CN219496578U - Chip detection device - Google Patents
Chip detection device Download PDFInfo
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- CN219496578U CN219496578U CN202320205439.2U CN202320205439U CN219496578U CN 219496578 U CN219496578 U CN 219496578U CN 202320205439 U CN202320205439 U CN 202320205439U CN 219496578 U CN219496578 U CN 219496578U
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Abstract
The application discloses a chip detection device, wherein a circuit to be detected is arranged on a chip, the detection device comprises a detection component, and in the detection process, the detection component is electrically connected with the circuit to be detected; the observation assembly is used for observing whether the detection assembly is in physical contact with the circuit to be detected so as to form electrical connection; the light source component emits visible light to irradiate the chip so as to improve brightness, and the observation component is convenient to observe the detection component; the detection component is electrically connected with the detection component, in the detection process, the detection component generates a test current to test the circuit to be tested, in the application, the light source component is arranged, the light source component is utilized to emit visible light to irradiate the surface of the chip, the brightness in the visual field of the observation component is increased, and therefore the contact condition of the detection component and the circuit to be tested is more favorable to observation, the detection component is ensured to be electrically connected with the circuit to be tested, and further the chip test operation is favorable.
Description
Technical Field
The application belongs to the chip detection field, especially a chip detection device.
Background
The integrated circuit, or microcircuit, microchip, wafer/chip, has tiny electronic components distributed on the chip, which is the most important part of the electronic devices, and bears the functions of operation and storage, and is the core component of many electronic devices.
With the development of chip manufacturing technology, the sizes of structures such as electronic elements and circuits on the surface of a chip are smaller and smaller, and the detection difficulty is increased, so that the conventional chip detection device is difficult to ensure that the detection device is in electrical contact with the electronic elements, and the smooth performance of chip detection operation is difficult to ensure.
It should be noted that the information disclosed in the background section of the present application is only for enhancement of understanding of the general background of the present application and should not be taken as an admission or any form of suggestion that this information forms the prior art already known to a person skilled in the art.
Disclosure of Invention
The present application provides a chip detection device to solve the defects in the prior art, and provides a chip detection device with a light source assembly.
An embodiment of the present application provides a chip test device having a circuit to be tested on a chip, the test device comprising:
the detection component is electrically connected with the circuit to be detected in the detection process;
the observation assembly is used for observing whether the detection assembly is in physical contact with the circuit to be detected so as to form electrical connection;
the light source component emits visible light to irradiate the chip so as to improve brightness, and the observation component is convenient to observe the detection component;
and the detection element is electrically connected with the detection assembly, and generates a test current to test the circuit to be tested in the detection process.
The chip testing apparatus as described above, wherein the probe assembly comprises:
the first detection component is electrically connected with the input port of the circuit to be detected in the detection process;
the second detection component is electrically connected with the output port of the circuit to be detected in the detection process;
the first detection component and the second detection component are respectively and electrically connected with the detection element.
The chip detection device comprises the observation assembly, wherein the observation assembly comprises a microscope, and an objective lens of the microscope and a plane where the circuit to be detected is located form a first included angle.
The chip detection device is characterized in that the plane where the light source component and the circuit to be detected are located is provided with a second included angle, the light source component and the objective lens are coplanar, and the first included angle is equal to the second included angle.
The chip detection device as described above, wherein the light source assembly employs a parallel light source, and light emitted by the parallel light source is reflected by the surface of the chip and enters the objective lens.
The chip detection device as described above, wherein the microscope includes a first angle adjusting member for adjusting the first angle.
The chip detection device as described above, wherein the light source assembly includes a second angle adjusting member, configured to adjust the second angle.
The chip detection device is characterized in that the first angle adjusting piece and the second angle adjusting piece are both angle displacement tables.
The chip inspection apparatus as described above, wherein the observation assembly further comprises:
a camera mounted on the microscope eyepiece;
and a display connected with the camera.
Compared with the prior art, the application provides a chip detection device, wherein a circuit to be detected is arranged on a chip, the detection device comprises a detection component, and in the detection process, the detection component is electrically connected with the circuit to be detected; the observation assembly is used for observing whether the detection assembly is in physical contact with the circuit to be detected so as to form electrical connection; the light source component emits visible light to irradiate the chip so as to improve brightness, and the observation component is convenient to observe the detection component; with the detecting element that the detection subassembly electricity is connected, in the testing process, detecting element produces test current in order to test the circuit that awaits measuring, in this application, through setting up the observation subassembly, utilize the observation subassembly to observe the detection subassembly in real time, thereby can observe the contact condition of detection subassembly and circuit that awaits measuring, help the detection subassembly can form the electricity with the circuit that awaits measuring to be connected, and be provided with the light source subassembly, utilize the light source subassembly to send visible light irradiation to the chip surface, increase the luminance in the field of view of observing the subassembly, thereby be favorable to observing the contact condition of detection subassembly and circuit that awaits measuring more, thereby ensure that the detection subassembly can form the electricity with the circuit that awaits measuring and be connected, and then be favorable to the going on of chip test operation.
Drawings
Fig. 1 is a perspective view of a chip detection device provided in the present application;
FIG. 2 is a front view of FIG. 1;
fig. 3 is a schematic structural diagram of a light source assembly in a chip detection device provided by the present application.
Reference numerals illustrate:
1-workbench, 2-chip bearing area, 3-detection component, 4-bracket, 5-observation component, 6-light source component and 7-chip.
Detailed Description
The embodiments described below by referring to the drawings are exemplary only for the purpose of illustrating the present application and are not to be construed as limiting the present application.
For the purpose of making the objects, technical solutions and advantages of the embodiments of the present application more apparent, the embodiments of the present application will be described in detail below with reference to the accompanying drawings. However, as will be appreciated by those of ordinary skill in the art, in the various embodiments of the present application, numerous technical details have been set forth in order to provide a better understanding of the present application. However, the technical solutions claimed in the present application can be implemented without these technical details and with various changes and modifications based on the following embodiments. The following embodiments are divided for convenience of description, and should not be construed as limiting the specific implementation of the present application, and the embodiments may be mutually combined and referred to without contradiction.
It should be noted that the terms "first," "second," and the like in the description and claims of the present application and the above figures are used for distinguishing between similar objects and not necessarily for describing a particular sequential or chronological order. It is to be understood that the data so used may be interchanged where appropriate such that embodiments of the present application described herein may be implemented in sequences other than those illustrated or otherwise described herein. Furthermore, the terms "comprises," "comprising," and "having," and any variations thereof, are intended to cover a non-exclusive inclusion, such that a process, method, system, article, or apparatus that comprises a list of steps or elements is not necessarily limited to those steps or elements expressly listed but may include other steps or elements not expressly listed or inherent to such process, method, article, or apparatus.
The integrated circuit, or microcircuit, microchip, wafer/chip, has tiny electronic components distributed on the chip, which is the most important part of the electronic devices, and bears the functions of operation and storage, and is the core component of many electronic devices. With the development of chip manufacturing technology, the sizes of structures such as electronic elements and circuits on the surface of a chip are smaller and smaller, the detection difficulty is increased, the electrical contact between a detection device and the electronic elements is difficult to ensure by the existing chip detection device, the smooth performance of chip detection operation is difficult to ensure, an exemplary chip detection device such as a probe station is generally provided with a probe for contacting with the electronic elements on the surface of the chip, and a microscope for observing the contact process of a probe tip and the electronic elements in real time, along with the development of technology, the sizes of the electronic elements on the chip are smaller and smaller, the magnification requirement on the microscope is higher and higher, the observation field of view of the microscope is smaller, the observation requirement of the microscope is difficult to meet only by the brightness of natural light or laboratory light, and the relative position of the probe tip and the electronic elements is difficult to be captured by a microscope lens.
In view of this, the embodiment of the present application provides a chip detection device, which can ensure that the detection component can form an electrical connection with the circuit to be tested, so as to facilitate the chip testing operation.
Fig. 1 is a perspective view of a chip detection device provided in the present application;
FIG. 2 is a front view of FIG. 1;
referring to fig. 1 and fig. 2, in the chip detection device provided in the embodiment of the present application, a circuit to be detected is provided on the chip 7, and the detection device includes:
the chip test device comprises a workbench 1, wherein a chip bearing area 2 is arranged on the workbench 1, the chip bearing area 2 is positioned in the middle of the workbench 1, the chip bearing area 2 is used for placing a chip 7, and in particular implementation, in order to keep the chip 7 stable in the test process of the chip 7, a spring clip is arranged in the chip bearing area 2 so as to clip and fix the chip 7;
the detection assembly 3 is electrically connected with the circuit to be detected in the detection process, and the detection assembly 3 can be a probe, and when the detection assembly is implemented, the surface of the workbench 1 is provided with a probe seat, the probe seat comprises a probe arm for fixing the probe and a manual displacement adjusting mechanism for adjusting the probe arm, the manual displacement adjusting mechanism comprises three groups of mutually perpendicular adjusting screw rods, and the relative positions of the probe and the chip 7 can be manually adjusted by rotating the adjusting screw rods, so that the needle tip of the probe and the circuit to be detected on the chip 7 are in physical contact to realize the electrical connection of the probe and the circuit to be detected;
an observation component 5, configured to observe whether the detection component 3 is in physical contact with the circuit to be tested to form an electrical connection, and illustratively, a microscope is adopted as the observation component 5, a support 4 is provided on the workbench 1, the microscope is mounted on the support 4, a lens of the microscope faces the chip 7, and the microscope is utilized to observe whether the detection component 3 is in physical contact with the circuit to be tested to form an electrical connection;
the light source component 6 emits visible light to irradiate the chip 7 so as to improve brightness, so that the observation component 5 can observe the detection component 3 conveniently, and when the light source component 6 is mounted on the bracket 4, the light source component 6 can emit visible light to irradiate the surface of the chip 7, the visible light is reflected into a lens of a microscope through the surface of the chip 7, and the brightness in the field of view of the microscope is improved, so that the contact condition of the detection component 3 and a circuit to be detected can be observed more conveniently;
the detection element is electrically connected with the detection component 3, and in a detection process, the detection element generates a test current to test the circuit to be tested, and illustratively, one specific way is that the detection element comprises a constant current source component capable of generating the test current and an instrument component for measuring current and voltage, and when the circuit to be tested on the chip 7 is detected, the constant current source component is used for generating the test current to test the circuit to be tested.
In this embodiment, through setting up the observation subassembly 5, utilize the observation subassembly 5 to observe detection subassembly 3 in real time, thereby can observe the contact condition of detection subassembly 3 with the circuit that awaits measuring, help detection subassembly 3 can form the electricity with the circuit that awaits measuring and be connected, and be provided with light source module 6, utilize light source module 6 to send visible light irradiation to chip 7 surface, increase the luminance in the field of vision of observation subassembly 5, thereby be favorable to observing the contact condition of detection subassembly 3 with the circuit that awaits measuring more, thereby ensure that detection subassembly 3 can form the electricity with the circuit that awaits measuring and be connected, and then be favorable to the going on of chip 7 test operation.
In some embodiments of the present application, in order to facilitate testing a circuit under test, a test loop is constructed around the circuit under test, the probe assembly 3 provided in the embodiments of the present application includes:
the first detection component is electrically connected with the input port of the circuit to be detected in the detection process;
the second detection component is electrically connected with the output port of the circuit to be detected in the detection process;
the first detection component and the second detection component are respectively and electrically connected with the detection element, and a test loop is formed by using the first detection component, the circuit to be tested, the second detection component and the detection element which are sequentially connected so as to test the circuit to be tested.
Fig. 3 is a schematic structural diagram of a light source assembly 6 in a chip detection device provided in the present application.
It should be noted that, referring to fig. 3, the observation assembly 5 includes a microscope, because the probe is vertically disposed relative to the surface of the chip 7, in order to facilitate observation of the contact condition between the tip of the probe and the surface of the chip 7, the objective lens of the microscope and the plane where the circuit to be tested is located have a first included angle, and the obliquely disposed microscope can observe the tip of the probe from the side, so as to ensure that the tip of the probe contacts with the input port/output port of the circuit to be tested, and the microscope includes a first angle adjusting member for adjusting the size of the first included angle, where the first angle adjusting member adopts an angular displacement platform, and the microscope is mounted on the support 4 through the angular displacement platform, so that the size of the first included angle can be adjusted, thereby achieving the purpose of adjusting the inclination angle of the microscope.
Because the microscope's objective with the plane that awaits measuring the circuit place has first contained angle, in order to make light source module 6 can cooperate the inclination of microscope, light source module 6 with the plane that awaits measuring the circuit place has the second contained angle, light source module 6 with the objective coplane of microscope, just first contained angle with the second contained angle equals, and the visible light that light source module 6 sent projects the chip 7 surface, in this embodiment, the reflection angle of visible light is first contained angle, and the incident angle of visible light is the second contained angle, according to the reflection law of light, because the second contained angle equals with first contained angle, satisfies the condition that the reflection angle equals the incident angle, so light source module 6 sends out the visible light can get into the objective of microscope via the reflection on chip 7 surface to help improving the luminance in the microscope field of view, be convenient for observe the contact condition of detecting module 3 and await measuring the circuit, help the chip 7 test operation, light source module 6 includes second angle adjustment piece for adjust the size of second contained angle, second angle, the second angle adjustment piece adopts the second contained angle to be the first contained angle, can be adjusted the platform 6 through the displacement, can be adjusted the displacement by the second contained angle adjustment piece, can be adjusted the displacement by the platform is big that the second contained angle is small, and the displacement is enough to guarantee that the platform is big, the displacement is enough to be adjusted.
In order to further increase the brightness in the field of view of the microscope, the light source assembly 6 employs a parallel light source, and parallel light rays emitted by the parallel light source have strong directivity, and the parallel light rays emitted by the parallel light source are reflected by the surface of the chip 7 and enter the objective lens of the microscope.
In some embodiments of the present application, the observation assembly 5 further includes a camera mounted on the eyepiece of the microscope, and a display connected to the camera, and with the camera and the display, a view image in the microscope can be photographed in real time, and the photographed view image can be synchronized to the display.
In this embodiment, when the chip 7 is detected, the contact condition between the detecting component 3 and the circuit to be detected is observed in real time by using the microscope, and the relative position between the detecting component 3 and the circuit to be detected is adjusted, so that the detecting component 3 and the circuit to be detected form physical contact to realize electrical connection, the camera is utilized to shoot the view field picture in the microscope in real time, and the shot view field picture is synchronized to the display, so that the experimenter can observe the contact condition between the detecting component 3 and the circuit to be detected in real time, and the smooth performance of the chip 7 testing operation is effectively ensured.
The foregoing detailed description of the construction, features and advantages of the present application will be presented in terms of embodiments illustrated in the drawings, wherein the foregoing description is merely illustrative of preferred embodiments of the application, and the scope of the application is not limited to the embodiments illustrated in the drawings.
Claims (9)
1. A chip test device, characterized in that a chip (7) has a circuit to be tested thereon, the test device comprising:
the detection assembly (3) is electrically connected with the circuit to be detected in the detection process;
an observation assembly (5) for observing whether the detection assembly (3) is in physical contact with the circuit to be tested so as to form an electrical connection;
the light source component (6) emits visible light to irradiate the chip (7) to improve brightness, so that the observation component (5) can observe conveniently;
and a detection element electrically connected with the detection assembly (3), wherein the detection element generates a test current to test the circuit to be tested in a detection process.
2. Chip testing device according to claim 1, wherein the detection assembly (3) comprises:
the first detection component is electrically connected with the input port of the circuit to be detected in the detection process;
the second detection component is electrically connected with the output port of the circuit to be detected in the detection process;
the first detection component and the second detection component are respectively and electrically connected with the detection element.
3. Chip testing device according to claim 1, characterized in that the observation assembly (5) comprises a microscope, the objective of which has a first angle with the plane of the circuit under test.
4. A chip testing device according to claim 3, wherein the plane of the light source assembly (6) and the circuit to be tested has a second angle, the light source assembly (6) is coplanar with the objective lens, and the first angle is equal to the second angle.
5. Chip detection device according to claim 4, characterized in that the light source assembly (6) employs a parallel light source, the light rays emitted by which are reflected via the surface of the chip (7) into the objective lens.
6. The chip scale inspection apparatus according to claim 4 or 5, wherein the microscope includes a first angle adjusting member for adjusting the magnitude of the first angle.
7. The chip inspection apparatus according to claim 6, wherein the light source assembly (6) includes a second angle adjusting member for adjusting the magnitude of the second angle.
8. The chip inspection apparatus according to claim 7, wherein the first angle adjusting member and the second angle adjusting member each employ an angular displacement table.
9. The chip detection apparatus according to any one of claims 3, 4, 5, 7, 8, wherein the observation assembly (5) further comprises:
a camera mounted on the microscope eyepiece;
and a display connected with the camera.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320205439.2U CN219496578U (en) | 2023-01-31 | 2023-01-31 | Chip detection device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320205439.2U CN219496578U (en) | 2023-01-31 | 2023-01-31 | Chip detection device |
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| Publication Number | Publication Date |
|---|---|
| CN219496578U true CN219496578U (en) | 2023-08-08 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202320205439.2U Active CN219496578U (en) | 2023-01-31 | 2023-01-31 | Chip detection device |
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| CN (1) | CN219496578U (en) |
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- 2023-01-31 CN CN202320205439.2U patent/CN219496578U/en active Active
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