CN219421180U

CN219421180U - PCB packaging structure compatible with USB2.0 and USB3.0

Info

Publication number: CN219421180U
Application number: CN202320334067.3U
Authority: CN
Inventors: 谭荣豪
Original assignee: Shenzhen Youhua Technology Co ltd
Current assignee: Shenzhen Youhua Technology Co ltd
Priority date: 2023-02-28
Filing date: 2023-02-28
Publication date: 2023-07-25
Anticipated expiration: 2033-02-28

Abstract

The utility model relates to the technical field of hardware interfaces, and discloses a PCB packaging structure compatible with USB2.0 and USB3.0, which comprises the following components: the USB interface chip comprises a PCB substrate, a USB2.0 packaging module, a mounting slot, an expansion packaging module and a USB interface chip; according to the utility model, the USB3.0 interface is formed by the USB2.0 packaging module and the expansion packaging module, wherein the expansion packaging module is detachably arranged on the PCB substrate through the mounting slot, when a product needs the USB2.0 interface, the USB3.0 interface is not required to be directly used for considering the USB2.0 interface, the expansion packaging module is detached, and the USB3.0 interface is modified into the USB2.0 interface, so that the cost saving is realized, and the problem that the cost loss is caused by directly using the USB3.0 interface for considering the USB2.0 interface in the prior art is solved.

Description

PCB packaging structure compatible with USB2.0 and USB3.0

Technical Field

The utility model relates to the technical field of hardware interfaces, in particular to a PCB packaging structure compatible with USB2.0 and USB 3.0.

Background

With the widespread use of electronic terminal products, the requirements of diversified user interfaces are more diversified for the hardware interfaces of the terminal electronic products, and the requirements of 3.0 and 2.0 are often changed according to the requirements of customer orders just as for the hardware interfaces USB, while the 3.0 interfaces are downward compatible with 2.0, on the hardware cost, USB3.0 is higher by 30%, and the cost loss is caused by adopting 3.0 hardware for shipment according to the requirements of users of 2.0.

Disclosure of Invention

The utility model aims to provide a PCB packaging structure compatible with USB2.0 and USB3.0, and aims to solve the problem that cost loss is caused when a USB3.0 interface is directly used for considering a USB2.0 interface in the prior art.

The utility model is realized in this way, the utility model provides a PCB packaging structure compatible with USB2.0 and USB3.0, comprising:

the USB interface chip comprises a PCB substrate, a USB2.0 packaging module, a mounting slot, an expansion packaging module and a USB interface chip;

the USB2.0 packaging module and the mounting slot are arranged on the PCB substrate, and the USB2.0 packaging module is electrically connected with the mounting slot;

the expansion packaging module is detachably arranged in the mounting slot and is electrically connected with the USB2.0 packaging module through the mounting slot to form a USB3.0 packaging module;

the USB2.0 packaging module is electrically connected with the mounting slot, and the USB interface chip is used for communicating with external equipment.

In one embodiment, the USB2.0 package module includes 4pin conductive contacts.

In one embodiment, the extended package module includes 5pin conductive contacts.

In one embodiment, the USB interface chip is a CH375 chip.

In one embodiment, the expansion package module is disposed at a rear end of the USB2.0 package module.

In one embodiment, the USB interface chip is disposed at a rear end of the expansion package module.

The utility model provides a PCB packaging structure compatible with USB2.0 and USB3.0, which has the following beneficial effects:

according to the utility model, the USB3.0 interface is formed by the USB2.0 packaging module and the expansion packaging module, wherein the expansion packaging module is detachably arranged on the PCB substrate through the mounting slot, when a product needs the USB2.0 interface, the USB3.0 interface is not required to be directly used for considering the USB2.0 interface, the expansion packaging module is detached, and the USB3.0 interface is modified into the USB2.0 interface, so that the cost saving is realized, and the problem that the cost loss is caused by directly using the USB3.0 interface for considering the USB2.0 interface in the prior art is solved.

Drawings

FIG. 1 is a schematic diagram of a PCB package structure compatible with USB2.0 and USB3.0 according to an embodiment of the present utility model;

fig. 2 is an electrical schematic diagram of a USB3.0 interface and a USB2.0 interface according to an embodiment of the present utility model.

Reference numerals: the device comprises a 1-PCB substrate, a 2-USB2.0 packaging module, a 3-mounting slot, a 4-expansion packaging module, a 5-USB interface chip and a 6-conductive contact.

Detailed Description

The present utility model will be described in further detail with reference to the drawings and examples, in order to make the objects, technical solutions and advantages of the present utility model more apparent. It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the scope of the utility model.

The same or similar reference numerals in the drawings of the present embodiment correspond to the same or similar components; in the description of the present utility model, it should be understood that, if there is an azimuth or positional relationship indicated by terms such as "upper", "lower", "left", "right", etc., based on the azimuth or positional relationship shown in the drawings, it is only for convenience of describing the present utility model and simplifying the description, but it is not indicated or implied that the apparatus or element referred to must have a specific azimuth, be constructed and operated in a specific azimuth, and thus terms describing the positional relationship in the drawings are merely illustrative and should not be construed as limitations of the present patent, and specific meanings of the terms described above may be understood by those skilled in the art according to specific circumstances.

The implementation of the present utility model will be described in detail below with reference to specific embodiments.

Referring to fig. 1 and 2, a preferred embodiment of the present utility model is provided.

The utility model provides a PCB packaging structure compatible with USB2.0 and USB3.0, comprising:

the PCB substrate 1, the USB2.0 packaging module 2, the mounting slot 3, the expansion packaging module 4 and the USB interface chip 5.

Specifically, the USB2.0 package module 2 and the mounting slot 3 are both disposed on the PCB substrate 1, and the USB2.0 package module 2 is electrically connected to the mounting slot 3, the expansion package module 4 is detachably disposed in the mounting slot 3, and the expansion package module 4 is electrically connected to the USB2.0 package module 2 through the mounting slot 3 to form a USB3.0 package module.

It should be noted that, the USB3.0 encapsulation module and the ISB2.0 encapsulation module correspond to the USB3.0 interface and the USB2.0 interface respectively, the USB3.0 interface and the USB2.0 interface are both one type of USB interfaces, and the USB3.0 interface is a subsequent upgrade type of the USB2.0 interface, and structurally, the USB3.0 interface and the USB2.0 interface have a consistent part, and can be modified based on the USB2.0 interface, thereby forming the USB3.0 interface.

In the present utility model, the USB3.0 package module is formed by electrically connecting the USB2.0 package module 2 and the expansion package module 4, wherein the expansion package module 4 is detachably disposed in the mounting slot 3, and it can be understood that when the expansion package module 4 is disposed in the mounting slot 3, the PCB package structure is a USB3.0 interface, and when the expansion package module 4 is detached, the PCB package structure is a USB2.0 interface.

In practical application, some products only need a USB2.0 interface, and the USB3.0 interface can be compatible with the USB2.0 interface, but the cost is higher than that of the pure USB2.0 interface, at the moment, by using the utility model, the USB3.0 interface can be modified into the USB2.0 interface by disassembling the expansion packaging module 4, and the disassembled expansion packaging module 4 can be used in the subsequent production of a PCB packaging structure, thereby saving the cost.

Specifically, the USB interface chip 5 is disposed on the PCB substrate 1, the USB interface chip 5 is electrically connected to the USB2.0 package module 2 and the mounting slot 3, and the USB interface chip 5 is used for communicating with an external device.

More specifically, in the present utility model, the USB2.0 package module 2 plus the USB interface chip 5 form a complete USB2.0 interface, and the USB2.0 package module 2, the expansion package module 4 plus the USB interface chip 5 form a complete USB3.0 interface.

according to the utility model, the USB2.0 packaging module 2 and the expansion packaging module 4 are used for forming the USB3.0 interface, wherein the expansion packaging module 4 is detachably arranged on the PCB substrate 1 through the mounting slot 3, when a product needs the USB2.0 interface, the USB3.0 interface is not required to be directly used for considering the USB2.0 interface, the expansion packaging module 4 is detached, and the USB3.0 interface is modified into the USB2.0 interface, so that the cost saving is realized, and the problem that the cost loss is caused when the USB2.0 interface is directly used for considering the USB3.0 interface in the prior art is solved.

In some embodiments, the USB2.0 package module 2 includes 4pin conductive contacts 6, and the expansion package module 4 is a 5pin conductive contact 6.

Specifically, the conductive contact 6 is a chip-like device that realizes electrical connection by contact, and has a function of transmitting an electrical signal.

More specifically, the 4pin conductive contacts 6 and the 5pin conductive contacts 6 are a manner of arranging the conductive contacts 6, the 4pin conductive contacts 6 are arranged in a row uniformly with four conductive contacts 6, and the 5pin conductive contacts 6 are arranged in a row uniformly with five conductive contacts 6.

It should be noted that, in the structure of the USB3.0 interface, the 4pin conductive contact 6 is disposed at the front and the 5pin conductive contact 6 is disposed at the rear, so in the present utility model, the expansion package module 4 is disposed at the rear end of the USB2.0 package module 2.

In some embodiments, USB interface chip 5 is a CH375 chip.

Specifically, CH375 is a universal interface chip for a USB bus that supports the USB-HOST HOST mode and the USB-DEVICE/SLAVE DEVICE mode.

In the utility model, the USB interface chip 5 is electrically connected with the USB2.0 packaging module 2 and the mounting slot 3 respectively, so as to realize electrical connection with external equipment, thereby realizing a communication function.

It should be noted that, the PCB packaging structure is a design concept, and the layout of the product needs to be considered, and since the USB interface needs to be connected to an external device to realize connection and transmission of an electrical signal, the USB interface chip 5 cannot be blocked in front of the interface, that is, the USB interface chip 5 is disposed at the rear end of the expansion package module 4.

The foregoing description of the preferred embodiments of the utility model is not intended to be limiting, but rather is intended to cover all modifications, equivalents, and alternatives falling within the spirit and principles of the utility model.

Claims

1. A PCB packaging structure compatible with USB2.0 and USB3.0, comprising:

2. The USB2.0 and USB3.0 compatible PCB package structure of claim 1, wherein said USB2.0 package module includes 4pin conductive contacts.

3. The PCB packaging structure compatible with USB2.0 and USB3.0 of claim 1, wherein the expansion package module includes 5pin conductive contacts.

4. The PCB packaging structure compatible with USB2.0 and USB3.0 as claimed in claim 1, wherein said USB interface chip is a CH375 chip.

5. The PCB packaging structure compatible with USB2.0 and USB3.0 according to claim 1, wherein the expansion package module is disposed at a rear end of the USB2.0 package module.

6. The PCB packaging structure compatible with USB2.0 and USB3.0 of claim 5, wherein the USB interface chip is disposed at a rear end of the expansion package module.