CN219486288U - Semiconductor plastic package die convenient to install - Google Patents
Semiconductor plastic package die convenient to install Download PDFInfo
- Publication number
- CN219486288U CN219486288U CN202320513743.3U CN202320513743U CN219486288U CN 219486288 U CN219486288 U CN 219486288U CN 202320513743 U CN202320513743 U CN 202320513743U CN 219486288 U CN219486288 U CN 219486288U
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- fixedly connected
- plate
- semiconductor plastic
- gear
- plastic package
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/10—Greenhouse gas [GHG] capture, material saving, heat recovery or other energy efficient measures, e.g. motor control, characterised by manufacturing processes, e.g. for rolling metal or metal working
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- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Abstract
The utility model relates to the technical field of semiconductor plastic packaging molds and discloses a semiconductor plastic packaging mold convenient to install, which comprises a supporting seat, wherein a supporting frame is fixedly connected to the top of the supporting seat, an electric push rod is fixedly connected to the top of the supporting frame, a top plate is fixedly connected to the lower end of the electric push rod, a bottom plate is arranged in the top plate, installation mechanisms are arranged at the top of the bottom plate and the bottom of the top plate, and a lower mold and an upper mold are respectively arranged at one side of the installation mechanism. This semiconductor plastic envelope mould convenient to installation, through the installation mechanism who sets up, the starter motor work makes the movable plate can drive the inserted block and insert to the long piece inside that corresponds to can realize further spacing to the long piece, make the long piece unable inside from the slot pull out, and then realize the installation of bed die or last mould, and can reach good installation effectiveness. The operation can be realized without the help of external tools by staff, and the practicability of the device is enhanced.
Description
Technical Field
The utility model relates to the technical field of semiconductor plastic packaging molds, in particular to a semiconductor plastic packaging mold convenient to install.
Background
The plastic package mould is a kind of plastic package mould for semiconductor integrated circuit, which belongs to the type of thermosetting plastic extruding mould with fixed feeding cavity, and has the characteristics of multiple cavity positions, high precision, long service life, etc., and is one of the necessary key technological equipment for the post-process package of semiconductor integrated circuit.
Along with the development of science and technology, semiconductor is used a plurality of fields gradually, and semiconductor integrated circuit can use plastic envelope mould at the in-process of processing production, and common plastic envelope mould just can realize installation or dismantlement purpose when installing or dismantling, but like this can not reach good work efficiency, thereby be inconvenient for the staff to operate and use, reduced the practicality of device.
Disclosure of Invention
The utility model aims to provide a semiconductor plastic package die convenient to install, so as to solve the problems in the background technology.
In order to achieve the above purpose, the present utility model provides the following technical solutions: the utility model provides a semiconductor plastic envelope mould convenient to installation, includes the supporting seat, supporting seat top fixedly connected with support frame, support frame top fixedly connected with electric putter, electric putter low side fixedly connected with roof, the roof is inside to be provided with the bottom plate, bottom plate top and roof bottom all are provided with mounting mechanism, mounting mechanism one side is provided with bed die and last mould respectively, the inside buffer gear that is provided with of supporting seat;
the installation mechanism comprises motors, the motors are provided with two, the motors are respectively fixedly connected with the top of the bottom plate and the bottom of the top plate, one side of each motor is provided with a first gear, the outer ring of each first gear is meshed with a second gear, the inner ring of each second gear is fixedly connected with a threaded rod, the outer wall of each threaded rod is in threaded connection with a movable plate, one side of each movable plate is fixedly connected with an inserting block, the top of the bottom plate and the bottom of the top plate are respectively fixedly connected with a slot, long blocks are inserted into the slots, sliding grooves are respectively fixedly connected with the top of the bottom plate and the bottom of the top plate, and limiting blocks are connected to the sliding grooves in a sliding mode.
Preferably, the output end of the motor is fixedly connected with an output shaft, the first gear is fixedly connected with the outer wall of the output shaft, and the motor is convenient to start to work, so that the threaded rod can be driven to rotate through the transmission of the first gear and the second gear.
Preferably, the threaded rod is rotatably connected to the inside of the slot, and the directions of threads on the outer walls of the two ends of the threaded rod are opposite, so that the rotary motion of the threaded rod can be converted into the linear motion of the movable plate.
Preferably, the limiting block is fixedly connected to one side of the moving plate, the four long blocks are respectively and fixedly connected to the bottom of the lower die and the top of the upper die, and the limiting block can be limited in the moving process of the moving plate, so that the moving plate can stably move.
Preferably, the slot and one side of the long block, which is close to the movable plate, are provided with sockets matched with the plug blocks, and the plug blocks are inserted into the sockets, so that the long block can not be pulled out of the slot when the plug blocks are matched with the sockets.
Preferably, the buffer mechanism comprises a friction cylinder, the friction cylinder is fixedly connected inside the supporting seat, a spring is fixedly connected to the inner wall of the friction cylinder, a circular plate is fixedly connected to the top end of the spring, and a connecting rod is fixedly connected to the top of the circular plate, so that a certain buffer purpose can be achieved in the processing process.
Preferably, the circular plate is slidably connected to the inner wall of the friction cylinder, and the top end of the connecting rod is fixedly connected with the bottom of the bottom plate, so that the bottom plate can push the circular plate to stably slide to compress the spring through the connecting rod.
Compared with the prior art, the utility model provides the semiconductor plastic package die convenient to install, which has the following beneficial effects:
1. this semiconductor plastic envelope mould convenient to installation, through the installation mechanism who sets up, the starter motor work makes the movable plate can drive the inserted block and insert to the long piece inside that corresponds to can realize further spacing to the long piece, make the long piece unable inside from the slot pull out, and then realize the installation of bed die or last mould, and can reach good installation effectiveness. The operation can be realized without the help of external tools by staff, and the practicability of the device is enhanced.
2. This semiconductor plastic envelope mould convenient to installation, through the buffer gear who sets up, the bottom plate can promote the connecting rod downwards, and the connecting rod promotes the plectane and can slide at the inner wall of friction section of thick bamboo, and the plectane also can compress the spring simultaneously to the energy conversion of vibrations is the elastic potential energy of spring, again with the friction heat energy of elastic potential energy conversion plectane, thereby can realize the purpose of friction damping shock attenuation and reduce the damage that the vibration force caused to the bed die, thereby prolonged the life of bed die to a certain extent.
Drawings
For a clearer description of the technical solutions of the embodiments of the present utility model, the drawings that are needed in the description of the embodiments will be briefly described below, it will be apparent that the drawings in the description below are only some embodiments of the present utility model, and that other drawings can be obtained according to these drawings without inventive effort for a person skilled in the art:
FIG. 1 is a front elevational view of the structure of the present utility model;
FIG. 2 is a schematic view of a portion of the structure of the mounting mechanism;
FIG. 3 is a schematic view showing the bottom view of the lower die;
fig. 4 is a partially exploded view of the cushioning mechanism.
In the figure: 1. a support base; 2. a support frame; 3. an electric push rod; 4. a lower die; 5. an upper die; 6. a top plate; 7. a bottom plate; 8. a mounting mechanism; 81. a motor; 82. a first gear; 83. a second gear; 84. a threaded rod; 85. a moving plate; 86. inserting blocks; 87. a limiting block; 88. a chute; 89. a long block; 801. a slot; 9. a buffer mechanism; 91. a friction cylinder; 92. a spring; 93. a circular plate; 94. and (5) connecting a rod.
Detailed Description
The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.
In the present utility model, unless explicitly specified and limited otherwise, the terms "mounted," "connected," "secured," and the like are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communicated with the inside of two elements or the interaction relationship of the two elements. The specific meaning of the above terms in the present utility model can be understood by those of ordinary skill in the art according to the specific circumstances.
The utility model provides the following technical scheme:
example 1
Referring to fig. 1 to 4, a semiconductor plastic package mold convenient to install comprises a supporting seat 1, wherein a supporting frame 2 is fixedly connected to the top of the supporting seat 1, an electric push rod 3 is fixedly connected to the top of the supporting frame 2, a top plate 6 is fixedly connected to the lower end of the electric push rod 3, a bottom plate 7 is arranged inside the top plate 6, installation mechanisms 8 are arranged at the top of the bottom plate 7 and the bottom of the top plate 6, a lower mold 4 and an upper mold 5 are respectively arranged at one side of the installation mechanism 8, and a buffer mechanism 9 is arranged inside the supporting seat 1;
the installation mechanism 8 comprises motors 81, the motors 81 are provided with two, the two motors 81 are fixedly connected to the top of the bottom plate 7 and the bottom of the top plate 6 respectively, one side of each motor 81 is provided with a first gear 82, the outer ring of each first gear 82 is meshed with a second gear 83, the inner ring of each second gear 83 is fixedly connected with a threaded rod 84, the outer wall of each threaded rod 84 is in threaded connection with a movable plate 85, one side of each movable plate 85 is fixedly connected with an inserting block 86, the top of the bottom plate 7 and the bottom of the top plate 6 are fixedly connected with inserting grooves 801, long blocks 89 are inserted into the inserting grooves 801, sliding grooves 88 are fixedly connected to the top of the bottom plate 7 and the bottom of the top plate 6 respectively, and limiting blocks 87 are slidably connected inside the sliding grooves 88.
Further, the output end of the motor 81 is fixedly connected with an output shaft, the first gear 82 is fixedly connected to the outer wall of the output shaft, so that the motor 81 is convenient to start to work, and the threaded rod 84 can be driven to rotate through the transmission of the first gear 82 and the second gear 83.
Further, the threaded rod 84 is rotatably connected to the slot 801, and the threads on the outer walls of the two ends of the threaded rod 84 are opposite in direction, so that the rotational movement of the threaded rod 84 can be converted into the linear movement of the moving plate 85.
Further, the limiting block 87 is fixedly connected to one side of the moving plate 85, four long blocks 89 are arranged, and the four long blocks 89 are respectively and fixedly connected to the bottom of the lower die 4 and the top of the upper die 5, so that the limiting block can be limited in the moving process of the moving plate 85, and can be stably moved.
Further, the socket 801 and the long block 89 are provided with sockets matched with the plug 86 on one side close to the movable plate 85, and the plug 86 is inserted into the socket, so that the long block 89 can not be pulled out of the socket 801 when the plug 86 and the socket are matched with each other.
Example two
Referring to fig. 1 to 4, on the basis of the first embodiment, the buffer mechanism 9 further includes a friction cylinder 91, the friction cylinder 91 is fixedly connected inside the supporting seat 1, a spring 92 is fixedly connected to an inner wall of the friction cylinder 91, a circular plate 93 is fixedly connected to a top end of the spring 92, and a connecting rod 94 is fixedly connected to a top of the circular plate 93, so that a certain buffer purpose can be achieved in a processing process.
Further, the circular plate 93 is slidably connected to the inner wall of the friction cylinder 91, and the top end of the connecting rod 94 is fixedly connected to the bottom of the bottom plate 7, so that the bottom plate 7 can push the circular plate 93 to stably slide through the connecting rod 94 to compress the spring 92.
In the actual operation process, when the device is used, when the lower die 4 or the upper die 5 is required to be installed, firstly, the corresponding long block 89 can be inserted into the corresponding slot 801 through the lower die 4 or the upper die 5, the preliminary limit of the long block 89 is realized, the motor 81 is started to work immediately, the output shaft of the motor 81 can drive the threaded rod 84 to rotate through the transmission of the first gear 82 and the second gear 83, the rotary motion of the first gear 82 can be converted into the linear motion of the movable plate 85 under the sliding limit effect of the limiting block 87 and the sliding chute 88, so that the movable plate 85 can drive the inserting block 86 to be inserted into the corresponding long block 89, further limit of the long block 89 can be realized, the long block 89 can not be pulled out from the inside of the slot 801, the installation of the lower die 4 or the upper die 5 is realized, and good installation efficiency can be realized. The operation can be realized without the help of external tools by staff, so that the practicability of the device is enhanced;
immediately after the installation of the lower die 4 and the upper die 5 is completed, the electric push rod 3 can be started to work to drive the upper die 5 to descend, so that the purpose of processing is achieved, meanwhile, a certain vibration force can be generated in the processing process, the bottom plate 7 can downwards push the connecting rod 94, the connecting rod 94 pushes the circular plate 93 to slide on the inner wall of the friction cylinder 91, meanwhile, the circular plate 93 can compress the spring 92, so that vibration energy is converted into elastic potential energy of the spring 92, and then the elastic potential energy is converted into friction heat energy of the circular plate 93, the purpose of friction damping vibration reduction can be achieved, damage to the lower die 4 caused by the vibration force is reduced, and the service life of the lower die 4 is prolonged to a certain extent.
It is noted that relational terms such as first and second, and the like are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Moreover, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising one does not exclude the presence of other like elements in a process, method, article, or apparatus that comprises an element.
Claims (7)
1. The utility model provides a semiconductor plastic envelope mould convenient to installation, includes supporting seat (1), its characterized in that: the automatic feeding device is characterized in that a supporting frame (2) is fixedly connected to the top of the supporting seat (1), an electric push rod (3) is fixedly connected to the top of the supporting frame (2), a top plate (6) is fixedly connected to the lower end of the electric push rod (3), a bottom plate (7) is arranged inside the top plate (6), mounting mechanisms (8) are arranged at the top of the bottom plate (7) and the bottom of the top plate (6), a lower die (4) and an upper die (5) are respectively arranged on one side of the mounting mechanisms (8), and a buffer mechanism (9) is arranged inside the supporting seat (1);
the mounting mechanism (8) comprises motors (81), the motors (81) are provided with two motors (81), the two motors (81) are fixedly connected to the top of the bottom plate (7) and the bottom of the top plate (6) respectively, one side of each motor (81) is provided with a first gear (82), the outer ring of each first gear (82) is meshed with a second gear (83), an inner ring of each second gear (83) is fixedly connected with a threaded rod (84), the outer wall of each threaded rod (84) is in threaded connection with a movable plate (85), one side of each movable plate (85) is fixedly connected with an inserting block (86), slots (801) are fixedly connected to the top of the bottom plate (7) and the bottom of the top plate (6), long blocks (89) are inserted into the slots (801), sliding grooves (88) are fixedly connected to the top of the bottom plate (7) and the bottom of the top plate (6), and limiting blocks (87) are connected to the sliding grooves (88) in a sliding mode.
2. The semiconductor plastic package mold convenient to install according to claim 1, wherein: the output end of the motor (81) is fixedly connected with an output shaft, and the first gear (82) is fixedly connected to the outer wall of the output shaft.
3. The semiconductor plastic package mold convenient to install according to claim 1, wherein: the threaded rod (84) is rotatably connected to the inside of the slot (801), and the threads on the outer walls of the two ends of the threaded rod (84) are opposite in direction.
4. The semiconductor plastic package mold convenient to install according to claim 1, wherein: the limiting block (87) is fixedly connected to one side of the movable plate (85), four long blocks (89) are arranged, and the four long blocks (89) are respectively and fixedly connected to the bottom of the lower die (4) and the top of the upper die (5).
5. The semiconductor plastic package mold convenient to install according to claim 1, wherein: the slot (801) and one side of the long block (89) close to the movable plate (85) are provided with sockets matched with the plug blocks (86), and the plug blocks (86) are inserted into the sockets.
6. The semiconductor plastic package mold convenient to install according to claim 1, wherein: the buffer mechanism (9) comprises a friction cylinder (91), the friction cylinder (91) is fixedly connected inside the supporting seat (1), a spring (92) is fixedly connected to the inner wall of the friction cylinder (91), a circular plate (93) is fixedly connected to the top end of the spring (92), and a connecting rod (94) is fixedly connected to the top of the circular plate (93).
7. The semiconductor plastic package mold convenient to mount according to claim 6, wherein: the circular plate (93) is connected to the inner wall of the friction cylinder (91) in a sliding manner, and the top end of the connecting rod (94) is fixedly connected with the bottom of the bottom plate (7).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320513743.3U CN219486288U (en) | 2023-03-16 | 2023-03-16 | Semiconductor plastic package die convenient to install |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320513743.3U CN219486288U (en) | 2023-03-16 | 2023-03-16 | Semiconductor plastic package die convenient to install |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219486288U true CN219486288U (en) | 2023-08-08 |
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ID=87480404
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202320513743.3U Active CN219486288U (en) | 2023-03-16 | 2023-03-16 | Semiconductor plastic package die convenient to install |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN219486288U (en) |
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2023
- 2023-03-16 CN CN202320513743.3U patent/CN219486288U/en active Active
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