CN219457643U - Miniature LED backlight module and LED lamp - Google Patents
Miniature LED backlight module and LED lamp Download PDFInfo
- Publication number
- CN219457643U CN219457643U CN202320523243.8U CN202320523243U CN219457643U CN 219457643 U CN219457643 U CN 219457643U CN 202320523243 U CN202320523243 U CN 202320523243U CN 219457643 U CN219457643 U CN 219457643U
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- China
- Prior art keywords
- backlight module
- blue light
- led backlight
- light chip
- conductive solder
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- 239000000758 substrate Substances 0.000 claims abstract description 22
- 239000000084 colloidal system Substances 0.000 claims abstract description 14
- 229910000679 solder Inorganic materials 0.000 claims description 38
- 238000002156 mixing Methods 0.000 claims description 6
- 239000000843 powder Substances 0.000 claims description 6
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 2
- 230000000149 penetrating effect Effects 0.000 claims description 2
- 229920005989 resin Polymers 0.000 claims description 2
- 239000011347 resin Substances 0.000 claims description 2
- 229910052710 silicon Inorganic materials 0.000 claims description 2
- 239000010703 silicon Substances 0.000 claims description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 abstract description 13
- 239000004973 liquid crystal related substance Substances 0.000 description 6
- 238000007689 inspection Methods 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 230000003287 optical effect Effects 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 230000004888 barrier function Effects 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 2
- 230000002035 prolonged effect Effects 0.000 description 2
- 229920002050 silicone resin Polymers 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000003384 imaging method Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
- 238000004383 yellowing Methods 0.000 description 1
Landscapes
- Led Device Packages (AREA)
Abstract
The utility model provides a miniature LED backlight module and an LED lamp, wherein the miniature LED backlight module comprises a substrate, a containing groove is formed in the substrate, a baffle plate extends upwards around the containing groove, two conductive tin pastes which are not electrically connected with each other are arranged in the containing groove, the heights of the two conductive tin pastes are lower than those of the baffle plate, a preset gap is reserved between the conductive tin pastes and the edges of the containing groove, a plurality of through holes are formed between the two conductive tin pastes in the containing groove, a blue light chip is arranged on the two conductive tin pastes, the anode and the cathode of the blue light chip are respectively electrically communicated with the anode and the cathode of the substrate through the two conductive tin pastes, and the outer side of the blue light chip is covered with yellow fluorescent colloid. The miniature LED backlight module provided by the utility model effectively reduces the size of the backlight module, avoids the short circuit of the anode and the cathode of the blue light chip, expands the application range of products and is suitable for large-scale popularization.
Description
Technical Field
The utility model belongs to the technical field of LED backlight display, and particularly relates to a miniature LED backlight module and an LED lamp.
Background
The backlight module is one of the key components of the liquid crystal display panel. The light source component is arranged on the back surface of the back of the liquid crystal display, and has the functions of providing enough light sources with uniform brightness and distribution, so that the liquid crystal can normally display images, the liquid crystal does not emit light, and the display graph or character is the result of modulating light rays, so that the light-emitting effect of the backlight module directly influences the visual effect of the liquid crystal display module.
The backlight module is used as one of important components of the display panel, and the quality of the backlight module directly influences the imaging effect of the liquid crystal display; at present, white light displayed by a commonly used backlight module is mainly mixed by red, green and blue primary lights, specifically, the white light can be mixed by light emitted by a red light chip, a green light chip and a blue light chip, and in addition, various color lights can be displayed by mixing the red, green and blue primary lights with different proportions.
At present, a single backlight module has more chips for white light adhesion through mixing red, green and blue light emitting chips, so that the size of the single backlight module is larger, and the application range is limited. In addition, when the light-emitting chip is connected with the substrate through conductive materials such as solder paste, the solder paste is easy to overflow after being melted, so that the light-emitting chip is short-circuited, and the product quality is affected.
Disclosure of Invention
Based on the above, the utility model aims to provide a miniature LED backlight module and an LED lamp, which solve the problems in the prior art.
The utility model provides a miniature LED backlight module, wherein a containing groove is formed in a substrate, a baffle plate extends upwards around the containing groove, two conductive tin pastes which are not electrically connected with each other are arranged in the containing groove, the heights of the two conductive tin pastes are lower than the height of the baffle plate, a preset gap is reserved between the conductive tin pastes and the edge of the containing groove, a plurality of through holes are formed between the two conductive tin pastes in the containing groove, a blue light chip is arranged on the two conductive tin pastes, the positive electrode and the negative electrode of the blue light chip are respectively electrically communicated with the positive electrode and the negative electrode of the substrate through the two conductive tin pastes, and the outer side of the blue light chip is covered with yellow fluorescent colloid.
The beneficial effects of the utility model are as follows: according to the miniature LED backlight module provided by the utility model, the blue light chip is electrically connected to the substrate, the yellow fluorescent colloid is covered on the outer side of the blue light chip, the optical principle that yellow fluorescent powder is excited by the blue light chip to generate white light is utilized, white light can be emitted only by one light emitting chip, the size of the backlight module is effectively reduced.
Preferably, the side wall of the baffle is provided with a wire guide hole, and the conductive solder paste is electrically communicated with the anode and the cathode of the substrate through a wire penetrating through the wire guide hole.
Preferably, the baffle is a transparent structure.
Preferably, the accommodating groove comprises two rows of through holes, and the two rows of through holes are staggered.
Preferably, one end of the through hole, which is close to the blue light chip, is a countersunk hole, and the other end of the through hole is a straight hole.
Preferably, the counter bore is a V-shaped counter bore, and the diameter of the counter bore is 3-5 times of the diameter of the straight bore.
Preferably, the yellow fluorescent colloid is formed by mixing yellow fluorescent powder and organic silicon resin.
The utility model further provides an LED lamp, which comprises any one of the miniature LED backlight modules.
Additional aspects and advantages of the utility model will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the utility model.
Drawings
Fig. 1 is a schematic structural diagram of a micro LED backlight module according to a first embodiment of the present utility model;
FIG. 2 is a schematic view of the structure of the substrate in FIG. 1;
FIG. 3 is a schematic view of another view of the substrate of FIG. 2.
Description of main reference numerals:
| substrate board | 10 | Accommodating groove | 11 |
| Baffle plate | 12 | Through hole | 13 |
| Conductive solder paste | 20 | Preset gap | 21 |
| Blue light chip | 30 | Yellow fluorescent colloid | 40 |
The utility model will be further described in the following detailed description in conjunction with the above-described figures.
Detailed Description
In order that the utility model may be readily understood, a more complete description of the utility model will be rendered by reference to the appended drawings. Several embodiments of the utility model are presented in the figures. This utility model may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.
It will be understood that when an element is referred to as being "mounted" on another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "left," "right," and the like are used herein for illustrative purposes only.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this utility model belongs. The terminology used herein in the description of the utility model is for the purpose of describing particular embodiments only and is not intended to be limiting of the utility model. The term "and/or" as used herein includes any and all combinations of one or more of the associated listed items.
Specifically, as shown in fig. 1 to 3, a first embodiment of the present utility model provides a micro LED backlight module, which includes a substrate 10, a receiving groove 11 disposed on the substrate, a baffle 12 extending upward around the receiving groove 11, two conductive solder pastes 20 disposed in the receiving groove 11 and not electrically connected to each other, a preset gap 21 disposed between the conductive solder pastes 20 and the edge of the receiving groove 11, a plurality of through holes 13 disposed between the conductive solder pastes 20 in the receiving groove 11, a blue light chip 30 disposed on the conductive solder pastes 20, positive and negative electrodes of the blue light chip 30 electrically connected to the positive and negative electrodes of the substrate 10 through the conductive solder pastes 20, and yellow fluorescent colloid 40 covering the outer side of the blue light chip 30.
Specifically, in this embodiment, the accommodating groove 11 is disposed in the middle area of the substrate 10, two conductive solder pastes 20 that are not electrically connected with each other are disposed in the accommodating groove, the positive and negative electrodes of the blue light chip 30 are electrically connected with the positive and negative electrodes of the substrate 10 through the two conductive solder pastes 20, specifically, when the conductive solder pastes are electrically connected, the conductive solder pastes often need to be thawed and heated to be heated into a molten state and then pass through needle tube points in the accommodating groove 11, then the blue light chip 30 is mounted on the molten conductive solder pastes, and the molten conductive solder pastes extend and expand to the periphery, so in order to prevent the molten conductive solder pastes from diffusing out of the blue light chip 30, in this embodiment, the baffle plates 12 extend upwards around the accommodating groove 11 to prevent the conductive solder pastes from overflowing, further, a plurality of through holes 13 are disposed between the conductive solder pastes 20 and the edges of the accommodating groove 11, the molten conductive solder pastes can flow into the preset gaps 21 and the through holes 13, and the conductive solder pastes electrically connected with the positive and negative electrodes of the blue light chip 30 in the accommodating groove 11 are avoided. On the other hand, the through hole 13 is provided to conduct the cavity formed by the two conductive solder pastes 20 and the blue light chip with the outside, it can be understood that when the molten conductive solder paste diffuses to the periphery, the volume of the cavity is continuously reduced, the gas pressure in the cavity is increased, and the cavity is conducted with the outside environment through the through hole, so that the air pressure in the cavity can be effectively maintained to be stable.
In addition, in the embodiment, the yellow fluorescent colloid 40 is covered on the outer side of the blue light chip 30, so that the white light can be emitted only by one light emitting chip by utilizing the optical principle that the blue light chip 30 excites the yellow fluorescent powder to generate the white light, and the size of the backlight module is effectively reduced; in addition, the brightness of the white light module is tens times of that of the original blue light chip, so that the use of other gain plates in the light-emitting electronic element can be effectively reduced, and further, the damage of other parts of the light-emitting electronic element can be effectively reduced by white light, for example, the yellowing reaction of the support column in the electronic element can be effectively prolonged by white light relative to blue light, and the service life of the electronic element is prolonged.
Specifically, in the present embodiment, a wire guide is disposed on the sidewall of the baffle 12, and the conductive solder paste 20 is electrically connected to the positive and negative electrodes of the substrate 10 through the wires passing through the wire guide. In order not to affect the light emitting effect of the micro LED backlight module provided in the present embodiment, the baffle 12 is of a transparent structure. In addition, in order to prevent blue light from being individually emitted through the barrier 12, the yellow fluorescent colloid 40 disposed outside the blue light chip 30 completely covers the barrier 12, and further, the yellow fluorescent colloid 40 is formed by mixing yellow fluorescent powder and silicone resin.
Further, in the present embodiment, as shown in fig. 3, the through holes 13 provided in the accommodating groove 11 are arranged in two rows, and the two rows of through holes 13 are arranged in a staggered manner, and it is understood that the strength of the substrate 10 can be effectively maintained by the two staggered rows of through holes. Specifically in this embodiment, the end of the through hole 13 near the blue light chip 30 is a countersink, the end far away from the blue light chip 30 is a straight hole, preferably, the countersink is a V-shaped countersink, the diameter of the V-shaped countersink is 3-5 times of the diameter of the straight hole, by arranging two rows of through holes, two melted conductive solder pastes 20 respectively enter the through holes near the through holes, so as to prevent the two conductive solder pastes from being electrically connected, further, by arranging the end of the through hole 13 near the blue light chip 30 as a V-shaped countersink, the melted conductive solder pastes 20 are easier to be led in, the end of the through hole 13 far away from the blue light chip 30 is arranged as a straight hole, and the diameter of the straight hole is smaller, so that the filling resistance of the conductive solder pastes 20 can be increased, and the solder pastes are prevented from leaking from the bottom of the substrate 10.
Specifically, in the preparation of the micro LED backlight module provided by the present utility model, performance indexes such as appearance, size, function, etc. of each material are firstly checked, then solder paste is heated and processed into a molten state, then a substrate is placed on a plate loading machine in parallel, and tin is dispensed at a preset position, conductive solder paste 30 on a substrate 10 is checked, after the inspection is qualified, a blue light chip 30 is stuck on the conductive solder paste 20, the stuck blue light chip 30 is cured, specifically, operations such as reflow soldering, etc. can be performed to cure, after curing, inspection such as offset, dirt, breakage, reverse direction, material error, etc. are performed on the blue light chip 30 by using AOI (automatic optical inspection), after the inspection is qualified, plasma cleaning is performed on the blue light chip 30, after cleaning, after mixing proportion of yellow fluorescent powder and silicone resin, dispensing treatment is started on the blue light chip 30, so as to form yellow fluorescent colloid 40 on the outer side of the blue light chip 30. Curing after the dispensing treatment, and detecting concentricity of the blue light chip 30 and the yellow fluorescent colloid 40 by AOI on the die after curing to detect whether bubbles exist in the yellow fluorescent colloid 40 and whether the diameters and the shapes of the bubbles meet the requirements; after meeting the requirements, the miniature LED backlight module provided by the utility model is packaged and put in storage, so that the size of the backlight module is effectively reduced, the short circuit of the anode and the cathode of a blue light chip is avoided, the application range of the product is enlarged, and the miniature LED backlight module is suitable for large-scale popularization.
The second embodiment of the utility model provides an LED lamp, where the LED lamp provided in the present embodiment includes the micro LED backlight module provided in the first embodiment.
It should be noted that the above implementation process is only for illustrating the feasibility of the present application, but this does not represent that the micro LED backlight module and the LED lamp of the present application only have the implementation process, and instead, as long as the micro LED backlight module and the LED lamp of the present application can be implemented, all the implementation processes may be incorporated into the feasible implementation of the present application.
In the description of the present specification, a description referring to terms "one embodiment," "some embodiments," "examples," "specific examples," or "some examples," etc., means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the present utility model. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiments or examples. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
The foregoing examples illustrate only a few embodiments of the utility model and are described in detail herein without thereby limiting the scope of the utility model. It should be noted that it will be apparent to those skilled in the art that several variations and modifications can be made without departing from the spirit of the utility model, which are all within the scope of the utility model. Accordingly, the scope of protection of the present utility model is to be determined by the appended claims.
Claims (8)
1. The utility model provides a miniature LED backlight unit, its characterized in that, includes the base plate, be equipped with the holding groove on the base plate, upwards extend around the holding groove has the baffle, be equipped with two conductive solder paste each other not electric connection in the holding groove, two conductive solder paste's height is all less than the height of baffle, conductive solder paste with the edge of holding groove is left and is predetermine the clearance, be equipped with a plurality of through-holes in the holding groove two between the conductive solder paste, two be equipped with a blue light chip on the conductive solder paste, the positive negative pole of blue light chip passes through two conductive solder paste respectively with the positive negative pole electric connection of base plate, the outside of blue light chip covers there is yellow fluorescent colloid.
2. The micro LED backlight module according to claim 1, wherein the sidewall of the baffle is provided with a wire guide, and the conductive solder paste is electrically connected to the anode and the cathode of the substrate through a wire penetrating the wire guide.
3. The micro LED backlight module of claim 1, wherein the baffle is a transparent structure.
4. The miniature LED backlight module of claim 1, wherein the receiving groove comprises two rows of the through holes, and the two rows of the through holes are staggered.
5. The micro LED backlight module according to claim 1, wherein one end of the through hole close to the blue light chip is a countersunk hole, and the other end is a straight hole.
6. The micro LED backlight module according to claim 5, wherein the counter bore is a V-shaped counter bore having a diameter 3-5 times the diameter of the straight bore.
7. The micro LED backlight module of claim 1, wherein the yellow fluorescent colloid is formed by mixing yellow fluorescent powder and organic silicon resin.
8. An LED lamp comprising a micro LED backlight module according to any one of claims 1-7.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320523243.8U CN219457643U (en) | 2023-03-07 | 2023-03-07 | Miniature LED backlight module and LED lamp |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320523243.8U CN219457643U (en) | 2023-03-07 | 2023-03-07 | Miniature LED backlight module and LED lamp |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219457643U true CN219457643U (en) | 2023-08-01 |
Family
ID=87386832
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202320523243.8U Active CN219457643U (en) | 2023-03-07 | 2023-03-07 | Miniature LED backlight module and LED lamp |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN219457643U (en) |
-
2023
- 2023-03-07 CN CN202320523243.8U patent/CN219457643U/en active Active
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