CN219404877U

CN219404877U - Thermosensitive semiconductor dicing saw

Info

Publication number: CN219404877U
Application number: CN202320266946.7U
Authority: CN
Inventors: 李东祥; 谭明传; 秦连杰; 孙芳芳; 谭森
Original assignee: Yantai Xinrui Semiconductor Co ltd
Current assignee: Yantai Xinrui Semiconductor Co ltd
Priority date: 2023-02-17
Filing date: 2023-02-17
Publication date: 2023-07-25
Anticipated expiration: 2033-02-17

Abstract

The application relates to a thermosensitive semiconductor scribing machine, including the scribing machine body, horizontal sliding connection has the cutting platform on the scribing machine body, and cutting platform horizontal sliding connection has the cutting cylinder, and cutting cylinder telescopic shaft fixedly connected with tool bit, two compression cylinders of fixedly connected with on the cutting platform compress tightly the vertical downwardly setting of cylinder telescopic section and fixedly connected with layering, and the scribing machine body is equipped with the objective table, and the objective table is located the cutting platform below. The semiconductor device is arranged on the object stage, and the telescopic shaft of the compression cylinder stretches out to drive the pressing strip to move downwards until the pressing strip is abutted with the semiconductor device. The telescopic shaft of the cutting cylinder drives the cutter head to move downwards until the cutter head is abutted with the semiconductor device. The sliding cutting cylinder drives the cutter head to slide along the horizontal direction for scribing. The pressing bar presses the semiconductor device on the objective table in the scribing process. The method has the effects of enhancing the stability of the semiconductor device in the dicing process and improving the dicing precision.

Description

Thermosensitive semiconductor dicing saw

Technical Field

The application relates to the field of semiconductor cutting technical equipment, in particular to a thermosensitive semiconductor dicing saw.

Background

The dicing saw is also called a wafer dicing saw, and is mainly used for dicing electronic components such as semiconductor wafers, integrated circuits, QFN, light emitting diodes, LED chips, solar cells, electronic substrates and the like.

The related art can refer to Chinese patent publication No. CN209478633U to disclose a dicing saw, which comprises a machine table, a dicing moving assembly and a multi-degree-of-freedom moving platform, wherein the dicing moving assembly and the multi-degree-of-freedom moving platform are arranged on the machine table, the end part of the dicing moving assembly is connected with a tool bit, the multi-degree-of-freedom moving platform is provided with a dicing platform for placing a workpiece, and the tool bit is arranged in an adaptive manner with the dicing platform.

Aiming at the related technology, the device is directly placed on the scribing platform, the effective fixation is lacking, the inclination angle of the scribing platform can be changed along with the multi-degree-of-freedom motion platform, and the stability of the device in the scribing process is difficult to ensure.

Disclosure of Invention

In order to enhance the stability of a semiconductor device in a dicing process and improve dicing accuracy, the application provides a thermosensitive semiconductor dicing saw.

The application provides a thermosensitive semiconductor dicing saw, adopts following technical scheme:

the utility model provides a thermosensitive semiconductor dicing saw, includes the dicing saw body, horizontal sliding connection has the cutting platform on the dicing saw body, cutting platform horizontal sliding connection has the cutting cylinder, cutting cylinder slip direction is perpendicular with cutting platform slip direction, the vertical downwardly setting of cutting cylinder telescopic shaft and fixedly connected with tool bit, two fixedly connected with compress tightly the cylinder on the cutting platform, two compress tightly the cylinder and be located cutting cylinder both sides respectively, compress tightly the vertical downwardly setting of cylinder telescopic section and fixedly connected with layering, the layering is on a parallel with cutting cylinder slip direction setting, the dicing saw body is equipped with the objective table, the objective table is located cutting platform below.

By adopting the technical scheme, the semiconductor device is placed on the object stage, the compression cylinder is started, and the telescopic shaft of the compression cylinder stretches out to drive the pressing strip to move downwards until the pressing strip is abutted with the semiconductor device. And starting the cutting cylinder, and driving the cutter head to move downwards by the telescopic shaft of the cutting cylinder until the cutter head is abutted with the semiconductor device. The sliding cutting cylinder drives the cutter head to slide along the horizontal direction, so that scribing is performed. The pressing strip presses the semiconductor device on the object stage in the scribing process, so that the stability of the semiconductor device in the scribing process is enhanced, and the scribing precision is improved.

Optionally, wear to be equipped with the first lead screw of level setting on the cutting table, first lead screw and cutting table threaded connection and first both ends of lead screw rotate with the dicing saw body and are connected, first lead screw is on a parallel with cutting table slip direction setting, fixedly connected with displacement motor on the dicing saw body, first output shaft level of displacement motor sets up and with the coaxial fixed connection of one end of first lead screw.

Through adopting above-mentioned technical scheme, a displacement motor drive lead screw rotation and then drive the cutting platform at the dicing saw body slip, and machinery replaces the manual work, has saved the manpower and has improved the precision of cutting platform sliding displacement.

Optionally, the last fixedly connected with displacement cylinder of cutting table, displacement cylinder level sets up and is parallel with cutting cylinder slip direction, displacement cylinder telescopic shaft and cutting cylinder fixed connection.

Through adopting above-mentioned technical scheme, drive the horizontal slip of cutting cylinder and then scribe through the flexible of displacement cylinder telescopic shaft, saved the manual work, also be convenient for control scribing speed and dynamics are favorable to improving the scribing precision.

Optionally, the layering is kept away from and is pressed cylinder one end fixedly connected with buffer layer.

Through adopting above-mentioned technical scheme, the buffer layer adopts the rubber material to make, and when layering and semiconductor device butt, the buffer layer can provide good buffering effect, has avoided damaging semiconductor device when fixed semiconductor device.

Optionally, the objective table includes frame and cutting board, the cutting board rotates to be connected in the frame, fixedly connected with rotation motor in the frame, rotation motor output shaft sets up on vertical mutually, rotation motor output shaft keeps away from rotation motor one end and cutting board fixed connection.

Through adopting above-mentioned technical scheme, after layering and the butt of semiconductor device, the tool bit slides along being parallel to the layering direction and carries out the scribing, and the repositioning is on the cutting board after changing the semiconductor device direction after only shifting layering and tool bit upward in order to change the scribing direction, wastes time and energy. The cutting board is rotationally connected with the frame, and the rotation of the cutting board is controlled by the rotating motor, so that the directions of the cutting board and the semiconductor device can be changed rapidly, and the scribing efficiency can be improved.

Optionally, the spout that the level set up has been seted up on the dicing saw body, frame sliding connection is on the spout, be equipped with the washhouse on the dicing saw body, the spout is kept away from cutting bench one end and is let in the washhouse, be equipped with spray set in the washhouse.

By adopting the technical scheme, powder can be generated to be attached to the surface of the semiconductor device in the dicing process, so that the product quality is affected, and the semiconductor device is required to be cleaned later, which is time-consuming and labor-consuming. The rack can be directly driven to slide and move to the cleaning bin through the sliding groove, the spraying device is started to directly clean along with the semiconductor device on the cutting plate, attached powder is removed, cleaning of the semiconductor device is facilitated, and production efficiency of the semiconductor device is improved.

Optionally, the spout top is equipped with the manger plate folded plate that the level set up, manger plate folded plate one end and washs storehouse inner wall fixed connection, the other end and scribing machine body fixed connection, manger plate folded plate is the wave, the fixed mouth has been seted up on the manger plate folded plate, the frame top is located fixed mouthful and with fixed mouthful inner wall fixed connection all around.

Through adopting above-mentioned technical scheme, manger plate folded plate becomes the wave setting, can stretch out and draw back along with the displacement direction of objective table, so can not influence the displacement of objective table. When the objective table is positioned in the cleaning bin, the water sprayed by the spraying device can be scattered onto the water retaining folded plate after cleaning the semiconductor device, and flows to two sides of the water retaining folded plate along the wave lines of the water retaining folded plate, and finally flows to the upper surface of the dicing saw body. The contact between water and the rotating motor is avoided, and the rotating motor is protected.

Optionally, wear to be equipped with the lead screw second of level setting in the frame, lead screw second one end rotates with the dicing saw body to be connected, and the other end rotates with the cleaning bin inner wall to be connected, lead screw second and frame threaded connection, fixedly connected with displacement motor second on the dicing saw body, the output shaft level of displacement motor second sets up and with the coaxial fixed connection of one end of lead screw second.

Through adopting above-mentioned technical scheme, displacement motor two drive lead screw two rotate and then drive the frame and slide on the spout, and machinery replaces the manual work, has saved the manpower.

In summary, the present application includes at least one of the following beneficial technical effects:

1. the semiconductor device is placed on the object stage, the compression cylinder is started, the telescopic shaft of the compression cylinder stretches out to drive the pressing strip to move downwards until the pressing strip is abutted against the semiconductor device, the pressing strip compresses the semiconductor device on the object stage, the stability of the semiconductor device in the dicing process is enhanced, and the dicing precision is improved;

2. in the scribing process, powder can be generated to be attached to the surface of the semiconductor device, the product quality is affected, the semiconductor device is required to be cleaned later, time and labor are wasted, the frame can be directly driven to slide and move to the cleaning bin together through the sliding chute, the spraying device is started to directly clean along with the semiconductor device on the cutting board, the attached powder is removed, the cleaning of the semiconductor device is facilitated, and the production efficiency of the semiconductor device is improved.

Drawings

Fig. 1 is a schematic diagram of the overall structure of the embodiment.

Fig. 2 is a schematic view showing an internal structure of the shower device in the embodiment.

Reference numerals illustrate: 1. a dicing saw body; 11. a first lead screw; 12. a displacement motor I; 13. a chute; 14. cleaning a bin; 141. a spraying device; 1411. a spray head; 1412. a water storage tank; 15. a water retaining folded plate; 16. a second lead screw; 17. a displacement motor II; 2. a cutting table; 21. a cutting cylinder; 22. a cutter head; 23. a compacting cylinder; 24. pressing strips; 241. a buffer layer; 25. a displacement cylinder; 3. an objective table; 31. a frame; 32. cutting the plate; 33. and rotating the motor.

Detailed Description

The present application is described in further detail below with reference to the accompanying drawings.

The embodiment of the application discloses a thermosensitive semiconductor dicing machine.

Referring to fig. 1 and 2, a thermosensitive semiconductor dicing saw includes a dicing saw body 1, a dicing table 2, and a stage 3. The cutting table 2 is horizontally arranged and is in sliding connection with the dicing saw body 1, a first screw rod 11 which is horizontally arranged is arranged in the cutting table 2 in a penetrating mode, the first screw rod 11 is in threaded connection with the cutting table 2, two ends of the first screw rod 11 are both in rotational connection with the dicing saw body 1, and the first screw rod 11 is parallel to the sliding direction of the cutting table 2. The dicing saw body 1 is fixedly connected with a first displacement motor 12, and an output shaft of the first displacement motor 12 is horizontally arranged and is fixedly connected with one end of a first lead screw 11 in a coaxial manner. The first displacement motor 12 is used for driving the first screw rod 11 to rotate, so as to drive the cutting table 2 to slide on the dicing saw body 1.

Referring to fig. 1 and 2, a cutting cylinder 21 is horizontally and slidably connected to the lower surface of the cutting table 2, the sliding direction of the cutting cylinder 21 is perpendicular to the sliding direction of the cutting table 2, and a telescopic shaft of the cutting cylinder 21 is vertically and downwardly arranged and fixedly connected with a cutter head 22. The cutting table 2 is fixedly connected with a displacement cylinder 25, the displacement cylinder 25 is horizontally arranged and parallel to the sliding direction of the cutting cylinder 21, and a telescopic shaft of the displacement cylinder 25 is fixedly connected with the cutting cylinder 21. The displacement cylinder 25 is used to drive the cutting cylinder 21 to slide horizontally.

Referring to fig. 1 and 2, the cutting table 2 is fixedly connected with two vertically arranged compression cylinders 23, the two compression cylinders 23 are respectively located at two sides of the cutting cylinder 21, a compression bar 24 is fixedly connected to a telescopic part of the compression cylinder 23, and the compression bar 24 is arranged parallel to the sliding direction of the cutting cylinder 21. The end of the pressing bar 24 far away from the pressing cylinder 23 is fixedly connected with a buffer layer 241.

The buffer layer 241 is made of rubber. The bead 24 compresses the semiconductor device during dicing. The stability of the semiconductor device in the dicing process is enhanced, and the buffer layer 241 is made of rubber, so that a good buffer effect can be provided.

Referring to fig. 1 and 2, the dicing saw body 1 is provided with a stage 3, the stage 3 is located below the dicing table 2, the stage 3 includes a frame 31 and a dicing plate 32, and the dicing plate 32 is for carrying a semiconductor device and is rotatably connected to the frame 31. The frame 31 is internally fixedly connected with a rotating motor 33, an output shaft of the rotating motor 33 is vertically arranged on the upper side, one end, far away from the rotating motor 33, of the output shaft of the rotating motor 33 is fixedly connected with the cutting plate 32, and the directions of the cutting plate 32 and the semiconductor device can be changed rapidly.

Referring to fig. 1 and 2, a sliding chute 13 is formed in the dicing saw body 1, a frame 31 is slidably connected to the sliding chute 13, a cleaning bin 14 is formed in the dicing saw body 1, and the cleaning bin 14 is in a cube shape. One end of the chute 13, which is far away from the cutting table 2, is led into the cleaning bin 14, and the frame 31 and the cutting plate 32 can slide and move into the cleaning bin 14. The cleaning bin 14 is internally provided with a spraying device 141, and the spraying device 141 comprises a spray head 1411 and a water storage tank 1412 which are mutually communicated and are used for cleaning powder attached to the surface of the semiconductor device.

Referring to fig. 1 and 2, a second screw rod 16 is arranged on the frame 31 in a penetrating manner, the second screw rod 16 is in threaded connection with the frame 31, one end of the second screw rod 16 is in rotary connection with the dicing saw body 1, and the other end of the second screw rod 16 is in rotary connection with the inner wall of the cleaning bin 14. The dicing saw body 1 is fixedly connected with a second displacement motor 17, and an output shaft of the second displacement motor 17 is horizontally arranged and is fixedly connected with one end of a second lead screw 16 in a coaxial manner. The second displaceable motor 17 drives the second screw 16 to rotate so as to drive the frame 31 to slide on the chute 13.

Referring to fig. 1 and 2, a water retaining folded plate 15 horizontally arranged is arranged above the chute 13, one end of the water retaining folded plate 15 is fixedly connected with the inner wall of the cleaning bin 14, the other end of the water retaining folded plate 15 is fixedly connected with the scriber body 1, the water retaining folded plate 15 is wavy, and the water retaining folded plate can stretch along with the displacement direction of the objective table 3, so that the displacement of the objective table 3 cannot be influenced. The water retaining folded plate 15 is provided with a fixed opening, and the top end of the frame 31 is positioned in the fixed opening and fixedly connected with the inner wall around the fixed opening.

The water sprayed by the spraying device 141 in the cleaning bin 14 can be sprayed onto the water retaining folded plate 15 after cleaning the semiconductor device, and flows to two sides of the water retaining folded plate 15 along the wave lines of the water retaining folded plate 15, and finally flows to the upper surface of the dicing saw body 1. Avoiding contact of water with the rotary motor 33 and protecting the rotary motor 33.

The implementation principle of the thermosensitive semiconductor dicing saw in the embodiment of the application is as follows: the semiconductor device is placed on the cutting plate 32, the compression cylinder 23 is started, and the telescopic shaft of the compression cylinder 23 stretches out to drive the pressing bar 24 to move towards the cutting plate 32 until the pressing bar 24 is abutted with the semiconductor device. The cutting cylinder 21 is started, and the telescopic shaft of the cutting cylinder 21 drives the tool bit 22 to move downwards until the tool bit 22 abuts against the semiconductor device, so that the semiconductor device is pressed and fixed on the cutting plate 32. The displacement cylinder 25 is started to drive the cutting cylinder 21 to horizontally slide to drive the tool bit 22 to horizontally slide, so that scribing is performed. The first motor 12 can drive the cutting table 2 to change the cutting position of the cutter head 22 on the cutting cylinder 21, and the second motor 33 can drive the cutting plate 32 to rotate to change the direction of the semiconductor device. The pressing strip 24 presses the semiconductor device on the object stage 3 in the dicing process, so that the stability of the semiconductor device in the dicing process is enhanced, and the dicing precision is improved.

The foregoing are all preferred embodiments of the present application, and are not intended to limit the scope of the present application in any way, therefore: all equivalent changes in structure, shape and principle of this application should be covered in the protection scope of this application.

Claims

1. The utility model provides a thermosensitive semiconductor dicing saw, includes dicing saw body (1), its characterized in that: the utility model provides a scribing machine, including cutting machine body (1), horizontal sliding connection has cutting platform (2), cutting platform (2) horizontal sliding connection has cutting cylinder (21), cutting cylinder (21) slip direction is perpendicular with cutting platform (2) slip direction, cutting cylinder (21) telescopic shaft is vertical to set up downwards and fixedly connected with tool bit (22), two fixedly connected with compress tightly cylinder (23) on cutting platform (2), two compress tightly cylinder (23) are located cutting cylinder (21) both sides respectively, compress tightly cylinder (23) telescopic part vertical setting downwards and fixedly connected with layering (24), layering (24) are parallel to cutting cylinder (21) slip direction setting, scribing machine body (1) are equipped with objective table (3), objective table (3) are located cutting platform (2) below.

2. A thermally sensitive semiconductor dicing saw according to claim 1, wherein: the cutting machine is characterized in that a first lead screw (11) horizontally arranged is arranged on the cutting table (2) in a penetrating mode, the first lead screw (11) is in threaded connection with the cutting table (2), two ends of the first lead screw (11) are rotationally connected with the dicing saw body (1), the first lead screw (11) is parallel to the sliding direction of the cutting table (2), a first displacement motor (12) is fixedly connected to the dicing saw body (1), and an output shaft of the first displacement motor (12) is horizontally arranged and is fixedly connected with one end of the first lead screw (11) in a coaxial mode.

3. A thermally sensitive semiconductor dicing saw according to claim 1, wherein: the cutting table (2) is fixedly connected with a displacement cylinder, the displacement cylinder is horizontally arranged and parallel to the sliding direction of the cutting cylinder (21), and a telescopic shaft of the displacement cylinder is fixedly connected with the cutting cylinder (21).

4. A thermally sensitive semiconductor dicing saw according to claim 1, wherein: one end of the pressing bar (24) far away from the pressing cylinder (23) is fixedly connected with a buffer layer (241).

5. A thermally sensitive semiconductor dicing saw according to claim 1, wherein: the objective table (3) comprises a frame (31) and a cutting plate (32), the cutting plate (32) is rotationally connected to the frame (31), a rotating motor (33) is fixedly connected to the frame (31), an output shaft of the rotating motor (33) is vertically upwards arranged, and one end, far away from the rotating motor (33), of the output shaft of the rotating motor (33) is fixedly connected with the cutting plate (32).

6. A thermally sensitive semiconductor dicing saw according to claim 5, wherein: the automatic cleaning device is characterized in that a sliding chute (13) which is horizontally arranged is formed in the scribing machine body (1), the frame (31) is connected onto the sliding chute (13) in a sliding mode, a cleaning bin (14) is arranged on the scribing machine body (1), one end, away from the cutting table (2), of the sliding chute (13) is led into the cleaning bin (14), and a spraying device (141) is arranged in the cleaning bin (14).

7. A thermally sensitive semiconductor dicing saw according to claim 6, wherein: the utility model discloses a cleaning machine, including spout (13), frame (31), cutting board (32), baffle folded plate (15), spout (13) top is equipped with manger plate folded plate (15) that the level set up, manger plate folded plate (15) one end and wash storehouse (14) inner wall fixed connection, the other end and scribing machine body (1) fixed connection, manger plate folded plate (15) are the wave, the fixed mouth has been seted up on manger plate folded plate (15), frame (31) top is located fixed mouthful and cutting board (32) and fixed mouthful inner wall fixed connection all around.

8. A thermally sensitive semiconductor dicing saw according to claim 6, wherein: the automatic cleaning device is characterized in that a second lead screw (16) which is horizontally arranged is arranged in the frame (31) in a penetrating manner, one end of the second lead screw (16) is rotationally connected with the scribing machine body (1), the other end of the second lead screw is rotationally connected with the inner wall of the cleaning bin (14), the second lead screw (16) is in threaded connection with the frame (31), a second displacement motor (17) is fixedly connected to the scribing machine body (1), and an output shaft of the second displacement motor (17) is horizontally arranged and is coaxially and fixedly connected with one end of the second lead screw (16).