CN219393387U - Electronic equipment - Google Patents

Abstract

The application provides an electronic device, which comprises: the heat dissipation channel is positioned between the processing chip and the soaking plate and is connected with the processing chip and the soaking plate.

Description

Electronic equipment

Technical Field

The application relates to the technical field of electronic equipment, in particular to electronic equipment.

Background

With the improvement of the requirements of people on the quality of life, the functions of the mobile phone are more and more, the computing capacity of a core CPU is more and more powerful, and the increase of the computing capacity is accompanied by the sudden increase of the heat generation quantity; some designers add hot plates within the fuselage to increase the heat dissipation efficiency.

However, a middle frame and a shielding cover are arranged between the hot plate and the heat generating element, and heat transfer structures such as copper blocks, copper plates, graphite and heat conducting gel are required to be arranged to connect the hot plate and the heat generating element and conduct heat, so that heat resistance between the hot plate and the heat generating element is difficult to reduce due to the numerous heat conducting structures, and heat dissipation efficiency is poor.

Disclosure of Invention

The embodiment of the application aims to provide electronic equipment.

The application provides an electronic device, which comprises:

a soaking plate;

the processing chip is a heat source of the electronic equipment;

and the heat dissipation channel is positioned between the processing chip and the soaking plate and is connected with the processing chip and the soaking plate.

In some modified embodiments of the present application, the foregoing electronic device, wherein the heat dissipation channel is a shielding case covering and surrounding the processing chip, and the shielding case is directly connected to the soaking plate.

In some modified embodiments of the present application, the foregoing electronic device, wherein the heat dissipation channel includes a through channel.

In some modified embodiments of the present application, the electronic device described above, wherein the electronic device further includes a heat dissipation medium; the heat dissipation medium is located in the through channel.

In some modified embodiments of the present application, the heat dissipation medium is a metal block, and two ends of the heat dissipation medium are respectively in contact with the soaking plate and the processing chip.

In some modified embodiments of the present application, the foregoing electronic device, wherein the heat dissipation channel includes a shielding case; and a first through hole is formed in the shielding cover at a position corresponding to the processing chip so as to form the through channel.

In some modified embodiments of the present application, the foregoing electronic device, wherein the heat dissipation channel includes a reinforcing plate; the reinforcing plate is connected between the shielding cover and the soaking plate, and is provided with a second through hole coaxial with the first through hole.

In some modified embodiments of the present application, the electronic device described above, wherein at least a portion of an edge of the stiffener is attached to a frame of the electronic device.

In some modified embodiments of the present application, in the foregoing electronic device, the second through hole is formed with a cylinder in a direction away from the vapor chamber, and an outer wall of the cylinder is attached to a hole wall of the first through hole.

In some modified embodiments of the present application, the aforementioned electronic device, wherein the reinforcing plate is integrally formed with the shielding case.

Drawings

The above, as well as additional purposes, features, and advantages of exemplary embodiments of the present application will become readily apparent from the following detailed description when read in conjunction with the accompanying drawings. Several embodiments of the present application are illustrated by way of example and not by way of limitation in the figures of the accompanying drawings, in which like reference numerals refer to similar or corresponding parts and in which:

fig. 1 schematically shows a first structural diagram of an electronic device disclosed in this embodiment;

fig. 2 schematically illustrates a second structural diagram of the electronic device disclosed in the present embodiment;

fig. 3 schematically shows a third structural diagram of the electronic device disclosed in the present embodiment;

fig. 4 schematically shows a fourth structural diagram of the electronic device disclosed in the present embodiment;

reference numerals illustrate: vapor chamber 1, shield 2, first through hole 201, metal block 3, processing chip 4, reinforcing plate 5, second through hole 501, and cylinder 502.

Detailed Description

Exemplary embodiments of the present disclosure will be described in more detail below with reference to the accompanying drawings. While exemplary embodiments of the present disclosure are shown in the drawings, it should be understood that the present disclosure may be embodied in various forms and should not be limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the disclosure to those skilled in the art.

It is noted that unless otherwise indicated, technical or scientific terms used herein should be given the ordinary meaning as understood by one of ordinary skill in the art to which this application belongs.

Examples

Referring to fig. 1 to 4, the present embodiment provides an electronic apparatus including: the heat dissipation device comprises a soaking plate 1, a processing chip 4 and a heat dissipation channel, wherein the processing chip 4 is a heat source of the electronic equipment, and the heat dissipation channel is positioned between the processing chip 4 and the soaking plate 1 and is connected with the processing chip 4 and the soaking plate 1.

Specifically, in order to solve the problem that the heat dissipation efficiency of the heat conduction structure of the existing electronic device chip is poor, the heat dissipation channel provided in this embodiment is located between the vapor chamber 1 and the processing chip 4, when the processing chip 4 is used efficiently and the temperature rises rapidly, the heat of the processing chip 4 can be directly transferred to the lower surface of the vapor chamber 1 through the setting of the heat dissipation channel, and then water near the heat dissipation channel on the lower surface of the vapor chamber 1 can absorb the heat rapidly to gasify into steam, so as to take away a large amount of heat energy. Then, the latent heat of the vapor is utilized again, when the vapor in the vapor chamber 1 is diffused to a low pressure region from a high pressure region, and the vapor contacts a region with lower temperature, the vapor can be quickly condensed into liquid and emit heat energy to realize heat dissipation, then the vapor is pre-cooled and condensed into liquid, and the vapor flows to the bottom of the vapor chamber 1 again from two ends through the capillary structure in the vapor chamber 1 to complete a heat transfer cycle, so that a dual-phase circulation system with the coexistence of the water and the vapor is formed.

The electronic device provided in this embodiment may be, but is not limited to, a mobile phone, a tablet, a notebook, etc.; the upper copper sheet and the lower copper sheet of the vapor chamber 1 are made of oxygen-free copper, pure water is usually used as working fluid, a capillary structure is manufactured by copper powder sintering or copper mesh technology, an evaporation end, a condensation end and a capillary structure are arranged in the vapor chamber, when the vapor chamber 1 dissipates heat, the vapor chamber contacts the position of the processing chip 4 to absorb heat and evaporate, the vapor is changed into vapor to quickly move to a condensation area of the internal structure, then precooled and condensed into liquid state, heat is released, and then the vapor returns to the evaporation end through the internal capillary structure, so that the heat dissipation effect is achieved by cyclic reciprocation, and the processing chip 4 can be a part with more heat generation such as a CPU (Central processing unit), a GPU (graphic processing unit), and the like; the heat dissipation channel can be a laminated structure directly connected between the vapor chamber 1 and the processing chip 4, so as to dissipate heat of the processing chip 4, or can be a heat dissipation substance in the channel open pore structure matched with the channel, so that the vapor chamber 1 and the processing chip 4 are connected to realize rapid heat conduction of the vapor chamber 1 and the processing chip 4, and finally, the vapor chamber 1 is used for realizing heat dissipation, and at the moment, the actual size of the heat dissipation channel can be adjusted according to the size of the chip, so that efficient heat dissipation is effectively ensured.

According to the above list, the electronic equipment that this application provided, through set up the heat dissipation passageway between handling chip 4 and vapor chamber 1, when handling chip 4 high-efficient use leads to the temperature to rise rapidly, can directly make the heat of handling chip 4 directly transmit to vapor chamber 1 through the settlement of heat dissipation passageway dispel the heat, when such design has avoided using heat conduction structure, under the effect of middle frame and shield cover 2, the temperature of handling chip 4 can not directly transmit to vapor chamber 1, the condition of the secondary contact of having avoided needs through middle frame and shield cover 2 has effectually reduced the contact thermal resistance that the secondary contact transmission led to, and then great improvement radiating effect, guaranteed radiating efficiency, can solve the poor problem of current electronic equipment radiating efficiency.

Further, referring to fig. 1, in a specific implementation of the electronic device provided in this embodiment, an implementation manner is: the heat dissipation channel is a shielding case 2 covering and surrounding the processing chip 4, and the shielding case 2 is directly connected with the soaking plate 1.

Specifically, in order to enable the processing chip 4 to perform heat dissipation more directly and efficiently, the processing chip 4 and the vapor chamber 1 are directly stacked and connected and attached through the shielding cover 2, wherein the shielding cover 2 is of a cover body structure and can cover and enclose the processing chip 4, and at the moment, the shielding cover 2 can play roles in shielding and heat conduction at the same time, and particularly can be made of a copper alloy material, but is not limited to, so that the processing chip 4 and the vapor chamber have a good heat conduction effect; more specific shield cover 2's diameter is greater than the diameter of handling chip 4 far away, and then guarantees the full coverage of shield cover 2 to handling chip 4, and then when handling chip 4 and dispel the heat, can dispel the heat jointly to handling chip 4 whole, the circumstances that handling chip 4 surface temperature phase difference is great can not appear, also can abundant protection handling chip 4 does not transfer heat through the secondary heat conduction structure, guarantees handling chip 4's normal use.

Further, in the electronic device provided in this embodiment, in a specific implementation, another implementation manner is: the heat dissipation channel includes a through channel.

Specifically, in order to make the direct contact and the indirect contact between the processing chip 4 and the soaking plate 1 better, a special communication channel is set between the soaking plate 1 and the processing chip 4, in this way, an independent area of the processing chip 4-channel-soaking plate 1 is formed, and in the space, the space contact between the soaking plate 1 and the processing chip 4 can be realized, so that heat conduction is realized, and further efficient heat dissipation is realized.

Further, referring to fig. 2, in the embodiment of the electronic device provided in this embodiment, in a case where the heat dissipation channel includes a through channel, the electronic device further includes a heat dissipation medium, where the heat dissipation medium is located in the through channel.

Specifically, in order to enable the processing chip to dissipate heat better and avoid leakage of signals, in this embodiment, a heat dissipation medium is disposed inside a heat dissipation channel and is respectively in contact with the processing chip 4 and the soaking plate 1, heat generated by the processing chip 4 is transferred to the lower surface of the soaking plate 1 through the heat conduction function of the heat dissipation medium, and then is dissipated from the upper surface of the soaking plate 1 through the internal transfer of the soaking plate 1, so that the transfer of heat to the processing chip 4 is realized; the heat dissipation medium may be, but not limited to, a metal block, liquid metal or water, which does not affect the materials used in the electronic device, and the shielding case 2 may cooperate with the heat dissipation medium to play a role of shielding together with the vapor chamber 1 at this time.

Further, in the electronic device provided in this embodiment, in a specific implementation, the heat dissipation medium is a metal block, and two ends of the heat dissipation medium are respectively in contact with the vapor chamber 1 and the processing chip 4.

Specifically, in order to improve the heat dissipation rate, the heat dissipation medium specifically used in this embodiment is the metal block 3, the structural property of the metal block 3 is stable, and for the easy installation of liquid property medium, the heat conduction effect of the liquid heat dissipation medium needs to realize quick heat conduction to the flowing of the liquid medium, the metal block 3 is more convenient to use than the liquid state, the two ends of the metal block 3 are respectively in contact connection with the soaking plate 1 and the processing chip 4, the heat generated by the processing chip 4 is in the heat dissipation channel, and is directly transmitted to the soaking plate 1 through the metal block 3, so that the thermal resistance is reduced to the minimum, and the heat dissipation effect is further ensured to the maximum.

Referring to fig. 2, in the embodiment of the electronic device provided in the present embodiment, in a solution in which a heat dissipation channel includes a through channel, the heat dissipation channel includes a shielding case 2; a first through hole 201 is provided on the shielding case 2 at a position corresponding to the processing chip 4 to form the through channel.

Specifically, in order to better dissipate heat of the processing chip 4, in the solution adopted in this embodiment, the heat dissipation channel includes the shielding case 2, and the first through hole 201 is formed on the shielding case 2 corresponding to the position of the processing chip 4 to form the through channel, where the heat dissipation medium in the through channel, such as the metal block 3, is better connected with the processing chip 4 and the soaking plate 1, so as to achieve a better heat dissipation effect; optimally, the heat dissipation medium is completely filled in the first through hole 201, for example: when the heat dissipation medium is a metal block, the diameter of the first through hole 201 and the diameter of the metal block are mutually adapted, so that leakage of signals from between the metal block 3 and the inner wall of the first through hole 201 is avoided, and the usability of the processing chip 4 is affected.

Further, referring to fig. 3, in the electronic device provided in this embodiment, in an implementation, the heat dissipation channel includes a reinforcing plate 5; the reinforcement plate 5 connects the shield 2 and the soaking plate 1 between the shield 2 and the soaking plate 1, and a second through hole 502 coaxial with the first through hole 201 is provided on the reinforcement plate 5.

Specifically, in order to prevent leakage of signals from between the soaking plate 1 and the shielding cover 2, in the embodiment, the reinforcing plate 5 is specifically arranged between the shielding cover 2 and the soaking plate 1, wherein the flatness of the lower surface of the conventional soaking plate 1 is not high when the conventional soaking plate 1 is used, so that the signals are easy to leak from a gap between the soaking plate 1 and the shielding cover 2, the tightness of connection with the shielding cover 2 can be enhanced through the setting of the reinforcing plate 5, the leakage of the signals is effectively reduced, meanwhile, the position of the second through hole 501 on the surface of the reinforcing plate 5 and the position of the first through hole 201 are located on the same vertical surface, the metal block 3 is convenient to integrally pass through the first through hole 201 and the second through hole 501 when conducting heat, special adjustment is not needed for the shape of the metal block 3, finally, the other end of the metal block 3 directly acts on the soaking plate 1, finally heat dissipation is performed through the soaking plate 1, meanwhile, the inner walls of the second through holes 501 of the metal block 3 are tightly attached, and the possibility of signal leakage in the area between the metal block 3 and the inner wall of the second through hole 501 is avoided.

Further, in the electronic device provided in this embodiment, at least a part of the edge of the reinforcing plate 5 is connected to a frame (not shown in the figure) of the electronic device.

Specifically, in order to improve the overall strength of the electronic device, in the embodiment, the edge of the reinforcing plate 5 is specifically connected to the frame of the electronic device, the traditional middle frame structure is composed of four groups of frames and a plate body of a middle parallel screen, the plate body in the mode is easy to be damaged due to extrusion, the middle plate body is replaced by the reinforcing plate 5 in the embodiment to form a new middle plate body, the reinforcing plate 5 can be made of stainless steel materials, the overall strength of the middle frame can be ensured, the overall thickness of the electronic device can be reduced, and the processing of an ultrathin chip is facilitated.

Further, referring to fig. 4, in the electronic device provided in this embodiment, in a specific implementation, the second through hole 501 is formed with a cylinder 502 in a direction away from the vapor chamber 1, and an outer wall of the cylinder 502 is attached to a hole wall of the first through hole 501.

Specifically, in order to conveniently realize a better anti-leakage effect on the first through hole 201 of the shielding case 2, in this embodiment, the second through hole 501 is specifically extended towards the direction of the first through hole 201 downwards to form a cylinder 502, and the cylinder 502 covers a gap between the first through hole 201 and the second through hole 501, so that leakage of signals from between the first through hole 201 and the second through hole 502 is avoided, the shielding effect on the signals is enhanced, and meanwhile, the cylinder 502 is covered outside the metal block 3.

Further, in the electronic device provided in this embodiment, in a specific implementation, the reinforcing plate 5 is integrally formed with the shielding case 2.

Specifically, in order to facilitate the production of the shielding case 2, in this embodiment, the shielding case 2 and the reinforcing plate 5 are integrally formed, and the shielding case 2 and the reinforcing plate 5 can be welded and connected during the production, but not limited to, when the shielding case 2 and the soaking plate 1 are connected with the processing chip 4, the shielding case can be integrally and directly connected with the soaking plate and the processing chip, so that the process of installation and processing is shortened, meanwhile, due to the integrally formed design of the shielding case 2 and the reinforcing plate 5, the possibility of signal leakage between the shielding case 2 and the reinforcing plate 5 is reduced, and the efficient use of the processing chip is ensured.

It should be noted that, in the description of the present specification, the azimuth or positional relationship indicated by the terms "upper", "lower", etc. are based on the azimuth or positional relationship shown in the drawings, and are merely for convenience of description of the present application and simplification of the description, and are not indicative or implying that the apparatus or element in question must have a specific azimuth, be configured and operated in a specific azimuth, and therefore should not be construed as limiting the present application; the terms "coupled," "mounted," "secured," and the like are to be construed broadly, and may be fixedly coupled, detachably coupled, or integrally connected, for example; can be directly connected or indirectly connected through an intermediate medium. The specific meaning of the terms in this application will be understood by those of ordinary skill in the art as the case may be.

In the description of the present specification, the terms "one embodiment," "some embodiments," "particular embodiments," and the like, mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the present application. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

The foregoing is merely specific embodiments of the present application, but the scope of the present application is not limited thereto, and any person skilled in the art can easily think about changes or substitutions within the technical scope of the present application, and the changes and substitutions are intended to be covered by the scope of the present application. Therefore, the protection scope of the present application shall be subject to the protection scope of the claims.

Claims (10)

1. An electronic device, comprising:

a soaking plate;

the processing chip is a heat source of the electronic equipment;

and the heat dissipation channel is positioned between the processing chip and the soaking plate and is connected with the processing chip and the soaking plate.

2. The electronic device of claim 1, wherein:

the heat dissipation channel is a shielding cover which covers and surrounds the processing chip, and the shielding cover is directly connected with the soaking plate.

3. The electronic device of claim 1, wherein:

the heat dissipation channel includes a through channel.

4. An electronic device as claimed in claim 3, characterized in that:

the electronic device further includes a heat dissipation medium;

the heat dissipation medium is located in the through channel.

5. The electronic device of claim 4, wherein:

the heat dissipation medium is a metal block, and two ends of the heat dissipation medium are respectively contacted with the soaking plate and the processing chip.

6. An electronic device as claimed in claim 3, characterized in that:

the heat dissipation channel comprises a shielding cover;

and a first through hole is formed in the shielding cover at a position corresponding to the processing chip so as to form the through channel.

7. The electronic device of claim 6, wherein:

the heat dissipation channel comprises a reinforcing plate;

the reinforcing plate is connected between the shielding cover and the soaking plate, and is provided with a second through hole coaxial with the first through hole.

8. The electronic device of claim 7, wherein:

at least part of the edge of the reinforcing plate is connected with the frame of the electronic equipment.

9. The electronic device of claim 7, wherein:

the second through hole is formed with the barrel to deviating from the direction of vapor chamber, the barrel outer wall laminating in the pore wall of first through hole.

10. The electronic device of claim 7, wherein:

the reinforcing plate and the shielding cover are integrally formed.