CN219478004U - Electronic equipment - Google Patents

Abstract

The embodiment of the application discloses electronic equipment; the electronic device includes: the device comprises a frame body, a screen and an acoustic module; the screen cover is arranged on the frame body, a sound guide channel is formed between the screen cover and the frame body, a micro-slit sound outlet hole is formed between the frame body and the screen, and the sound guide channel is in acoustic communication with the micro-slit sound outlet hole; the acoustic module is arranged in the frame body; the area of the frame body corresponding to the acoustic module is provided with at least one sound hole, the at least one sound hole covers one side of the acoustic module, and the acoustic module is communicated with the sound guide channel through the at least one sound hole.

Description

Electronic equipment

Technical Field

The application belongs to the technical field of terminals, and particularly relates to electronic equipment.

Background

Among many types of electronic products, smart phones have become an indispensable item in human life and work, taking as an example. Along with the rapid development of technology, the user has higher and higher experience requirements when using the mobile phone, so that the appearance of the mobile phone is required to be simpler, and the original performance cannot be lost. Taking the design of the phone-on-phone sound guide structure of the smart phone as an example, in the related technology, a phone cover is generally required to be added for guiding sound, and on the basis of the added phone-on sound guide structure, the outgoing sound Kong Kaishe is arranged on the phone cover. However, this approach not only increases the cost of the receiver cover, but also increases the difficulty of assembly and sacrifices maintainability.

Disclosure of Invention

The application aims to provide electronic equipment, and solves the problems of increased manufacturing cost and high assembly difficulty caused by introducing a receiver cover into the electronic equipment.

In order to solve the technical problems, the application is realized as follows:

the embodiment of the application provides electronic equipment, which comprises:

a frame;

the screen is covered on the frame body, a sound guide channel is formed between the screen and the frame body, a micro-slit sound outlet hole is formed between the frame body and the screen, and the sound guide channel is in acoustic communication with the micro-slit sound outlet hole;

the acoustic module is arranged in the frame body;

the area of the frame body corresponding to the acoustic module is provided with at least one sound hole, the at least one sound hole covers one side of the acoustic module, and the acoustic module is communicated with the sound guide channel through the at least one sound hole.

In the embodiment of the application, the electronic equipment is provided, the sound guiding structure of the acoustic module, namely the sound hole, is directly arranged on the frame body to play a role in guiding sound, and a receiver cover is not required to be additionally arranged, so that the receiver cover is omitted, the sound outlet effect and the appearance expressive force of the micro-seam sound outlet hole are ensured, and the audio performance is improved; in addition, the scheme provided by the embodiment of the application is beneficial to reducing the production and manufacturing cost of the electronic equipment due to the fact that the receiver cover is omitted.

Drawings

The foregoing and/or additional aspects and advantages of the present application will become apparent and readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings, wherein:

fig. 1 is one of external structural schematic diagrams of an electronic device provided according to an embodiment of the present application;

fig. 2 is a schematic diagram of an internal front-back structure of an electronic device according to an embodiment of the present application;

fig. 3 is one of schematic internal structures of an electronic device according to an embodiment of the present application;

FIG. 4 is a second schematic diagram of an internal structure of an electronic device according to an embodiment of the present application;

fig. 5 is a schematic view of a partial structure of an electronic device according to an embodiment of the present application;

FIG. 6 is an exploded schematic view of the structure shown in FIG. 5;

fig. 7 is a sound emission schematic diagram of an acoustic module of an electronic device according to an embodiment of the present application;

FIG. 8 is a schematic view of a use state of a mold pellet provided according to an embodiment of the present application;

FIG. 9 is a schematic view of the structure of the mold bullet of FIG. 8;

fig. 10 is a schematic structural view of a dust-proof foam assembly provided according to an embodiment of the present application.

Reference numerals:

1. micro-slit sound outlet holes; 2. a groove; 3. an acoustic aperture; 4. a dust-proof foam assembly; 401. a third gum layer; 402. a dust screen; 403. a first gum layer; 404. a support layer; 405. a second gum layer; 406. a sealing layer; 407. a fourth gum layer; 5. an acoustic module; 6. a circuit board; 7. a frame; 8. a screen; 9. a sound guide channel; 10. a die spring block; 1001. an elastic member; 11. and (5) back glue.

Detailed Description

Reference will now be made in detail to embodiments of the present application, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to like or similar elements or elements having like or similar functionality throughout. The embodiments described below by referring to the drawings are exemplary only for the purpose of explaining the present application and are not to be construed as limiting the present application. All other embodiments, which can be made by one of ordinary skill in the art based on the embodiments herein without making any inventive effort, are intended to be within the scope of the present application.

The features of the terms "first", "second", and the like in the description and in the claims of this application may be used for descriptive or implicit inclusion of one or more such features. In the description of the present application, unless otherwise indicated, the meaning of "a plurality" is two or more. Furthermore, in the description and claims, "and/or" means at least one of the connected objects, and the character "/", generally means that the associated object is an "or" relationship.

In the description of the present application, it should be understood that the terms "center," "longitudinal," "transverse," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," "circumferential," etc. indicate orientations or positional relationships based on the orientations or positional relationships illustrated in the drawings, are merely for convenience in describing the present application and simplifying the description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be configured and operated in a particular orientation, and therefore should not be construed as limiting the present application.

In the description of the present application, it should be noted that, unless explicitly specified and limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be either fixedly connected, detachably connected, or integrally connected, for example; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the terms in this application will be understood by those of ordinary skill in the art in a specific context.

An electronic device provided according to an embodiment of the present application is further described below with reference to fig. 1 to 10.

According to the electronic device provided by the embodiment of the application, the electronic device may be, for example, a smart phone, and the scheme provided by the embodiment of the application is described below by taking the smart phone as an example. The smart phone provided by the embodiment of the application has a concise appearance, can ensure the appearance expressive force of the micro-slit sound outlet holes, and can ensure the audio quality.

Referring to fig. 1 to 4, an electronic device provided in an embodiment of the present application includes: a frame 7, a screen 8 and an acoustic module 5. The screen 8 is covered on the frame 7, a sound guide channel 9 is formed between the screen 8 and the frame 7, a micro-gap sound outlet hole 1 is formed between the frame 7 and the screen 8, and the sound guide channel 9 is in acoustic communication with the micro-gap sound outlet hole 1; the acoustic module 5 is arranged in the frame 7; the area of the frame 7 corresponding to the acoustic module 5 is provided with at least one acoustic hole 3, the at least one acoustic hole 3 covers one side of the acoustic module 5, and the acoustic module 5 is communicated with the sound guide channel 9 through the at least one acoustic hole 3.

According to the electronic device provided in the above embodiment of the present application, the micro-slit sound outlet 1 is formed between the frame 7 and the screen 8 of the electronic device, see fig. 1. Specifically, taking the smart phone as an example, a micro-slit sound outlet hole 1 is formed in the joint of the top frame, close to the camera, of the smart phone and the screen 8, and the design of the micro-slit sound outlet hole 1 plays a role in hiding the appearance effect of the receiver sound outlet hole, and meanwhile, the requirement of the tone quality effect of audio frequency can be met.

Referring to fig. 7, when the acoustic module 5 in the smart phone emits sound, the sound passes through the at least one sound hole 3 (referring to fig. 2, a plurality of sound holes 3 are shown) on the frame 7, and the screen 8 is erected on one side of the frame 7, so that a sound guiding channel 9 is formed therebetween, and the sound can pass through the sound guiding channel 9 and then be output through the micro-slit sound outlet hole 1, thereby realizing normal sound output of the electronic device.

The screen 8 is, for example, a touch screen, which is not limited in the embodiment of the present application.

The screen 8 may be fixed to one side of the frame 7 by, for example, adhesive bonding with a back adhesive 11, see fig. 4 and 5.

According to the embodiment of the application, the electronic device is provided, the sound hole 3 of the acoustic module 5 is directly arranged on the frame body 7 to achieve the sound guiding effect, a receiver cover is not required to be additionally arranged, the receiver cover is canceled, and the sound outlet effect and the appearance expressive force of the micro-seam sound outlet hole 1 are guaranteed, so that the audio performance is improved. In addition, the scheme provided by the embodiment of the application is beneficial to reducing the production and manufacturing cost of the electronic equipment due to the fact that the receiver cover is omitted.

In the scheme provided by the embodiment of the application, the design of the receiver cover is completely omitted, and the production of the receiver cover also needs independent die sinking production, so that the whole process is complex and the production cost is high.

The electronic equipment that this application embodiment provided need not extra design receiver cover to the sound of acoustic module 5, can directly be in through the mould with a plurality of sound holes 3 processing come out on the framework 7. Wherein, through the mode of adjusting the aperture, not only can keep acoustical communication, also can avoid the dust to get into. The whole process is simpler, and the production cost is not increased.

Wherein a plurality of sound holes 3 are directly machined in the frame 7, the plurality of sound holes 3 are arranged in a target array on the frame 7, for example, and all sound holes 3 should be located close to the sound emitting side of the acoustic module 5, see fig. 2.

Specifically, referring to fig. 2, for the acoustic module 5, a plurality of acoustic holes 3 provided therein may be provided in two areas, for example, in a daily shape. It should be noted that, in the embodiment of the present application, the arrangement manner of the plurality of sound holes 3 is not limited, and the structure shown in fig. 2 is only an example, and may be actually adjusted according to the needs.

The sound guide channel 9 is located between the sound hole 3 and the micro-slit sound outlet hole 1, and plays a role in acoustic conduction.

In addition, in the embodiment of the present application, the number and shape of the sound holes 3 are not limited, and may be adjusted according to the specific situation.

In some examples of the present application, referring to fig. 2 and 3, the frame 7 includes a frame and a bearing portion disposed on an inner side of the frame, the micro-slit sound hole 1 is located between the frame and the screen 8, and the bearing portion at least partially corresponds to the micro-slit sound hole 1. The at least one sound hole 3 is formed in the bearing part corresponding to the acoustic module 5.

The bearing part is formed by extending the frame towards the inside of the electronic equipment. In the embodiment of the present application, the recess 2 is designed to be located on the carrier.

Optionally, a groove 2 is disposed on the bearing portion, and the groove 2 is located between the micro-slit sound outlet 1 and the at least one sound hole 3.

According to the electronic device provided by the embodiment of the application, a certain interval is arranged between the micro-slit sound outlet hole 1 and the at least one sound hole 3, and a groove 2 for storing dust can be formed in the interval.

In particular, a special dust-proof structure, i.e. the above-mentioned recess 2, may be provided inside the electronic device, in particular between the micro-slit sound outlet opening 1 and the at least one sound opening 3. Therefore, when dust enters from the micro-slit sound outlet hole 1, the dust can fall into the groove 2, so that the dust is prevented from directly falling into the acoustic module 5 from the micro-slit sound outlet hole 1.

According to the above example of the present application, the sound hole 3 is directly formed on the frame 7, which plays a role of guiding sound, and the recess 2 is provided inside as an ash storage groove, which can play a role of dust prevention of the acoustic module 5. That is, the electronic device provided by the embodiment of the application, when canceling the receiver cover, further improves the dustproof effect, ensures the appearance expressive force of the micro-slit sound outlet 1, improves the audio performance, and reduces the cost. The appearance and the performance of the electronic equipment are both achieved.

Optionally, the grooves 2 are provided in plurality and are disposed at intervals between the micro-slit sound outlet holes 1 and the at least one sound hole 3, and the grooves 2 are used for accommodating dust entering the electronic device through the micro-slit sound outlet holes 1.

As a more preferable mode in this application, see fig. 2 and 3, a recess 2 for hiding ash can be set up to 2 ~ 3, and be the layer by layer setting between micro-slit play sound hole 1 with at least one sound hole 3, can accomodate the dust layer by layer like this, better promotion dustproof effect. And the design of 2-3 grooves does not occupy too much space.

Wherein the aperture of the sound hole 3 is 0.4 mm-0.55 mm.

In the embodiment of the application, the sound hole 3 is directly formed on the frame 7 through a die, and the diameter of the sound hole 3 is designed to be 0.4 mm-0.55 mm, for example, in the size range, so that good sound guiding effect can be ensured, and dust and fine impurities can be prevented from entering.

Wherein the sound holes 3 are, for example, circular holes.

When the hole diameter of the sound hole 3 is smaller than 0.4mm, not only is the Yu Dao sound disadvantageous, but also the mold is not easy to process. And when the hole diameter of the sound hole 3 is larger than 0.55mm, the hole diameter is too large, and dust is easily entered.

For example, the aperture of the sound hole 3 is 0.4mm, 0.45mm, 0.5mm and 0.55mm.

In addition, the number of the sound holes 3 can be flexibly designed according to the needs, and the number of the sound holes is not limited in the application.

In some examples of the application, the at least one acoustic hole 3 is directly formed in a target area corresponding to the acoustic module 5 on the bearing part through a die bullet 10 when the frame body is formed through a die; the mold bullet 10 includes a base, and an elastic member 1001 is embedded in an end of the base away from the frame 7, and the mold bullet 10 is used for propping up the target area during demolding.

That is, the at least one sound hole 3 may be formed directly in the target area on the carrier portion, for example, by a mold. The elastic member 1001 is, for example, a spring.

In the above example, the mold is in a top-bottom mold closing structure, and the mold elastic block 10 is disposed in the mold, specifically in the lower mold. The mold may be used to form at least one sound hole 3 in a target area of the frame 7. Since the sound holes 3 may have a lot of holes and are very dense, if the sound holes are normally ejected according to a common die, the sound holes are pulled and deformed, and meanwhile, the sound holes are easy to be ejected.

In order to solve the problem, in the present application, when forming the sound structure, a mold bullet 10 is designed for the mold, and an elastic piece 1001 is arranged in the tail of the mold bullet 10, and when the mold bullet 10 is molded by compression molding, the overpressure between the mold bullet 10 and the target area is 0.05 mm-0.1 mm; during demolding, the mold elastic block 10 has a strand of elastic force to fix the target area, so that the problems that the sound outlet is deformed in a pulling way and the sound outlet is easy to break out can be effectively solved.

In some examples of the present application, referring to fig. 4 to 6, the acoustic module 5 is adhesively fixed to the frame 7 by the dust-proof foam assembly 4.

Optionally, referring to fig. 10, the dust-proof foam assembly 4 includes a dust-proof net 402, a supporting layer 404 and a sealing layer 406 that are stacked, the dust-proof net 402 and the supporting layer 404 are adhered and fixed by a first adhesive-backed layer 403, the supporting layer 404 and the sealing layer 406 are adhered and fixed by a second adhesive-backed layer 405, a third adhesive-backed layer 401 is disposed on a side, facing away from the supporting layer 404, of the dust-proof net 402, and a fourth adhesive-backed layer 407 is disposed on a side, facing away from the supporting layer 404, of the sealing layer 406.

According to the above-described example of the present application, referring to fig. 4 and 5, the screen 8 may be attached to one side of the frame 7 and cover the cover side of the frame 7, for example, by back-bonding. And the frame 7 is provided with the sound hole 3 and the groove 2 after being processed by a mould. The dustproof foam component 4 is a composite film material, and is formed by stacking the third adhesive layer 401, the dustproof net 402, the first adhesive layer 403, the supporting layer 404, the second adhesive layer 405, the sealing layer 406 and the fourth adhesive layer 407 from top to bottom.

The dustproof foam component 4 is a composite film material, and the dustproof net 402 can play a role in two-channel dust prevention; the third and fourth back adhesive layers 401 and 407 on the surface layer can serve to fix the whole acoustic module 5 on the frame 7 in an adhesive manner, and can also raise the acoustic module 5; in addition, the sealing layer can play a role in sealing and preventing sound leakage.

The material of the supporting layer 404 is, for example, PET material, and the material of the sealing layer 406 is, for example, foam material.

The supporting layer 404 is made of a PET material with a certain hardness, which is beneficial to improving the strength of the whole dustproof foam assembly 4 and can play a stable supporting role.

The sealing layer 406 may be made of, for example, a foam material. For example, the sealing layer 406 is formed by compression molding a foam material layer in the thickness direction.

The foam material has wide sources and easy compression, plays a sealing role after being compressed in the thickness direction, has lighter weight and does not increase the weight.

The dustproof foam assembly 4 is adhered and fixed to the frame 7 through the third adhesive back layer 401, and the dustproof foam assembly 4 is adhered and fixed to the acoustic module 5 through the fourth adhesive back layer 407.

That is, the acoustic module 5 and the frame 7 may be connected by means of adhesive fixation. The connecting mode has low cost, better firmness and simple operation.

In some examples of the present application, the acoustic module 5 includes a receiver on which a first electrical contact is provided; referring to fig. 5 and 6, the electronic device further includes a circuit board 6, and a second electrical contact is disposed on the circuit board 6, where the receiver is electrically connected to the circuit board 6 when the second electrical contact is in contact with the first electrical contact.

That is, the receiver itself carries electrical contacts which can make contact with a circuit board 6 (motherboard) within the electronic device to form an electrical connection.

It should be noted that, the electronic device provided in the embodiment of the present application includes, but is not limited to, smart phones, and other forms of electronic devices, for example, tablet computers, notebook computers, navigator or wearable devices, where specific types of electronic devices are not limited in the embodiment of the present application.

In the description of the present specification, reference to the terms "one embodiment," "some embodiments," "illustrative embodiments," "examples," "specific examples," or "some examples," etc., means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the present application. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiments or examples. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

While embodiments of the present application have been shown and described, it will be understood by those of ordinary skill in the art that: many changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the application, the scope of which is defined by the claims and their equivalents.

Claims (10)

1. An electronic device, comprising:

a frame (7);

the screen (8), the said screen (8) covers and locates the said frame body (7), and form the leading sound channel (9) with the said frame body (7), there are micro-gap sound outlet holes (1) between said frame body (7) and said screen (8), the said leading sound channel (9) communicates with said micro-gap sound outlet holes (1) acoustics;

the acoustic module (5) is arranged in the frame body (7);

the area of the frame body (7) corresponding to the acoustic module (5) is provided with at least one sound hole (3), the at least one sound hole (3) covers one side of the acoustic module (5), and the acoustic module (5) is communicated with the sound guide channel (9) through the at least one sound hole (3).

2. The electronic device according to claim 1, characterized in that the frame (7) comprises a border and a bearing part arranged inside the border, the micro-slit sound outlet (1) is positioned between the border and the screen (8), and the bearing part corresponds at least partially to the micro-slit sound outlet (1);

the at least one sound hole (3) is arranged on the bearing part corresponding to the acoustic module (5).

3. Electronic device according to claim 2, characterized in that a recess (2) is provided on the carrier part, and that the recess (2) is located between the micro-slit sound outlet opening (1) and the at least one sound opening (3).

4. An electronic device according to claim 3, characterized in that the grooves (2) are provided in a plurality and are arranged at intervals between the micro-slit sound outlet holes (1) and the at least one sound hole (3), the grooves (2) being adapted to receive dust entering the electronic device via the micro-slit sound outlet holes (1).

5. The electronic device according to claim 2, characterized in that the at least one sound hole (3) is formed directly in the target area corresponding to the acoustic module (5) on the carrier part by means of a mould bullet (10) when the frame is moulded;

the die elastic block (10) comprises a base body, an elastic piece (1001) is embedded in one end of the base body far away from the frame body (7), and the die elastic block (10) is used for propping up the target area when the die is ejected.

6. The electronic device according to claim 1, characterized in that the acoustic module (5) is adhesively secured to the frame (7) by means of a dust-proof foam assembly (4).

7. The electronic device according to claim 6, wherein the dust-proof foam assembly (4) comprises a dust-proof screen (402), a supporting layer (404) and a sealing layer (406) which are stacked, the dust-proof screen (402) and the supporting layer (404) are adhered and fixed through a first adhesive-backed layer (403), the supporting layer (404) and the sealing layer (406) are adhered and fixed through a second adhesive-backed layer (405), a third adhesive-backed layer (401) is arranged on one side, facing away from the supporting layer (404), of the dust-proof screen (402), and a fourth adhesive-backed layer (407) is arranged on one side, facing away from the supporting layer (404), of the sealing layer (406).

8. The electronic device of claim 7, wherein the sealing layer (406) is compression molded in a thickness direction using a foam material layer.

9. The electronic device according to claim 7, characterized in that the dust-proof foam assembly (4) is adhesively fixed with the frame (7) by the third backing adhesive layer (401), and the dust-proof foam assembly (4) is adhesively fixed with the acoustic module (5) by the fourth backing adhesive layer (407).

10. The electronic device according to any of the claims 1-9, characterized in that the acoustic module (5) comprises a receiver, on which a first electrical contact is arranged;

the electronic device further comprises a circuit board (6), a second electric contact point is arranged on the circuit board (6), and the receiver is electrically conducted with the circuit board (6) under the condition that the second electric contact point and the first electric contact point are in contact with each other.