CN219402819U - Automatic positioning marking device for IC chip - Google Patents

Automatic positioning marking device for IC chip Download PDF

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Publication number
CN219402819U
CN219402819U CN202320818343.3U CN202320818343U CN219402819U CN 219402819 U CN219402819 U CN 219402819U CN 202320818343 U CN202320818343 U CN 202320818343U CN 219402819 U CN219402819 U CN 219402819U
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China
Prior art keywords
frame
chip
supporting plate
tray
jacking piece
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CN202320818343.3U
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Chinese (zh)
Inventor
易伟健
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Shenzhen Dengfeng Technology Co ltd
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Shenzhen Dengfeng Technology Co ltd
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Priority to CN202320818343.3U priority Critical patent/CN219402819U/en
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Abstract

The utility model relates to the technical field of marking devices, and provides an automatic positioning marking device for an IC chip, which comprises a frame, wherein a feeding limit frame is arranged on the frame, the feeding limit frame is provided with a limit channel, a first supporting plate is movably arranged on the frame and positioned at one side of the limit channel, after the first supporting plate moves, the first supporting plate stretches into the limit channel, a first lifting piece is arranged on the frame in a lifting manner and positioned at the bottom of the limit channel and below the first supporting plate, a second lifting piece is arranged on the first lifting piece in a lifting manner, after the first lifting piece is lifted, the second lifting piece is close to the first supporting plate, and after the second lifting piece is lifted, the second lifting piece is used for abutting against the chip. Through the technical scheme, the problem that the marking device in the prior art is inconvenient to position batch IC chips, and therefore each IC chip cannot be engraved rapidly is solved.

Description

Automatic positioning marking device for IC chip
Technical Field
The utility model relates to the technical field of marking devices, in particular to an automatic positioning marking device for an IC chip.
Background
The marking device should be very extensive in industrial processing, and most common has laser marking device, pneumatic marking device and spouts a yard marking device, and marking device uses more in the chip field at present, usually needs to carry out carving treatment to the IC chip surface of batch fast, but marking device among the prior art is inconvenient to carry out the location to batch IC chip, leads to can't carry out carving treatment to every IC chip fast.
Disclosure of Invention
The utility model provides an automatic positioning and marking device for IC chips, which solves the problem that the marking device in the related art is inconvenient to position batch of IC chips, so that each IC chip cannot be engraved quickly.
The technical scheme of the utility model is as follows:
IC chip automatic positioning marking device includes
The machine frame is provided with a machine frame,
the feeding limit frame is arranged on the frame and is provided with a limit channel,
the first supporting plate is movably arranged on the frame and positioned at one side of the limiting channel, after the first supporting plate moves, the first supporting plate stretches into the limiting channel,
the first jacking piece is arranged on the frame in a lifting way, is positioned at the bottom of the limiting channel and is positioned below the first supporting plate,
the second jacking piece is arranged on the first jacking piece in a lifting manner, after the first jacking piece is lifted, the second jacking piece is close to the first supporting plate, after the second jacking piece is lifted, the second jacking piece is used for abutting against the chip, the lifting direction of the first jacking piece is parallel to the lifting direction of the second jacking piece,
the engraving device is arranged on the frame and positioned at one side of the feeding limit frame,
the tray is arranged on the frame in a moving way and is positioned below the first supporting plate, the moving direction of the first supporting plate, the lifting direction of the first jacking piece and the moving direction of the tray are perpendicular to each other, after the tray moves, the tray moves from one side of the engraving device to the limiting channel, and the tray is used for receiving chips.
As a further technical scheme, the feeding limiting frame comprises
Four material loading shelves are all in the vertical direction setting in the frame, and all be L type, four form between the material loading shelf spacing passageway.
As a further technical scheme, the number of the first supporting plates is two, the two first supporting plates are respectively located at two sides of the limiting channel, and the first supporting plates are L-shaped.
As a further technical scheme, the number of the second jacking pieces is two, the two second jacking pieces are symmetrically arranged on the first jacking piece, and after the tray moves, the tray is located between the two second jacking pieces.
As a further technical proposal, also comprises
The sliding rail is arranged on the frame, and the tray is movably arranged on the sliding rail.
As a further technical proposal, also comprises
Four material storage frames are arranged on the frame along the vertical direction and are L-shaped, a material storage channel is formed among the four material storage frames, the material storage frames are positioned at one end of the sliding rail far away from the material loading limiting frame,
the two second supporting plates are symmetrically arranged on the frame in a swinging way, and are respectively positioned at two sides of the material storage channel,
the third jacking piece is arranged on the frame in a lifting manner, is positioned below the material storage channel and below the second supporting plate, and swings after being lifted, and is used for abutting against the chip and jacking the chip onto the second supporting plate.
The working principle and the beneficial effects of the utility model are as follows:
in the utility model, the current marking device usually performs rapid engraving treatment operation on the surfaces of I C chips in batches in the chip field, but the marking device is inconvenient to position I C chips in batches and is inconvenient to rapidly engrave each I C chip one by one, so that an automatic positioning marking device for I C chips is designed for solving the problems;
the worker can place the batch I C chips in the limiting channel of the feeding limiting frame, the frame provides supporting function for the batch I C chips, positioning operation is carried out on the batch I C chips, and in order to further facilitate sorting out each I C chip one by one, the subsequent engraving device arranged on the frame is convenient for engraving treatment, the frame is movably provided with a first supporting plate which can extend into the limiting channel after moving, further limiting supporting operation on the batch I C chips can be carried out, when one I C chips at the bottom are needed to be separated, the second lifting piece arranged on the first lifting piece is controlled to move towards the I C chips and abut against the I C chips, limiting supporting operation can be carried out on the batch I C chips instead of the first supporting plate, at the moment, the first supporting plate is moved to be far away from the I C chips, and limiting function is relieved, further moving the first jacking piece to further enable the second jacking piece to drive a plurality of I C chips to move towards the bottom of the limiting channel, at the moment, the first supporting plate is lifted relative to the positions of the chips in batches I C, when the first supporting plate is just separated from one I C chip at the bottom, the first jacking piece is stopped to move, the first supporting plate is driven to carry out limiting supporting operation on all I C chips at the bottom, at the moment, one I C chip is successfully separated, a tray which is moved between the engraving device and the bottom of the limiting channel is driven to receive one I C chip at the bottom, after the tray is moved, the tray is close to the second jacking piece which supports one I C chip at the bottom and supports I C chips, at the moment, the second jacking piece is lowered, so that the I C chips are completely supported by the tray, and further the tray is conveniently transported to the engraving device for engraving; and in order to stabilize the operation effect of the whole device, designing the moving direction of the first supporting plate, the lifting direction of the first jacking piece and the moving direction of the tray, wherein the moving direction, the lifting direction and the moving direction of the tray are perpendicular to each other; after the engraving operation of the I C chip is finished, a worker can directly take the chip off the tray, so that the subsequent operation is convenient; after the bottom I C chip is taken away and the engraving operation is completed, the I C chip at the bottom can be further operated according to the steps, so that the overall working efficiency is improved.
Drawings
The utility model will be described in further detail with reference to the drawings and the detailed description.
FIG. 1 is a schematic diagram of an automatic positioning and marking device for I C chips in the utility model;
FIG. 2 is a schematic diagram of the structure of the feeding limiting frame in the present utility model;
FIG. 3 is an enlarged view of portion A of FIG. 2 in accordance with the present utility model;
FIG. 4 is a schematic view of a first pallet according to the present utility model;
FIG. 5 is an enlarged view of portion D of FIG. 4 in accordance with the present utility model;
FIG. 6 is an enlarged view of portion B of FIG. 2 in accordance with the present utility model;
FIG. 7 is an enlarged view of portion E of FIG. 4 in accordance with the present utility model;
FIG. 8 is an enlarged view of portion C of FIG. 2 in accordance with the present utility model;
FIG. 9 is a cross-sectional view of the loading end stop of the present utility model;
in the figure: 1. the device comprises a frame, 2, a feeding limit frame, 3, a limit channel, 4, a first supporting plate, 5, a first jacking piece, 6, a second jacking piece, 7, a carving device, 8, a tray, 9, a feeding frame, 10, a sliding rail, 11, a stock frame, 12, a stock channel, 13, a second supporting plate, 14 and a third jacking piece.
Detailed Description
The technical solutions of the embodiments of the present utility model will be clearly and completely described below in conjunction with the embodiments of the present utility model, and it is apparent that the described embodiments are only some embodiments of the present utility model, not all embodiments. All other embodiments, which can be made by one of ordinary skill in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.
As shown in fig. 1-9, the embodiment provides an automatic positioning and marking device for I C chips, which comprises
The machine frame 1 is provided with a plurality of machine frames,
a feeding limit frame 2 arranged on the frame 1, wherein the feeding limit frame 2 is provided with a limit channel 3,
the first supporting plate 4 is movably arranged on the frame 1 and positioned at one side of the limiting channel 3, after the first supporting plate 4 moves, the first supporting plate 4 stretches into the limiting channel 3,
the first jacking piece 5 is arranged on the frame 1 in a lifting way, is positioned at the bottom of the limiting channel 3 and is positioned below the first supporting plate 4,
the second jacking piece 6 is arranged on the first jacking piece 5 in a lifting manner, after the first jacking piece 5 is lifted, the second jacking piece 6 is close to the first supporting plate 4, after the second jacking piece 6 is lifted, the second jacking piece 6 is used for abutting against a chip, the lifting direction of the first jacking piece 5 is parallel to the lifting direction of the second jacking piece 6,
the engraving device 7 is arranged on the frame 1 and positioned at one side of the feeding limit frame 2,
the tray 8 is movably arranged on the frame 1 and is positioned below the first supporting plate 4, the moving direction of the first supporting plate 4, the lifting direction of the first jacking piece 5 and the moving direction of the tray 8 are perpendicular to each other, after the tray 8 moves, the tray 8 moves from one side of the engraving device 7 to the inside of the limiting channel 3, and the tray 8 is used for receiving chips.
In this embodiment, the current marking device generally performs rapid engraving operation on the surfaces of I C chips in batches in the chip field, but the marking device is inconvenient to position I C chips in batches, and is inconvenient to rapidly engrave each I C chip one by one, so as to solve the above problems, an automatic I C chip positioning marking device is designed;
the worker can place the batch I C chips in the limiting channel 3 of the feeding limiting frame 2, the frame 1 provides supporting function for the batch I C chips, positioning operation is carried out on the batch I C chips, and in order to further facilitate sorting out each I C chip one by one, the subsequent engraving device 7 arranged on the frame 1 is convenient for engraving treatment, the frame 1 is movably provided with the first supporting plate 4 which can extend into the limiting channel 3 after moving, further limiting supporting operation can be carried out on the batch I C chips, when one I C chips at the bottom are needed to be separated out, the second lifting piece 6 arranged on the first lifting piece 5 is controlled to move towards the I C chips and abut against the I C chips, limiting supporting operation can be carried out on the batch I C chips instead of the first supporting plate 4, the first supporting plate 4 is moved away from the I C chips at the moment, limiting function is relieved, further moving the first jacking piece 5 to further enable the second jacking piece 6 to drive a plurality of I C chips to move towards the bottom of the limiting channel 3, at the moment, the first supporting plate 4 ascends relative to the positions of the chips in batches I C, when the first supporting plate 4 is just separated from one I C chip at the bottom, the first jacking piece 5 is stopped moving, the first supporting plate 4 is driven to implement limiting supporting operation on all I C chips remained at the bottom, at the moment, a single I C chip is successfully separated, a tray 8 moving between the engraving device 7 and the bottom of the limiting channel 3 is driven to receive one I C chip at the bottom, after the tray 8 moves, the tray 8 approaches to the second jacking piece 6 for supporting one I C chip at the bottom and supports I C chips, at the moment, the second jacking piece 6 is descended, so that the I C chips are completely supported by the tray 8, and then the material is conveniently transported to the engraving device 7 for engraving; in order to stabilize the operation effect of the whole device, the moving direction of the first supporting plate 4, the lifting direction of the first jacking piece 5 and the moving direction of the tray 8 are designed to be perpendicular to each other; after the engraving operation of the I C chip is finished, a worker can directly take the chip off the tray 8, so that the subsequent operation is convenient; after the bottom I C chip is taken away and the engraving operation is completed, the I C chip at the bottom can be further operated according to the steps, so that the overall working efficiency is improved.
Further, the loading limiting frame 2 comprises
Four material loading shelves 9 are all in the vertical direction setting in on the frame 1, and all be L type, four form between the material loading shelves 9 spacing passageway 3.
In this embodiment, in order to provide stable spacing effect to the I C chip of batch, the four vertically setting's of design material loading spacing 2 oil material loading frame 9 are constituteed, form spacing passageway 3 between four material loading frames 9, restrict the chip of batch I C in spacing passageway 3, and material loading frame 9 is the L type, provides stable joint spacing effect.
Further, the number of the first supporting plates 4 is two, the two first supporting plates 4 are respectively located at two sides of the limiting channel 3, and the first supporting plates 4 are of an L shape.
In this embodiment, after moving the first layer board 4, in order to conveniently adjust the spacing supporting role to I C chip, the design is provided with first layer board 4 in the equal removal of spacing passageway 3 both sides, after first layer board 4 removes, can butt I C chip both ends partly just can be to its spacing supporting role, convenient operation, and can not influence other work pieces to I C chip's operation, and L type tray 8 design is in order to conveniently provide power to it, saves equipment volume simultaneously.
Further, the number of the second jacking members 6 is two, the two second jacking members 6 are symmetrically arranged on the first jacking member 5, and after the tray 8 moves, the tray 8 is located between the two second jacking members 6.
In this embodiment, since the I C chip is longer, only a group of second jacking members 6 are used to stably support I C chips, the second jacking members 6 are symmetrically arranged on two sides of the first jacking member 5, two ends of the I C chip can be supported as the first supporting plate 4, the tray 8 can be conveniently moved and then positioned between the two second jacking members 6, and I C chips can be conveniently transported.
Further, also include
The sliding rail 10 is arranged on the frame 1, and the tray 8 is movably arranged on the sliding rail 10.
In this embodiment, in order to provide a stable guiding function for the moving tray 8, a slide rail 10 is mounted on the frame 1, so that the tray 8 is movably disposed on the slide rail 10.
Further, also include
Four stock racks 11 are all arranged on the frame 1 along the vertical direction and are L-shaped, stock channels 12 are formed among the four stock racks 11, the stock racks 11 are positioned at one end of the slide rail 10 away from the loading limit frame 2,
two second supporting plates 13, the two second supporting plates 13 are symmetrically arranged on the frame 1 in a swinging way, the two second supporting plates 13 and 4 are respectively positioned at two sides of the material storage channel 12,
the third jacking piece 14 is arranged on the frame 1 in a lifting manner, is positioned below the material storage channel 12 and below the second supporting plate 13, after the third jacking piece 14 is lifted, the second supporting plate 13 swings, and the third jacking piece 14 is used for abutting against the chip and jacking the chip onto the second supporting plate 13.
In this embodiment, in order to facilitate collection and storage of each I C chip subjected to engraving operation, no worker needs to collect I C chips once every time operation is completed, a material storage device is designed, four material storage racks 11 which are all L-shaped are arranged at one end of each material storage rack 2 in the vertical direction on a rack 1 according to the same principle as that of each material storage rack 2, so that the material storage channels 12 for storing materials are also formed, transfer I C chips from the material storage channels 3 to the material storage channels 12 of a tray 8 is realized, in order to store the engraved I C chips one by one into the material storage channels, two second supporting plates 13 are symmetrically arranged at two sides of the material storage channels 12 in a swinging manner, when the tray 8 transfers I C chips, a third lifting member 14 which is arranged under the material storage channels 12 is driven to lift up and down, so that I C chips on the tray 8 are lifted up, in the lifting process of the I C chip, two ends of the I C chip can abut against the second supporting plate 13 with the inclined part, the second supporting plate 13 swings a certain angle, the I C chip is conveniently lifted to the upper side of the second supporting plate 13, then the second supporting plate 13 swings back to the original position after the gravity action of the second supporting plate 13 and I C chips do not abut against the inclined part, at the moment, the I C chip can be supported by the second supporting plates 13 on two sides, the position of the third jacking piece 14 is lowered, the I C chip is stored, after the carving of one I C chip is finished, only the third jacking piece 14 is required to be driven to jack the second supporting plate, meanwhile, the I C chip originally positioned in the stock channel 12 is lifted together, stock is completed, and the L-shaped design also can provide a limit guiding effect for the moving I C chip, so that stable stock is realized.
The foregoing description of the preferred embodiments of the utility model is not intended to be limiting, but rather is intended to cover all modifications, equivalents, alternatives, and improvements that fall within the spirit and scope of the utility model.

Claims (6)

  1. The IC chip automatic positioning marking device is characterized by comprising
    A frame (1),
    the feeding limit frame (2) is arranged on the frame (1), the feeding limit frame (2) is provided with a limit channel (3),
    the first supporting plate (4) is movably arranged on the frame (1) and positioned at one side of the limiting channel (3), after the first supporting plate (4) moves, the first supporting plate (4) stretches into the limiting channel (3),
    the first jacking piece (5) is arranged on the frame (1) in a lifting way, is positioned at the bottom of the limiting channel (3) and is positioned below the first supporting plate (4),
    the second jacking piece (6) is arranged on the first jacking piece (5) in a lifting manner, after the first jacking piece (5) is lifted, the second jacking piece (6) is close to the first supporting plate (4), after the second jacking piece (6) is lifted, the second jacking piece (6) is used for abutting against a chip, the lifting direction of the first jacking piece (5) is parallel to the lifting direction of the second jacking piece (6),
    the engraving device (7) is arranged on the frame (1) and positioned at one side of the feeding limit frame (2),
    tray (8), remove and set up in frame (1), be located first layer board (4) below, first layer board (4) direction of movement, first jacking piece (5) direction of lifting with tray (8) direction of movement, three two liang are perpendicular, after tray (8) remove, tray (8) follow engraving device (7) one side removes to in spacing passageway (3), tray (8) are used for accepting the chip.
  2. 2. The automatic positioning and marking device for the IC chip according to claim 1, wherein the feeding limiting frame (2) comprises
    Four material loading shelves (9) are all arranged on the frame (1) along the vertical direction, are all L-shaped, and form between four material loading shelves (9) spacing passageway (3).
  3. 3. The automatic positioning and marking device for the IC chip according to claim 1, wherein the number of the first supporting plates (4) is two, the two first supporting plates (4) are respectively positioned at two sides of the limiting channel (3), and the first supporting plates (4) are L-shaped.
  4. 4. The automatic positioning and marking device for the IC chip according to claim 1, wherein the number of the second jacking members (6) is two, the two second jacking members (6) are symmetrically arranged on the first jacking member (5), and the tray (8) is located between the two second jacking members (6) after the tray (8) is moved.
  5. 5. The IC chip automatic positioning marking device according to claim 1, further comprising
    The sliding rail (10) is arranged on the frame (1), and the tray (8) is movably arranged on the sliding rail (10).
  6. 6. The IC chip automatic positioning marking device according to claim 5, further comprising
    Four stock racks (11) are arranged on the frame (1) along the vertical direction and are L-shaped, stock channels (12) are formed among the four stock racks (11), the stock racks (11) are positioned at one end of the sliding rail (10) far away from the feeding limiting frame (2),
    two second supporting plates (13), wherein the two second supporting plates (13) are symmetrically arranged on the frame (1) in a swinging way, the two second supporting plates (13) are respectively positioned at two sides of the material storage channel (12),
    the third jacking piece (14) is arranged on the frame (1) in a lifting mode, is located below the material storage channel (12) and below the second supporting plate (13), after the third jacking piece (14) is lifted, the second supporting plate (13) swings, and the third jacking piece (14) is used for abutting against the chip and jacking the chip onto the second supporting plate (13).
CN202320818343.3U 2023-04-04 2023-04-04 Automatic positioning marking device for IC chip Active CN219402819U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202320818343.3U CN219402819U (en) 2023-04-04 2023-04-04 Automatic positioning marking device for IC chip

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202320818343.3U CN219402819U (en) 2023-04-04 2023-04-04 Automatic positioning marking device for IC chip

Publications (1)

Publication Number Publication Date
CN219402819U true CN219402819U (en) 2023-07-25

Family

ID=87237952

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202320818343.3U Active CN219402819U (en) 2023-04-04 2023-04-04 Automatic positioning marking device for IC chip

Country Status (1)

Country Link
CN (1) CN219402819U (en)

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