CN219476664U - IC carrier plate convenient for positioning and mounting chip - Google Patents
IC carrier plate convenient for positioning and mounting chip Download PDFInfo
- Publication number
- CN219476664U CN219476664U CN202320410784.XU CN202320410784U CN219476664U CN 219476664 U CN219476664 U CN 219476664U CN 202320410784 U CN202320410784 U CN 202320410784U CN 219476664 U CN219476664 U CN 219476664U
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- positioning
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
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Abstract
The IC carrier plate comprises a carrier plate main body and a positioning assembly, wherein the positioning assembly comprises a positioning frame, a transverse positioning rule and a longitudinal positioning rule, the positioning frame is sleeved on the outer side of the carrier plate main body, the transverse positioning rule is embedded on one long edge of the positioning frame, and the longitudinal positioning rule is embedded on one short edge of the positioning frame; the positioning frame is also provided with a plurality of transverse positioning grooves and longitudinal positioning grooves respectively; two ends of the transverse positioning ruler can be embedded in the transverse positioning groove, and two ends of the longitudinal positioning ruler can be embedded in the longitudinal positioning groove; and a plurality of embedded grooves are formed in the transverse positioning ruler and the longitudinal positioning ruler. According to the utility model, the positioning assembly is arranged on the outer side of the IC carrier plate, and the positioning assembly is used for positioning the coordinates of the bonding pad, so that the chip can be welded on the bonding pad more accurately, and the quality or the poor function of the IC carrier plate caused by the welding deviation of the chip is avoided; the utility model has strong practicability and has stronger popularization significance.
Description
Technical Field
The utility model relates to a PCB, in particular to an IC carrier plate convenient for positioning and mounting a chip.
Background
The IC carrier board, i.e. the packaging substrate, is developed on the basis of the HDI board, is a technical innovation suitable for the rapid development of the electronic packaging technology, and has the excellent characteristics of high density, high precision, high performance, miniaturization, light weight and the like. The IC carrier plate is used as a core material for chip packaging, on one hand, the chip can be protected, fixed and supported, the heat conduction and heat dissipation performance of the chip is enhanced, the chip is not damaged physically, on the other hand, the upper layer of the packaging substrate is connected with the chip, and the lower layer of the packaging substrate is connected with the printed circuit board, so that the functions of electric and physical connection, power distribution, signal distribution, communication between the inside of the chip and an external circuit and the like are realized.
Usually, the IC carrier is soldered and fixed on the bonding pad by soldering, but the chip and the bonding pad are always offset during soldering, so that the electrical connection between the chip and the IC carrier is affected, and even the IC carrier may be damaged and scrapped.
Disclosure of Invention
Based on this, it is necessary to provide an IC carrier board that facilitates positioning and mounting of chips, in view of the deficiencies in the prior art.
The utility model provides an IC carrier plate convenient to chip location installation, includes carrier plate main part and locating component, locating component includes a locating frame, horizontal location chi and vertical location chi, the carrier plate main part outside is located to the locating frame cover, horizontal location chi gomphosis is on a long edge of locating frame, vertical location chi gomphosis is on a minor face of locating frame. The positioning frame is also provided with a plurality of transverse positioning grooves and longitudinal positioning grooves respectively, wherein the transverse positioning grooves are symmetrically distributed on two short sides of the positioning frame, and the longitudinal positioning grooves are symmetrically distributed on two long sides of the positioning frame. The two ends of the transverse positioning ruler can be embedded in the transverse positioning groove, and the two ends of the longitudinal positioning ruler can be embedded in the longitudinal positioning groove. The transverse positioning ruler and the longitudinal positioning ruler are respectively provided with a plurality of embedded grooves, and the embedded grooves on the transverse positioning ruler can be mutually engaged and assembled with the embedded grooves on the longitudinal positioning ruler.
Further, a long side and a short side of the positioning frame are provided with a transverse limiting long hole and a longitudinal limiting long hole in a distributed mode, and the transverse limiting long hole and the longitudinal limiting long hole are correspondingly communicated with a plurality of transverse positioning grooves and longitudinal positioning grooves respectively. The positioning frame is also provided with a transverse limiting pin and a longitudinal limiting pin, and the transverse limiting pin and the longitudinal limiting pin are respectively arranged in the transverse limiting long hole and the longitudinal limiting long hole in a penetrating mode. And one ends of the transverse positioning ruler and the longitudinal positioning ruler are respectively provided with a limiting lock hole.
Further, the edge of the carrier plate main body is provided with an annular step, the positioning frame is embedded on the annular step, and the bottoms of the transverse positioning groove and the longitudinal positioning groove are flush with the upper end face of the carrier plate main body.
Further, the side face of the carrier plate main body is also provided with a plurality of heat dissipation through holes penetrating through the front and rear parts.
Further, a plurality of mounting through holes penetrating up and down are further formed in four corners of the annular step.
In summary, the IC carrier board of the present utility model has the beneficial effects that: the positioning assembly is arranged on the outer side of the IC carrier plate, and the positioning assembly is used for positioning the coordinates of the bonding pad, so that the chip can be welded on the bonding pad more accurately, and the quality or the poor function of the IC carrier plate caused by the welding deviation of the chip is avoided; the side surface of the IC carrier plate is provided with the heat dissipation through holes, so that the heat dissipation effect of the IC carrier plate can be greatly improved; the utility model has strong practicability and has stronger popularization significance.
Drawings
FIG. 1 is a schematic diagram of an IC carrier for facilitating chip positioning and mounting according to the present utility model;
FIG. 2 is a schematic view of the structure of the use state of FIG. 1;
FIG. 3 is an exploded view of FIG. 1;
fig. 4 is an exploded view of the positioning assembly of fig. 3.
Detailed Description
In order to make the objects, technical solutions and advantages of the present utility model more apparent, the present utility model will be described in further detail with reference to the accompanying drawings and examples. It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the scope of the utility model.
As shown in fig. 1 to 4, the present utility model provides an IC carrier 100 for positioning and mounting a chip, which includes a carrier main body 10 and a positioning assembly 20, wherein the positioning assembly 20 includes a positioning frame 21, a transverse positioning rule 22 and a longitudinal positioning rule 23, the positioning frame 21 is sleeved outside the carrier main body 10, the transverse positioning rule 22 is embedded on one long side of the positioning frame 21, and the longitudinal positioning rule 23 is embedded on one short side of the positioning frame 21.
The positioning frame 21 is further provided with a plurality of transverse positioning grooves 211 and longitudinal positioning grooves 212, wherein the transverse positioning grooves 211 are symmetrically distributed on two short sides of the positioning frame 21, and the longitudinal positioning grooves 212 are symmetrically distributed on two long sides of the positioning frame 21. Both ends of the lateral positioning rule 22 may be engaged with the lateral positioning groove 211, and both ends of the longitudinal positioning rule 23 may be engaged with the longitudinal positioning groove 212. The transverse positioning rule 22 and the longitudinal positioning rule 23 are respectively provided with a plurality of jogging grooves 221, and the jogging grooves 221 on the transverse positioning rule 22 can be mutually meshed and assembled with the jogging grooves 221 on the longitudinal positioning rule 23.
When the chip and the bonding pad on the carrier plate main body 10 are required to be aligned, only the transverse positioning rule 22 and the longitudinal positioning rule 23 on the positioning frame 21 are required to be taken out and then are respectively embedded into the corresponding transverse positioning groove 211 and the corresponding longitudinal positioning groove 212, and the joint of the transverse positioning rule 22 and the longitudinal positioning rule 23 is the coordinate of the bonding pad. When the chip is welded and installed, only two adjacent edges of the chip are tightly pressed down with the lateral sides of the transverse positioning ruler 22 and the longitudinal positioning ruler 23, so that accurate alignment with the bonding pads can be ensured.
The lateral sides of one long side and one short side of the positioning frame 21 are provided with a transverse limiting long hole 213 and a longitudinal limiting long hole 214, and the transverse limiting long hole 213 and the longitudinal limiting long hole 214 are correspondingly communicated with a plurality of transverse positioning grooves 211 and longitudinal positioning grooves 212 respectively. The positioning frame 21 is further provided with a transverse limiting pin 24 and a longitudinal limiting pin 25, and the transverse limiting pin 24 and the longitudinal limiting pin 25 are respectively inserted into the transverse limiting slot 213 and the longitudinal limiting slot 214. One end of the transverse positioning ruler 22 and one end of the longitudinal positioning ruler 23 are respectively provided with a limiting lock hole 222. The limiting pin and the limiting long hole can limit and lock the transverse positioning ruler 22 or the longitudinal positioning ruler 23, so that the phenomenon that the sliding of the transverse positioning ruler 22 or the longitudinal positioning ruler 23 in the transverse positioning groove 211 or the longitudinal positioning groove 212 influences the positioning and mounting operation of the chip is avoided.
The edge of the carrier plate body 10 is provided with an annular step 11, the positioning frame 21 is embedded on the annular step 11, and the bottoms of the transverse positioning groove 211 and the longitudinal positioning groove 212 are flush with the upper end surface of the carrier plate body 10. The annular step 11 enables the positioning frame 21 to be better embedded on the carrier plate main body 10. The side surface of the carrier plate main body 10 is also provided with a plurality of heat dissipation through holes 12 penetrating front and back. And a plurality of mounting through holes 13 penetrating up and down are further formed in four corners of the annular step 11. The heat dissipation through hole 12 can accelerate the heat dissipation efficiency of the IC carrier, and the mounting through hole 13 can fix the IC carrier with other products more conveniently.
When the utility model is used, the carrier plate main body 10 and the positioning frame 21 are assembled, and then the transverse positioning ruler 22 and the longitudinal positioning ruler 23 are taken off from the positioning frame 21. The limit pin is then pulled out from the limit slot hole, so that the positioning ruler can be smoothly embedded into the positioning groove of the positioning frame 21. After the positioning rule is embedded, the limiting pin is reset to form limiting locking on the positioning rule. The two crisscross positioning rules can accurately position the coordinates of the bonding pads on the carrier plate main body 10, and the mounting and positioning accuracy of the chip can be ensured only by tightly adhering the two adjacent edges of the chip to the side edges of the two positioning rules when the chip is welded. Finally, all the chips are welded and mounted on the carrier plate main body 10, and then the positioning assembly 20 is removed from the carrier plate main body 10.
In summary, the IC carrier 100 of the present utility model has the following advantages: the positioning assembly 20 is arranged on the outer side of the IC carrier plate, and the positioning assembly 20 is used for positioning the welding disc seat marks, so that the chip can be welded on the welding disc more accurately, and the quality or the poor function of the IC carrier plate caused by the welding deviation of the chip is avoided; the side surface of the IC carrier plate is provided with the heat dissipation through holes 12, so that the heat dissipation effect of the IC carrier plate can be greatly improved; the utility model has strong practicability and has stronger popularization significance.
The above examples illustrate only one embodiment of the utility model, which is described in more detail and is not to be construed as limiting the scope of the utility model. It should be noted that variations and modifications can be made by those skilled in the art without departing from the inventive concept, which fall within the scope of the utility model. Accordingly, the scope of the utility model should be determined from the following claims.
Claims (5)
1. An IC carrier plate convenient for positioning and mounting a chip, which is characterized in that: the positioning assembly comprises a positioning frame, a transverse positioning ruler and a longitudinal positioning ruler, wherein the positioning frame is sleeved on the outer side of the carrier plate body, the transverse positioning ruler is embedded on one long side of the positioning frame, and the longitudinal positioning ruler is embedded on one short side of the positioning frame; the positioning frame is also provided with a plurality of transverse positioning grooves and longitudinal positioning grooves respectively, wherein the transverse positioning grooves are symmetrically distributed on two short sides of the positioning frame, and the longitudinal positioning grooves are symmetrically distributed on two long sides of the positioning frame; two ends of the transverse positioning ruler can be embedded in the transverse positioning groove, and two ends of the longitudinal positioning ruler can be embedded in the longitudinal positioning groove; the transverse positioning ruler and the longitudinal positioning ruler are respectively provided with a plurality of embedded grooves, and the embedded grooves on the transverse positioning ruler can be mutually engaged and assembled with the embedded grooves on the longitudinal positioning ruler.
2. The IC carrier for facilitating chip placement and mounting as defined in claim 1, wherein: the lateral sides of one long side and one short side of the positioning frame are provided with a transverse limiting long hole and a longitudinal limiting long hole, and the transverse limiting long hole and the longitudinal limiting long hole are correspondingly communicated with a plurality of transverse positioning grooves and longitudinal positioning grooves respectively; the positioning frame is also provided with a transverse limiting pin and a longitudinal limiting pin, and the transverse limiting pin and the longitudinal limiting pin are respectively penetrated into the transverse limiting long hole and the longitudinal limiting long hole; and one ends of the transverse positioning ruler and the longitudinal positioning ruler are respectively provided with a limiting lock hole.
3. The IC carrier for facilitating chip placement and mounting as defined in claim 1, wherein: the edge of the carrier plate main body is provided with an annular step, the positioning frame is embedded on the annular step, and the bottoms of the transverse positioning groove and the longitudinal positioning groove are all flush with the upper end face of the carrier plate main body.
4. The IC carrier for facilitating chip placement and mounting as defined in claim 1, wherein: the side of the carrier plate main body is also provided with a plurality of heat dissipation through holes penetrating front and back.
5. The IC carrier for facilitating chip placement and mounting as defined in claim 3, wherein: and a plurality of mounting through holes penetrating up and down are further formed in four corners of the annular step.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320410784.XU CN219476664U (en) | 2023-03-07 | 2023-03-07 | IC carrier plate convenient for positioning and mounting chip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320410784.XU CN219476664U (en) | 2023-03-07 | 2023-03-07 | IC carrier plate convenient for positioning and mounting chip |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219476664U true CN219476664U (en) | 2023-08-04 |
Family
ID=87463657
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202320410784.XU Active CN219476664U (en) | 2023-03-07 | 2023-03-07 | IC carrier plate convenient for positioning and mounting chip |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN219476664U (en) |
-
2023
- 2023-03-07 CN CN202320410784.XU patent/CN219476664U/en active Active
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