CN219418955U - Integrated circuit packaging bonding wire machine heating block easy to attach - Google Patents
Integrated circuit packaging bonding wire machine heating block easy to attach Download PDFInfo
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- CN219418955U CN219418955U CN202320452847.8U CN202320452847U CN219418955U CN 219418955 U CN219418955 U CN 219418955U CN 202320452847 U CN202320452847 U CN 202320452847U CN 219418955 U CN219418955 U CN 219418955U
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Abstract
The utility model provides an integrated circuit packaging wire bonding machine heating block easy to attach, comprising: a fixing plate; the heating plate is arranged in the middle of the front surface of the fixed plate, the periphery of the heating plate is fixedly provided with a mounting device, the inside of the mounting device is rotatably provided with an adjusting device, and the outer surface of the adjusting device is in threaded engagement with a limiting device; the integrated circuit board is arranged in the middle of the front face of the heating plate. The utility model provides an integrated circuit packaging wire bonding machine heating block which is easy to attach, and four limiting devices are enabled to limit an integrated circuit board placed on the surface of a heating plate from the periphery by rotating the periphery to move on the surface of the heating plate through the threaded engagement limiting devices of the adjusting devices, so that the stability of the integrated circuit board when packaged on the heating plate is kept.
Description
Technical Field
The utility model relates to the field of integrated circuits, in particular to an integrated circuit packaging wire bonding machine heating block easy to attach.
Background
The integrated circuit board is made up by using semiconductor manufacturing process, and making several components of transistor, resistor and capacitor on a small monocrystalline silicon wafer, and combining them into a complete electronic circuit according to the method of multilayer wiring or tunnel wiring, and in the circuit the letter "IC" (also using letter "N" etc.) is used.
An integrated circuit is a miniature electronic device or component, which is made up by interconnecting the transistors, resistors, capacitors and inductors, etc. needed in a circuit and wiring together, and then making them into a miniature structure with needed circuit function by making them on a small or several small semiconductor wafers or dielectric substrates and then packaging them in a tube shell.
The integrated circuit is packaged by a wire bonding machine during packaging, in the prior art, a heating block in the wire bonding machine and a pressing plate are mutually extruded to package the integrated circuit, the packaging failure can not be completely caused by insufficient compactness between the heating block and the pressing plate through mechanical pressing, equipment is unstable, for example, the heating block of the integrated circuit packaging wire bonding machine which is easy to attach and is disclosed as CN211088207U is provided with a vacuum hole, and gas in the hole is extracted through a vacuum pump, so that the contact between the pressing plate and the heating block forms vacuum contact, the vacuum adsorption force is improved, the pressing effect is improved, the bonding stability is improved, NSOP and spherical failure are reduced, and the packaging close attaching degree is improved; on the one hand, vacuum lamination is utilized, on the other hand, the whole packaging is more stable through the cooperation of the boss and the pressing plate in a mechanical contact manner, but the position of the pressing plate cannot be fixed due to the fact that the pressing plate is attracted by the suction force of the air pump, the pressing plate is easily deflected due to external vibration, the positions of the fixed vacuum holes cannot be adjusted, and the integrated circuit board packaging with larger size cannot be adapted.
Therefore, there is a need to provide an integrated circuit package wire bonding machine heating block that is easy to attach.
Disclosure of Invention
The utility model provides an integrated circuit packaging wire bonding machine heating block easy to attach, which solves the problems that the suction force of an air pump is used for sucking a pressing plate, the position of the pressing plate cannot be fixed, the pressing plate is easy to deviate due to external vibration, a plurality of fixed vacuum holes cannot adjust the position, and the integrated circuit packaging block cannot adapt to the packaging of an integrated circuit board with larger size.
In order to solve the technical problems, the utility model provides an integrated circuit packaging wire bonding machine heating block easy to attach, comprising: a fixing plate;
the heating plate is arranged in the middle of the front face of the fixed plate, mounting devices are fixedly mounted on the periphery of the heating plate, an adjusting device is rotatably mounted in the mounting devices, and a limiting device is engaged with the outer surface of the adjusting device in a threaded manner;
and the integrated circuit board is arranged in the middle of the front face of the heating plate.
Preferably, the installation device comprises an installation block, a chute is arranged in the middle of the front face of the installation block, and a communication hole is arranged in the middle of one side of the inner cavity of the chute.
Preferably, the adjusting device comprises a threaded rod, and an adjusting block is fixedly arranged at one end of the threaded rod.
Preferably, the limiting device comprises a push plate, a connecting rod is arranged in the middle of one side of the push plate, a moving block is fixed at the other end of the connecting rod, and a threaded hole is formed in the moving block.
Preferably, the middle of one side of the push plate is fixedly provided with a connecting device, the middle of one side of the connecting rod is provided with a thread groove, and the inner thread of the thread groove is engaged with a bolt.
Preferably, the connecting device comprises a connecting column, a clamping groove is formed in the middle of one side of the connecting column, a setting hole is formed in one side of an inner cavity of the clamping groove, and a mounting hole is formed in the other side of the inner cavity of the clamping groove.
Compared with the related art, the heating block of the integrated circuit packaging wire bonding machine, which is easy to attach, has the following beneficial effects:
the utility model provides an integrated circuit packaging wire bonding machine heating block which is easy to attach, and four limiting devices are enabled to limit an integrated circuit board placed on the surface of a heating plate from the periphery by rotating the periphery to move on the surface of the heating plate through the threaded engagement limiting devices of the adjusting devices, so that the stability of the integrated circuit board when packaged on the heating plate is kept.
Drawings
Fig. 1 is a schematic structural diagram of a first embodiment of a bonding wire machine heating block for integrated circuit package with easy bonding according to the present utility model;
FIG. 2 is a schematic cross-sectional view of the mounting device shown in FIG. 1;
FIG. 3 is a schematic view of the limiting device shown in FIG. 1;
fig. 4 is a schematic structural diagram of a second embodiment of a bonding wire machine heating block for integrated circuit package with easy bonding according to the present utility model;
fig. 5 is an enlarged schematic view at a shown in fig. 4.
Reference numerals in the drawings: 1. the fixing plate, 2, the heating plate, 3, the integrated circuit board, 4, the mounting device, 41, the mounting block, 42, the sliding chute, 43, the communication hole, 5, the adjusting device, 51, the threaded rod, 52, the adjusting block, 6, the limiting device, 61, the push plate, 62, the connecting rod, 63, the moving block, 64, the threaded hole, 7, the connecting device, 71, the connecting column, 72, the clamping groove, 73, the setting hole, 74, the mounting hole, 8, the threaded groove, 9 and the bolt.
Detailed Description
The utility model will be further described with reference to the drawings and embodiments.
Referring to fig. 1, fig. 2 and fig. 3 in combination, fig. 1 is a schematic structural diagram of a first embodiment of a heating block of an integrated circuit package bonding machine with easy bonding according to the present utility model; FIG. 2 is a schematic cross-sectional view of the mounting device shown in FIG. 1; fig. 3 is a schematic structural view of the limiting device shown in fig. 1. An integrated circuit package wire bonding machine heating block easy to attach, comprising: a fixing plate 1;
the heating plate 2 is arranged in the middle of the front face of the fixed plate 1, the installation devices 4 are fixedly installed on the periphery of the heating plate 2, the adjusting devices 5 are rotatably installed in the installation devices 4, and the limiting devices 6 are in threaded engagement with the outer surfaces of the adjusting devices 5;
and an integrated circuit board 3, wherein the integrated circuit board 3 is arranged in the middle of the front surface of the heating plate 2.
The mounting device 4 comprises a mounting block 41, a sliding groove 42 is formed in the middle of the front face of the mounting block 41, and a communication hole 43 is formed in the middle of one side of the inner cavity of the sliding groove 42.
The adjusting device 5 comprises a threaded rod 51, and an adjusting block 52 is fixedly arranged at one end of the threaded rod 51.
The threaded rod 51 is rotatably connected to the inside of the chute 42, and one end of the threaded rod 51 extends out of the outer surface of the mounting block 41 through the communication hole 43 to be connected with the adjusting block 52.
The limiting device 6 comprises a push plate 61, a connecting rod 62 is arranged in the middle of one side of the push plate 61, a moving block 63 is fixedly arranged at the other end of the connecting rod 62, and a threaded hole 64 is formed in the moving block 63.
The moving block 63 is threadedly engaged with the outer surface of the threaded rod 51 through the threaded hole 64, and the moving block 63 is limited to slide only by the slide groove 42.
The utility model provides an integrated circuit packaging wire bonding machine heating block easy to attach, which has the following working principle:
when the integrated circuit board packaging device works, firstly, a user places the integrated circuit board 3 to be packaged on the surface of the heating plate 2, the user sequentially rotates the surrounding adjusting blocks 52, the adjusting blocks 52 drive the threaded rods 51 to rotate, the threaded holes 64 of the moving blocks 63 are engaged with threads when the threaded rods 51 rotate, so that the four moving blocks 63 move towards the integrated circuit board 3 of the heating plate 2, and the four pushing plates 61 limit the integrated circuit board 3 from the surrounding.
Compared with the related art, the heating block of the integrated circuit packaging wire bonding machine, which is easy to attach, has the following beneficial effects:
the utility model provides an integrated circuit packaging wire bonding machine heating block which is easy to attach, and four limiting devices 6 limit an integrated circuit board placed on the surface of a heating plate 2 from the periphery by rotating the four limiting devices 5 to move on the surface of the heating plate 2 in a threaded engagement manner, so that the stability of the integrated circuit board 3 when packaged on the heating plate 2 is maintained.
Second embodiment
Referring to fig. 4 and 5 in combination, another integrated circuit package bonding wire machine heating block easy to attach is provided according to a second embodiment of the present application. The second embodiment is merely a preferred manner of the first embodiment, and implementation of the second embodiment does not affect the implementation of the first embodiment alone.
Specifically, the second embodiment of the present application provides an integrated circuit packaging bonding wire machine heating block easy to laminate, which is characterized in that, an integrated circuit packaging bonding wire machine heating block easy to laminate, the middle of one side of the push plate 61 is fixedly provided with a connecting device 7, the middle of one side of the connecting rod 62 is provided with a thread groove 8, and the internal thread of the thread groove 8 is meshed with a bolt 9.
The connecting device 7 comprises a connecting column 71, a clamping groove 72 is formed in the middle of one side of the connecting column 71, a setting hole 73 is formed in one side of the inner cavity of the clamping groove 72, and a mounting hole 74 is formed in the other side of the inner cavity of the clamping groove 72.
The bolt 9 is threaded through the setting hole 73 and the thread groove 8.
The utility model provides an integrated circuit packaging wire bonding machine heating block easy to attach, which has the following working principle:
in operation, first, the user rotates the bolt 9 to move out of the thread groove 8 so that the connection device 7 is not limited by the bolt 9, the user removes the push plate 61 and the connection device 7, installs the push plate 61 having the shape adapted to the shape of the integrated circuit board on the outer surface of the connection rod 62, and inserts the bolt 9 into the setting hole 73 to be threadedly engaged with the thread groove 8 and to be inserted into the installation hole 74.
Compared with the related art, the heating block of the integrated circuit packaging wire bonding machine, which is easy to attach, has the following beneficial effects:
the utility model provides an integrated circuit packaging wire bonding machine heating block which is easy to attach, wherein a push plate 61 and a connecting rod 62 are installed or detached through bolts 9 and a connecting device 7.
The foregoing description is only illustrative of the present utility model and is not intended to limit the scope of the utility model, and all equivalent structures or equivalent processes or direct or indirect application in other related technical fields are included in the scope of the present utility model.
Claims (6)
1. An integrated circuit package wire bonding machine heating block easy to attach, comprising: a fixing plate;
the heating plate is arranged in the middle of the front face of the fixed plate, mounting devices are fixedly mounted on the periphery of the heating plate, an adjusting device is rotatably mounted in the mounting devices, and a limiting device is engaged with the outer surface of the adjusting device in a threaded manner;
and the integrated circuit board is arranged in the middle of the front face of the heating plate.
2. The heating block for an integrated circuit package wire bonding machine easy to attach according to claim 1, wherein the mounting device comprises a mounting block, a chute is formed in the middle of the front face of the mounting block, and a communication hole is formed in the middle of one side of the inner cavity of the chute.
3. The integrated circuit package wire bonding machine heating block of claim 1 wherein the adjustment means comprises a threaded rod having one end fixedly mounted with the adjustment block.
4. The heating block for an integrated circuit package wire bonding machine easy to attach according to claim 1, wherein the limiting device comprises a push plate, a connecting rod is arranged in the middle of one side of the push plate, a moving block is fixedly arranged at the other end of the connecting rod, and a threaded hole is formed in the moving block.
5. The heat block of claim 4, wherein the connecting device is fixedly mounted in the middle of one side of the pushing plate, the connecting rod is provided with a thread groove in the middle of one side, and the internal thread of the thread groove is engaged with a bolt.
6. The integrated circuit package wire bonding machine heating block of claim 5, wherein the connecting device comprises a connecting column, a clamping groove is formed in the middle of one side of the connecting column, a setting hole is formed in one side of an inner cavity of the clamping groove, and a mounting hole is formed in the other side of the inner cavity of the clamping groove.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320452847.8U CN219418955U (en) | 2023-03-11 | 2023-03-11 | Integrated circuit packaging bonding wire machine heating block easy to attach |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320452847.8U CN219418955U (en) | 2023-03-11 | 2023-03-11 | Integrated circuit packaging bonding wire machine heating block easy to attach |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219418955U true CN219418955U (en) | 2023-07-25 |
Family
ID=87233351
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202320452847.8U Active CN219418955U (en) | 2023-03-11 | 2023-03-11 | Integrated circuit packaging bonding wire machine heating block easy to attach |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN219418955U (en) |
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2023
- 2023-03-11 CN CN202320452847.8U patent/CN219418955U/en active Active
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