CN219395425U - Concurrent cooling plate type liquid cooling cabinet - Google Patents

Abstract

The utility model discloses a downstream cooling plate type liquid cooling cabinet which comprises a cabinet body, a plurality of object carrying partition boards and a downstream cooling plate cooling mechanism, wherein the object carrying partition boards are arranged in the cabinet body, a plurality of cooling object carrying cavities are formed between the object carrying partition boards and the cabinet body, the downstream cooling plate cooling mechanism is arranged in the cabinet body and comprises a plurality of downstream cooling plates, heat conducting grooves are formed in two sides of the downstream cooling plates, heat conducting blocks are arranged in the heat conducting grooves and are in contact with the inner walls of the heat conducting grooves, guide plate cores are arranged in the downstream cooling plates, a plurality of current limiting protrusions are integrally formed in two sides of the downstream cooling plates, and the current limiting protrusions are distributed with the heat conducting grooves at intervals. According to the utility model, through the arrangement of the corresponding mechanism, the contact effect of the flowing refrigerant and the core heating point of the single cabinet of the data center is increased, and the cooling effect of the single cabinet of the data center is improved.

Description

Concurrent cooling plate type liquid cooling cabinet

Technical Field

The present utility model relates to liquid cooling cabinets, and more particularly to a concurrent flow cold plate type liquid cooling cabinet.

Background

With the continuous progress and development of computer science and technology, the industrial technology of data centers is also continuously promoted, the function consumption of data center servers is also increasingly greater, local hot spots can be easily generated due to the excessively high chip power consumption, so that the damage such as downtime can occur when the temperature of the server chip is excessively high and serious, and the cooling of the data center servers is particularly important.

At present, the common data center mainly comprises an air cooling mode and a liquid cooling mode, and as the power density of the single cabinet of the data center is gradually increased, the traditional air cooling mode can not meet the cooling requirement of the single cabinet of the data center, and the liquid cooling mode becomes the main stream cooling mode of the single cabinet of the data center.

The general liquid cooling mainly comprises direct contact liquid cooling and indirect contact liquid cooling, wherein the direct contact liquid cooling is represented by immersion liquid cooling, however, a strict sealing technology is required in the cooling mode, the development is still immature, and the cold plate type liquid cooling is represented by indirect contact liquid cooling.

In the prior art, a hollow metal cold plate is mainly clung to a core heating point in a single cabinet of a data center, and the core heating point is subjected to cooling treatment in a mode that flowing refrigerants pass through the hollow metal cold plate, however, the effect of heat exchange on the core heating point in the single cabinet of the data center is poor by adopting a single hollow metal cold plate, and the contact period of the refrigerants and the core heating point is short, so that the cooling efficiency of the cold plate type liquid cooling cabinet is low.

Disclosure of Invention

The utility model aims to provide a downstream cold plate type liquid cooling cabinet, which can solve the problem of lower cooling efficiency of the conventional cold plate type liquid cooling cabinet.

To achieve the above object, the present utility model provides a downstream cold plate type liquid cooling cabinet, comprising: the cabinet body, a plurality of year thing baffles, concurrent flow cold plate cooling mechanism.

The object carrying partition boards are arranged in the cabinet body, and a plurality of cooling object carrying cavities are formed between the object carrying partition boards and the cabinet body. The cooling device comprises a cabinet body, a downstream type cold plate cooling mechanism and a cooling plate fixing block, wherein the downstream type cold plate cooling mechanism is arranged in the cabinet body and comprises a plurality of downstream type cold plates, the downstream type cold plates are respectively arranged in a cooling carrying cavity, guide plate cores are arranged in the downstream type cold plates, a pair of downstream conduction cavities are formed between the downstream type cold plates and the guide plate cores, the two ends of the downstream type cold plates are respectively connected with the cold plate fixing block, and a conduction pipe is arranged in the cold plate fixing block.

In one or more embodiments, heat conducting grooves are formed on two sides of the downstream cold plates.

In one or more embodiments, a plurality of heat conducting blocks are arranged in the heat conducting grooves, and the heat conducting blocks are in contact with the inner walls of the heat conducting grooves.

In one or more embodiments, the baffle core is integrally formed with a plurality of flow-limiting protrusions on two sides of the downstream cold plate, and the plurality of flow-limiting protrusions are spaced apart from the heat-conducting grooves.

In one or more embodiments, a pair of liquid adding pipes are connected to one side of the conducting pipe close to the downstream cooling plate, and the pair of liquid adding pipes are conducted with the downstream conducting cavity.

In one or more embodiments, a conduction downstream pipe is connected between the downstream cold plates, the conduction downstream pipe is conducted with the conduction pipe, and the conduction downstream pipe is arranged in the object carrying partition plate.

In one or more embodiments, a liquid feeding port is connected to the lower portion of the cabinet body, a liquid inlet pipe is connected to the liquid feeding port, and the liquid inlet pipe is communicated with the conducting pipe.

In one or more embodiments, a liquid outlet is connected to one side of the cabinet body away from the liquid filling port, a liquid discharge pipe is connected to the liquid outlet, the liquid discharge pipe is communicated with the guide pipe, and the liquid discharge pipe is located above the liquid inlet pipe.

Compared with the prior art, the utility model increases the contact effect of the flowing refrigerant and the core heating point of the single cabinet of the data center through the arrangement of the corresponding mechanism, and improves the cooling effect of the single cabinet of the data center.

Drawings

Fig. 1 is a front cross-sectional view according to an embodiment of the present utility model.

Fig. 2 is a schematic diagram of the structure at a in fig. 1.

Fig. 3 is a schematic diagram of the structure at B in fig. 1.

Fig. 4 is a schematic view of the structure at C in fig. 1.

Fig. 5 is a perspective view of an embodiment according to the present utility model.

The main reference numerals illustrate:

1-cabinet, 2-object carrying partition board, 3-cooling object carrying cavity, 4-downstream cooling plate cooling mechanism, 401-downstream cooling plate, 402-guide plate core, 403-downstream conducting cavity, 404-cooling plate fixing block, 405-conducting pipe, 406-conducting block, 407-current limiting bulge, 408-liquid adding pipe, 409-downstream conducting pipe, 410-liquid adding port, 411-liquid inlet pipe, 412-liquid outlet and 413-liquid outlet pipe.

Detailed Description

The following detailed description of embodiments of the utility model is, therefore, to be taken in conjunction with the accompanying drawings, and it is to be understood that the scope of the utility model is not limited to the specific embodiments.

Throughout the specification and claims, unless explicitly stated otherwise, the term "comprise" or variations thereof such as "comprises" or "comprising", etc. will be understood to include the stated element or component without excluding other elements or components.

As shown in fig. 1 to 5, according to an embodiment of the present utility model, the refrigerator comprises a cabinet 1, a plurality of object-carrying partition boards 2, and a downstream cooling mechanism 4.

As shown in fig. 1, a plurality of object carrying partition boards 2 are arranged in the cabinet body 1, and the servers in the cabinet body 1 are assembled and limited through the object carrying partition boards 2, meanwhile, the object carrying partition boards 2 are convenient to play a role in fixing and protecting the conduction downstream pipe 409, so that the condition that the conduction downstream pipe 409 leaks in the use process is reduced. A plurality of cooling carrying cavities 3 are formed between the plurality of carrying partition boards 2 and the cabinet body 1, so that the server can be conveniently assembled, limited and cooled.

As shown in fig. 1 to 2, the downstream cooling mechanism 4 is disposed in the cabinet body 1, so that the cooling treatment is performed on the cooling object carrying cavity 3 by the downstream cooling mechanism 4. The downstream cooling mechanism 4 comprises a plurality of downstream cooling plates 401, and the downstream cooling plates 401 are respectively arranged in the cooling carrying cavity 3, so that the cooling carrying cavity 3 is conveniently cooled by the flow guiding mode of the downstream cooling plates 401. Wherein, heat conduction grooves are formed on two sides of the plurality of downstream cold plates 401, so that the heat conduction blocks 406 are fixed and limited through the heat conduction grooves.

As shown in fig. 1 to 2, the heat conducting blocks 406 are disposed in the plurality of heat conducting grooves, so that heat exchange treatment is conveniently performed on the core heating point of the device in the cooling carrying cavity 3 through the heat conducting blocks 406. The heat conducting block 406 contacts with the inner wall of the heat conducting groove, and the refrigerant flowing in the downstream conduction cavity 403 can fully contact with the heat conducting block 406 by contacting the heat conducting block 406 with the inner wall of the heat conducting groove, so that the heat exchange efficiency of the heat conducting block 406 is improved.

As shown in fig. 1 to 2, a plurality of downstream cooling plates 401 are each provided with a guide plate core 402, so that a downstream conduction cavity 403 is formed by the cooperation of the guide plate cores 402 and the downstream cooling plates 401, thereby facilitating the limit conduction of the refrigerant. A pair of downstream conducting cavities 403 is formed between the downstream cold plate 401 and the guide plate core 402, so that the cooling and cooling treatment of the cooling carrying cavity 3 can be conveniently performed in a mode that the refrigerant circulates in the downstream conducting cavities 403.

As shown in fig. 1 to 2, both ends of the plurality of concurrent cooling plates 401 are connected with cooling plate fixing blocks 404, and the concurrent cooling plates 401 are supported and fixed by the cooling plate fixing blocks 404. And simultaneously, the cold plate fixing block 404 is convenient to play a role in preventing leakage of liquid from the conducting tube 405. A conduction pipe 405 is arranged in the cold plate fixing block 404, so that heat exchange refrigerant is conveniently conveyed into the downstream conduction cavity 403 through the conduction pipe 405.

As shown in fig. 1 to 2, a plurality of current-limiting protrusions 407 are integrally formed on two sides of the current-guiding plate core 402 in the downstream cooling plate 401, and the plurality of current-limiting protrusions 407 are distributed with the heat-conducting grooves at intervals, so that the current-guiding and conveying effects on the refrigerant flowing in the downstream conduction cavity 403 can be conveniently achieved through the current-limiting protrusions 407.

As shown in fig. 1 to 2, a pair of liquid adding pipes 408 is connected to one side of the conducting pipe 405 close to the downstream cooling plate 401, and the pair of liquid adding pipes 408 are all conducted with the downstream conducting cavity 403, so that the refrigerant flowing in the conducting pipe 405 is conveyed into the downstream conducting cavity 403 under the action of the pair of liquid adding pipes 408, and thus the cooling and cooling treatment is performed on the cooling carrying cavity 3.

As shown in fig. 1 to 4, a conduction downstream pipe 409 is connected between the plurality of downstream cold plates 401, and the plurality of downstream cold plates 401 are connected by the conduction downstream pipe 409. The conduction downstream pipe 409 is conducted with the conduction pipe 405, so that the conduction downstream pipe 409 is convenient to communicate with the conduction pipe 405, and the refrigerant can flow downstream along the conduction downstream pipes 405 under the action of the conduction downstream pipe 409. And the conduction forward flow pipe 409 is arranged in the object carrying partition board 2, plays a role in assembly and fixation of the conduction forward flow pipe 409 through the object carrying partition board 2, and simultaneously plays a role in leakage protection of the conduction forward flow pipe 409 through the object carrying partition board 2.

As shown in fig. 1 to 3, a liquid filling port 410 is connected to the lower side of the cabinet 1, so that the external refrigerant is conveniently communicated through the liquid filling port 410. The liquid inlet 410 is connected with a liquid inlet pipe 411, and the liquid inlet pipe 411 is communicated with the communicating pipe 405, so that the external refrigerant is conveyed into the communicating pipe 405 under the action of the liquid inlet pipe 411.

As shown in fig. 1 to 4, a liquid outlet 412 is connected to a side of the cabinet body 1 away from the liquid inlet 410, and a pipe for the return of the external refrigerant is connected and fixed through the liquid outlet 412. The liquid discharge port 412 is connected with a liquid discharge pipe 413, and the liquid discharge pipe 413 is communicated with the conducting pipe 405, so that the refrigerant after heat exchange in the conducting pipe 405 is conveniently conveyed and led out through the liquid discharge pipe 413. And the drain pipe 413 is located the top of feed liquor pipe 411, through setting up the drain pipe 413 in the top of feed liquor pipe 411 for the refrigerant can fully circulate in multiunit concurrent cooling plate 401, has improved concurrent cooling plate 401 and has carried out the efficiency of cooling down to cabinet body 1.

In specific use, the external refrigerant is fed into the conducting tube 405 through the liquid feeding port 410, and the external refrigerant is conveyed into the conducting tube 411. The refrigerant in the conduit 405 is conveyed into the downstream conduit 403 under the action of the liquid adding pipe 408, and exchanges heat between the downstream cooling plate 401 and the heat conducting block 406 in a manner that the refrigerant circulates in the downstream conduit 403, so as to cool the cabinet 1.

Meanwhile, in the use process, the heat conduction block 406 can be in contact with the core heating point in the cabinet body 1 to perform heat exchange on the core heating point. Meanwhile, the heat conduction block 406 is subjected to multi-azimuth heat exchange by the refrigerant flowing in the downstream conduction cavity 403, so that the efficiency of cooling the heat generating point of the core in the cabinet body 1 is improved.

In addition, the refrigerant in the downstream conduction cavity 403 is downstream in the plurality of groups of downstream cooling plates 401 under the cooperation of the conduction pipe 405 and the conduction downstream pipe 409, and the refrigerant after heat exchange can be discharged from the liquid discharge pipe 413 and the liquid discharge port 412.

The foregoing descriptions of specific exemplary embodiments of the present utility model are presented for purposes of illustration and description. It is not intended to limit the utility model to the precise form disclosed, and obviously many modifications and variations are possible in light of the above teaching. The exemplary embodiments were chosen and described in order to explain the specific principles of the utility model and its practical application to thereby enable one skilled in the art to make and utilize the utility model in various exemplary embodiments and with various modifications as are suited to the particular use contemplated. It is intended that the scope of the utility model be defined by the claims and their equivalents.

Claims (8)

1. Downstream cold plate-type liquid cooling rack, its characterized in that includes:

a cabinet body;

the object carrying partition plates are arranged in the cabinet body, and a plurality of cooling object carrying cavities are formed between the object carrying partition plates and the cabinet body;

the downstream type cold plate cooling mechanism is arranged in the cabinet body and comprises a plurality of downstream type cold plates, the downstream type cold plates are respectively arranged in the cooling carrying cavities, guide plate cores are arranged in the downstream type cold plates, a pair of downstream conduction cavities are formed between the downstream type cold plates and the guide plate cores, the two ends of the downstream type cold plates are respectively connected with a cold plate fixing block, and a conduction pipe is arranged in each cold plate fixing block.

2. The downstream-cooled panel-type liquid-cooled cabinet of claim 1, wherein a plurality of the downstream-cooled panels are provided with thermally conductive grooves on both sides.

3. The downstream-cooled panel-type liquid-cooled cabinet of claim 2, wherein a plurality of the heat-conducting grooves are each provided with a heat-conducting block, and the heat-conducting blocks are in contact with the inner walls of the heat-conducting grooves.

4. The downstream-cooled panel-type liquid-cooled cabinet of claim 2, wherein the baffle core is integrally formed with a plurality of flow-limiting protrusions on two sides of the downstream-type cold panel, and the plurality of flow-limiting protrusions are spaced apart from the heat-conducting grooves.

5. The downstream-cooled panel-type liquid-cooled cabinet of claim 1, wherein the conduit is connected to a pair of liquid-filling tubes on a side of the conduit proximate to the downstream-cooled panel, the pair of liquid-filling tubes each being in communication with the downstream-conducting cavity.

6. The downstream-cooled panel-type liquid-cooled cabinet of claim 1, wherein a conductive downstream pipe is connected between the downstream-type cold panels, the conductive downstream pipe is in communication with the conductive pipe, and the conductive downstream pipe is disposed in the carrier partition.

7. The downstream-cooled plate-type liquid cooling cabinet of claim 1, wherein a liquid filling port is connected below the cabinet body, a liquid inlet pipe is connected to the liquid filling port, and the liquid inlet pipe is communicated with the conducting pipe.

8. The downstream-cooled plate-type liquid-cooled cabinet of claim 7, wherein a liquid outlet is connected to one side of the cabinet body away from the liquid inlet, a liquid discharge pipe is connected to the liquid outlet, the liquid discharge pipe is communicated with the guide pipe, and the liquid discharge pipe is located above the liquid inlet pipe.