CN219392414U - Backlight device and bonding equipment - Google Patents

Abstract

The utility model relates to a backlight device and bonding equipment, which relate to the technical field of bonding equipment, and the technical scheme is as follows: the bonding equipment comprises a back pressure head and a backlight device, wherein the back pressure head is used for bearing and bonding the liquid crystal glass and a workpiece to be processed, the backlight device is arranged in a moving mode relative to the back pressure head, and when the driving mechanism drives the light source mechanism to an initial position, the light source mechanism is far away from the back pressure head than the position where the light source mechanism is located. When bonding equipment is bonded, the light source mechanism is moved through the driving mechanism, so that the light source mechanism integrally moves away from the direction of the back support pressure head until the light source mechanism is shielded by the carrying mechanism, at the moment, the light source mechanism is at an initial position, the light source mechanism cannot interfere with the back support pressure head, and the situation that the back light source device or the back support pressure head is abnormal in operation due to mutual interference of mounting positions is reduced.

Description

Backlight device and bonding equipment

Technical Field

The present utility model relates to bonding devices, and more particularly, to a backlight device and a bonding device.

Background

The bonding equipment is special equipment for circuit hot-press connection procedures such as COF, COG, FPC, TCP in the manufacturing process of the liquid crystal module product.

The bonding equipment comprises a back-supporting pressing head, an upper pressing head mechanism and a correction mechanism, a liquid crystal glass product and a workpiece to be processed are generally bonded on the back-supporting pressing head, the workpiece to be processed is placed on a bearing table before the bonding equipment is used, a light source mechanism is arranged on one side of the bearing table back to the workpiece to be processed, the light source mechanism needs to extend out of the bearing table to irradiate a marking surface of the workpiece to be processed, and the marking surface of the workpiece to be processed at the correction position is photographed through a CCD (charge coupled device) photographing and correcting mechanism, so that the definition and correction accuracy of the marking surface of the workpiece to be processed are ensured. After correction, the bonding area of the workpiece to be processed is right below the upper pressure head mechanism and right above the back pressure head, so that the upper pressure head mechanism can be ensured to smoothly bond the workpiece to be processed and the liquid crystal glass.

However, in the above process, when the workpiece to be machined moves to the bonding position of the backing press head, the light source mechanism may touch the backing press head, and the mounting positions of the light source mechanism and the backing press head interfere with each other, so that abnormal operation of the bonding device may occur.

Disclosure of Invention

Accordingly, it is necessary to provide a backlight device and a bonding apparatus, which can prevent interference between the backlight device and the bonding apparatus when the bonding apparatus is in operation, and reduce the abnormal operation of the backlight device or the bonding apparatus due to the interference between the mounting positions.

The first aspect of the present utility model provides a backlight device, the backlight device includes a carrying mechanism for carrying the workpiece to be processed, and a light source mechanism, the light source mechanism is disposed on a side of the carrying mechanism facing away from the workpiece to be processed, the light source mechanism can move along a preset direction relative to the carrying mechanism and has an initial position and an irradiation position, when the light source mechanism is in the initial position, light rays emitted by the light source mechanism are blocked by the carrying mechanism; when the light source mechanism is positioned at the irradiation position, the light source mechanism can irradiate light to the workpiece to be processed.

When the bonding equipment is bonded, an operator can move the light source mechanism to an irradiation position when the to-be-machined piece needs to be irradiated, the light source mechanism can extend out of the carrying mechanism, and light rays emitted by the light source mechanism irradiate the to-be-machined piece; when the workpiece to be processed is not required to be irradiated, an operator can move the light source mechanism to the initial position, light rays emitted by the light source mechanism can be shielded by the carrying mechanism, the whole device occupies a small space, and phenomena of crushing, ash falling and the like caused by long-term complete exposure of the light source mechanism are reduced.

In one embodiment, the backlight device further comprises a driving mechanism connected to the light source mechanism, the driving mechanism being configured to drive the light source mechanism between the initial position and the illumination position.

The driving mechanism drives the light source mechanism to move between the initial position and the irradiation position, so that the automatic degree is high and the use is convenient.

In one embodiment, the driving mechanism comprises a driving part connected to the carrying mechanism and a sliding part connected to the light source mechanism, wherein the driving part is connected with the sliding part and drives the sliding part to move, so that the sliding part drives the light source mechanism to move.

The driving part drives the sliding part to move relative to the carrying mechanism, and the sliding part can drive the light source mechanism to move between an initial position and an irradiation position relative to the carrying mechanism, so that the working requirement is met.

In one embodiment, the loading mechanism comprises a loading unit and a leveling unit, wherein the loading unit and the leveling unit both comprise a loading surface for loading a workpiece to be machined, and the leveling unit can move relative to the loading unit so that the loading surface of the loading unit and the loading surface of the leveling unit are both positioned on the same datum plane.

The to-be-machined part is placed on the bearing surface, if the to-be-machined part is overlong, sagging phenomenon possibly occurs, and irradiation precision is affected, so that the to-be-machined part moves along with the leveling unit through the leveling unit, the levelness of the to-be-machined part can be adjusted, and the sagging phenomenon of the to-be-machined part is reduced.

In one embodiment, the leveling unit comprises a first leveling member and a second leveling member that are slidably engaged in a second direction; the first leveling piece can move relative to the carrying unit along a first direction, the position of the second leveling piece is closer to the light source mechanism than the position of the carrying surface of the carrying unit, and the second leveling piece can move in a second direction to be far away from or close to the carrying unit.

According to the size of the to-be-machined part, the leveling unit is moved in the direction parallel to and/or perpendicular to the bearing surface, the adjustment range of the to-be-machined part is enlarged, and the adjustment work requirement is met.

In one embodiment, the first leveling member includes a first positioning hole extending in a first direction, and the second leveling member includes a first mating slot; a first fastener is arranged in the first positioning hole and the first adapting groove in a penetrating mode, and the first leveling piece and the second leveling piece are in sliding fit along a first direction by means of the first fastener.

The first adapting groove is provided with a first direction, the first leveling piece can move to a proper first positioning position in the first adapting groove according to the adjustment degree of the workpiece to be processed, and the first positioning hole and the first adapting groove are fixed through a fastener at the first positioning position.

In one embodiment, the second leveling member includes a second positioning hole extending along a second direction, and the mounting unit includes a second adapting groove disposed in the second direction; the second positioning hole and the second adapting groove are internally provided with a second fastening piece in a penetrating way, and the second leveling piece and the carrying unit are in sliding fit along a second direction by means of the second fastening piece.

The second adapting groove has a second direction, and the second leveling member is movable within the second adapting groove to a suitable second positioning position, where the second positioning hole and the second adapting groove are fixed by a fastener, depending on the size of the workpiece to be processed.

In one embodiment, the first leveling member is movable relative to the second leveling member in a third direction that is orthogonal to the first and second directions.

And the to-be-machined parts are adjusted along the first direction, the second direction and the third direction, so that the adjustment range is further improved, and the adjustment requirement is met.

In one embodiment, the first leveling member includes a plurality of receiving locations spaced apart along the third direction, and the second leveling member is positionable in a different receiving location.

According to the adjustment range of the to-be-machined workpiece, the to-be-machined workpiece moves to a proper containing position in three directions according to the size of the to-be-machined workpiece, and the adjustment requirement is met.

In one embodiment, the loading mechanism comprises a loading unit and a leveling unit, the loading unit and the leveling unit comprise loading surfaces for loading the workpiece to be machined, the loading surfaces of the leveling unit and the loading surface of the loading unit are in the same plane, and the leveling unit can move on the same plane to be far away from or close to the loading mechanism so as to adjust levelness of the workpiece to be machined.

The to-be-machined workpiece is placed on the bearing surface, if the to-be-machined workpiece is overlong, sagging phenomenon possibly occurs, and irradiation precision is affected, so that the to-be-machined workpiece moves on the same plane along with the leveling unit through the leveling unit, the levelness of the to-be-machined workpiece can be adjusted, and the sagging phenomenon of the to-be-machined workpiece is reduced.

In one embodiment, the loading mechanism further comprises an adsorption unit for positioning the workpiece to be processed, and the adsorption unit is arranged on the loading unit and/or the adjusting unit.

Realize waiting the absorption of machined part, improve waiting the stability of machined part to promote the irradiation stability.

In one embodiment, the adsorption unit comprises an adsorption layer with a part to be machined, and the adsorption layer is made of a flexible material.

The flexible material can reduce abrasion of the adsorption layer to the workpiece, and the adsorption layer is subjected to encapsulation treatment, so that the workpiece has an antistatic effect.

The second aspect of the utility model provides bonding equipment, which comprises a backing press head for carrying and bonding liquid crystal glass and a workpiece to be processed and the backlight device, wherein the backlight device is arranged in a moving way relative to the backing press head, and the light source mechanism is positioned at an initial position and is far away from the backing press head than the irradiation position.

When bonding equipment is bonded, the light source mechanism is moved through the driving mechanism, so that the light source mechanism integrally moves away from the direction of the back support pressure head until the light source mechanism is shielded by the carrying mechanism, at the moment, the light source mechanism is at an initial position, the light source mechanism cannot interfere with the back support pressure head, and the situation that the back light source device or the back support pressure head is abnormal in operation due to mutual interference of mounting positions is reduced.

Drawings

FIG. 1 is a perspective view of a bonding device of the present utility model, wherein the bonding device is in a bonding state.

FIG. 2 is a side view of the bonding apparatus of the present utility model, wherein the backlight device is in an illuminated state.

Fig. 3 is a perspective view of a backlight device in the present utility model.

Fig. 4 is a combined perspective view of the backlight device and the correction device in the present utility model.

Fig. 5 is a perspective view of a leveling unit in the present utility model.

Fig. 6 is a perspective view of the other view of fig. 3.

The reference numerals: 100. bonding equipment; 10. a backing press head; 11. a workpiece to be machined; 20. a backlight device; 21. a mounting mechanism; 211. a mounting unit, 2111, and a first fitting groove; 212. a leveling unit; 2121. a first leveling member; 2121a, first positioning holes; 2121b, a second adaptation groove; 2122. a second leveling member; 2122a, second positioning holes; 2122b, rong Zhiwei; a second leveling member; 213. an adsorption unit; 2131. a suction cup; 2132. an adsorption layer; 2133. a vacuum hole; 2134. a tracheal elbow; 22. a light source mechanism; 23. a driving mechanism; 30. and a correction device.

Detailed Description

In order that the above objects, features and advantages of the utility model will be readily understood, a more particular description of the utility model will be rendered by reference to the appended drawings. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present utility model. The present utility model may be embodied in many other forms than described herein and similarly modified by those skilled in the art without departing from the spirit of the utility model, whereby the utility model is not limited to the specific embodiments disclosed below.

In the description of the present utility model, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings are merely for convenience in describing the present utility model and simplifying the description, and do not indicate or imply that the device or element being referred to must have a specific orientation, be configured and operated in a specific orientation, and therefore should not be construed as limiting the present utility model.

Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include at least one such feature. In the description of the present utility model, the meaning of "plurality" means at least two, for example, two, three, etc., unless specifically defined otherwise.

In the present utility model, unless explicitly specified and limited otherwise, the terms "mounted," "connected," "secured," and the like are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; either directly or indirectly, through intermediaries, or both, may be in communication with each other or in interaction with each other, unless expressly defined otherwise. The specific meaning of the above terms in the present utility model can be understood by those of ordinary skill in the art according to the specific circumstances.

In the present utility model, unless expressly stated or limited otherwise, a first feature "up" or "down" a second feature may be the first and second features in direct contact, or the first and second features in indirect contact via an intervening medium. Moreover, a first feature being "above," "over" and "on" a second feature may be a first feature being directly above or obliquely above the second feature, or simply indicating that the first feature is level higher than the second feature. The first feature being "under", "below" and "beneath" the second feature may be the first feature being directly under or obliquely below the second feature, or simply indicating that the first feature is less level than the second feature.

It will be understood that when an element is referred to as being "fixed" or "disposed" on another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and the like are used herein for illustrative purposes only and are not meant to be the only embodiment.

Referring to fig. 1, fig. 1 shows a schematic structural diagram of a bonding apparatus according to an embodiment of the present utility model, wherein the bonding apparatus 100 includes a backing press head 10 and a backlight device 20, and the backlight device 20 includes a mounting mechanism 21, a light source mechanism 22 for emitting a light source, and a driving mechanism 23 connected to the light source mechanism 22. When bonding equipment 100 is bonded, light source mechanism 22 is moved by driving mechanism 23, so that light source mechanism 22 moves along the preset direction of deviating from back pressure head 10 as a whole, until light rays emitted by light source mechanism 22 are blocked by carrying mechanism 21, back pressure head 10 disclosed in this embodiment presents a bonding state as shown in fig. 1, and light source mechanism 22 is at the initial position at this time, so that it is ensured that backlight device 20 and bonding equipment 20 will not touch each other, and the situation that backlight device 20 or back pressure head 10 is abnormal in operation due to mutual interference of mounting positions is reduced.

In other embodiments, the driving unit 23 may not be provided, the mounting mechanism 21 and the light source mechanism 22 may be slidingly connected, and the light source mechanism 22 may move between the initial position and the preset position relative to the mounting mechanism 21, so that the working requirements may be satisfied.

The backing press head 10 and the mounting mechanism 21 both bear the workpiece 11, the workpiece 11 may be a PCB panel, an FPC board, liquid crystal glass or other products, and the size and shape of the workpiece 11 are not limited. The mounting mechanism 21 of the present embodiment is provided with a panel, the panel area beyond the mounting mechanism 21 is a bonding area, the backing press head 10 is provided with liquid crystal glass and an FPC board bonded to the liquid crystal glass, the mounting mechanism 21 moves towards the backing press head 10 through the correction device 30 (shown in fig. 2) until the panel moves to the bonding position of the FPC, and the backing press head 10 is in the bonding state shown in fig. 1.

As shown in fig. 2-3, in this embodiment, the backing press 10 may assume a bonding state different from that disclosed in fig. 1, and the backlight device 20 of this embodiment is in an irradiated state. Before bonding the bonding apparatus 100, the whole backlight device 20 is moved to a position far away from the bonding apparatus 100 by the correction device 30, the driving mechanism 23 is started, the driving mechanism 23 drives the light source mechanism 22 to move towards the preset direction of the back-support pressing head 10, so that the light source mechanism 22 extends out of the mounting mechanism 21, at this time, the mounting mechanism 21 does not shield the light source mechanism 22, the light source mechanism 22 is at an irradiation position, and at this time, the emission light source of the light source mechanism 22 irradiates the bonding area of the workpiece 11 to be processed. The bonding region of the workpiece 11 is corrected by a CCD camera (not shown) and the correction mechanism 30, and the definition and correction accuracy of the bonding region of the workpiece 11 are improved.

After the workpiece 11 is corrected, the backlight device 20 moves towards the direction of the backing press head 10 through the correction device 30 until the bonding area of the workpiece 11 reaches the bonding position of the backing press head 10, and at this time, the bonding area of the workpiece 11 is directly under an upper press head mechanism (not shown) and directly above the backing press head 10, so that the upper press head mechanism can be ensured to smoothly bond the workpiece 11.

As shown in fig. 1, as shown in fig. 4, the mounting mechanism 21 includes a plurality of mounting units 211 and leveling units 212, each leveling unit 212 is disposed on one side of the mounting unit 211, the mounting unit 211 and the leveling unit 212 may be made of a plate or block made of wood, metal or other materials, and the specific shapes and sizes of the mounting unit 211 and the leveling unit 212 are not limited herein. When the back-supporting press head 10 is in a bonding state, the sagging phenomenon can occur at the part exceeding the FPC of the back-supporting press head 10, the binding precision is affected, the levelness of the FPC board can be adjusted through the leveling unit 212, the carrying unit 211 and the leveling unit 212 are movably arranged, so that the leveling unit 212 can move relative to the carrying unit 211, the levelness of the workpiece 11 to be processed can be adjusted through the leveling unit 212, the condition of the sagging phenomenon of the FPC is reduced, the carrying surfaces of the carrying unit 211 and the leveling unit 212 are guaranteed to be co-located on the same reference surface, and therefore the horizontal surfaces of the FPC board, the panel and the liquid crystal panel are co-located on the same reference surface, and the bonding accuracy is further improved.

In other embodiments, the sagging phenomenon of the workpiece 11 beyond the carrying unit 211 may occur, which affects the irradiation accuracy, and by moving the leveling unit 212, the workpiece 11 moves along with the leveling unit 212, so that the levelness of the workpiece 11 can be adjusted, and the sagging phenomenon of the workpiece 11 is reduced.

In other embodiments, the leveling unit 212 may be provided individually, the area of the leveling unit 212 may be set according to the size of the FPC board, and the leveling unit 212 may be independently adjusted to the workpiece 11 on the carrying unit 211, and may also meet the adjustment requirement.

As shown in fig. 4 to 5, the leveling unit 212 includes a first leveling member 2121 and a second leveling member 2122 connected to the first leveling member 2121, where the second leveling member 2122 is located closer to the light source mechanism 22 than the location of the bearing surface of the carrying unit 211, i.e., the second leveling member 2122 is disposed below the carrying unit 211, where the first leveling member 2121 can move along a first direction perpendicular to the bearing surface, and the first leveling member 2121 follows the second leveling member 2122 and can move along a second direction parallel to the bearing surface, and the workpiece 11 can be adjusted in the first direction, the second direction, or the first direction, so as to achieve the adjustment requirement for adjusting the levelness of the workpiece 11. The first leveling member 2121 and the second leveling member 2122 can be made of wood, metal or other plates or blocks, and the specific shape and size of the first leveling member 2121 and the second leveling member 2122 are not limited herein.

In other embodiments, the leveling unit 212 may not be provided with the first leveling unit 2121, and only needs to ensure that the bearing surface of the second leveling unit 2122 and the bearing surface of the carrying unit 211 are co-located on the same plane, and the second leveling member 2122 only moves in the second direction, so as to meet the adjustment requirement of the workpiece 11.

The first leveling member 2121 includes a first elongated positioning hole 2121a, the first positioning hole 2121a extends along the first direction, the second leveling member 2122 includes a first adapting groove 2122b, the first leveling member 2121 can be slidably engaged with the second leveling member 2122 along the first direction, and when the second leveling member 2122 moves to the first positioning position along the first direction, a first fastener is inserted between the first positioning hole 2121a and the first adapting groove 2122b for positioning. In addition, the first leveling member 2121 includes a plurality of accommodating portions 2121b spaced apart in a third direction orthogonal to the first direction and the second direction, and the first leveling member 2121 is movable relative to the second leveling member 2122 in the third direction, so that the second leveling member 2122 can be positioned in different accommodating portions 2122b, and the levelness of the workpiece 11 can be adjusted in the first direction, the second direction, and the third direction.

With continued reference to fig. 4 to 5, the second leveling unit 2122 includes an elongated second positioning hole 2122a, the second positioning hole 2122a extends along a second direction, the mounting unit 211 is provided with a second fitting groove 2111 extending along the second direction, the second leveling member 2122 can move in the second fitting groove 2111, and a plurality of fitting holes (not shown) are provided in the corresponding second fitting groove 2111, and when the second leveling member 2122 moves to the second positioning position, the second positioning hole 2122a and the fitting holes are positioned by a second fastener (not shown). The first and second fasteners can be stainless steel nails or galvanized dovetails, and the first and second fasteners can facilitate the disassembly, maintenance and replacement of the first leveling piece 2121 or the second leveling piece 2122, and the stainless steel nails or the galvanized dovetails have rust prevention and durability and are suitable for indoor and outdoor environments.

In other embodiments, the fastener may employ a snap-fit or adhesive, so long as the securement of the second leveling member 2122 is satisfied.

In other embodiments, the leveling unit 212 may be movable in any one or both of the first direction, the second direction and the third direction, for example, the leveling unit 212 may not provide the accommodating portion 2121b or separately provide the accommodating portion 2121b, so that the workpiece 11 can be adjusted only in the first direction and the second direction, and the adjustment requirement of the levelness of the workpiece 11 can be met.

The upper surfaces of the carrying unit 211 and the leveling unit 212 are provided with an adsorption unit 213 capable of adsorbing the workpiece 11, the adsorption unit 213 can adopt a suction cup 2131, or an adsorption layer 2132 is arranged on the upper surface of the first leveling unit 2121, the surface of the adsorption layer 2132 is provided with a plurality of vacuum holes 2133, and the workpiece 11 is adsorbed by vacuumizing through a tracheal elbow 2134. In addition, the adsorbing layer 2132 disclosed in this embodiment is made of a flexible material, and the adsorbing layer 2132 is encapsulated with an antistatic effect.

As shown in fig. 6, the driving mechanism 23 includes a driving portion 231 provided on one side of the mounting unit 211 and a sliding portion 232 connected to the light source mechanism 22, and the driving portion 231 is connected to the sliding portion 232 and drives the sliding portion 232 to move, so that the sliding portion 232 can drive the light source mechanism 22 to move. The driving part 231 may be a cylinder, the sliding part 232 may be a sliding block slidably connected to the mounting unit 211, and the cylinder is activated to move the sliding block in the slide rail of the mounting unit 211, thereby realizing the movement of the light source mechanism 22 between the initial position and the irradiation position.

In other embodiments, the driving part 231 also adopts a linear motor or other driving elements, so long as the driving requirement is satisfied. The number of sliding blocks may be set to be single or other as long as the sliding requirement is satisfied.

To sum up, as shown in fig. 1 to 6, when the backlight device 20 is in the irradiation state, the driving mechanism 23 is started, and the driving mechanism 23 drives the light source mechanism 22 to move towards the preset direction of the back pressure head 10, so that the light source mechanism 22 extends out of the mounting mechanism 21, at this time, the mounting mechanism 21 does not shield the light source mechanism 22, the light source mechanism 22 is in the irradiation position, and the light source emitted by the light source mechanism 22 irradiates the bonding region of the workpiece 11; when the back support pressure head 10 is in the bonding state, the light source mechanism 22 is moved by the driving mechanism 23, so that the light source mechanism 22 is entirely moved away from the preset direction of the back support pressure head 10 until the light source mechanism 22 is shielded by the carrying mechanism 21, thereby ensuring that the back light source device 20 and the bonding equipment 20 cannot touch each other, and reducing the conditions of abnormal operation of the back light source device 20 or the back support pressure head 10 caused by mutual interference of mounting positions.

The technical features of the above-described embodiments may be arbitrarily combined, and all possible combinations of the technical features in the above-described embodiments are not described for brevity of description, however, as long as there is no contradiction between the combinations of the technical features, they should be considered as the scope of the description.

The above examples illustrate only a few embodiments of the utility model, which are described in detail and are not to be construed as limiting the scope of the utility model. It should be noted that it is possible for a person skilled in the art to make several variants and modifications without departing from the inventive concept, which fall within the scope of protection of the present utility model, which is therefore subject to the appended claims.

Claims (13)

1. A backlight device, the backlight device comprising:

the loading mechanism is used for loading a workpiece to be processed; and

the light source mechanism is arranged on one side of the carrying mechanism, which is opposite to the workpiece to be processed, and the light source mechanism can move along a preset direction relative to the carrying mechanism and has an initial position and an irradiation position; the light source mechanism is positioned at the initial position, light rays emitted by the light source mechanism can be blocked by the carrying mechanism, the light source mechanism is positioned at the irradiation position, and the light rays can be irradiated to the workpiece to be processed.

2. A backlight device according to claim 1, further comprising a drive mechanism coupled to the light source mechanism, the drive mechanism for driving the light source mechanism between the initial position and the illumination position.

3. The backlight device according to claim 2, wherein the driving mechanism comprises a driving part connected to the mounting mechanism and a sliding part connected to the light source mechanism, and the driving part is connected to the sliding part and drives the sliding part to move so that the sliding part drives the light source mechanism to move.

4. A backlight device according to any one of claims 1 to 3, wherein the mounting mechanism comprises a mounting unit and a levelling unit, each of the mounting unit and the levelling unit comprising a bearing surface for bearing the workpiece to be processed, the levelling unit being movable relative to the mounting unit such that the bearing surface of the mounting unit and the bearing surface of the levelling unit are both in the same datum plane.

5. The backlight device of claim 4, wherein the leveling unit comprises a first leveling member and a second leveling member that are slip fit in a second direction;

the first leveling piece can move relative to the carrying unit along a first direction, the second leveling piece is positioned closer to the light source mechanism than the carrying surface of the carrying unit, and the second leveling piece can move in the second direction to be far away from or close to the carrying unit;

the first direction is perpendicular to the reference plane, and the first direction and the second direction are perpendicular to each other.

6. The backlight device of claim 5, wherein the first leveling member comprises a first locating hole extending in the first direction, and the second leveling member comprises a first mating slot; the first positioning hole and the first adapting groove are internally provided with a first fastening piece in a penetrating way, and the first leveling piece and the second leveling piece are in sliding fit along the first direction by means of the first fastening piece.

7. The backlight device of claim 5, wherein the second leveling member comprises a second positioning hole extending in the second direction, and the mounting unit comprises a second fitting groove disposed in the second direction; and a second fastening piece is arranged in the second positioning hole and the second adapting groove in a penetrating way, and the second leveling piece and the carrying unit are in sliding fit along the second direction by means of the second fastening piece.

8. The backlight device of claim 5, wherein the first leveling member is movable relative to the second leveling member in a third direction, the third direction being orthogonal to the first direction and the second direction.

9. The backlight device of claim 8, wherein the first leveling member comprises a plurality of receptacle sites spaced apart along the third direction, the second leveling member being positionable in different ones of the receptacle sites.

10. A backlight device according to any one of claims 1 to 3 wherein the mounting mechanism comprises a mounting unit and a levelling unit, the mounting unit and levelling unit each comprising a bearing surface for bearing the workpiece to be processed, the bearing surfaces of the levelling unit and the mounting unit being in the same plane, the levelling unit being movable on the same plane away from or towards the mounting mechanism to adjust the levelness of the workpiece to be processed.

11. A backlight device according to any one of claims 1 to 3, wherein the mounting mechanism further comprises an adsorption unit for positioning the workpiece to be processed, the adsorption unit being provided to the mounting mechanism.

12. The backlight device of claim 11, wherein the adsorption unit comprises an adsorption layer having a load bearing the workpiece, the adsorption layer being made of a flexible material.

13. A bonding device, the bonding device comprising:

the back support pressure head is used for bearing and bonding a workpiece to be machined; and

the backlight device of any one of claims 1-12, the backlight device being movably disposed relative to the backing press, wherein the light source mechanism is in the initial position, the light source mechanism being further from the backing press than in the illuminated position.