, and a dustproof net arranged in the heat dissipation shell is adhered to one side of the air inlet area.

The utility model has the advantages that: according to the utility model, the internal heat of the edge computing node device can be effectively absorbed and discharged to the outside through the built-in active heat radiating device, the heat can be rapidly conducted through the soaking plate, the heat radiating fan can be restarted when the heat is required to be radiated through the temperature sensor, the continuous rotation of the heat radiating fan is avoided, the work efficiency is reduced, the effect of preventing external dust from falling onto the edge computing node mainboard from the air inlet area can be achieved through the arrangement of the soaking plate, the service life is prolonged, and the maintenance times are reduced.

Drawings

The accompanying drawings, which are included to provide a further understanding of the utility model and are incorporated in and constitute a part of this specification, illustrate embodiments of the utility model and together with the description serve to explain the utility model. In the drawings:

FIG. 1 is a front view of the present utility model;

FIG. 2 is a side view of the present utility model;

FIG. 3 is a schematic diagram of a built-in active heat sink according to the present utility model;

fig. 4 is a side view of the built-in active heat sink of the present utility model.

Reference numerals illustrate:

1. a heat dissipation housing; 2. an active heat dissipation device is arranged in the heat radiator; 11. a heat-dissipating grille; 12. an air inlet area; 21. a mounting rack is arranged in the box; 22. a soaking plate; 23. a heat radiation fan; 24. a temperature sensor; 211. a mounting plate body; 212. a first support portion; 213. a second supporting part; 3. a mounting base plate; 4. an interface module; 5. a signal bar; 13. a dust-proof net.

Detailed Description

It should be noted that, without conflict, the embodiments of the present utility model and features of the embodiments may be combined with each other.

In the description of the present utility model, it should be understood that the terms "center", "longitudinal", "lateral", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, are merely for convenience in describing the present utility model and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the present utility model. Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first", "a second", etc. may explicitly or implicitly include one or more such feature. In the description of the present utility model, unless otherwise indicated, the meaning of "a plurality" is two or more.

In the description of the present utility model, it should be noted that, unless explicitly specified and limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be either fixedly connected, detachably connected, or integrally connected, for example; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the above terms in the present utility model can be understood by those of ordinary skill in the art in a specific case.

Embodiment one, described with reference to fig. 1, 2 and 3:

an edge computing node device with active heat sink, comprising: the intelligent heat dissipation device comprises a heat dissipation shell 1, a built-in active heat dissipation device 2 and an edge computing node main board, wherein a heat dissipation grid 11 is arranged on the upper side of the heat dissipation shell 1, an air inlet area 12 is arranged on the upper portion of the side face of the heat dissipation shell 1, the edge computing node main board is arranged in the heat dissipation shell 1, the built-in active heat dissipation device 2 is arranged above the edge computing node main board, and the built-in active heat dissipation device 2 sucks external air through the air inlet area 12 and discharges the air through the heat dissipation grid 11.

The air inlet area 12 is formed by arranging a plurality of groups of oblique slotted holes in a matrix mode, and a dustproof net 13 arranged in the heat dissipation shell 1 is attached to one side of the air inlet area 12.

So set up, the slant slotted hole can be better hold external air and pass through and stable in structure, not fragile, structural strength is high, and compressive capacity is strong.

The built-in active heat dissipation device 2 includes: the built-in mounting frame 21, the soaking plate 22, the cooling fan 23 and the temperature sensor 24, the built-in mounting frame 21 is fixedly mounted in the cooling shell 1 through screws, the built-in mounting frame 21 is arranged above the edge calculation node main board, and the built-in mounting frame 21 is used for supporting the soaking plate 22, the cooling fan 23 and the temperature sensor 24 above the edge calculation node main board.

The two sides of the soaking plate 22 are fixedly arranged on the lower layer of the built-in mounting frame 21 through screws, and the lower side of the soaking plate 22 is close to the upper side of the edge computing node main board so as to better absorb heat generated by the edge computing node main board. The vapor chamber 22 is conventional and will not be described in detail herein.

The vapor chamber 22 can also play a role in isolating outside air from the main board, and prevent dust in the air from falling into the main board to cause equipment failure.

The cooling fan 23 is arranged on the upper layer of the built-in mounting frame 21, the temperature sensor 24 is arranged on one side of the vapor chamber 22, and the temperature sensor 24 is used for sensing the real-time temperature of the vapor chamber 22 so as to control the cooling fan 23 to timely start heat dissipation.

Embodiment two, based on embodiment one, will be described with reference to fig. 3 and 4:

the built-in mount 21 includes: mounting panel body 211, first supporting part 212 and second supporting part 213, mounting panel body 211, first supporting part 212 and second supporting part 213 are integrated into a whole structure, first supporting part 212 sets up in mounting panel body 211 lower part, second supporting part 213 sets up in first supporting part 212 top, soaking plate 22 both sides pass through screw fixed mounting in first supporting part 212 upside, radiator fan 23 passes through screw fixed mounting on second supporting part 213, radiator fan 23 provides the driving force through the motor of installing on second supporting part 213, second supporting part 213 downside fixed mounting has temperature sensor 24, so set up, the convenience is produced and processed, equipment dismouting is maintained, and manufacturing cost is lower, the mass production of being convenient for.

Embodiment three, based on embodiment one, is described with reference to fig. 1 and 2:

an edge computing node device with an active heat sink, further comprising: mounting plate 3, interface module 4 and signal pole 5, mounting plate 3 fixed mounting is in heat dissipation casing 1 bottom, and interface module 4 sets up in heat dissipation casing 1 side, and signal pole 5 is provided with the multiunit, and multiunit signal pole 5 sets up on heat dissipation casing 1.

The interface module 4 includes: HDMI interface, USB2.0 interface, RS232 interface, VGA interface, SIM card slot, TF card slot, audio interface, network interface, RS485 interface and USB3.0 interface, HDMI interface, USB2.0 interface, RS232 interface, VGA interface, SIM card slot, TF card slot, audio interface, network interface, RS485 interface and USB3.0 interface are connected with edge computing node mainboard electricity respectively.

Mounting flanges are arranged on two sides of the mounting bottom plate 3, and a plurality of screw mounting oblong holes are formed in the mounting flanges.

The working principle of the utility model is as follows: when the heat spreader is used, heat generated by the main board can be quickly absorbed by the heat spreader 22, after the temperature of the heat spreader is increased, the heat dissipation fan 23 is started to suck external air from the air inlet area 12, the external air takes away the heat of the heat spreader and is discharged from the heat dissipation grid 11, so that the effect of cooling is achieved, the heat spreader can also separate the main board from the air flow space, the effect of isolating is achieved, dust is prevented from falling onto the main board, the service life of the device is prolonged, the heat spreader is reasonable in structure and convenient to use, the heat generated inside the edge computing node device can be effectively absorbed and discharged to the outside, the heat dissipation efficiency is improved, and the service life of the device is prolonged.

It will be evident to those skilled in the art that the utility model is not limited to the details of the foregoing illustrative embodiments, and that the present utility model may be embodied in other specific forms without departing from the spirit or essential characteristics thereof; the present embodiments are, therefore, to be considered in all respects as illustrative and not restrictive, the scope of the utility model being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.

The foregoing description is only of the preferred embodiments of the present utility model, and is not intended to limit the utility model, but any minor modifications, equivalents, and improvements made to the above embodiments according to the technical principles of the present utility model should be included in the scope of the technical solutions of the present utility model.

Claims

1. An edge computing node device with active heat sink, comprising: the intelligent heat dissipation device comprises a heat dissipation shell (1), a built-in active heat dissipation device (2) and an edge computing node main board, wherein a heat dissipation grid (11) is arranged on the upper side of the heat dissipation shell (1), an air inlet area (12) is arranged on the upper side of the side face of the heat dissipation shell (1), the edge computing node main board is arranged in the heat dissipation shell (1), the built-in active heat dissipation device (2) is arranged above the edge computing node main board, and the built-in active heat dissipation device (2) sucks external air through the air inlet area (12) and discharges the air through the heat dissipation grid (11).

2. An edge computing node device with active heat sink according to claim 1, characterized in that the built-in active heat sink (2) comprises: built-in mounting bracket (21), soaking plate (22), radiator fan (23) and temperature sensor (24), built-in mounting bracket (21) fixed mounting is in radiator case (1), and built-in mounting bracket (21) set up in edge calculation node mainboard top, and the lower floor of built-in mounting bracket (21) is set up in soaking plate (22), and radiator fan (23) set up built-in mounting bracket (21) upper strata, and temperature sensor (24) set up in soaking plate (22) one side.

3. An edge computing node device with active heat sink according to claim 2, characterized in that the built-in mounting (21) comprises: mounting panel body (211), first supporting part (212) and second supporting part (213), mounting panel body (211), first supporting part (212) and second supporting part (213) are integrated into one piece structure, first supporting part (212) set up in mounting panel body (211) lower part, second supporting part (213) set up in first supporting part (212) top, soaking plate (22) fixed mounting is in first supporting part (212) upside, radiator fan (23) fixed mounting is on second supporting part (213), second supporting part (213) downside fixed mounting has temperature sensor (24).

4. An edge computing node device with active heat sink as defined in claim 1, further comprising: mounting plate (3), interface module (4) and signal pole (5), mounting plate (3) fixed mounting is in heat dissipation casing (1) bottom, and interface module (4) set up in heat dissipation casing (1) side, and signal pole (5) are provided with the multiunit, and multiunit signal pole (5) set up on heat dissipation casing (1).

5. The edge computing node device with the active heat dissipation device according to claim 1, wherein the air inlet area (12) is formed by arranging a plurality of groups of oblique slotted holes in a matrix mode, and a dust screen (13) arranged in the heat dissipation shell (1) is attached to one side of the air inlet area (12).