CN219395395U - Heat abstractor and electronic equipment - Google Patents
Heat abstractor and electronic equipment Download PDFInfo
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- CN219395395U CN219395395U CN202320164187.3U CN202320164187U CN219395395U CN 219395395 U CN219395395 U CN 219395395U CN 202320164187 U CN202320164187 U CN 202320164187U CN 219395395 U CN219395395 U CN 219395395U
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- capillary structure
- plate body
- capillary
- heat
- heat dissipation
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
- Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management
Abstract
The application discloses a heat abstractor and electronic equipment. The heat dissipation device comprises a heat dissipation body, a first capillary structure and at least one second capillary structure, wherein the heat dissipation body comprises a first plate body and a second plate body which are oppositely arranged, a closed accommodating cavity is formed between the first plate body and the second plate body, and the first plate body is used for being connected with a heat source of electronic equipment; the first capillary structure covers the surface of the first plate body in the accommodating cavity; the at least one second capillary structure is arranged on the surface of the first capillary structure, which is away from the first plate body, and other parts of the space between the first capillary structure and the second plate body form a gas space. At least partial gas space is occupied in the limited space in the accommodating cavity so as to add the second capillary structure, and the overall thickness of the capillary structure is increased, so that the speed of reflux of condensed liquid is increased, and the heat dissipation efficiency and the continuous heat dissipation effect of the heat dissipation device are effectively improved.
Description
Technical Field
The application relates to the technical field of electronic equipment, in particular to a heat dissipation device and electronic equipment.
Background
With the improvement of the efficiency of electronic products, the heat energy of the integrated circuits and other electroacoustic optical devices in the electronic products is higher and higher, and poor heat dissipation can cause local temperature rise of the products, so that the use experience is affected.
Disclosure of Invention
The embodiment of the application provides a heat abstractor and electronic equipment to solve current electronic equipment heat dissipation poor, lead to the local temperature of product to rise, influence the problem of using experience.
In order to solve the technical problems, the embodiment of the application provides the following technical scheme:
the first aspect of the application provides a heat dissipation device, which comprises a heat dissipation body, wherein the heat dissipation body comprises a first plate body and a second plate body which are oppositely arranged, a closed accommodating cavity is formed between the first plate body and the second plate body, and the first plate body is used for being connected with a heat source of electronic equipment;
the first capillary structure covers the surface of the first plate body in the accommodating cavity;
the at least one second capillary structure is arranged on the surface of the first capillary structure, which is away from the first plate body, and other parts of the space between the first capillary structure and the second plate body form a gas space.
In some modified embodiments of the first aspect of the present application, the aforementioned heat dissipating device, wherein a side of the second capillary structure facing away from the first capillary structure is connected to the second board.
In some modified embodiments of the first aspect of the present application, the foregoing heat dissipating device, wherein the number of the second capillary structures is a plurality;
the plurality of second capillary structures are arranged on the surface, away from the first plate body, of the first capillary structures at intervals.
In some modified embodiments of the first aspect of the present application, the foregoing heat dissipating device, wherein the second capillary structures are columnar, and a plurality of the second capillary structures are arranged in a matrix.
In some modified embodiments of the first aspect of the present application, the foregoing heat dissipating device, wherein the second capillary structure is two;
the two second capillary structures are arranged at two ends of the surface, deviating from the first plate body, of the first capillary structure, and the second capillary structures are formed by bending the first capillary structures.
In some variations of the first aspect of the present application, the aforementioned heat dissipating device, wherein the second capillary structure is the same or different material as the first capillary structure.
In some modified embodiments of the first aspect of the present application, the foregoing heat dissipating device further includes a plurality of supporting members;
the plurality of supporting pieces are distributed between the first capillary structure and the second plate body at intervals.
In some modified embodiments of the first aspect of the present application, the foregoing heat dissipating device, wherein the support member is disposed parallel to the second capillary structure, and a channel penetrating the support member in a direction parallel to the second capillary structure is provided on the support member; or;
and a third capillary structure is arranged on the surface of the supporting piece and is connected with the first capillary structure.
In some modified embodiments of the first aspect of the present application, the foregoing heat dissipating device, wherein the thickness of the first capillary structure is equal to the height of the gas space.
A second aspect of the present application provides an electronic device, comprising:
the heat radiator comprises a shell, at least one heat source and the heat radiator, wherein the heat radiator is arranged between the shell and the heat source.
Compared with the prior art, the heat dissipation device provided by the first aspect of the application occupies at least part of the gas space in the limited space in the accommodating cavity so as to add the second capillary structure, so that the overall thickness of the capillary structure is increased, the speed of reflux of condensed liquid is increased, and the heat dissipation efficiency of the heat dissipation device is effectively improved; the problem of the low local temperature of product that leads to of radiating efficiency in effectively solving current electronic equipment risees, influences the use experience is solved.
Drawings
The above, as well as additional purposes, features, and advantages of exemplary embodiments of the present application will become readily apparent from the following detailed description when read in conjunction with the accompanying drawings. Several embodiments of the present application are illustrated by way of example and not by way of limitation in the figures of the accompanying drawings, in which like reference numerals refer to similar or corresponding parts and in which:
fig. 1 schematically illustrates a schematic structural diagram of a heat dissipating device provided in an embodiment of the present application;
fig. 2 schematically illustrates a second structural schematic diagram of a heat dissipating device according to an embodiment of the present application;
FIG. 3 schematically illustrates a top view of the heat sink of FIG. 2;
fig. 4 schematically illustrates a third structural schematic diagram of a heat dissipating device according to an embodiment of the present application;
FIG. 5 schematically illustrates a top view of the heat sink of FIG. 4;
fig. 6 schematically illustrates a fourth structural schematic diagram of a heat dissipating device according to an embodiment of the present application;
fig. 7 schematically illustrates a structural schematic diagram of an electronic device provided in an embodiment of the present application;
reference numerals illustrate: the heat sink comprises a heat radiation body 1, a first plate 11, a second plate 12, a first capillary structure 2, a second capillary structure 3, a heat source 4, a support 5 and a shell 6.
Detailed Description
Exemplary embodiments of the present disclosure will be described in more detail below with reference to the accompanying drawings. While exemplary embodiments of the present disclosure are shown in the drawings, it should be understood that the present disclosure may be embodied in various forms and should not be limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the disclosure to those skilled in the art.
It is noted that unless otherwise indicated, technical or scientific terms used herein should be given the ordinary meaning as understood by one of ordinary skill in the art to which this application belongs.
The technical scheme of the embodiment of the application aims to solve the technical problems, and the overall thought is as follows:
example 1
Referring to fig. 1, a heat dissipating device provided in this embodiment of the present application includes a heat dissipating body 1, a first capillary structure 2, and at least one second capillary structure 3, where the heat dissipating body 1 includes a first board 11 and a second board 12 that are disposed opposite to each other, a closed accommodating cavity is formed between the first board 11 and the second board 12, and the first board 11 is used for connecting a heat source 4 of an electronic device; the first capillary structure 2 covers the surface of the first plate 11 in the accommodating cavity; the at least one second capillary structure 3 is arranged on the surface of the first capillary structure 2 facing away from the first plate 11, and other parts of the space between the first capillary structure 2 and the second plate 12 form a gas space.
Specifically, in order to improve the heat dissipation efficiency of the vapor chamber, the thickness of the inner capillary structure of the vapor chamber is generally increased, but the thickness of the capillary structure is increased to increase the overall thickness of the vapor chamber, so that the problem of limited design is caused for ultrathin products, and further, in order to solve the problem that the heat dissipation efficiency is low in the existing electronic equipment to cause local temperature rise of the products, the use experience is affected and the thickness of the capillary structure is increased to influence the overall thickness of the vapor chamber, the heat dissipation device provided by the embodiment is characterized in that at least one second capillary structure 3 is arranged in the accommodating cavity with a limited size while the first capillary structure 2 covering the first plate 11 is arranged to improve the accommodating quantity of heat absorption fluid, so that the heat dissipation efficiency of the heat dissipation device is improved.
The heat dissipation body 1 is in a vacuum plate structure, the first plate 11 and the second plate 12 are arranged at opposite intervals to form the accommodating cavity, the first plate 11 and the second plate 12 can be rigid plane plates or non-plane plates, in this embodiment, the position contacted with the heat source 4 is preferably set to be a plane plate, and the rest positions can be set to be non-plane plates, so as to effectively ensure heat transfer efficiency and increase heat dissipation area; one side of the first plate 11, which is away from the second plate 12, is used for being attached to the heat source 4, so that heat of the heat source 4 is led into the heat dissipation device to dissipate heat of the heat source 4; specifically, one end of the first plate 11, which is away from the surface of one side of the second plate 12, is attached to the heat source 4, so that the heat absorbing fluid in one end of the first capillary structure 2, which corresponds to the heat source 4, is heated and evaporated, in actual use, the accommodating cavity is vacuumized, and then the heat absorbing-heat dissipating phenomenon occurs in the phase change process of evaporation-condensation of the sealed heat absorbing fluid in the accommodating cavity in a negative pressure state, so that the heat diffusion is realized; specifically, the gas moves from the hot end, i.e. the end connected to the heat source 4, to the cold end, i.e. the end not contacted with the heat source 3, due to the pressure difference; the heat absorbing fluid is subjected to surface tension and circularly absorbs heat from the first capillary structure 2 from the cold end back to the heat source 4.
Wherein the first capillary structure 2 is used for containing and storing heat absorbing fluid, such as fiber, copper powder, etc., and the first capillary structure 2 covers the whole surface of the first plate body 1; the second capillary structure 3 is also used for containing and storing the heat absorbing fluid, and the second capillary structure 3 and the first capillary structure 2 may be made of the same material or different materials, as long as they can simultaneously contain and store the heat absorbing fluid, and the shape of the second capillary structure 3 is not limited herein, and may be a strip shape extending along the length or width direction of the first plate 11, or may be a block shape, a cylinder shape, or the like. The accommodating space of the closed accommodating cavity is certain in this embodiment, and the second capillary structure 3 is additionally arranged after the first capillary structure 2 is arranged, so that the overall sectional area of the capillary structure is increased in the thickness direction of the heat radiation body 1, more heat absorption fluid can be accommodated and stored, the heat absorption efficiency and the fluid supplementing rate are greatly improved, the heat absorption fluid is ensured to timely return to the position corresponding to the heat source 4, and the continuous heat radiation effect is effectively improved. It will of course be appreciated that: the number of the second capillary structures 3 may be designed and adjusted according to actual needs, and may be only one as shown in fig. 1, or may be a plurality of as shown in fig. 3, and when only one second capillary structure 3 is provided, it is preferably disposed at a position corresponding to the center of the first plate 11.
The electronic device may be, but is not limited to, a mobile phone, a notebook computer, a tablet computer, etc.; the heat source 4 is a heating element in the electronic device, and may be, but not limited to, a CPU, a GPU, or the like.
According to the above list, the heat dissipating device provided in the first aspect of the present application occupies at least part of the gas space in the limited space in the accommodating cavity to add the second capillary structure 3, so as to increase the overall thickness of the capillary structure, thereby increasing the speed of the reflux of the condensed liquid, and effectively improving the heat dissipating efficiency of the heat dissipating device; the problem of the low local temperature of product that leads to of radiating efficiency in effectively solving current electronic equipment risees, influences the use experience is solved.
The term "and/or" is herein merely an association relation describing an associated object, meaning that there may be three relations, e.g. a and/or B, specifically understood as: the composition may contain both a and B, and may contain a alone or B alone, and any of the above three cases may be provided.
Further, in the heat dissipating device provided in this embodiment, in a specific implementation, a side of the second capillary structure 3 facing away from the first capillary structure 2 is connected to the second plate 12.
Specifically, in order to increase the holding capacity of the capillary structure for the heat absorbing fluid as much as possible, in this embodiment, one side of the second capillary structure 3 away from the first capillary structure 2 is designed to be connected with the second plate 12, so that the size of the second capillary structure 3 reaches the maximum in the thickness direction of the heat dissipating body 1, the cross-sectional area of the thickness direction of the capillary structure is effectively increased on the premise of not changing the size of the space of the holding cavity, meanwhile, the second capillary structure 3 can also play a supporting role, effectively maintain the size of the gas space, and avoid the second plate 12 from deforming in the direction of the first plate 11, thereby affecting the size of the gas space and even the heat dissipating efficiency.
Further, referring to fig. 2 and fig. 3, in the heat dissipating device provided in this embodiment, in a specific implementation, the number of the second capillary structures 3 is a plurality; the plurality of second capillary structures 3 are arranged on the surface of the first capillary structure 2 facing away from the first plate 11 at intervals.
Specifically, in order to increase the carrying capacity of the heat absorbing fluid as much as possible, the supporting effect on the second plate 12 can be greatly improved by arranging the plurality of capillary structures 3 in this embodiment, and in order to ensure that the fluid gas in the gas space can ensure the gas backflow, the plurality of second capillary structures 3 are arranged at intervals, which may be orderly arranged in rows and columns on the surface of the first capillary structure 2 facing away from the first plate 11, or may not be orderly arranged.
Further, in the heat dissipating device provided in this embodiment, in a specific implementation, the second capillary structure 3 is in a column shape, and the plurality of second capillary structures 3 are arranged in a matrix.
Specifically, in this embodiment, the second capillary structure 3 is configured to be columnar, and the first plate 11 is axially parallel to the second plate 12, so as to ensure a larger contact area with the first capillary structure 2; of course, the columnar second capillary structure 3 may be disposed in parallel with the first plate 11 in the axial direction; meanwhile, in order to ensure smooth flow of the gas in the gas space, in this embodiment, the plurality of second capillary structures 3 are arranged in a matrix, so that a continuous and smooth gas flow channel can be formed in both the length direction and the width direction of the first plate 11.
Further, referring to fig. 4 and fig. 5, in the heat dissipating device provided in this embodiment, in an implementation manner, two second capillary structures 3 are provided; the two second capillary structures 3 are disposed at two ends of the surface of the first capillary structure 2 facing away from the first plate 11, and the second capillary structures 3 are formed by bending the first capillary structures 3.
Specifically, in order to simplify the structural design and molding of the heat radiator 1, in this embodiment, the two ends of the first capillary structure 3 are bent to form two arrangements of the second capillary structure 3, which not only can ensure that the bearing capacity of the heat absorption fluid is increased, but also can effectively reduce the molding process difficulty.
Further, referring to fig. 6, the heat dissipating device provided in this embodiment further includes a plurality of supporting members 5 in a specific implementation; the plurality of supporting members 5 are spaced between the first capillary structure 2 and the second plate 12.
Specifically, since the second capillary structure 3 is used for carrying the heat-absorbing fluid, a gap is necessarily present in the second capillary structure, so that the supporting strength is wired, and further, in order to effectively ensure the support of the second plate 12, in this embodiment, a plurality of supporting pieces 5 are additionally arranged on the basis of the second capillary structure 3, and the supporting pieces 5 are rigid structures, and can be any structures such as block, column, strip, cylinder and the like, so long as the supporting pieces can simultaneously abut against the first capillary structure 2 and the second plate 12; and it will be appreciated that a support 5 is necessarily provided in the present embodiment at the centre corresponding to the second plate 12 to ensure support for the second plate 12 against collapse or deformation.
Further, in the heat dissipating device provided in this embodiment, in a specific implementation, the supporting member 5 is disposed parallel to the second capillary structure 3, and a channel penetrating the supporting member 5 in a direction parallel to the second capillary structure 3 is provided on the supporting member 5; or; a third capillary structure (not shown) is provided on the surface of the support 5, which third capillary structure (not shown) is connected to the first capillary structure 2.
In particular, in this embodiment, the support 5 may also be arranged parallel to the second capillary structure 3, for example: the second capillary structure 3 is in a columnar shape which vertically props against the first capillary structure 2 and the second plate body 12, a channel is arranged between the first capillary structure 2 and the second plate body 12 by the supporting piece 5, and the weight of the supporting piece 5 and the weight of the whole heat dissipation device can be effectively reduced on the premise of keeping the supporting strength; for another example: the second capillary structure 3 is a strip structure parallel to the first plate 11, and the supporting member 5 is provided with a channel in a direction parallel to the first plate 11, so that a gas flow channel can be provided under the premise of maintaining the support, and the reflux rate of the heat absorption liquid is greatly improved. Further, in order to increase the bearing capacity of the heat absorption fluid and increase the backflow speed of the fluid, in this embodiment, a third capillary structure is arranged on the surface of the third capillary structure, and the third capillary structure is connected with the first capillary structure 2, so that the bearing space of the heat absorption fluid is effectively increased, and the persistence of heat dissipation is improved; the third capillary structure may be the same material as the first capillary structure 2 or may be a different material as long as the carrying amount of the heat absorbing fluid can be realized.
Further, referring to fig. 1, fig. 2, fig. 4, and fig. 6, in the heat dissipating device provided in this embodiment, in a specific implementation, the thickness of the first capillary structure 2 is equal to the height of the gas space.
Specifically, in order to ensure rapid backflow of the endothermic fluid after the endothermic evaporation, in this embodiment, the thickness of the first capillary structure 2 is set to be equal to the height of the gas space, so as to ensure sufficient and smooth gas backflow space.
Example 2
Referring to fig. 7, the present embodiment provides an electronic device, which includes a housing 6, at least one heat source 4, and the heat dissipation device, where the heat dissipation device is disposed between the housing 6 and the heat source 4.
Specifically, in order to solve the problem that the use experience is affected due to the local temperature rise of the product caused by low heat dissipation efficiency in the existing electronic device, the electronic device provided in this embodiment is configured such that the heat dissipation device is disposed between the housing 6 and the heat source 4, so that the first plate 11 of the heat dissipation device is connected with the heat source 4; the heat dissipating device is the heat dissipating device described in embodiment 1, and the specific structure and the working principle thereof are described in detail in embodiment 1, and are not described in detail herein.
The foregoing is merely specific embodiments of the present application, but the scope of the present application is not limited thereto, and any person skilled in the art can easily think about changes or substitutions within the technical scope of the present application, and the changes and substitutions are intended to be covered by the scope of the present application. Therefore, the protection scope of the present application shall be subject to the protection scope of the claims.
Claims (10)
1. A heat sink, comprising:
the electronic device comprises a heat radiation body and a heat radiation body, wherein the heat radiation body comprises a first plate body and a second plate body which are oppositely arranged, a closed accommodating cavity is formed between the first plate body and the second plate body, and the first plate body is used for being connected with a heat source of the electronic device;
the first capillary structure covers the surface of the first plate body in the accommodating cavity;
the at least one second capillary structure is arranged on the surface of the first capillary structure, which is away from the first plate body, and other parts of the space between the first capillary structure and the second plate body form a gas space.
2. The heat sink as recited in claim 1, wherein:
one side of the second capillary structure, which is away from the first capillary structure, is connected with the second plate body.
3. The heat sink as recited in claim 1, wherein:
the number of the second capillary structures is a plurality;
the plurality of second capillary structures are arranged on the surface, away from the first plate body, of the first capillary structures at intervals.
4. A heat sink according to claim 3, wherein:
the second capillary structures are columnar, and a plurality of the second capillary structures are arranged in a matrix mode.
5. The heat sink as recited in claim 1, wherein:
the number of the second capillary structures is two;
the two second capillary structures are arranged at two ends of the surface, deviating from the first plate body, of the first capillary structure, and the second capillary structures are formed by bending the first capillary structures.
6. The heat sink as recited in claim 1, wherein:
the second capillary structure is the same or different material as the first capillary structure.
7. The heat sink as recited in claim 1, wherein:
the device also comprises a plurality of supporting pieces;
the plurality of supporting pieces are distributed between the first capillary structure and the second plate body at intervals.
8. The heat sink as recited in claim 7, wherein:
the support piece is arranged in parallel with the second capillary structure, and a channel penetrating along the direction parallel to the second capillary structure is arranged on the support piece; or;
and a third capillary structure is arranged on the surface of the supporting piece and is connected with the first capillary structure.
9. The heat sink as recited in claim 1, wherein:
the thickness of the first capillary structure is equal to the height of the gas space.
10. An electronic device, comprising:
a housing;
at least one heat source;
the heat sink of any one of claims 1-9, disposed between the housing and the heat source.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320164187.3U CN219395395U (en) | 2023-01-17 | 2023-01-17 | Heat abstractor and electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320164187.3U CN219395395U (en) | 2023-01-17 | 2023-01-17 | Heat abstractor and electronic equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219395395U true CN219395395U (en) | 2023-07-21 |
Family
ID=87198636
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202320164187.3U Active CN219395395U (en) | 2023-01-17 | 2023-01-17 | Heat abstractor and electronic equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN219395395U (en) |
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2023
- 2023-01-17 CN CN202320164187.3U patent/CN219395395U/en active Active
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