CN219434887U - Batch test cable device - Google Patents

Abstract

The utility model provides a batch test cable device, and belongs to the technical field of chip test cables. The batch test cable device includes: the adapter comprises an input interface and an output interface, wherein the input interface and the output interface respectively comprise corresponding signal wires and shielding layers arranged outside the signal wires, and the input interface is used for receiving electric signals; and the chip test module comprises a first cable and a test probe connected with the first cable, and one end, far away from the test probe, of the first cable is connected with the output interface. The batch test cable device can effectively improve the test precision in batch test.

Description

Batch test cable device

Technical Field

The utility model relates to the technical field of chip test cables, in particular to a batch test cable device.

Background

The chip test requires a chip test structure (also called a chip test head) with an output end being a test probe, one end of the chip test structure is connected with a source meter, an electric signal is transmitted to the test probe through the chip test structure, and then the electric signal is applied to a chip to be tested through the test probe.

The chip test structure in the prior art is usually set for a chip alone, and in order to perform chip test more efficiently, a batch test device needs to be set, but because the chip test is a current test of a picoampere level, when a plurality of chip test structures are arranged together for test, the problem of electromagnetic interference exists, and the test precision is affected.

Disclosure of Invention

The utility model aims to provide a batch test cable device which can effectively improve the test precision in batch test.

It is a further object of the present utility model to improve the accuracy and connection stability of electrical signals.

It is a further object of the utility model to prevent low leakage.

In particular, the present utility model provides a batch test cable arrangement comprising:

the adapter comprises an input interface and an output interface, wherein the input interface and the output interface respectively comprise corresponding signal wires and shielding layers arranged outside the signal wires, and the input interface is used for receiving electric signals; and

the chip test module comprises a first cable and a test probe connected with the first cable, and one end, away from the test probe, of the first cable is connected with the output interface.

Optionally, the input interface includes a test interface and a compensation monitor interface;

the test interface comprises a test signal input wire, a first shielding layer and a first grounding layer, wherein the first shielding layer is arranged outside the test signal input wire in a wrapping mode, and the first grounding layer is arranged outside the first shielding layer in a wrapping mode;

the compensation monitoring interface comprises a feedback signal input wire, a second shielding layer and a second grounding layer, wherein the second shielding layer is arranged outside the feedback signal input wire in a wrapping mode, and the second grounding layer is arranged outside the second shielding layer in a wrapping mode.

Optionally, the output interface includes:

the test signal output wire is connected with the test signal input wire;

the feedback signal output layer is wrapped outside the test signal output wire and connected with the feedback signal input wire; and

and the third shielding layer is wrapped outside the feedback signal output layer and is connected with the first shielding layer and the second shielding layer.

Optionally, the input interface and the output interface are connected through a circuit board.

Optionally, the input interface and the output interface are respectively disposed at two opposite ends of the circuit board.

Optionally, the batch test cable device further includes a first protective case including a first shielding case for fixing the adaptor, and a first mounting hole and a second mounting hole for passing through the input interface and the output interface, respectively, are provided at the first shielding case.

Optionally, the first protection shell further comprises an insulating isolation plate, the isolation plate is fixed on the connection side of the first shielding box and the output interface, and a third mounting hole for penetrating through the output interface is formed in the isolation plate.

Optionally, the number of the adapters and the number of the chip test modules are multiple, and the multiple adapters are all arranged in the first shielding box;

the first shielding box is internally provided with a plurality of shielding clapboards which are used for separating a plurality of chambers, and each chamber is used for placing one adapter.

Optionally, the first shielding box comprises a cover plate and a shielding cover with an opening, and the cover plate covers the opening of the shielding cover to form a closed space.

Optionally, the chip test module further includes a second protective case, where the second protective case includes:

a second shielding box for fixing the first cable and the test probe; and

and the low-leakage protective cover is arranged at the outer surface of the second shielding box and used for preventing leakage.

According to one embodiment of the utility model, a batch test cable device is provided, which comprises a metal shielding box with a plurality of mutually isolated cavities, wherein each cavity is internally provided with a circuit board, two ends of each circuit board are respectively connected with an input cable and an output cable, each output cable is connected with an input end of each chip test structure, and an output end of each chip test structure is connected with a test chip.

According to one embodiment of the utility model, the contact resistance can be reduced and the electrical signal can be improved by providing the first wire terminal comprising the connecting column and the connecting sleeve, wherein the peripheral side of the connecting column is attached to the inner wall of the connecting sleeve

According to the embodiment of the utility model, the connecting column and the connecting sleeve are compressed by the spring, so that one end, close to the first column, of the second column of the connecting column is compressed with the inner wall of the accommodating cavity in the connecting sleeve, the contact stability is further improved, and the signal transmission is facilitated.

According to the embodiment of the utility model, the outside of the wires of the second pair of joints and the third pair of joints are sequentially coated with the shielding layer and the grounding layer, so that the wires at the joint of the input cable and the circuit board can be protected from being disturbed, and meanwhile, the outermost layer of the first pair of joints is set as the shielding layer, and the wires at the joint of the output cable and the circuit board can be protected.

According to one embodiment of the utility model, the chip test structure comprises the metal shielding shell, electromagnetic interference can be prevented, and the insulating protective cover is arranged outside the metal shielding shell, so that low electric leakage can be further prevented.

The above, as well as additional objectives, advantages, and features of the present utility model will become apparent to those skilled in the art from the following detailed description of a specific embodiment of the present utility model when read in conjunction with the accompanying drawings.

Drawings

Some specific embodiments of the utility model will be described in detail hereinafter by way of example and not by way of limitation with reference to the accompanying drawings. The same reference numbers will be used throughout the drawings to refer to the same or like parts or portions. It will be appreciated by those skilled in the art that the drawings are not necessarily drawn to scale. In the accompanying drawings:

FIG. 1 is a schematic diagram of a batch test cable arrangement according to one embodiment of the utility model;

FIG. 2 is a schematic diagram of an assembly structure of a chip test structure and an output cable of a batch test cable apparatus according to one embodiment of the utility model;

FIG. 3 is a cross-sectional view of a first pair of contacts of a batch test cable arrangement according to one embodiment of the utility model;

FIG. 4 is an exploded view of a first pair of contacts (with a first housing removed) of a batch test cable assembly, according to one embodiment of the utility model;

FIG. 5 is a cross-sectional view of a first wire connection terminal of a batch test cable arrangement in accordance with one embodiment of the present utility model;

FIG. 6 is a schematic diagram of a batch test cable arrangement according to another embodiment of the utility model;

FIG. 7 is a schematic wiring diagram of a first pair of contacts, a second pair of contacts, and a third pair of contacts of a batch test cable assembly according to one embodiment of the utility model.

Reference numerals:

batch test cable apparatus 100, interposer 10, metallic shield case 11, cavity 111, wiring board 12, insulating shield 13, input cable 20, first input cable 21, second input cable 22, output cable 30, chip test structure 40, probe set 41, metallic shield case 42, insulating boot 43, first pair of contacts 50, first case 51, first board end connector 52, connection hole 521, first cable end connector 53, through hole 501, first isolation layer 531, conductor layer 532, second isolation layer 533, first shield layer 534, first conductor connection terminal 535, connection post 502, connection sleeve 503, cavity 504, first post 505, second post 506, spring 507, second pair of contacts 60, first conductor 61, second shield layer 62, first ground layer 63, third pair of contacts 70, second conductor 71, third shield layer 72, second ground layer 73.

Detailed Description

Fig. 1 is a schematic structural view of a batch test cable apparatus 100 according to one embodiment of the utility model. Fig. 2 is a schematic diagram of an assembled structure of the chip test structure 40 and the output cables 30 of the batch test cable apparatus 100 according to one embodiment of the utility model. As shown in fig. 1, in one embodiment, a batch test cable arrangement 100 includes a transition structure 10, a plurality of input cables 20, a plurality of output cables 30, and a plurality of chip test structures 40. The switching structure 10 includes a metal shielding box 11, in which a plurality of cavities 111 isolated from each other are formed, two opposite ends of each cavity 111 are respectively provided with a first opening and a second opening, a connection circuit board 12 is disposed in each cavity 111, and an input connection end and an output connection end are disposed on the connection circuit board 12 and used for transmitting signals of the input connection end to the output connection end. Each input cable 20 is disposed corresponding to each cavity 111, and one end of each input cable 20 passes through the first opening of the corresponding cavity 111 and then is connected to the input connection end of the circuit board 12 in the cavity 111. Each output cable 30 is disposed corresponding to each cavity 111, and one end of each output cable 30 passes through the second opening of the corresponding cavity 111 and then is connected to the output connection end of the circuit board 12 in the cavity 111. As shown in fig. 2, a probe group 41 is disposed in each chip test structure 40, and an input end of each probe group 41 is connected to each output cable 30, and an output end is used for connecting to a test chip.

The embodiment provides a batch test cable device 100, which comprises a metal shielding box 11 with a plurality of cavities 111 isolated from each other, wherein a circuit board 12 is arranged in each cavity 111, two ends of the circuit board 12 are respectively connected with an input cable 20 and an output cable 30, each output cable 30 is connected with an input end of each chip test structure 40, and an output end of each chip test structure 40 is connected with a test chip, so that the batch test cable device is provided, and the metal shielding box 11 of the device can effectively shield external electromagnetic interference and mutual electromagnetic interference at the connecting positions of the circuit boards 12, so as to improve test precision.

Fig. 3 is a cross-sectional view of a first pair of contacts 50 of a batch test cable arrangement 100 in accordance with one embodiment of the present utility model. Fig. 4 is an exploded view of the first pair of contacts 50 (with the first housing 51 hidden) of the batch test cable assembly 100, in accordance with one embodiment of the utility model. As shown in fig. 1, the batch test cable arrangement 100 also includes a first pair of contacts 50 for connecting the outgoing cables 30 to the circuit board 12. As shown in fig. 3, referring also to fig. 4, the first pair of connectors 50 includes a first housing 51, and a first board end connector 52 and a first cable end connector 53 which are butt-connected, wherein an end of the first board end connector 52 away from the first cable end connector 53 is connected to the circuit board 12, an end of the first cable end connector 53 away from the first board end connector 52 is connected to the output cable 30, and the first housing 51 is used for connecting the first board end connector 52 and the first cable end connector 53.

Fig. 5 is a cross-sectional view of a first wire connection terminal 535 of a batch test cable device 100 according to one embodiment of the present utility model. As shown in fig. 4, in one embodiment, the first cable end connector 53 includes a first cable connection layer and a first wire connection terminal 535. The innermost layer structure of the first cable connection layer is provided with a through hole 501 penetrating in the axial direction, and in one embodiment, as shown in fig. 4, the cable connection layer includes a first isolation layer 531, a wire layer 532, a second isolation layer 533 and a first shielding layer 534 sleeved in sequence from inside to outside, and the first isolation layer 531 is provided with the through hole 501. The first wire connection terminal 535 includes a connection post 502 and a connection sleeve 503 (see fig. 5), the connection sleeve 503 is fixedly disposed in the through hole 501, a portion of the connection post 502 is disposed in the connection sleeve 503, and a circumferential surface of the connection post 502 is attached to an inner wall of the connection sleeve 503. The innermost layer of the first plate end connector 52 is provided with a connection hole 521 for extending into the connection post 502. Of course, the first board end connector 52 is further provided with respective layers respectively butt-jointed with the first isolation layer 531, the wire layer 532, the second isolation layer 533 and the first shielding layer 534, the output cable 30 is also provided with connection portions corresponding to the connection sleeve 503, the first isolation layer 531, the wire layer 532, the second isolation layer 533 and the first shielding layer 534, and as shown in fig. 2, the probe set 41 includes 3 probes, and the output cable 30 is respectively connected with the connection sleeve 503, the wire layer 532 and the first shielding layer 534, so that electrical signals can be normally transmitted.

In this embodiment, by providing the first wire connection terminal 535 including the connection post 502 and the connection sleeve 503, the circumference of the connection post 502 is attached to the inner wall of the connection sleeve 503, so that the contact resistance can be reduced, and the accuracy of the electrical signal can be improved.

Further, compared with the prior art in which the connection pin is fixed on the cable connection layer, the connection hole 521 with a diameter larger than that of the connection pin is arranged on the board-end connector, and the connection mode of the embodiment is more stable in connection and free from the situation of non-conduction in a mode that the connection pin is eccentrically contacted with the connection hole 521 and conducted.

In a further embodiment, as shown in fig. 5, the connecting sleeve 503 is provided with a cavity 504, and the cavity 504 is provided with an opening near one end of the first board end connector 52. The connecting column 502 comprises a first column 505 and a second column 506 with a diameter larger than that of the first column 505, the second column 506 is located in the connecting sleeve 503, the side wall of the second column 506 is attached to the connecting sleeve 503, and the first column 505 extends out of the connecting sleeve 503 through the opening. The wire connection terminal further includes a spring 507, two ends of which are respectively connected to the second post 506 and the cavity 504, for pressing one end of the second post 506 close to the first post 505 against the inner wall of the cavity 504.

In this embodiment, the connecting post 502 and the connecting sleeve 503 are compressed by the spring 507, so that one end of the second post 506 of the connecting post 502, which is close to the first post 505, is compressed with the inner wall of the cavity 504 in the connecting sleeve 503, thereby further improving the stability of contact and being beneficial to signal transmission.

In one embodiment, as shown in fig. 1, the adapting structure 10 further includes an insulating guard 13 disposed on a side of the metal shielding case 11 where the second openings are disposed, and a plurality of third openings are disposed on the insulating guard 13 for mounting the first board end connectors 52.

Since the output cables 30 are connected to the circuit board 12 through the first pair of connectors 50, the first cable end connectors 53 of the first pair of connectors 50 are provided with the first shielding layer 534, and the insulation protection board 13 isolates each first pair of connectors 50, so as to prevent low leakage.

Fig. 6 is a schematic structural view of a batch test cable apparatus 100 according to another embodiment of the utility model. Fig. 7 is a schematic diagram of wiring of the first, second and third pairs of contacts 50, 60, 70 of the bulk test cable device 100 according to one embodiment of the utility model, with all insulation omitted from fig. 7. As shown in fig. 1, in one embodiment, the input cables 20 include a first input cable 21 and a second input cable 22, and each of the circuit boards 12 is connected with one of the first input cables 21 and one of the second input cables 22. As shown in fig. 6, the batch test cable apparatus 100 further includes a second pair of contacts 60 for connecting the first input cable 21 and the wiring board 12, and a third pair of contacts 70 for connecting between the second input cable 22 and the wiring board 12. As shown in fig. 7, the second butt joint 60 includes a first conductive wire 61, a third isolation layer, a second shielding layer 62, a fourth isolation layer and a first ground layer 63, which are sequentially sleeved from inside to outside, the first conductive wire 61 is connected to the connection post 502, the second shielding layer 62 is connected to the first shielding layer 534, and the first ground layer 63 is grounded. The third pair of connectors 70 includes a second conductive wire 71, a fifth isolation layer, a third shielding layer 72, a sixth isolation layer and a second ground layer 73, which are sequentially sleeved from inside to outside, the second conductive wire 71 is connected to the conductive wire layer 532, the third shielding layer 72 is connected to the first shielding layer 534, and the second ground layer 73 is grounded. The constituent elements of the second 60 and third 70 pairs are similar to those of the first 50 pairs, except for the differences in routing order, i.e., the routing pattern shown in fig. 7.

One end of the first input cable 21 far from the second pair of connectors 60 and one end of the second input cable 22 far from the third pair of connectors 70 may be connected to a source meter, which is used to provide test electrical signals and transmit the test electrical signals to the first input cable 21, and the probe set 41 of the chip test structure 40 is connected to the chip to be tested and then grounded, so as to form a test loop. The source meter is also adapted to receive a feedback electrical signal fed back from the second input cable 22 to modify the test electrical signal based on the feedback electrical signal. For example, the test electric signal required by the chip to be tested is 5V, and the feedback electric signal received by the source meter is 4.5V, so that the source meter can be controlled to give out the test electric signal of 5.5V.

In this embodiment, through the above wiring manner, the outside of the wires of the second pair of connectors 60 and the third pair of connectors 70 are sequentially covered with the shielding layer and the grounding layer, so that the wires at the connection position of the input cable 20 and the circuit board 12 can be protected from being disturbed, and meanwhile, the outermost layer of the first pair of connectors 50 is set as the shielding layer, so that the wires at the connection position of the output cable 30 and the circuit board 12 can be protected.

Since the outermost layers of the second and third pairs of contacts 60 and 70 are ground layers, the side of the metallic shield case 11 where the input cable 20 is disposed may not be provided with an insulating member.

As shown in fig. 1, in one embodiment, a plurality of chip test structures 40 are sequentially arranged in the same direction, and each chip test structure 40 includes a metal shielding case 42 and an insulating protection cover 43 disposed outside the metal shielding case 42.

The chip test structure 40 of the present embodiment includes the metal shield case 42, which can prevent electromagnetic interference, and the insulating protective cover 43 is provided outside the metal shield case 42, which can further prevent low leakage.

By now it should be appreciated by those skilled in the art that while a number of exemplary embodiments of the utility model have been shown and described herein in detail, many other variations or modifications of the utility model consistent with the principles of the utility model may be directly ascertained or inferred from the present disclosure without departing from the spirit and scope of the utility model. Accordingly, the scope of the present utility model should be understood and deemed to cover all such other variations or modifications.

Claims (10)

1. A batch test cable apparatus, comprising:

the switching structure comprises a metal shielding box, wherein a plurality of cavities which are isolated from each other are formed in the metal shielding box, a first opening and a second opening are respectively formed at two opposite ends of each cavity, a connecting circuit board is arranged in each cavity, and an input connecting end and an output connecting end are arranged on the connecting circuit board and used for transmitting signals of the input connecting ends to the output connecting ends;

the input cables are arranged corresponding to the cavities, and one end of each input cable passes through the first opening of the corresponding cavity and then is connected with the input connecting end of the circuit board in the cavity;

the plurality of output cables are arranged corresponding to the cavities, and one end of each output cable passes through the second opening of the corresponding cavity and then is connected with the output connection end of the circuit board in the cavity; and

and the input end of each probe group is connected with each output cable, and the output end of each probe group is used for being connected with a test chip.

2. The batch test cable assembly of claim 1 further comprising a first pair of connectors for connecting the output cables to the circuit board, the first pair of connectors including a first housing and a butt-connected first board end connector and first cable end connector, the first board end connector being connected to the circuit board at an end remote from the first cable end connector, the first cable end connector being connected to the output cables at an end remote from the first board end connector, the first housing being adapted to connect the first board end connector to the first cable end connector.

3. The batch test cable arrangement of claim 2, wherein,

the first cable end connector includes:

the innermost layer structure of the first cable connecting layer is provided with a through hole which penetrates along the axial direction;

the first wire connecting terminal comprises a connecting column and a connecting sleeve, the connecting sleeve is fixedly arranged in the through hole, part of the connecting column is positioned in the connecting sleeve, and the peripheral side surface of the connecting column is attached to the inner wall of the connecting sleeve;

the innermost layer of the first board end connector is provided with a connecting hole for extending into the connecting column.

4. A batch test cable assembly as defined in claim 3, wherein,

the connecting sleeve is provided with a containing cavity, and one end of the containing cavity, which is close to the first board end connector, is provided with an opening;

the connecting column comprises a first column body and a second column body with the diameter larger than that of the first column body, the second column body is positioned in the connecting sleeve, the side wall of the second column body is attached to the connecting sleeve, and the first column body penetrates through the opening and extends out of the connecting sleeve;

the wire connecting terminal further comprises a spring, wherein two ends of the spring are respectively connected with the second column body and the accommodating cavity, and the spring is used for pressing one end, close to the first column body, of the second column body against the inner wall of the accommodating cavity.

5. A batch test cable arrangement according to claim 3, wherein the cable connection layer comprises a first isolation layer, a wire layer, a second isolation layer and a first shielding layer, which are sleeved in sequence from inside to outside, the first isolation layer being provided with the through holes.

6. The batch test cable assembly of claim 5, wherein the adapter structure further includes an insulating shield disposed on a side of the metal shield having the second opening, the insulating shield having a plurality of third openings for mounting the first board-end connectors.

7. The batch test cable assembly of claim 5, wherein,

the input cables comprise a first input cable and a second input cable, and each circuit board is connected with one first input cable and one second input cable;

the batch test cable arrangement further comprises a second pair of connectors for connecting the first input cable and the circuit board, and a third pair of connectors for connecting between the second input cable and the circuit board.

8. The batch test cable assembly of claim 7, wherein,

the second butt joint comprises a first wire, a third isolation layer, a second shielding layer, a fourth isolation layer and a first grounding layer which are sleeved in sequence from inside to outside, the first wire is connected with the connecting column, the second shielding layer is connected with the first shielding layer, and the first grounding layer is grounded;

the third butt joint comprises a second wire, a fifth isolation layer, a third shielding layer, a sixth isolation layer and a second grounding layer which are sequentially sleeved from inside to outside, the second wire is connected with the wire layer, the third shielding layer is connected with the first shielding layer, and the second grounding layer is grounded.

9. The batch test cable assembly of claim 8, wherein,

the probe set comprises 3 probes, and the probes are respectively connected with the connecting sleeve, the conducting wire layer and the first shielding layer through the output cables.

10. Batch test cable arrangement according to any one of claims 1-9, characterized in that,

the chip test structures are sequentially arranged in the same direction, and each chip test structure comprises a metal shielding shell and an insulating protective cover arranged outside the metal shielding shell.