CN219417313U - Device for detecting bonding quality of quartz wafer conductive adhesive on site - Google Patents
Device for detecting bonding quality of quartz wafer conductive adhesive on site Download PDFInfo
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- CN219417313U CN219417313U CN202223388866.3U CN202223388866U CN219417313U CN 219417313 U CN219417313 U CN 219417313U CN 202223388866 U CN202223388866 U CN 202223388866U CN 219417313 U CN219417313 U CN 219417313U
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Abstract
The device for detecting the bonding quality of the quartz wafer conductive adhesive on site is used for monitoring the bonding quality of the quartz wafer conductive adhesive on line and comprises a working bench, a teaching module, an image recognition module, a test position alignment module, a test probe module, a rotary platform module, a digital bridge, a computer and a software system, wherein the teaching module, the image recognition module, the test position alignment module, the test probe module, the rotary platform module, the digital bridge and the computer are arranged on the working bench. The utility model realizes real-time effective control of the processing technology and quality of the quartz resonator by monitoring the quality of the conductive adhesive at the processing front section of the quartz resonator, thereby achieving the purposes of improving the yield of products and avoiding the waste of production resources.
Description
Technical Field
The utility model relates to the technical field of quartz crystal manufacturing, in particular to a device for detecting the quality of conductive adhesive of a quartz wafer in situ in the quartz crystal production process.
Background
With the rapid development of electronic information technology, the fields of aerospace, navigation, communication, measurement and control and the like provide higher and higher requirements for indexes such as short-term stability, long-term stability and reliability of a frequency source. High stability quartz crystal is required to have extremely low fault tolerance as a core component of a high precision frequency source, so that reliability is increasingly important.
At present, quartz crystal production enterprises are controlling the quality of raw materials and auxiliary materials in the production process to the greatest extent, wherein the quality comprises the purity of quartz materials, the materials of a base and an elastic sheet, a cleaning solvent, conductive adhesive and the like; meanwhile, the control of the processing technology, such as the cleaning time, the cleaning mode, the glue amount of the conductive glue, the curing time, the curing temperature and the like, is more focused, so that the processed product has higher yield. In the production process of the quartz resonator, the control of the processing front section plays a decisive role, wherein the dispensing process is used as a key node for processing the quartz resonator, and the bonding quality of glue directly influences key indexes such as resistance, electrostatic capacity and the like of the resonator and the electrical performance of the resonator in the whole life cycle. However, since there is no better detection device in the front stage of the processing of the quartz resonator at present, the indexes such as resistance and DLD of the resonator product are generally required to be integrally tested after the processing is completed, and the method has the defect that the hidden trouble problem in the resonator processing process cannot be eliminated in time, so that the yield of the final product is low, and the waste of production resources is caused.
Disclosure of Invention
The utility model provides a device for detecting the conductive adhesive quality of a quartz wafer on site, which aims to realize real-time effective control of the processing technology and quality of the quartz resonator by monitoring the conductive adhesive quality of the processing front section of the quartz resonator, thereby achieving the purposes of improving the yield of products and avoiding the waste of production resources.
In order to achieve the above purpose, the present utility model adopts the following technical scheme:
the device for detecting the conductive adhesive quality of the quartz wafer on site comprises a working bench, a teaching module, an image recognition module, a test position alignment module, a test probe module, a rotary platform module, a digital bridge, a computer and a software system, wherein the teaching module, the image recognition module, the test position alignment module, the test probe module, the rotary platform module, the digital bridge and the computer are arranged on the working bench; wherein:
the teaching module is used for inputting the tested range determined by calculation into the image recognition module system;
the image recognition module is used for accurately recognizing the testable region on the wafer electrode;
the test position alignment module is used for accurately aligning the tested position according to the image identification;
a test probe module for directly contacting a unit of a testable area;
the rotating platform module is used for rotating the wafer to the other surface after one surface of the wafer is tested;
the digital bridge is used for testing the on-resistance value of the conductive adhesive;
and the computer and the software system are used for receiving feedback signals of all the modules, and driving and coordinating the actions of all the modules.
The device for detecting the conductive adhesive quality of the quartz wafer on site comprises the testing position alignment module, wherein the testing position alignment module comprises an X-axis and Z-axis adjusting assembly and a Y-axis adjusting assembly, the X-axis and Z-axis adjusting assembly and the Y-axis adjusting assembly are all screw nut transmission assemblies driven by a motor, nuts axially move along the screw, and the Y-axis adjusting assembly is arranged on the nuts of the X-axis and Z-axis adjusting assembly.
According to the device for detecting the conductive adhesive quality of the quartz wafer on site, the image recognition module and the test probe module are both arranged on the nut of the Y-axis adjusting assembly, and the Y-axis motor drives the screw nut transmission assembly to drive the image recognition module and the test probe module to approach or be far away from a tested workpiece.
According to the device for detecting the conductive adhesive quality of the quartz wafer on site, the test probe module is provided with two groups of spring probes in parallel.
The device for detecting the bonding quality of the quartz wafer conductive adhesive on site is characterized in that the rotating platform module is provided with a rotating motor and a rotating platform, an output shaft of the rotating motor is connected with the rotating platform, and a workpiece to be tested is mounted on the rotating platform.
The utility model provides a device for detecting the quality of conductive adhesive of a quartz wafer on site, which can judge the bonding quality of the conductive adhesive by testing the on-resistance of the conductive adhesive on line, can monitor the quality of raw materials and the execution condition of a processing technology in the process of the front section of the quartz resonator in time, can analyze through real-time statistical data, and is convenient for judging and processing the quality problems of workpieces in the processing process in time, thereby achieving the purposes of improving the yield of products and avoiding the waste of production resources.
Drawings
FIG. 1 is a schematic diagram of the structure of a workpiece to be inspected;
FIG. 2 is a side view of FIG. 1;
FIG. 3 is a schematic diagram of an apparatus for in-situ detection of the quality of conductive adhesive on quartz wafers;
fig. 4 is a flow chart of a method for in-situ testing the bonding quality of a quartz wafer conductive paste.
The reference numerals in the drawings are respectively as follows:
1 is a detected workpiece, 1-1 is a testable area, 1-2 is a core energy area of wafer oscillation, 1-3 is a bevel area, and 1-4 is a crystal lead;
2 is a teaching module; 3 is an image recognition module; 4 is a Y-axis adjusting component; 5 is an X-axis and Z-axis adjusting component; 6, a digital bridge; 7 is a computer and software system; 8 is a rotary platform module; 9 is a test probe module; 10 is a work bench.
Detailed Description
The utility model will be further described with reference to the accompanying drawings and specific examples.
Referring to fig. 3, the utility model provides a device for detecting the conductive adhesive quality of a quartz wafer on site, which is used for detecting the conductive adhesive quality of the quartz wafer, and comprises a workbench 10, a teaching module 2, an image recognition module 3, a test position alignment module, a test probe module 9, a rotary platform module 8, a digital bridge 6, a computer and a software system 7, wherein the teaching module 2, the image recognition module 3, the test position alignment module, the test probe module 9 and the digital bridge 6 are arranged on the workbench 10; wherein:
the teaching module 2 is used for inputting the tested range determined by calculation into the image recognition module 3 system;
an image recognition module 3 for precisely recognizing the testable region 1-1 on the wafer electrode;
the test position alignment module is used for accurately aligning a tested position according to image recognition and comprises an X-axis and Z-axis adjusting assembly 5 and a Y-axis adjusting assembly 4, wherein the X-axis and Z-axis adjusting assembly 5 and the Y-axis adjusting assembly 4 are all screw nut transmission assemblies driven by a motor, a screw is driven by the motor to rotate, a nut moves along the axial direction of the screw, and the Y-axis adjusting assembly is arranged on the nut of the X-axis and Z-axis adjusting assembly 5;
the test probe module 9 is used for directly contacting the unit of the testable area 1-1, the image recognition module 3 and the test probe module 9 are both arranged on the nut of the Y-axis adjusting assembly 4, two groups of spring probes are arranged on the test probe module 9 in parallel, and the lead screw nut transmission assembly is driven by the Y-axis motor to drive the two groups of spring probes of the image recognition module 3 and the test probe module 9 to approach or be far away from the tested workpiece 1;
the rotary platform module 8 is used for rotating the wafer to the other surface after one surface of the wafer is tested, a rotary motor and a rotary table are arranged in the rotary platform module 8, an output shaft of the rotary motor is connected with the rotary table, and a workpiece 1 to be tested is mounted on the rotary table;
the digital bridge 6 is used for testing the on-resistance value of the conductive adhesive;
and the computer and software system 7 is used for receiving feedback signals of all the modules and driving and coordinating the actions of all the modules.
Referring to fig. 1, 2, 3 and 4, the device for detecting the conductive adhesive quality of a quartz wafer in situ according to the present utility model detects the conductive adhesive quality after the gluing and curing operations are completed in the production process of the quartz resonator, and the operation steps are as follows:
a. according to the information of the size, frequency and the like of the detected workpiece 1, the method utilizes the oscillation energy range formula of the wafer to determine the oscillation core energy area 1-2 of the wafer, and because the oscillation is mainly concentrated in the core energy area when the wafer works normally, the quality of products can be directly affected if the areas (quartz body and coating) are damaged, therefore, the areas need to be avoided in the test, the utility model determines the oscillation core energy area of each detected wafer according to the following formula and referring to different processes and empirical values, and the oscillation core energy range of the detected workpiece 1 is the diameter d a Is calculated by the following formula:wherein d is a The core energy region diameter, n is the harmonic overtones number (n=1, 3,5 …), h is the wafer thickness, and R is the coating radius on the wafer. Since the test area needs to satisfy two conditions: 1) A non-oscillating core energy region; 2) This area needs to be coated. According to the above conditions, there are two testable areas 1-1 on the wafer, on the front and back surfaces of the wafer, respectively, and under normal conditions, the testable areas are described as starting from the center of the wafer, except the core energy area 1-2 of the wafer oscillation, on the plating layer inside the chamfered area 1-3, if the wafer has chamfered edges, avoiding the chamfered area 1-3;
b. c, taking the top point of an included angle between the spring plate and the upper right (or lower right) of the electrode as a positioning origin according to the wafer testable region 1-1 determined in the step a, and inputting the top point into an image recognition module 3 system through a teaching module 2 to accurately identify the testable region 1-1;
c. the method comprises the steps of starting a test, clamping a tested workpiece 1, placing the tested workpiece on a rotary platform module 8, starting an image recognition module 3 and an alignment module, enabling a probe of a test probe module 9 to contact a test area of a wafer electrode through an X-axis and Z-axis adjusting assembly 5 and a Y-axis adjusting assembly 4, wherein the actual test points are crystal leads 1-4 and the wafer electrode, the crystal leads and the wafer electrode are metal, are good conductors, neglecting trace impedance generated by the crystal leads and the wafer electrode, and the resistance measured between the crystal leads 1-4 and the wafer electrode is the on-resistance of conductive adhesive, reading the resistance value through a digital bridge 6, completing single-sided test of the workpiece, and then rotating the rotary platform module 8 by 180 degrees to test the other surface of the tested workpiece 1, wherein the resistance value read twice is the on-resistance value of the conductive adhesive;
d. displaying and storing the resistance value obtained by the test in a database for analyzing the bonding quality of the conductive adhesive of the workpiece and tracing the product, reworking or scrapping the workpiece which does not meet the requirement, and entering the next processing procedure by the qualified workpiece, wherein the information in the database further comprises: the production lot number, the base model, the base manufacturer, the wafer cleaning condition, the glue curing process, the glue curing equipment and the like.
Claims (3)
1. The device for detecting the conductive adhesive quality of the quartz wafer on site is used for detecting the conductive adhesive quality of the quartz wafer, and comprises a workbench frame (10), a teaching module (2), an image recognition module (3), a test position alignment module, a test probe module (9), a rotary platform module (8), a digital bridge (6), a computer and a software system (7) which are arranged on the workbench frame (10); wherein:
the teaching module (2) is used for inputting the tested range determined by calculation into the image recognition module (3) system;
an image recognition module (3) for precisely recognizing the testable region (1-1) on the wafer electrode;
the test position alignment module is used for accurately aligning the tested position according to the image identification;
a test probe module (9) for directly contacting the unit of the testable area (1-1);
a rotating platform module (8) for rotating the wafer to the other surface after the test of one surface of the wafer is completed;
a digital bridge (6) for testing the on-resistance value of the conductive adhesive;
the computer and software system (7) is used for receiving feedback signals of all the modules, and driving and coordinating actions of all the modules;
the method is characterized in that: the test position alignment module comprises an X-axis and Z-axis adjusting assembly (5) and a Y-axis adjusting assembly (4), wherein the X-axis and Z-axis adjusting assembly (5) and the Y-axis adjusting assembly (4) are all screw nut transmission assemblies driven by a motor, nuts axially move along the screw, and the Y-axis adjusting assembly is arranged on the nuts of the X-axis and Z-axis adjusting assembly (5);
the image recognition module (3) and the test probe module (9) are both arranged on nuts of the Y-axis adjusting assembly (4), and the Y-axis motor drives the screw nut transmission assembly to drive the image recognition module (3) and the test probe module (9) to approach or be far away from the tested workpiece (1).
2. The apparatus for in-situ detection of conductive adhesive quality of quartz wafers of claim 1, wherein: the test probe module (9) is provided with two groups of spring probes in parallel.
3. The apparatus for in-situ detection of conductive adhesive quality of quartz wafers of claim 1, wherein: the rotary platform module (8) is provided with a rotary motor and a rotary table, an output shaft of the rotary motor is connected with the rotary table, and a workpiece (1) to be tested is mounted on the rotary table.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202223388866.3U CN219417313U (en) | 2022-12-17 | 2022-12-17 | Device for detecting bonding quality of quartz wafer conductive adhesive on site |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202223388866.3U CN219417313U (en) | 2022-12-17 | 2022-12-17 | Device for detecting bonding quality of quartz wafer conductive adhesive on site |
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| Publication Number | Publication Date |
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| CN219417313U true CN219417313U (en) | 2023-07-25 |
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| CN202223388866.3U Active CN219417313U (en) | 2022-12-17 | 2022-12-17 | Device for detecting bonding quality of quartz wafer conductive adhesive on site |
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| CN (1) | CN219417313U (en) |
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