CN219513046U - Air inlet adjusting device of dry etching machine - Google Patents

Air inlet adjusting device of dry etching machine Download PDF

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Publication number
CN219513046U
CN219513046U CN202320569260.5U CN202320569260U CN219513046U CN 219513046 U CN219513046 U CN 219513046U CN 202320569260 U CN202320569260 U CN 202320569260U CN 219513046 U CN219513046 U CN 219513046U
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China
Prior art keywords
upper cover
air inlet
reaction
section
limiting
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CN202320569260.5U
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Chinese (zh)
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费爱勇
李宁
居法银
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Zhejiang Unisom New Material Technology Co ltd
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Zhejiang Unisom New Material Technology Co ltd
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    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02PCLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50Manufacturing or production processes characterised by the final manufactured product

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Abstract

The utility model provides an air inlet regulating device of a dry etching machine, which comprises a reaction base and a reaction upper cover, wherein the reaction upper cover is arranged on the top of the reaction base in a covering manner, a reaction chamber for placing a wafer is arranged on the top of the reaction base, a main air inlet hole is formed in the center of the reaction upper cover, a plurality of auxiliary air inlet holes are formed in the reaction upper cover along the circumferential direction, and air outlets of the auxiliary air inlet holes are vertically opposite to the edge of the wafer. The gas outlet of the auxiliary gas inlet is opposite to the edge of the wafer from top to bottom, the edge of the wafer can be treated by the gas exhausted from the auxiliary gas inlet, the etching rate of the contact area between the edge of the wafer and the pressure ring is improved, byproducts are not easy to accumulate in the contact area between the edge of the wafer and the pressure ring, and the uniformity and the particles can achieve a good effect.

Description

Air inlet adjusting device of dry etching machine
Technical Field
The utility model relates to a dry etching machine accessory, in particular to an air inlet adjusting device of a dry etching machine.
Background
Etching is an important process in semiconductor, microelectronic, and LED fabrication processes, and is a process that utilizes chemical or physical methods to selectively remove unwanted materials from the surface of a silicon wafer or sapphire substrate. With the improvement of the integration level of semiconductor devices, the line width of the semiconductor devices is smaller, the control of critical dimensions is more and more important, and the requirements on etching processes are higher and higher.
The etching can be classified into wet etching and dry etching from a process point of view. Dry etching, i.e. plasma etching, is usually performed by introducing an etching gas into a plasma processing apparatus, ionizing the etching gas into a plasma, and etching a wafer to be etched by using the plasma.
In the existing plasma etching method, a photoresist pattern is usually formed on the surface to be etched, and the photoresist pattern is used as a mask to etch the layer to be etched. The dry etching has the advantages of good anisotropy, high selection ratio, good controllability, high flexibility, good repeatability, easy realization of automation and high cleanliness, and becomes one of the most common etching processes at present.
At present, chinese patent publication No. CN103337444a discloses a reaction chamber of a dry plasma etching machine, which comprises a cylindrical reaction chamber, an upper cover covered on the top of the reaction chamber, an air inlet hole is provided at the central position of the upper cover, the reaction chamber comprises a side wall, a bottom wall and an upper wall, and a wafer to be etched is placed at the central position of the bottom wall of the reaction chamber. However, the reaction chamber of the dry plasma etching machine adopts a central air inlet mode, so that the etching rate of the contact area between the edge of the wafer and the pressure ring is low, byproducts are easy to accumulate, and uniformity and particles cannot achieve very good effects.
Disclosure of Invention
In view of the above, the present utility model aims to provide an air inlet adjusting device of a dry etching machine, which can independently ventilate the upper part of the contact area between the edge of the wafer and the pressure ring, and improve the etching rate of the contact area between the edge of the wafer and the pressure ring, so that byproducts are not easy to accumulate in the contact area between the edge of the wafer and the pressure ring, and the uniformity and the particles can achieve better effects.
In order to solve the technical problems, the technical scheme of the utility model is as follows: the utility model provides a dry etching machine air inlet adjusting device, includes reaction base, lid is established reaction upper cover at reaction base top, reaction chamber for placing the wafer has been seted up at the top of reaction base, main inlet port has been seted up to reaction upper cover center department, a plurality of auxiliary inlet ports have been seted up along circumference to the reaction upper cover, the gas outlet of auxiliary inlet port is relative from top to bottom with the edge of wafer.
Through the technical scheme, the air outlet of the auxiliary air inlet hole is vertically opposite to the edge of the wafer, the edge of the wafer can be treated by the air exhausted from the auxiliary air inlet hole, the etching rate of the contact area between the edge of the wafer and the pressure ring is improved, byproducts are not easy to accumulate in the contact area between the edge of the wafer and the pressure ring, and the uniformity and the particles can achieve a good effect.
Preferably, the auxiliary air inlet hole comprises an air inlet section, a connecting section and an air outlet section which are communicated in sequence, the air inlet section is perpendicular to the top surface of the reaction upper cover, the connecting section is arranged along the radial direction of the reaction upper cover, and the air outlet section is perpendicular to the bottom surface of the reaction upper cover.
Through above-mentioned technical scheme, the section of admitting air is perpendicular with the top surface of reaction upper cover, so gas can enter into the reaction upper cover sooner. The gas outlet section is perpendicular to the bottom surface of the reaction upper cover, so that the gas in the connecting section can leave the reaction upper cover faster.
Preferably, the width of the air inlet section is smaller than the width of the connecting section, and the width of the connecting section is smaller than the width of the air outlet section.
Through the technical scheme, when the gas flows through the auxiliary air inlet hole, the speed is gradually reduced.
Preferably, the reaction upper cover is provided with a plurality of branch air passages along the circumferential direction, the top of the branch air passages is communicated with the main air inlet hole, and the bottom of the branch air passages penetrates through the bottom surface of the reaction upper cover.
Through the technical scheme, the reaction upper cover is provided with the plurality of branch air passages communicated with the main air inlet, so that gas can be more dispersed, the etching rates of the wafer are similar everywhere, byproducts are not easy to accumulate, and uniformity and particles can achieve a good effect.
Preferably, the reaction upper cover comprises an upper cover main body, an upper cover splicing piece and an upper cover limiting piece, the main air inlet is formed in the center of the upper cover main body, the upper cover main body is provided with mounting through grooves, the number of the mounting through grooves is identical to that of the auxiliary air inlets, the mounting through grooves are uniformly distributed along the circumference of the upper cover main body, the number of the upper cover splicing piece is identical to that of the mounting through grooves, the upper cover splicing piece is arranged in the corresponding mounting through grooves, the auxiliary air inlets are formed in the upper cover splicing piece, and the upper cover limiting piece is used for connecting the upper cover main body with the upper cover splicing piece.
Through above-mentioned technical scheme, upper cover main part and upper cover splice pass through upper cover locating part and are connected, so can change the upper cover splice of different length according to the diameter of wafer, promote the suitability of etching machine.
Preferably, the upper cover splicing piece comprises a first splicing block, a second splicing block and a third splicing block which are sequentially clamped, the air inlet section is arranged in the first splicing block, the side wall of the first splicing block is provided with a first connecting port communicated with the air inlet section, the connecting section is arranged in the second splicing block, the connecting section is communicated with the first connecting port, the air outlet section is arranged in the third splicing block, the side wall of the third splicing block is provided with a second connecting port communicated with the air outlet section, and the second connecting port is communicated with the connecting section.
Through the technical scheme, the first splicing block, the second splicing block and the third splicing block are spliced in sequence, and the second splicing blocks with different lengths can be replaced according to the diameters of the wafers when the etching machine is used, so that the applicability of the etching machine is improved.
Preferably, the second splicing block comprises a plurality of splicing units which are sequentially clamped, and the connecting section comprises a plurality of connecting units arranged in the splicing units.
Through the technical scheme, the second splicing block comprises a plurality of splicing units which are sequentially clamped, so that the splicing units with different numbers can be taken according to the diameter of the wafer when the etching machine is used, and the applicability of the etching machine is improved.
Preferably, the upper cover locating part includes spacing turn-ups first, stop screw first, spacing turn-ups second and stop screw second, spacing turn-ups first fixed connection is in the top surface of first splice, spacing turn-ups first with the top surface of upper cover main part is contradicted, stop screw first runs through spacing turn-ups and threaded connection in the same time the upper cover main part, spacing turn-ups second fixed connection is in the top surface of third splice, spacing turn-ups second with the top surface of upper cover main part is contradicted, stop screw second runs through spacing turn-ups second and threaded connection the upper cover main part.
Through above-mentioned technical scheme, spacing turn-ups and first cooperation of stop screw for be connected first splice block and upper cover main part, have the comparatively convenient advantage of dismouting. The second limit flanging is matched with the second limit screw and used for connecting the third splicing block with the upper cover main body, so that the upper cover has the advantage of being convenient to assemble and disassemble.
Drawings
Fig. 1 is a schematic structural diagram of an embodiment.
Reference numerals: 1. a reaction base; 2. a reaction upper cover; 21. an upper cover main body; 22. an upper cover splice; 221. a first splice block; 222. a second splice block; 223. a third splice block; 23. an upper cover limiting piece; 231. a first limit flanging is carried out; 232. a first limit screw; 233. a second limit flanging; 234. a second limit screw; 3. a reaction chamber; 4. a main air inlet; 5. an auxiliary air inlet hole; 51. an air inlet section; 52. a connection section; 53. an air outlet section; 6. a branch air passage; 7. installing a through groove; 8. a first connecting port; 9. and a second connecting port.
Detailed Description
The following detailed description of the utility model is provided in connection with the accompanying drawings to facilitate understanding and grasping of the technical scheme of the utility model.
An air inlet adjusting device of a dry etching machine, as shown in figure 1, comprises a reaction base 1 and a reaction upper cover 2 which is arranged on the top of the reaction base 1 in a covering manner. The top of the reaction base 1 is provided with a reaction chamber 3 for placing a wafer, the center of the reaction upper cover 2 is provided with a main air inlet 4, the reaction upper cover 2 is provided with a plurality of auxiliary air inlet holes 5 along the circumferential direction, and the air outlets of the auxiliary air inlet holes 5 are opposite to the edge of the wafer up and down.
The auxiliary air inlet hole 5 comprises an air inlet section 51, a connecting section 52 and an air outlet section 53 which are communicated in sequence. The air inlet section 51 is perpendicular to the top surface of the reaction upper cover 2, the connecting section 52 is arranged along the radial direction of the reaction upper cover 2, and the air outlet section 53 is perpendicular to the bottom surface of the reaction upper cover 2. The width of the inlet section 51 is smaller than the width of the connecting section 52, and the width of the connecting section 52 is smaller than the width of the outlet section 53.
The reaction upper cover 2 is provided with a plurality of branch air ducts 6 along the circumferential direction, the top of branch air duct 6 communicates main inlet port 4, and the bottom of branch air duct 6 runs through the bottom surface of reaction upper cover 2.
The reaction upper cover 2 includes an upper cover main body 21, an upper cover splice 22, and an upper cover stopper 23. The main intake hole 4 is opened at the center of the upper cover body 21. The upper cover main body 21 is provided with mounting through grooves 7, the number of the mounting through grooves 7 is the same as that of the auxiliary air inlet holes 5, and the mounting through grooves 7 are uniformly distributed along the circumferential direction of the upper cover main body 21. The number of the upper cover splice pieces 22 is the same as that of the mounting through slots 7, and the upper cover splice pieces 22 are mounted in the corresponding mounting through slots 7. The secondary intake aperture 5 is provided in the upper cover sub 22. The upper cover limiting member 23 is used for connecting the upper cover main body 21 and the upper cover splicing member 22.
The upper cover splice 22 includes a first splice block 221, a second splice block 222, and a third splice block 223 that are sequentially snapped together. The air intake section 51 opens in the first joint block 221. The side wall of the first splicing block 221 is provided with a first connecting port 8 communicated with the air inlet section 51. The connecting section 52 is arranged in the second splicing block 222, and the connecting section 52 is communicated with the first connecting port 8. The air outlet section 53 is arranged in the third splicing block 223, the side wall of the third splicing block 223 is provided with a second connecting port 9 communicated with the air outlet section 53, and the second connecting port 9 is communicated with the connecting section 52.
The second splice block 222 includes a plurality of splice units that are sequentially clamped, and the connection section 52 includes connection units disposed among the plurality of splice units.
The upper cover limiting piece 23 comprises a first limiting flange 231, a first limiting screw 232, a second limiting flange 233 and a second limiting screw 234, wherein the first limiting flange 231 is fixedly connected to the top surface of the first splicing block 221, the first limiting flange 231 is in interference fit with the top surface of the upper cover main body 21, the first limiting screw 232 penetrates through the first limiting flange 231 and is in threaded connection with the upper cover main body 21, the second limiting flange 233 is fixedly connected to the top surface of the third splicing block 223, the second limiting flange 233 is in interference fit with the top surface of the upper cover main body 21, and the second limiting screw 234 penetrates through the second limiting flange 233 and is in threaded connection with the upper cover main body 21.
Of course, the above is only a typical example of the utility model, and other embodiments of the utility model are also possible, and all technical solutions formed by equivalent substitution or equivalent transformation fall within the scope of the utility model claimed.

Claims (8)

1. The utility model provides a dry etching machine air inlet adjusting device, is in including reaction base (1), lid reaction upper cover (2) at reaction base (1) top, reaction cavity (3) for placing the wafer have been seted up at the top of reaction base (1), main inlet port (4), characterized by have been seted up in reaction upper cover (2) center department: the reaction upper cover (2) is provided with a plurality of auxiliary air inlet holes (5) along the circumferential direction, and the air outlets of the auxiliary air inlet holes (5) are opposite to the edge of the wafer up and down.
2. The dry etching machine air inlet adjusting device according to claim 1, wherein: the auxiliary air inlet hole (5) comprises an air inlet section (51), a connecting section (52) and an air outlet section (53) which are sequentially communicated, the air inlet section (51) is perpendicular to the top surface of the reaction upper cover (2), the connecting section (52) is arranged along the radial direction of the reaction upper cover (2), and the air outlet section (53) is perpendicular to the bottom surface of the reaction upper cover (2).
3. The dry etching machine air inlet adjusting device according to claim 2, wherein: the width of the air inlet section (51) is smaller than that of the connecting section (52), and the width of the connecting section (52) is smaller than that of the air outlet section (53).
4. A dry etching machine air inlet adjusting device according to claim 3, characterized in that: the reaction upper cover (2) is provided with a plurality of branch air passages (6) along the circumferential direction, the top of branch air passages (6) is communicated with the main air inlet hole (4), and the bottom of branch air passages (6) penetrates through the bottom surface of the reaction upper cover (2).
5. The dry etching machine air inlet adjusting device according to claim 4, wherein: the reaction upper cover (2) comprises an upper cover main body (21), an upper cover splicing piece (22) and an upper cover limiting piece (23), wherein the main air inlet hole (4) is formed in the center of the upper cover main body (21), the upper cover main body (21) is provided with a mounting through groove (7), the number of the mounting through grooves (7) is identical to the number of the auxiliary air inlet holes (5), the upper cover splicing piece (22) is uniformly distributed along the circumference of the upper cover main body (21), the number of the upper cover splicing piece (22) is identical to the number of the mounting through grooves (7), the upper cover splicing piece (22) is arranged in the corresponding mounting through groove (7), the auxiliary air inlet holes (5) are formed in the upper cover splicing piece (22), and the upper cover limiting piece (23) is used for connecting the upper cover main body (21) with the upper cover splicing piece (22).
6. The dry etching machine air inlet adjusting device according to claim 5, wherein: the upper cover splice (22) comprises a first splice block (221), a second splice block (222) and a third splice block (223) which are sequentially clamped, the air inlet section (51) is formed in the first splice block (221), the side wall of the first splice block (221) is formed with a first connecting port (8) communicated with the air inlet section (51), the connecting section (52) is formed in the second splice block (222), the connecting section (52) is communicated with the first connecting port (8), the air outlet section (53) is formed in the third splice block (223), the side wall of the third splice block (223) is formed with a second connecting port (9) communicated with the air outlet section (53), and the second connecting port (9) is communicated with the connecting section (52).
7. The dry etching machine air inlet adjusting device according to claim 6, wherein: the second splicing block (222) comprises a plurality of splicing units which are sequentially clamped, and the connecting section (52) comprises connecting units arranged in the plurality of splicing units.
8. The dry etching machine air inlet adjusting device according to claim 6, wherein: the upper cover limiting part (23) comprises a limiting flanging first (231), a limiting screw first (232), a limiting flanging second (233) and a limiting screw second (234), wherein the limiting flanging first (231) is fixedly connected with the top surface of the first splicing block (221), the limiting flanging first (231) is in conflict with the top surface of the upper cover main body (21), the limiting screw first (232) penetrates through the limiting flanging first (231) and is in threaded connection with the upper cover main body (21), the limiting flanging second (233) is fixedly connected with the top surface of the third splicing block (223), the limiting flanging second (233) is in conflict with the top surface of the upper cover main body (21), and the limiting screw second (234) penetrates through the limiting flanging second (233) and is in threaded connection with the upper cover main body (21).
CN202320569260.5U 2023-03-16 2023-03-16 Air inlet adjusting device of dry etching machine Active CN219513046U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202320569260.5U CN219513046U (en) 2023-03-16 2023-03-16 Air inlet adjusting device of dry etching machine

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202320569260.5U CN219513046U (en) 2023-03-16 2023-03-16 Air inlet adjusting device of dry etching machine

Publications (1)

Publication Number Publication Date
CN219513046U true CN219513046U (en) 2023-08-11

Family

ID=87547650

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202320569260.5U Active CN219513046U (en) 2023-03-16 2023-03-16 Air inlet adjusting device of dry etching machine

Country Status (1)

Country Link
CN (1) CN219513046U (en)

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