CN219403788U

CN219403788U - Chemical mechanical polishing machine

Info

Publication number: CN219403788U
Application number: CN202223357173.8U
Authority: CN
Inventors: 秦俊; 宋亚滨
Original assignee: Jiangsu Jeshine New Material Co ltd; Tunghsu Technology Group Co Ltd
Current assignee: Jiangsu Jeshine New Material Co ltd; Tunghsu Technology Group Co Ltd
Priority date: 2022-12-13
Filing date: 2022-12-13
Publication date: 2023-07-25
Anticipated expiration: 2032-12-13

Abstract

The present disclosure provides a chemical mechanical polisher, comprising: the lower disc rotor (1) is used for bearing a piece to be polished and polishing the piece to be polished; a ceramic disc (2) for pressing the piece to be polished; and an upper tray assembly; wherein, upper disc subassembly includes upper disc rotor (3) and rotary joint (6) that are linked together with upper disc rotor (3), upper disc rotor (3) can be followed vertical direction and removed in order to compress tightly or loosen ceramic dish (2), be equipped with on upper disc rotor (3) and extend to air vent (4) of its bottom surface, rotary joint is including first joint (61) and second joint (62) that link to each other at an angle, the second connects coaxial coupling in upper disc rotor and can be linked together with the air vent, first joint can rotate relatively around the central axis of second joint, first joint can link to each other with air supply (21). Through above-mentioned technical scheme, ventilate in to the air vent, gas blows to ceramic dish surface, separates upper disc rotor and ceramic dish, prevents to appear absorbing phenomenon.

Description

Chemical mechanical polishing machine

Technical Field

The disclosure relates to the technical field of sapphire substrate slice processing, in particular to a chemical mechanical polishing machine.

Background

The polishing machine for the sapphire substrate slice is divided into an upper disc rotor and a lower disc rotor, wherein the sapphire substrate slice is adsorbed on a ceramic disc, the light surface to be polished faces outwards, the ceramic disc attached with the sapphire substrate slice is reversely buckled on a polishing pad of the lower disc rotor, and the ceramic disc is fixed through the upper disc rotor and a certain pressure is applied; when the lower disc rotates in the polishing process, the upper disc rotor also rotates along with the polishing pad due to the friction force of the sapphire wafer and the polishing pad.

However, after polishing, the upper disc rotor of the existing polishing machine is easy to absorb together with the upper disc rotor because the back surface of the ceramic disc is smooth, the ceramic disc is usually absorbed by the upper disc rotor and frequently falls down in the rising process of the upper disc, so that the problem of personnel operation safety is brought, the ceramic disc is possibly damaged, in order to avoid the ceramic disc being absorbed by the upper disc, the common practice is to add an anti-sucking pad between the back surface of the ceramic disc and the upper disc rotor, the anti-sucking pad well avoids the absorption of the ceramic disc and the upper disc rotor, but the anti-sucking pad also usually shakes in the polishing process, so that the abrasion to the upper disc rotor is increased, and the anti-sucking pad can cause surface residual stain because of long-term use, and the TTV value of a sapphire substrate sheet can be influenced if the ceramic disc is not cleaned in time; and the anti-sucking pad is a plastic product, if the anti-sucking pad is damaged in the use process, tiny scraps can cause scratches on the surface of the sapphire substrate sheet, the damage to the polishing pad is more likely to be caused, and once the polishing pad is damaged, the wafer on the whole machine can be damaged.

Disclosure of Invention

One technical problem to be solved by the present disclosure is: after polishing, the existing polishing machine adsorbs and falls off the upper disc rotor and the ceramic disc, so that personnel safety is affected.

To solve the above technical problems, an embodiment of the present disclosure provides a chemical mechanical polisher, including: the lower disc rotor is used for bearing a piece to be polished and polishing the piece to be polished; the ceramic disc is used for extruding a piece to be polished; and an upper tray assembly; wherein, the upper disc subassembly includes the upper disc rotor and with the rotary joint that upper disc rotor is linked together, the upper disc rotor can be followed vertical direction and removed in order to compress tightly or loosen the ceramic dish, be equipped with the air vent that extends to its bottom surface on the upper disc rotor, rotary joint is including the first joint and the second joint that link to each other of angulation, the second connects coaxially to be connected in the upper disc rotor and can be linked together with the air vent, the first joint can rotate relatively around the central axis of second joint, the first joint can link to each other with the air supply.

In some embodiments, the upper disc assembly further comprises a first connecting shaft connected with the upper disc rotor and a driving device arranged on the first connecting shaft, wherein the driving device comprises a first driving piece, a driving wheel connected with the first driving piece and a driven wheel arranged on the first connecting shaft, and the driving wheel is meshed with the driven wheel.

In some embodiments, the upper disc assembly further comprises a second driving member connected with the first connecting shaft, the second driving member comprises a telescopic rod and a cylinder body, and the telescopic rod is connected with the end part of the first connecting shaft through the connecting member so as to drive the first connecting shaft to move along the vertical direction.

In some embodiments, the upper disc assembly further comprises a first connection plate disposed between the first connection shaft and the connection member, the first driving member being disposed on the connection plate.

In some embodiments, the rotary joint is arranged on the first connecting plate through the joint support, a cavity capable of accommodating the joint support is arranged inside the connecting piece, a central through hole communicated with the vent hole is formed in the first connecting shaft, and the rotary joint penetrates through the first connecting plate through the air pipe to be communicated with the central through hole of the first connecting shaft.

In some embodiments, the motor further includes a second coupling shaft disposed on a central axis of the lower rotor and a third driving member coupled to the second coupling shaft.

In some embodiments, the motor further comprises a base for supporting the lower disc rotor, a groove for accommodating the lower disc rotor is formed in the base, and the third driving piece is arranged below the groove.

In some embodiments, the device further comprises a booster arranged at the bottom of the groove, and the booster is arranged between the lower disc rotor and the groove to assist the lower disc rotor to rotate.

In some embodiments, a plurality of ceramic disks are provided on the lower disk rotor, with an upper disk assembly disposed above each ceramic disk.

In some embodiments, the polishing machine further comprises a second connection plate, a plurality of second driving pieces are arranged on the connection plate, and the second connection plate is hung on the top of the polishing machine shell through a third connection shaft.

Through above-mentioned technical scheme, be equipped with the air vent on the upper disc rotor that this disclosure provided, the air vent passes through rotary joint with the air supply and is connected, after polishing is accomplished to the burnishing machine, ventilates in the air vent, blows ceramic disc surface through gas, separates upper disc rotor and ceramic disc, prevents to appear absorbing phenomenon to can effectively solve when upper disc rotor high-speed rotation through rotary joint, the trachea takes place to warp, distortion even the problem that drops.

Drawings

In order to more clearly illustrate the embodiments of the present disclosure or the technical solutions in the prior art, the drawings that are required in the embodiments or the description of the prior art will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present disclosure, and other drawings may be obtained according to these drawings without inventive effort to a person of ordinary skill in the art.

FIG. 1 is a schematic view of a chemical mechanical polisher according to an embodiment of the present disclosure;

FIG. 2 is a schematic structural view of a rotary joint disclosed in an embodiment of the present disclosure;

fig. 3 is a polishing data table of a chemical mechanical polisher disclosed in an embodiment of this disclosure.

Reference numerals illustrate:

1. a lower disc rotor; 2. a ceramic disc; 3. a disc rotor; 4. a vent hole; 5. a first connecting shaft; 6. a rotary joint; 7. a joint bracket; 8. an air pipe; 9. a second driving member; 10. a first connection plate; 11. a connecting piece; 12. a second connecting plate; 13. a third connecting shaft; 14. a first driving member; 15. a driving wheel; 16. driven wheel; 17. a second connecting shaft; 18. a third driving member; 19. a base; 20. a booster; 21. and (5) an air source.

Detailed Description

Embodiments of the present disclosure are described in further detail below with reference to the drawings and examples. The following detailed description of the embodiments and the accompanying drawings are provided to illustrate the principles of the disclosure and not to limit the scope of the disclosure, which may be embodied in many different forms and not limited to the specific embodiments disclosed herein, but rather to include all technical solutions falling within the scope of the claims.

The present disclosure provides these embodiments in order to make the present disclosure thorough and complete, and fully convey the scope of the disclosure to those skilled in the art. It should be noted that: the relative arrangement of parts and steps, the composition of materials, numerical expressions and numerical values set forth in these embodiments should be construed as exemplary only and not limiting unless otherwise specifically stated.

In the description of the present disclosure, unless otherwise indicated, the meaning of "plurality" is greater than or equal to two; the terms "upper," "lower," "left," "right," "inner," "outer," and the like indicate an orientation or positional relationship merely for convenience of describing the present disclosure and simplifying the description, and do not indicate or imply that the devices or elements being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus are not to be construed as limiting the present disclosure. When the absolute position of the object to be described is changed, the relative positional relationship may be changed accordingly.

Furthermore, the use of the terms first, second, and the like in this disclosure do not denote any order, quantity, or importance, but rather are used to distinguish one element from another. The "vertical" is not strictly vertical but is within the allowable error range. "parallel" is not strictly parallel but is within the tolerance of the error. The word "comprising" or "comprises" and the like means that elements preceding the word encompass the elements recited after the word, and not exclude the possibility of also encompassing other elements.

It should also be noted that, in the description of the present disclosure, unless explicitly specified and limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be either fixedly connected, detachably connected, or integrally connected, for example; can be directly connected or indirectly connected through an intermediate medium. The specific meaning of the terms in the present disclosure may be understood as appropriate by those of ordinary skill in the art. When a particular device is described as being located between a first device and a second device, there may or may not be an intervening device between the particular device and either the first device or the second device.

All terms used in the present disclosure have the same meaning as understood by one of ordinary skill in the art to which the present disclosure pertains, unless specifically defined otherwise. It will be further understood that terms, such as those defined in commonly used dictionaries, should be interpreted as having a meaning that is consistent with their meaning in the context of the relevant art and will not be interpreted in an idealized or overly formal sense unless expressly so defined herein.

Techniques, methods, and apparatus known to one of ordinary skill in the relevant art may not be discussed in detail, but where appropriate, the techniques, methods, and apparatus should be considered part of the specification.

Embodiments of the present disclosure provide a chemical mechanical polisher, comprising: the lower disc rotor 1 is used for bearing a piece to be polished and polishing the piece to be polished; a ceramic plate 2 for pressing a member to be polished; and an upper tray assembly; wherein, the upper disc subassembly includes upper disc rotor 3 and the rotary joint 6 that is linked together with upper disc rotor 3, and upper disc rotor 3 can be along vertical direction removal in order to compress tightly or loosen ceramic dish 2, is equipped with on upper disc rotor 3 and extends to its bottom surface's air vent 4, and rotary joint 6 includes angularly continuous first joint 61 and second joint 62, and the second joint 62 is connected in upper disc rotor coaxially and can be linked together with air vent 4, and first joint 61 can rotate relatively around the central axis of second joint 62, and first joint 61 can link to each other with air supply 21.

As shown in fig. 1 and 2, a polishing PAD (PAD) is laid on the surface of the lower disc rotor 1, a polyurethane polishing PAD is generally selected as the polishing PAD of the sapphire substrate, the surface to be polished of the sapphire substrate is placed towards the polishing PAD, then the ceramic disc 2 is pressed on the sapphire substrate, the upper disc rotor 3 is moved to press the ceramic disc 2, the sapphire substrate is tightly pressed on the polishing PAD to prevent the movement of the sapphire substrate, the lower disc rotor 1 is driven to rotate, the relative movement of the polishing PAD and the sapphire substrate is realized, the polishing PAD and the sapphire substrate are rubbed, and meanwhile, polishing liquid is sprayed on the polishing PAD to realize polishing of the sapphire substrate; after polishing, compressed air is introduced into the vent holes 4 to blow the air to the surface of the ceramic disc 2, so that the ceramic disc 2 is separated from the upper disc rotor 3, and the phenomenon of mutual adsorption of the ceramic disc 2 and the upper disc rotor is prevented.

Through the technical scheme, the upper disc rotor 3 is provided with the vent holes 4, the vent holes 4 are connected with the air source 21 through the rotary joint 6, compressed air enters from the first joint 61 and is blown out from the second joint 62, and the upper disc rotor 3 is separated from the ceramic disc 2, so that the phenomenon of adsorption is prevented; the first joint 61 may be a 90-degree universal pneumatic high-speed rotary joint, and the second joint 62 may be a straight-through universal pneumatic high-speed rotary joint, which are connected together by welding; meanwhile, in the rotating process of the lower disc rotor 1, the upper disc rotor 3 also rotates along with the rotating process due to the friction force between the sapphire substrate slice and the polishing pad, and when the upper disc rotor rotates at a high speed, the rotary joint 6 can ensure that an air pipe connected with the air source 21 is kept static relative to the upper disc rotor 3, so that the problems of deformation, distortion and even falling of the air pipe are solved.

In one embodiment, the upper disc assembly further comprises a first connecting shaft 5 connected with the upper disc rotor 3 and a driving device arranged on the first connecting shaft 5, wherein the driving device comprises a first driving piece 14, a driving wheel 15 connected with the first driving piece 14 and a driven wheel 16 arranged on the first connecting shaft 5, and the driving wheel 15 is meshed with the driven wheel 16.

As shown in fig. 1, the first driving member 14 can drive the driving wheel 15 to rotate, so as to drive the driven wheel 16 meshed with the driving wheel 15 to rotate, the driven wheel 16 is sleeved on the outer peripheral surface of the first connecting shaft 5 and fixedly connected with the first connecting shaft, the driven wheel 16 drives the first connecting shaft 5 and the upper disc rotor 3 to rotate around the central axis thereof, so as to drive the sapphire substrate to rotate around the central axis, thereby increasing the friction effect between the sapphire substrate and the polishing pad, further increasing the polishing effect and increasing the polishing efficiency; the first driving member 14 may be a driving member such as a motor, or the like.

In one embodiment, the upper disc assembly further comprises a second driving member 9 connected with the first connecting shaft 5, wherein the second driving member 9 comprises a telescopic rod and a cylinder body, and the telescopic rod is connected with the end part of the first connecting shaft 5 through a connecting member 11 so as to drive the first connecting shaft 5 to move along the vertical direction.

As shown in fig. 1, the telescopic rod is connected with the top of the connecting piece 11, the first connecting shaft 5 is connected with the bottom of the connecting piece 11, the telescopic rod of the second driving piece 9 can reciprocate along the vertical direction, the height adjustment of the upper disc rotor 3 is realized through the second driving piece 9, and the pressure of the upper disc rotor 3 to the ceramic disc 2 is adjusted by setting the extension amount of the telescopic rod; the second driving member 9 may be a driving member such as an electric cylinder, an air cylinder, or the like.

In one embodiment, the upper tray assembly further comprises a first connection plate 10 disposed between the first connection shaft 5 and the connection member 11, and the first driving member 14 is disposed on the first connection plate 10.

As shown in fig. 1, since the cross section of the first connecting shaft 5 is smaller, in order to facilitate the installation between the first connecting shaft 5 and the connecting piece 11, a first connecting plate 10 is arranged between the first connecting shaft 5 and the connecting piece 11, and the first driving piece 14 is arranged on the first connecting plate 10, so that the first driving piece 14 can synchronously move with the first connecting shaft 5, the relative stillness of the first connecting shaft and the first driving piece is realized, and the problem that the driving wheel 15 and the driven wheel 16 are staggered is prevented.

In one embodiment, the rotary joint 6 is arranged on the first connecting plate 10 through the joint support 7, a cavity capable of accommodating the joint support 7 is arranged inside the connecting piece 11, a central through hole communicated with the vent hole 4 is formed in the first connecting shaft 5, and the rotary joint 6 is communicated with the central through hole of the first connecting shaft 5 through the first connecting plate 10 through the air pipe 8.

As shown in fig. 1, the connecting piece 11 is configured as a cover body, a joint bracket 7 is arranged in the cover body, the rotary joint 6 is arranged on the joint bracket 7, wherein a second joint 62 is vertically downward arranged, the second joint 62 is communicated with a central through hole of the first connecting shaft 5 through an air pipe 8, and an opening through which an air pipe of an air supply source can pass is arranged on the side surface of the connecting piece 11; the center through hole of the first connecting shaft 5 coincides with the center axis of the vent hole 4, so that the compressed gas can be smoothly discharged from the vent hole 4.

In one embodiment, the lower disc rotor 1 further comprises a second connecting shaft 17 arranged on the central axis of the lower disc rotor 1 and a third driving member 18 connected to the second connecting shaft 17.

As shown in fig. 1, a third driving member 18 is disposed at the bottom of the lower disc rotor 1, an output end of the third driving member 18 is coaxially connected with the second connecting shaft 17, the second connecting shaft 17 is coaxially disposed with the lower disc rotor 1, the lower disc rotor 1 is driven to rotate around its central axis by the third driving member 18, and the third driving member 18 may be a driving member such as a motor or a motor.

In one embodiment, the polishing machine further comprises a base 19 for supporting the lower disc rotor 1, a groove for accommodating the lower disc rotor 1 is formed in the base 19, and the third driving member 18 is disposed below the groove.

As shown in fig. 1, the lower disc rotor 1 is placed on the base 19, the lower disc rotor 1 is disposed in a groove of the base 19, if an accident occurs in the rotation process of the lower disc rotor 1, the lower disc rotor 1 and the second connecting shaft 17 may be disconnected, the groove can prevent the phenomenon that the lower disc rotor 1 falls out from the surface of the base 19 under the rotation condition, and the damage of the lower disc rotor 1 to an operator can be avoided.

In one embodiment, the polishing machine further comprises a booster 20 disposed at the bottom of the groove, and the booster 20 is disposed between the lower disc rotor 1 and the groove to assist the lower disc rotor 1 to rotate.

As shown in fig. 1, since the weight of the lower disc rotor 1 is large, the lower disc rotor 1 is directly pressed on the base 19, and friction between the lower disc rotor 1 and the base 19 is large, so that the lower disc rotor 1 is difficult to rotate; the power assisting piece 20 is arranged between the two, the power assisting piece 20 comprises an upper end plate, a lower end plate and balls, the upper end plate and the balls are arranged between the two end plates at intervals, the upper end plate is attached to the bottom surface of the lower disc rotor 1, the lower end plate is attached to the bottom surface of a groove of the base 19, and the power assisting piece 20 can enable rotation between the lower disc rotor 1 and the base 19 to be smoother; the booster 20 may be a thrust bearing, and one or more coaxially arranged thrust bearings may be provided according to actual requirements.

In one embodiment, a plurality of ceramic disks 2 are provided on the lower disk rotor 1, and an upper disk assembly is provided above each ceramic disk 2.

As shown in fig. 1, a plurality of sapphire substrate sheets can be placed on the lower disc rotor 1, and polished at the same time, the sapphire substrate sheets are in one-to-one correspondence with the number of the ceramic discs 2 and the upper disc assemblies, so that the production efficiency can be increased.

In one embodiment, the polishing machine further comprises a second connection plate 12, and a plurality of second driving members 9 are disposed on the second connection plate 12, and the second connection plate 12 is suspended on top of the polishing machine housing by a third connection shaft 13.

As shown in fig. 1, the plurality of second driving members 9 are all disposed on the second connecting plate 12, so that the upper disc assembly is integrated on the second connecting plate 12, the second connecting plate 12 is coaxially disposed with the lower disc rotor 1, and the second connecting plate 12 can rotate relative to the polishing machine shell, thereby realizing that the upper disc assembly rotates along with the rotation of the lower disc rotor 1 in the polishing process.

The working process of the chemical mechanical polishing machine provided by the disclosure comprises the following steps: firstly spraying polishing liquid on a polishing pad, placing sapphire substrate slices under an upper disc rotor 3, secondly placing ceramic discs 2 on the sapphire substrate slices one by one, then driving a second driving piece 9 to enable the upper disc rotor 3 to be pressed on the ceramic discs 2, then opening a nozzle of the polishing liquid, spraying the polishing liquid on the surface of the polishing pad, and opening a first driving piece 14 and a third driving piece 18 to start polishing; after polishing is finished, the first driving piece 14 and the third driving piece 18 are stopped, after the polishing machine is static, the air source 21 is opened, the air hole 4 is inflated, the upper disc rotor 3 and the ceramic disc 2 are separated, the second driving piece 9 is driven to lift the upper disc rotor 3, and the sapphire substrate slice is taken out.

As shown in fig. 3, the present disclosure has a polishing machine that performs suction prevention by pneumatic force, and the TTV value of the polished sapphire substrate sheet is smaller and more stable (TTV is the difference between the maximum thickness and the minimum thickness of the wafer in the thickness measurement value, that is, the total thickness variation of the wafer, which is an important criterion for measuring the quality of the silicon single crystal wafer) compared with the polishing machine provided with the suction prevention pad.

Thus, various embodiments of the present disclosure have been described in detail. In order to avoid obscuring the concepts of the present disclosure, some details known in the art are not described. How to implement the solutions disclosed herein will be fully apparent to those skilled in the art from the above description.

Although some specific embodiments of the present disclosure have been described in detail by way of example, it should be understood by those skilled in the art that the above examples are for illustration only and are not intended to limit the scope of the present disclosure. It will be understood by those skilled in the art that the foregoing embodiments may be modified and equivalents substituted for elements thereof without departing from the scope and spirit of the disclosure. In particular, the technical features mentioned in the respective embodiments may be combined in any manner as long as there is no structural conflict.

Claims

1. A chemical mechanical polisher, comprising:

the lower disc rotor (1) is used for bearing a piece to be polished and polishing the piece to be polished;

a ceramic disc (2) for pressing the piece to be polished; and

a top plate assembly;

wherein, the upper disc subassembly include upper disc rotor (3) and with rotary joint (6) that upper disc rotor (3) are linked together, upper disc rotor (3) can be followed vertical direction and removed in order to compress tightly or loosen ceramic dish (2), be equipped with on upper disc rotor (3) and extend to air vent (4) of its bottom surface, rotary joint (6) are including angularly continuous first joint (61) and second joint (62), second joint (62) coaxial coupling in upper disc rotor and can with air vent (4) are linked together, first joint (61) can be around the central axis of second joint (62) is rotatory relatively, first joint (61) can link to each other with air supply (21).

2. A chemical mechanical polisher according to claim 1, characterised in that the upper disc assembly further comprises a first connecting shaft (5) connected to the upper disc rotor (3) and a driving device arranged on the first connecting shaft (5), the driving device comprising a first driving member (14), a driving wheel (15) connected to the first driving member (14) and a driven wheel (16) arranged on the first connecting shaft (5), the driving wheel (15) and the driven wheel (16) being meshed.

3. The chemical mechanical polisher according to claim 2, wherein the upper plate assembly further comprises a second driving member (9) connected to the first connecting shaft (5), the second driving member (9) comprising a telescopic rod and a cylinder, the telescopic rod being connected to an end of the first connecting shaft (5) through a connecting member (11) to drive the first connecting shaft (5) to move in a vertical direction.

4. A chemical mechanical polisher according to claim 3, characterised in that the upper disc assembly further comprises a first connection plate (10) arranged between the first connection shaft (5) and the connection piece (11), the first drive piece (14) being arranged on the first connection plate (10).

5. The chemical mechanical polishing machine according to claim 4, wherein the rotary joint (6) is arranged on the first connecting plate (10) through a joint bracket (7), a cavity capable of accommodating the joint bracket (7) is arranged inside the connecting piece (11), a central through hole communicated with the vent hole (4) is formed in the first connecting shaft (5), and the rotary joint (6) is communicated with the central through hole of the first connecting shaft (5) through an air pipe (8) penetrating through the first connecting plate (10).

6. A chemical mechanical polisher according to claim 5 further comprising a second coupling shaft (17) arranged on the central axis of the lower disc rotor (1) and a third drive member (18) connected to the second coupling shaft (17).

7. A chemical mechanical polisher according to claim 6 further comprising a base (19) for supporting the lower disc rotor (1), the base (19) being provided with a recess for receiving the lower disc rotor (1), the third drive member (18) being disposed below the recess.

8. The chemical mechanical polisher according to claim 7, further comprising a booster member (20) disposed at a bottom of the recess, the booster member (20) being disposed between the lower disc rotor (1) and the recess to assist rotation of the lower disc rotor (1).

9. A chemical mechanical polisher according to claim 3, characterised in that the lower disc rotor (1) is provided with a plurality of the ceramic discs (2), the upper disc assembly being provided above each ceramic disc (2).

10. A chemical mechanical polisher according to claim 9 further comprising a second connection plate (12), a plurality of the second drives (9) being arranged on the second connection plate (12), the second connection plate (12) being suspended at the top of the polisher housing by a third connection shaft (13).