CN219457598U - Power device module with efficient heat dissipation - Google Patents
Power device module with efficient heat dissipation Download PDFInfo
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- CN219457598U CN219457598U CN202320494273.0U CN202320494273U CN219457598U CN 219457598 U CN219457598 U CN 219457598U CN 202320494273 U CN202320494273 U CN 202320494273U CN 219457598 U CN219457598 U CN 219457598U
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Abstract
The utility model provides a power device module with efficient heat dissipation, which comprises a power device module, a metal heat dissipation module and a water cooling module, wherein the power device module is in contact with the upper surface of the metal heat dissipation module for heat conduction; according to the utility model, the plurality of through holes are formed below the metal heat dissipation module, and the water flow flows through the through holes to be contacted with the metal heat dissipation module so as to conduct heat into the water flow, so that the heat flow conduction can be circularly conducted out along with the water flow along the through holes, and the heat conduction efficiency is high; compared with machining and forming of PIN-shaped radiating strips, the machining difficulty of the through holes is low, and the machining cost can be reduced.
Description
Technical Field
The utility model relates to the technical field of heat dissipation, in particular to a power device module with efficient heat dissipation.
Background
Referring to fig. 1, a conventional heat dissipation structure of a power device module generally includes a power module 1', a metal heat dissipation block 2', and a water cooling module 3', wherein the water cooling module 3' includes a water inlet channel 31 'and a water outlet channel 32', the power module 1 'contacts with an upper surface of the metal heat dissipation block 2', and heat flow generated by the power module 1 'is conducted to the metal heat dissipation block 2' through the contact. In order to increase the heat dissipation area of the metal heat dissipation block 2', the lower surface of the metal heat dissipation block 2' is provided with a plurality of heat dissipation strips 21', the arrangement of the plurality of heat dissipation strips 21' is in a PIN shape, water flows into the cavity of the water cooling module 3' through the water inlet channel 31', heat in the metal heat dissipation block 2' is conducted into the water flow through the heat dissipation strips 21', and the water flow circularly takes away the heat through the water outlet channel 32 '. The existing structural design has the following defects:
(1) The heat flow generated by the power module 1' is conducted through the PIN-shaped heat dissipation strips 21' made of metal materials, but the heat dissipation strips 21' are thinner, the heat flow conduction is limited, and the heat conduction efficiency is low;
(2) The heat dissipation strips 21 'are required to be formed by machining, the number of the heat dissipation strips 21' is large, the machining difficulty is high, the cost is high, and the yield is low.
Disclosure of Invention
The utility model aims to overcome the defects and shortcomings of the prior art and provide a power device module with efficient heat dissipation.
The utility model provides a power device module with high-efficient heat dissipation, includes power device module, metal heat dissipation module and water-cooling module, the power device module with metal heat dissipation module upper surface contact carries out the heat conduction, metal heat dissipation module's below inserts in the water-cooling module, a plurality of through-holes have been seted up along the below of metal heat dissipation module the rivers direction of water-cooling module, water flow in the water-cooling module carries out the heat conduction through-hole.
Compared with the prior art, the heat conduction device has the advantages that the plurality of through holes are formed below the metal heat dissipation module, the water flow flows through the through holes to be in contact with the metal heat dissipation module to conduct heat into the water flow, and the heat flow conduction can be circularly conducted out along with the water flow along the through holes, so that the heat conduction efficiency is high. Compared with machining and forming of PIN-shaped radiating strips, the machining difficulty of the through holes is low, and the machining cost can be reduced.
In an implementation of one embodiment, the plurality of through holes are arranged in a rectangular array.
In one embodiment, the apertures of the plurality of through holes are the same.
In an implementation of one of the embodiments, the spacing between the through holes is 1/5 to 2/3 of the aperture of the through hole. The size of the interval between the through holes is preferably 1/2 of the aperture of the through holes.
In one embodiment, the aperture of the via is inversely proportional to the size of the space of the via from the power device module. That is, the aperture of the through hole in the metal heat dissipation module, which is close to the power device module, is larger, while the aperture of the through hole in the metal heat dissipation module, which is far away from the power device module, is smaller gradually, and the aperture of the through hole is gradually changed along with the distance. Because the heat conduction near the power device module is concentrated, the through hole has larger aperture, so that the water flow passing through the power device module is more, and the heat exchange efficiency is higher.
In an implementation manner of one embodiment, the water cooling module includes a water inlet channel and a water outlet channel, and the remaining through holes are arranged in an array with the through holes facing the water inlet channel as a center based on the through holes facing the water inlet channel. The apertures of the through holes are the same, and the distance between the through holes and the power device module can be gradually increased.
In one embodiment, the hole diameter of the through hole facing the water inlet channel is the smallest, and the hole diameters of the remaining through holes are gradually increased with the through hole facing the water inlet channel as the center. That is, the other through holes are outwardly diffused centering on the position facing the water inlet passage, and the through holes gradually increase in size. The size of the through holes right opposite to the position of the water inlet channel is small, the water flow rate is low, the water flow is promoted to pass through other through holes not right opposite to the water inlet channel, the flow of the water is improved, and the heat dissipation efficiency is improved.
In an embodiment of one of the embodiments, the cross-sectional area of the through hole is gradually smaller from the water inlet channel to the water outlet channel.
In one embodiment, a distance from the lower part of the metal heat dissipation module to the bottom and/or two side walls of the water cooling module is not greater than the aperture of the through hole. The problem that water flows too fast through the gaps between the lower parts of the metal heat dissipation modules and the water cooling modules to influence the heat exchange efficiency of the metal heat dissipation modules and water is avoided.
In one embodiment, the sum of the cross-sectional areas of the plurality of through holes accounts for 30% -60% of the cross-sectional area of the whole metal heat dissipation module. Not only the aperture of the through holes is changed, but also the distance between the through holes is changed, the through holes are not fixed at a certain fixed value, and the number of the through holes in the same transverse direction of the metal heat radiation module is also changed. The whole metal heat dissipation module is in the side view direction, and the area of the control through hole accounts for 30% to 60% of the total area of the heat dissipation part of the whole metal heat dissipation module, so that the heat conduction of the metal heat dissipation module can be ensured, and a larger heat exchange area is ensured.
The power device module with high-efficiency heat dissipation has the beneficial effects that: through arranging a plurality of through holes below the metal heat dissipation module, water flows through the through holes to be contacted with the metal heat dissipation module so as to conduct heat into the water flow, and the heat flow conduction can be circularly conducted out along the through holes along with the water flow, so that the heat conduction efficiency is high; compared with machining and forming of PIN-shaped radiating strips, the machining difficulty of the through holes is low, and the machining cost can be reduced.
Drawings
FIG. 1 is a schematic diagram of a prior art power module heat dissipation structure;
fig. 2 is a schematic structural diagram of a power device module with efficient heat dissipation according to the present utility model;
FIG. 3 is a schematic diagram of a power device module with efficient heat dissipation according to an embodiment of the present utility model;
fig. 4 is a schematic diagram of a second embodiment of a power device module with efficient heat dissipation according to the present utility model;
fig. 5 is a schematic diagram of a third embodiment of a power device module with efficient heat dissipation according to the present utility model;
fig. 6 is a schematic diagram of a fourth embodiment of a power device module with efficient heat dissipation according to the present utility model.
Detailed Description
Embodiments of the present utility model are described in detail below, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to like or similar elements or elements having like or similar functions throughout. The embodiments described below by referring to the drawings are illustrative only and are not to be construed as limiting the utility model.
In the description of the present utility model, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings are merely for convenience in describing the present utility model and simplifying the description, and do not indicate or imply that the device or element being referred to must have a specific orientation, be configured and operated in a specific orientation, and therefore should not be construed as limiting the present utility model.
Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include one or more such feature. In the description of the present utility model, the meaning of "a plurality" is two or more, unless explicitly defined otherwise.
In the present utility model, unless explicitly specified and limited otherwise, the terms "mounted," "connected," "secured," and the like are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communicated with the inside of two elements or the interaction relationship of the two elements. The specific meaning of the above terms in the present utility model can be understood by those of ordinary skill in the art according to the specific circumstances.
In the present utility model, unless expressly stated or limited otherwise, a first feature "up" or "down" a second feature may be the first and second features in direct contact, or the first and second features in indirect contact via an intervening medium. Moreover, a first feature being "above," "over" and "on" a second feature may be a first feature being directly above or obliquely above the second feature, or simply indicating that the first feature is level higher than the second feature. The first feature being "under", "below" and "beneath" the second feature may be the first feature being directly under or obliquely below the second feature, or simply indicating that the first feature is less level than the second feature.
The utility model provides a power device module with efficient heat dissipation, which comprises a power device module, a metal heat dissipation module and a water cooling module, wherein the power device module is in contact with the upper surface of the metal heat dissipation module for heat conduction, the lower part of the metal heat dissipation module is inserted into the water cooling module, a plurality of through holes are formed in the lower part of the metal heat dissipation module along the water flow direction of the water cooling module, and water in the water cooling module flows through the through holes for heat conduction.
According to the utility model, the plurality of through holes are formed below the metal heat dissipation module, and the water flow flows through the through holes to be contacted with the metal heat dissipation module so as to conduct heat into the water flow, so that the heat flow conduction can be circularly conducted out along with the water flow along the through holes, and the heat conduction efficiency is high; compared with machining and forming of PIN-shaped radiating strips, the machining difficulty of the through holes is low, and the machining cost can be reduced.
Example 1
Referring to fig. 2 and 3, the utility model provides a power device module with efficient heat dissipation, which comprises a power device module 1, a metal heat dissipation module 2 and a water cooling module 3, wherein the power device module 1 is in contact with the upper surface of the metal heat dissipation module 2 for heat conduction, the lower part of the metal heat dissipation module 2 is inserted into the water cooling module 3, the water cooling module 3 comprises a water inlet channel 31 and a water outlet channel 32, a plurality of through holes 21 are formed below the metal heat dissipation module 2 along the water flow direction of the water cooling module 3, water flows into a cavity of the water cooling module 3 through the water inlet channel 31, the water in the water cooling module 3 exchanges heat with the heat of the metal heat dissipation module 2 through the through holes 21, and the water flows circularly through the water outlet channel 32 to take away the heat.
More specifically, referring to fig. 3, a plurality of through holes 21 are arranged in a rectangular array. The apertures of the plurality of through holes 21 are the same. The machining efficiency of the through hole 21 is facilitated at the time of machining.
Referring to fig. 3, the spacing between the through holes 21 is 1/5 to 2/3 of the aperture of the through hole 21. The size of the space between the through holes 21 and the through holes 21 is preferably 1/2 of the aperture of the through holes 21. The heat conduction of the metal heat radiation module 2 can be ensured, and a larger heat exchange area is ensured.
According to the utility model, the plurality of through holes 21 are formed below the metal heat dissipation module 2, and the water flows through the through holes 21 to be contacted with the metal heat dissipation module 2 so as to conduct heat into the water flow, so that the heat flow conduction can be circularly conducted along with the water flow along the through holes 21, and the heat conduction efficiency is high; compared with machining and forming of PIN-shaped radiating strips, the machining difficulty of the through holes 21 is low, and machining cost can be reduced.
Example two
Referring to fig. 4, the present utility model provides a power device module with efficient heat dissipation, which has a structure substantially the same as that of the first embodiment, except that the size and arrangement of the through holes 21 are different. More specifically, the aperture of the through-hole 21 is inversely proportional to the size of the space of the through-hole 21 from the power device module 1. That is, the aperture of the through hole 21 in the metal heat dissipation module 2 near the power device module 1 is larger, and the aperture of the through hole 21 in the metal heat dissipation module 2 far from the power device module 1 is gradually smaller, and the aperture of the through hole 21 is gradually changed with the distance. Because the heat conduction near the power device module 1 is concentrated, the larger aperture of the through hole 21 can enable the water flow passing through to be more, and the heat exchange efficiency is higher.
According to the utility model, the plurality of through holes 21 are formed below the metal heat dissipation module 2, and the water flows through the through holes 21 to be contacted with the metal heat dissipation module 2 so as to conduct heat into the water flow, so that the heat flow conduction can be circularly conducted along with the water flow along the through holes 21, and the heat conduction efficiency is high; compared with machining and forming of PIN-shaped radiating strips, the machining difficulty of the through holes 21 is low, and machining cost can be reduced.
Example III
Referring to fig. 5, the present utility model provides a power device module with efficient heat dissipation, which has a structure substantially the same as that of the first embodiment, except that the size and arrangement of the through holes 21 are different. More specifically, the remaining through holes 21 are arranged in an array centered on the through holes 21 facing the water inlet channel 31 with reference to the through holes 21 facing the water inlet channel 31. The diameters of the through holes 21 are the same, and may be gradually increased according to the distance between the through holes 21 and the power device module 1.
Referring to fig. 5, the aperture of the through hole 21 facing the water inlet channel 31 is the smallest, and the aperture of the remaining through holes 21 is gradually increased centering on the through hole 21 facing the water inlet channel 31. That is, the other through holes 21 spread outward centering on the position facing the water inlet passage 31, and the through holes 21 gradually increase in size. The through holes 21 facing the water inlet channel 31 are small in size and low in water flow, so that water flow is promoted to pass through other through holes 21 not facing the water inlet channel, water flow is improved, and heat dissipation efficiency is improved.
According to the utility model, the plurality of through holes 21 are formed below the metal heat dissipation module 2, and the water flows through the through holes 21 to be contacted with the metal heat dissipation module 2 so as to conduct heat into the water flow, so that the heat flow conduction can be circularly conducted along with the water flow along the through holes 21, and the heat conduction efficiency is high; compared with machining and forming of PIN-shaped radiating strips, the machining difficulty of the through holes 21 is low, and machining cost can be reduced.
Example IV
Referring to fig. 6, the present utility model provides a power device module with efficient heat dissipation, which has a structure substantially the same as that of the first embodiment, except that the size and arrangement of the through holes 21 are different. More specifically, the cross-sectional area of the through hole 21 becomes gradually smaller from the water inlet passage 31 to the water outlet passage 32. The heat conduction efficiency between the water flow and the metal heat dissipation module 2 can be higher.
According to the utility model, the plurality of through holes 21 are formed below the metal heat dissipation module 2, and the water flows through the through holes 21 to be contacted with the metal heat dissipation module 2 so as to conduct heat into the water flow, so that the heat flow conduction can be circularly conducted along with the water flow along the through holes 21, and the heat conduction efficiency is high; compared with machining and forming of PIN-shaped radiating strips, the machining difficulty of the through holes 21 is low, and machining cost can be reduced.
The above embodiments are described by way of a few designs of through holes, more specifically, the distance from the lower side of the metal heat dissipation module 2 to the bottom and/or both side walls of the water cooling module 3 is not greater than the aperture of the through holes 21. In this way, the water flow is prevented from flowing too fast through the gap between the lower part of the metal heat dissipation module 2 and the water cooling module 3, and the heat exchange efficiency of the metal heat dissipation module 2 and water is prevented from being influenced.
More specifically, the sum of the cross-sectional areas of the plurality of through holes 21 accounts for 30% -60% of the cross-sectional area of the entire metal heat dissipation module 2. Not only the aperture of the through holes 21 but also the pitch between the through holes 21 is varied, and the number of through holes 21 in the same lateral direction of the metal heat dissipation module 2 is varied without being fixed at a certain fixed value. The whole metal heat dissipation module 2 is in the side view direction, and the area of the control through hole 21 accounts for 30% to 60% of the total area of the heat dissipation part of the whole metal heat dissipation module 2, so that the heat conduction of the metal heat dissipation module 2 can be ensured, and a larger heat exchange area is ensured.
The technical features of the above-described embodiments may be arbitrarily combined, and all possible combinations of the technical features in the above-described embodiments are not described for brevity of description, however, as long as there is no contradiction between the combinations of the technical features, they should be considered as the scope of the description.
The above examples illustrate only a few embodiments of the utility model, which are described in detail and are not to be construed as limiting the scope of the utility model. It should be noted that it will be apparent to those skilled in the art that several variations and modifications can be made without departing from the spirit of the utility model, which are all within the scope of the utility model. Accordingly, the scope of protection of the present utility model is to be determined by the appended claims.
Claims (10)
1. The utility model provides a power device module with high-efficient heat dissipation, its characterized in that includes power device module, metal heat dissipation module and water-cooling module, the power device module with metal heat dissipation module upper surface contact carries out the heat conduction, metal heat dissipation module's below inserts in the water-cooling module, a plurality of through-holes have been seted up along water cooling module's water flow direction to metal heat dissipation module's below, water in the water-cooling module flows through the through-hole carries out the heat conduction.
2. The power device module with efficient heat dissipation of claim 1, wherein: the through holes are distributed in a rectangular array.
3. The power device module with efficient heat dissipation of claim 2, wherein: and the apertures of the through holes are the same.
4. The power device module with efficient heat dissipation of claim 2, wherein: the size of the interval between the through holes is 1/5 to 2/3 of the aperture of the through hole.
5. The power device module with efficient heat dissipation of claim 4, wherein: the aperture of the via is inversely proportional to the size of the space of the via from the power device module.
6. The power device module with efficient heat dissipation of claim 1, wherein: the water cooling module comprises a water inlet channel and a water outlet channel, and the rest through holes are arranged in an array with the through holes facing the water inlet channel as the center based on the through holes facing the water inlet channel.
7. The power device module with efficient heat dissipation of claim 6, wherein: the aperture of the through hole right opposite to the water inlet channel is minimum, and the aperture of the rest through holes is gradually increased by taking the through hole right opposite to the water inlet channel as the center.
8. The power device module with efficient heat dissipation of claim 6, wherein: the cross section area of the through hole is gradually reduced from the water inlet channel to the water outlet channel.
9. The power device module with efficient heat dissipation according to any one of claims 1-8, wherein: the distance from the lower part of the metal heat radiation module to the bottom and/or the two side walls of the water cooling module is not greater than the aperture of the through hole.
10. The power device module with efficient heat dissipation according to any one of claims 1-8, wherein: the sum of the cross sectional areas of the through holes accounts for 30% -60% of the cross sectional area of the whole metal heat dissipation module.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320494273.0U CN219457598U (en) | 2023-03-14 | 2023-03-14 | Power device module with efficient heat dissipation |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320494273.0U CN219457598U (en) | 2023-03-14 | 2023-03-14 | Power device module with efficient heat dissipation |
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| Publication Number | Publication Date |
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| CN219457598U true CN219457598U (en) | 2023-08-01 |
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| CN202320494273.0U Active CN219457598U (en) | 2023-03-14 | 2023-03-14 | Power device module with efficient heat dissipation |
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- 2023-03-14 CN CN202320494273.0U patent/CN219457598U/en active Active
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