CN218918057U - Novel core module with improved structure - Google Patents

Abstract

The utility model discloses a novel core module with an improved structure, which comprises a module main board, a camera interface, a T card and SIM card interface, a screen interface and a power interface, wherein the camera interface is arranged on one side of the surface of the module main board, the T card and SIM card interface is arranged on the surface of the module main board on one side of the camera interface, the screen interface is arranged on the surface of the module main board on one side of the T card and SIM card interface, the surface of the module main board on one side of the camera interface, which is far away from the T card and SIM card interface, is provided with a diversity antenna interface, the power interface is arranged on the other side of the surface of the module main board, and the surface of the module main board on one side of the power interface is provided with a main antenna interface. The utility model has the advantages of no need of patches for external expansion connection, plug and play, good electrical property and anti-interference property, stable and reliable work, reduced operation cost by adopting a manual disassembly and assembly mode, rich functions, high integration level and simple design.

Description

Novel core module with improved structure

Technical Field

The utility model relates to the technical field of modules, in particular to a novel core module with an improved structure.

Background

The core module is a module which encapsulates the core function, such as an electronic main board, an integrated chip, a memory, a power amplifier device and the like, and provides a standard interface, wherein the interface mainly comprises an LCD circuit, a Camera circuit, a USB circuit, a SIM circuit, a keyboard circuit and other interface circuits, a built-in main control chip, a memory and a communication module, and various terminals realize different functions such as communication or positioning by means of the module, and the core module is widely applied to POS, PDA, intelligent home, internet of vehicles, medical appliances, video monitoring, food tracing and other various industrial control fields.

The electrical characteristic and the anti-interference characteristic of the core module are general, the operation is not stable and reliable enough, the module is more troublesome to operate when being connected in an outward expansion mode, meanwhile, the integration level of the module is not high, the function is single, and the processing cost and the operation cost are high, so that a novel core module is provided.

Disclosure of Invention

The present utility model aims to provide a novel core module with an improved structure, so as to solve the problems set forth in the background art.

In order to achieve the above purpose, the present utility model provides the following technical solutions: the utility model provides a novel core module of improvement structure, includes module mainboard, camera interface, T card & SIM card interface, screen interface and power source, the camera interface sets up in one side of module mainboard surface, T card & SIM card interface sets up the module mainboard surface in camera interface one side, the screen interface sets up the module mainboard surface in T card & SIM card interface one side, the module mainboard surface that T card & SIM card interface one side was kept away from to the camera interface is provided with diversity antenna interface, power source sets up the opposite side on the module mainboard surface, the module mainboard surface of power source one side is provided with main antenna interface, the module mainboard surface of power source opposite side is provided with trinity antenna interface, just the module mainboard surface of trinity antenna interface one side is provided with active GPS interface.

Preferably, an external expansion interface is arranged on one side of the surface of the module main board, and plug and play is realized without a patch in external expansion connection.

Preferably, the module main board adopts ten layers of HDI gold deposition process, has good electrical characteristics and anti-interference characteristics, and works stably and reliably.

Preferably, the module main board has 142 pins.

Preferably, the module main board adopts a non-stamp hole, no paster is needed, the secondary furnace passing of the main board is avoided, and the production difficulty and the production cost are reduced.

Preferably, the module main plate has a size of 60mm by 49mm by 3.2mm.

Compared with the prior art, the utility model has the beneficial effects that: the novel core module with the improved structure has the advantages that the novel core module is externally connected without a patch, can be plugged and used, has good electrical characteristics and anti-interference characteristics, works stably and reliably, reduces the operation cost by adopting a manual disassembly and assembly mode, has rich functions, high integration level and simple design;

(1) This novel core module passes through outside expansion interface, the connection of expanding need not the paster, plug and play, high integration can realize the peripheral and have no IC design entirely, from taking WIFI, bluetooth, GPS, USB, UART, SPI, I2C, GPIO function, the function is abundant, PCB adopts ten layers of HDI to sink gold technology, have good electrical property and anti-interference characteristic, job stabilization is reliable, adopt non-stamp hole, need not the paster, avoid the mainboard to pass the stove secondarily, reduce the production degree of difficulty and manufacturing cost, adopt manual dismouting mode, the running cost has been reduced, not only integrated common communication function in addition, still integrate charging circuit, audio power amplifier and backlight circuit, can realize peripheral and have no IC design entirely, only increase the connector can, the integrated level is high, and simple design.

Drawings

FIG. 1 is a schematic view of a module stack structure according to the present utility model;

FIG. 2 is a schematic diagram of a layout structure of a module interface according to the present utility model;

FIG. 3 is an enlarged schematic view of the structure of FIG. 2A according to the present utility model;

fig. 4 is an enlarged schematic view of the structure of fig. 2B according to the present utility model.

In the figure: 1. a module motherboard; 2. a camera interface; 3. t card & SIM card interface; 4. a screen interface; 5. an external expansion interface; 6. a power interface; 7. a main antenna interface; 8. diversity antenna interfaces; 9. three-in-one antenna interface; 10. an active GPS interface.

Detailed Description

The technical solutions of the embodiments of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present utility model, and all other embodiments obtained by those skilled in the art without making any inventive effort based on the embodiments of the present utility model are within the scope of protection of the present utility model.

Referring to fig. 1-4, an embodiment of the present utility model is provided: the novel core module with the improved structure comprises a module main board 1, a camera interface 2, a T card and SIM card interface 3, a screen interface 4 and a power interface 6, wherein the camera interface 2 is arranged on one side of the surface of the module main board 1;

the T card and SIM card interface 3 is arranged on the surface of the module main board 1 at one side of the camera interface 2;

the screen interface 4 is arranged on the surface of the module main board 1 at one side of the T card and SIM card interface 3;

a diversity antenna interface 8 is arranged on the surface of the module main board 1 on one side of the camera interface 2 far away from the T card and SIM card interface 3;

the power interface 6 is arranged on the other side of the surface of the module main board 1;

a main antenna interface 7 is arranged on the surface of the module main board 1 at one side of the power interface 6;

the surface of the module main board 1 at the other side of the power interface 6 is provided with a three-in-one antenna interface 9, and the surface of the module main board 1 at one side of the three-in-one antenna interface 9 is provided with an active GPS interface 10;

an external expansion interface 5 is arranged on one side of the surface of the module main board 1, and plug and play is realized without a patch in external expansion connection;

the module main board 1 adopts a ten-layer HDI gold deposition process, has good electrical characteristics and anti-interference characteristics, and works stably and reliably;

the module main board 1 has 142 pins in total;

the module main board 1 adopts non-stamp holes, no paster is needed, the secondary furnace passing of the main board is avoided, and the production difficulty and the production cost are reduced;

the dimensions of the module motherboard 1 were 60mm x 49mm x 3.2mm.

When the embodiment of the application is used, the following steps are adopted: firstly, adopting eight nuclear processors, 4G full network leads to, this novel core module is through outside extension interface 5, the connection need not the paster to expand, plug and play, high integration degree can realize the peripheral completely no IC design, from taking WIFI, bluetooth, GPS, USB, UART, SPI, I2C, GPIO function, the function is abundant, this novel core module is a full network 4G core module, adopt MT6765 treater, the PCB adopts ten layers HDI to sink gold technology, have good electrical property and interference killing feature, job stabilization is reliable, module collection 4G (LTE) 3G (WCDMA), GSM, GPS, WIFI, bluetooth, audio management, and functions such as low-power consumption power management, carry on android 8.1 operating system, connect the battery and can work, be the not two choices of realizing convenient mobile device ideal scheme, and still adopt non-stamp hole, need not the paster, avoid the mainboard secondary to cross the stove, reduce production and manufacturing cost, adopt manual dismouting mode, make the customer only need the very low bottom plate of goods cost, module and assemble shipment according to the purchase condition, reduce customer's product failure, even if there is the core module can also be used, but the integrated circuit is realized to realize the integrated circuit is not to the design, but complete IC is not required to change, the integrated circuit is realized, the integrated circuit is easy to connect, and can not have the IC is realized.

Claims (6)

1. The utility model provides a novel core module of improvement structure, its characterized in that, including module mainboard (1), camera interface (2), T card & SIM card interface (3), screen interface (4) and power source (6), camera interface (2) set up in one side on module mainboard (1) surface, T card & SIM card interface (3) set up in module mainboard (1) surface on one side of camera interface (2), screen interface (4) set up in module mainboard (1) surface on one side of T card & SIM card interface (3), module mainboard (1) surface on one side of T card & SIM card interface (3) is kept away from to camera interface (2) is provided with diversity antenna interface (8), power source (6) set up in the opposite side on module mainboard (1) surface, module mainboard (1) surface on one side of power source (6) is provided with main antenna interface (7), module mainboard (1) surface on the opposite side of power source (6) is provided with trinity antenna interface (9), just module mainboard (1) on one side of trinity antenna interface (9) is provided with active interface (10).

2. The improved novel core module of claim 1, wherein: an external expansion interface (5) is arranged on one side of the surface of the module main board (1).

3. The improved novel core module of claim 1, wherein: the module main board (1) adopts ten layers of HDI gold deposition processes.

4. The improved novel core module of claim 1, wherein: the module main board (1) is provided with 142 pins in total.

5. The improved novel core module of claim 1, wherein: the module main board (1) adopts a non-stamp hole.

6. The improved novel core module of claim 1, wherein: the size of the module main board (1) is 60mm 4 mm 3.2mm.

Images