CN219393343U

CN219393343U - A accurate range unit for solid brilliant equipment of chip

Info

Publication number: CN219393343U
Application number: CN202320342065.9U
Authority: CN
Inventors: 张青松; 郭建军
Original assignee: Anhui Zhongke Chuangxin Technology Co ltd
Current assignee: Anhui Zhongke Chuangxin Technology Co ltd
Priority date: 2023-02-28
Filing date: 2023-02-28
Publication date: 2023-07-21
Anticipated expiration: 2033-02-28

Abstract

The utility model discloses a precise distance measuring device for chip die bonding equipment, which comprises a supporting plate, a height measuring housing and a mounting seat, wherein the height measuring housing and the mounting seat are mounted and fixed on the supporting plate, and a sensor support and a push-pull electromagnet are arranged on the supporting plate. The movable core shaft of the push-pull electromagnet is fixedly connected with the core seat, the core seat is movably connected with one end of the core frame, the other end of the core frame is fixedly connected with the supporting shaft, the sensor support is fixedly provided with an oilless bushing, the other end of the supporting shaft penetrates through the oilless bushing to be connected with the contact pressing plate, the core frame is movably contacted with the sensor support, the guide core frame is limited to move in the vertical direction, the sensor support is also provided with and fixed with a mechanical switch, and the sensor support is provided with and fixed with a sensor baffle corresponding to the mechanical switch. The device can realize accurate ranging through the mutual matching of the push-pull electromagnet, the sensor support, the mechanical switch, the contact pressing plate and other parts. In addition, the whole distance measuring device has a not complex structure and low manufacturing cost.

Description

A accurate range unit for solid brilliant equipment of chip

Technical Field

The utility model belongs to the technical field of chip die bonding equipment, and particularly relates to an accurate distance measuring device for chip die bonding equipment.

Background

For the technological innovation industry today, the importance of chips is self-evident, called "industrial grain", which supports the technological industry today just as steel supports the traditional industry. As the integration level of the chip is higher, the manufacturing process of the chip is more and more complex, and thousands of complex processes are needed for manufacturing the chip. The chip manufacturing is also divided into hundreds of processes, and each process has corresponding professional equipment. The process packaging test equipment for chip manufacture is currently basically occupied by foreign big companies in the global market, and the domestic packaging test equipment belongs to a weaker link in the chip industry, so that the development of the domestic chip packaging test equipment is greatly supported.

The accurate ranging device is indispensable on automatic die bonding equipment, and before die bonding process is started, the equipment is required to read the height of a chip to be processed placed on a platform or the height of a tray for loading the chip to be processed. The current mainstream automatic chip die bonding equipment in market all adopts pneumatic or infrared laser range finding in the range finding, and pneumatic range finding is more troublesome in the aspect of equipment's assembly and application maintenance, and the dynamics of contacting is difficult to accurate control in addition. The infrared laser ranging cost of high resolution and high precision is higher.

Disclosure of Invention

The utility model aims to provide a precise distance measuring device for chip die bonding equipment, which is used for solving the problems in the background technology.

The utility model relates to a precise distance measuring device for chip die bonding equipment, which comprises a supporting plate, a height measuring housing and a mounting seat, wherein the height measuring housing and the mounting seat are mounted and fixed on the supporting plate;

the movable core shaft of the push-pull electromagnet is fixedly connected with the core seat, the core seat is movably connected with one end of the core frame, the other end of the core frame is fixedly connected with the supporting shaft, the sensor support is fixedly provided with an oilless bushing, the other end of the supporting shaft penetrates through the oilless bushing to be connected with the contact pressing plate, the core frame is movably contacted with the sensor support, the guide core frame is limited to move in the vertical direction, the sensor support is also provided with and fixed with a mechanical switch, and the sensor support is provided with and fixed with a sensor baffle corresponding to the mechanical switch.

In a preferred embodiment, at the movable connection part of the core seat and the core frame, the connection end of the core seat is round, the core frame is provided with a contact groove, and the push-pull electromagnet drives the core seat and the core frame to move when acting.

In a preferred embodiment, the sensor baffle is L-shaped, the horizontal part of the sensor baffle is opposite to the mechanical switch, the vertical part of the sensor support is fixed with the core frame, the sensor baffle is provided with an adjustable mounting hole, and the sensor baffle is in full contact with the mechanical switch when the push-pull electromagnet finishes the pushing action.

In a preferred embodiment, the sensor support is provided with a limit groove, and the core frame is limited by the limit groove and is in sliding contact with the inner wall of the limit groove.

The technical scheme of the utility model has the beneficial effects that:

the device can realize accurate ranging through the mutual matching of the push-pull electromagnet, the sensor support, the mechanical switch, the contact pressing plate and other parts. The relative position of the sensor baffle and the mechanical switch can be adjusted, so that the operation convenience of the distance measuring device in the actual debugging and application process is also ensured. In addition, the whole distance measuring device is not complex in structure, low in manufacturing cost, simple and stable in principle of action electric parts and high in anti-interference performance.

Drawings

Figure 1 is a cross-sectional view of the present utility model,

figure 2 is a schematic diagram of the overall structure of the utility model,

figure 3 is a schematic view of the overall internal structure of the utility model,

FIG. 4 is a schematic view of the internal part structure of the present utility model.

Reference numerals illustrate: 1 supporting plate, 2 mounting seat, 3 push-pull electromagnet, 4 core seat, 5 core frame, 6 supporting shaft, 7 sensor support, 8 oilless bushing, 9 contact pressure plate, 10 mechanical switch, 11 sensor separation blade, 12 height measurement shell cover.

Detailed Description

The utility model will be described in further detail with reference to the drawings and the detailed description. The embodiments of the present utility model have been presented for purposes of illustration and description, and are not intended to be exhaustive or limited to the utility model in the form disclosed. Many modifications and variations will be apparent to those of ordinary skill in the art. The embodiments were chosen and described in order to best explain the principles of the utility model and the practical application, and to enable others of ordinary skill in the art to understand the utility model for various embodiments with various modifications as are suited to the particular use contemplated.

The utility model relates to a precise distance measuring device for chip die bonding equipment, which comprises a supporting plate 1, a height measuring housing 12 and a mounting seat 2, wherein the height measuring housing 12 and the mounting seat 2 are mounted and fixed on the supporting plate 1, and a sensor support 7 and a push-pull electromagnet 3 are arranged on the supporting plate 1. The movable core shaft of the push-pull electromagnet 3 is fixedly connected with the core seat 4, the core seat 4 is movably connected with one end of the core frame 5, the other end of the core frame 5 is fixedly connected with the supporting shaft 6, the oil-free bushing 8 is fixedly installed on the sensor support 7, the other end of the supporting shaft 6 penetrates through the oil-free bushing 8 to be connected with the contact pressing plate 9, the core frame 5 is movably contacted with the sensor support 7, the movement of the core frame 5 in the vertical direction is limited and guided, the sensor support 7 is also fixedly provided with the mechanical switch 10, and the sensor baffle 11 is fixedly installed on the core frame 5 corresponding to the mechanical switch 10.

The mounting seat 2 is fixedly arranged on a machine head of the chip die bonding equipment, and the push-pull electromagnet 3 completes push-pull action through a current signal under the condition of electrifying. The push-pull electromagnet 3 drives the core holder 4, the core frame 5, the support shaft 6, the sensor baffle 11 and the contact pressing plate 9 to move in the vertical direction while completing the push-pull action. After receiving the ranging signal, the push-pull electromagnet 3 completes the vertical downward action, at this time, the sensor baffle 11 is contacted with the mechanical switch 10, at this time, the machine head of the chip die bonding equipment continues to move downwards, the equipment records the current reading of the grating ruler, after the contact pressing plate 9 is contacted with the die bonding platform or the substrate, the sensor baffle 11 is separated from the contact of the mechanical switch 10, the equipment records the current reading of the grating ruler again, and thus the distance between the die bonding platform or the substrate and the machine head of the die bonding equipment can be obtained.

The movable connection part of the core seat 4 and the core frame 5 is characterized in that the connection end of the core seat 4 is round, the core frame 5 is provided with a contact groove, and the push-pull electromagnet 3 drives the core seat 4 and the core frame 5 to move when acting. The movable connection of the core seat 4 and the core frame 5 can overcome the processing and assembly errors of parts to the greatest extent, so that the whole structure is free and smooth in movement.

The sensor separation blade 11 sets up to L shape, the horizontal part of sensor separation blade 11 is relative with mechanical switch 10, the vertical portion of sensor support 7 is fixed with core frame 5, be provided with adjustable mounting hole on the sensor separation blade 11, sensor separation blade 11 and mechanical switch 10 contact completely when push-and-pull electromagnet 3 accomplishes the pushing action. According to the design characteristics, the position of the sensor baffle 11 on the core frame 5 can be adjusted, so that the installation and debugging of the mechanical structure can be simply and conveniently finished.

The sensor support 7 is provided with a limiting groove, and the core frame 5 is limited by the limiting groove and is in sliding contact with the inner wall of the limiting groove. The structure setting of sensor support 7 can retrain the motion of core frame 5 to a certain extent, has played the spacing effect on mechanical structure, and sensor support 7 sets up in addition and installs oilless bush 8, and back shaft 6 can accomplish the action under the restraint guide of oilless bush 8, and the structural design of back shaft 6 in addition can play the spacing effect of machinery, and back shaft 6 and contact clamp plate 9 can not drop under the limit state to can protect whole equipment.

It will be apparent that the described embodiments are only some, but not all, embodiments of the utility model. All other embodiments, which can be made by those skilled in the art and which are included in the embodiments of the present utility model without the inventive step, are intended to be within the scope of the present utility model. Structures, devices and methods of operation not specifically described and illustrated herein, unless otherwise indicated and limited, are implemented according to conventional means in the art.

Claims

1. A accurate range unit for solid brilliant equipment of chip, its characterized in that: the device comprises a supporting plate, a height measurement housing and a mounting seat, wherein the height measurement housing and the mounting seat are mounted and fixed on the supporting plate, and a sensor support and a push-pull electromagnet are arranged on the supporting plate;

2. The precise ranging device for chip die bonding equipment according to claim 1, wherein: the movable connection part of the core seat and the core frame is characterized in that the connection end of the core seat is circular, a contact groove is formed in the core frame, and the core seat and the core frame are driven to move when the push-pull electromagnet acts.

3. The precise ranging device for chip die bonding equipment according to claim 1, wherein: the sensor separation blade sets up to L shape, the horizontal part and the mechanical switch of sensor separation blade are relative, the vertical portion and the core frame of sensor support are fixed, be provided with adjustable mounting hole on the sensor separation blade, the sensor separation blade is contacted with mechanical switch completely when push-and-pull type electro-magnet accomplishes the pushing action.

4. The precise ranging device for chip die bonding equipment according to claim 1, wherein: the sensor support is provided with a limiting groove, and the core frame is limited through the limiting groove and is in sliding contact with the inner wall of the limiting groove.