CN219391178U - Refrigerating capacity detection mechanism of semiconductor refrigerating sheet - Google Patents
Refrigerating capacity detection mechanism of semiconductor refrigerating sheet Download PDFInfo
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- CN219391178U CN219391178U CN202320870046.3U CN202320870046U CN219391178U CN 219391178 U CN219391178 U CN 219391178U CN 202320870046 U CN202320870046 U CN 202320870046U CN 219391178 U CN219391178 U CN 219391178U
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Abstract
The utility model discloses a refrigerating capacity detection mechanism of a semiconductor refrigerating plate, which comprises a sealing box, a cooling assembly, an electric heating device, a temperature and humidity sensor, a cold end temperature sensor and a hot end temperature sensor, wherein the sealing box is arranged on the sealing box; the cooling assembly is arranged on the sealing box, a cooling outlet of the cooling assembly faces to the inside of the sealing box, the cooling assembly is arranged on the outside of the sealing box, and a cooling outlet of the cooling assembly faces to the outside of the sealing box; the semiconductor refrigerating sheet to be detected is arranged between the cooling assembly and the heat dissipation assembly; the electric heating device, the temperature and humidity sensor and the cold end temperature sensor are all arranged in the sealing box, and the cold end temperature sensor is arranged close to the cooling assembly; the hot end temperature sensor is arranged outside the sealing box and is close to the heat dissipation assembly. The refrigerating capacity detection mechanism is favorable for precisely measuring the refrigerating capacity of the semiconductor refrigerating sheets, and is simple and reasonable in detection mechanism, and the measuring method is convenient and quick.
Description
Technical Field
The utility model relates to the technical field of refrigeration capacity detection, in particular to a refrigeration capacity detection mechanism of a semiconductor refrigeration piece.
Background
At present, two methods for testing the refrigerating capacity of an air conditioner are generally provided according to standard regulations, namely an environmental type thermal equilibrium method and an air enthalpy value method. The semiconductor refrigerating piece is a refrigerating piece which realizes the refrigerating function by utilizing the property of semiconductor materials, so that the refrigerating capacity of the semiconductor refrigerating piece can be detected by referring to the testing method of the refrigerating capacity of the air conditioner.
Most semiconductor refrigerating sheet manufacturers generally use an environmental thermal balance method to test the refrigerating capacity of a product, wherein an electric heating device is generally placed in a closed space, an axial flow fan is placed near the electric heating device, and when the internal temperature of the closed space and the ambient temperature reach balance, the electric power of electric heating is equal to the refrigerating capacity of the semiconductor refrigerating sheet to measure. However, the refrigerating capacity of the semiconductor refrigerating piece obtained by the test method has no reference value for the type selection of the semiconductor refrigerating piece, and the reason is that the following three points are included: firstly, the heating efficiency of the electric heating device cannot reach 100%, even if the heating efficiency of the electric heating device with excellent performance in industry is difficult to reach 90%, and the heating efficiency of the electric heating device is continuously reduced along with the lengthening of the service time, so when the internal temperature of the closed space and the ambient temperature reach balance, the refrigerating capacity of the semiconductor refrigerating sheet is not ideal when the electric power of the electric heating device is equal to the refrigerating capacity of the semiconductor refrigerating sheet; secondly, the axial flow fan generates heat during working, and the heat generation amount of the axial flow fan is increased along with the time, so that the measuring mode has great error for the semiconductor refrigerating sheet with small refrigerating capacity, and is not beneficial to the accurate measurement of the refrigerating capacity of the semiconductor refrigerating sheet; thirdly, because of the special performance of the semiconductor refrigerating plate, the refrigerating capacity of the semiconductor refrigerating plate is continuously reduced along with the increase of the temperature difference between the cold end and the hot end, and the refrigerating capacity measured in an environment type thermal balance method is only the refrigerating capacity under the specific environment and has no reference value.
In the air enthalpy method, in the measurement of the refrigerating capacity of the air conditioner, the enthalpy value participates in the calculation of the refrigerating capacity, so that the error caused by the environmental thermal balance method on the refrigerating capacity of the air conditioner is greatly compensated, and the measuring of the refrigerating capacity of the semiconductor refrigerating sheet can also be realized through the air enthalpy method, so that the calculation accuracy is improved. However, since the existing refrigeration capacity detection device based on the enthalpy difference method is only adapted to the air conditioner, it is needed to provide a detection mechanism based on the enthalpy difference method for accurately measuring the refrigeration capacity of the semiconductor refrigeration piece.
Disclosure of Invention
The utility model aims to provide a semiconductor refrigerating capacity detection mechanism which is beneficial to accurately measuring the refrigerating capacity of a semiconductor refrigerating plate, and the detection mechanism is simple and reasonable, and the measurement method is convenient and quick, so as to overcome the defects in the prior art.
To achieve the purpose, the utility model adopts the following technical scheme:
a refrigerating capacity detection mechanism of a semiconductor refrigerating plate comprises a sealing box, a cooling assembly, an electric heating device, a temperature and humidity sensor, a cold end temperature sensor and a hot end temperature sensor;
the sealing box is provided with a mounting position, the cooling assembly is mounted on the sealing box through the mounting position, a cooling outlet of the cooling assembly faces to the inside of the sealing box, the cooling assembly is detachably mounted on the outside of the sealing box, the cooling assembly is positioned at the top of the mounting position, and a cooling outlet of the cooling assembly faces to the outside of the sealing box; the semiconductor cooling plate to be detected is arranged between the cooling assembly and the heat dissipation assembly, the cold end surface of the semiconductor cooling plate is mutually attached to the upper surface of the cooling assembly, and the hot end surface of the semiconductor cooling plate is mutually attached to the lower surface of the heat dissipation assembly;
the electric heating device, the temperature and humidity sensor and the cold end temperature sensor are all arranged in the sealed box, the electric heating device is positioned at the lower part of the sealed box, the temperature and humidity sensor is positioned at the middle part of the sealed box, and the cold end temperature sensor is arranged close to the cooling assembly; the hot end temperature sensor is arranged outside the sealing box and is close to the heat dissipation assembly.
Preferably, the heat-insulating device further comprises a first heat-insulating piece, wherein the first heat-insulating piece is detachably arranged outside the sealing box, and the first heat-insulating piece is positioned between the cooling assembly and the heat dissipation assembly;
the first heat preservation piece is provided with a first containing position, and the first containing position is used for containing a semiconductor refrigerating sheet to be detected.
Preferably, the cooling assembly comprises a cooling bracket, a cooling guide block and a cooling fan, wherein the cooling bracket is U-shaped, and the cooling assembly is arranged at the installation position through the cooling bracket; the cooling guide block is arranged in the cooling bracket, the cooling fan is arranged at the bottom of the cooling bracket, and the air outlet direction of the cooling fan faces to the inside of the sealing box;
the cold end temperature sensor is arranged close to the cold guide block.
Preferably, the cold guide block comprises a cold guide seat, a cold guide plate and a plurality of cold guide fins which are sequentially connected from top to bottom; the cold guide seat is arranged on the top of the cold guide plate in a protruding mode, the cold end face of the semiconductor refrigerating sheet is mutually attached to the upper surface of the cold guide seat, the cold guide fins are arranged on the bottom of the cold guide plate in a protruding mode at intervals, and the cold guide fins extend vertically.
Preferably, the cooling device further comprises a second heat preservation piece, and the second heat preservation piece is positioned between the cooling assembly and the first heat preservation piece;
the second heat preservation piece is provided with a second containing position, and the second containing position is used for containing the cold guide seat.
Preferably, the heat dissipation assembly comprises a heat dissipation bracket, a heat conduction block and a heat dissipation fan, wherein the heat dissipation bracket is in an inverted U shape, the heat conduction block is arranged in the heat dissipation bracket, the heat dissipation fan is arranged at the top of the heat dissipation bracket, and the air outlet direction of the heat dissipation fan is opposite to the sealing box;
the hot end temperature sensor is arranged close to the heat conducting block.
Preferably, the heat conducting block comprises a heat conducting plate and a plurality of heat conducting fins; the heat end face of the semiconductor refrigerating sheet is mutually attached to the lower surface of the heat conducting plate, a plurality of heat conducting fins are arranged on the top of the heat conducting plate in a protruding mode at intervals, and the heat conducting fins extend vertically.
Preferably, the cooling assembly further comprises a fastening rod, and the top of the fastening rod sequentially penetrates through the cooling guide block, the second heat-insulating piece, the first heat-insulating piece and the heat-conducting piece, so that the semiconductor cooling sheet to be detected is clamped between the cooling assembly and the cooling assembly.
Preferably, the wall of the sealing box comprises an inner wall layer, a heat preservation layer and an outer wall layer from inside to outside, and the cooling bracket is detachably arranged on the outer wall layer.
Preferably, the cold end temperature sensor and the hot end temperature sensor are thermocouple thermometers.
The technical scheme provided by the embodiment of the application can comprise the following beneficial effects:
according to the semiconductor refrigerating capacity detection mechanism provided by the scheme, the refrigerating capacity of the semiconductor refrigerating plate is measured through the enthalpy difference method, so that the enthalpy value participates in the calculation of the refrigerating capacity, and therefore, the error caused by the environmental thermal balance method on the refrigerating capacity of the semiconductor refrigerating plate is greatly compensated, the calculation accuracy is improved, the detection mechanism is simple and reasonable, and the measurement method is convenient and rapid and can effectively overcome the defects in the prior art.
Drawings
Fig. 1 is a schematic view of a use state of a semiconductor refrigeration capacity detecting mechanism according to the present utility model.
Fig. 2 is a cross-sectional view of a semiconductor refrigeration capacity sensing mechanism according to one aspect of the present utility model.
Fig. 3 is an exploded view of a semiconductor refrigeration capacity sensing mechanism according to the present utility model.
Fig. 4 is a cross-sectional view of a semiconductor refrigeration capacity sensing mechanism of the present utility model in another direction.
Fig. 5 is an enlarged view at a in fig. 4.
Wherein: the sealing box 1, an inner wall layer 11, a heat preservation layer 12, an outer wall layer 13 and an installation position 101;
the cooling assembly 2, the cooling bracket 21, the cooling block 22, the cooling seat 221, the cooling plate 222, the cooling fin 223, the cooling fan 23 and the fastening rod 24;
the heat dissipation assembly 3, the heat dissipation bracket 31, the heat conduction block 32, the heat conduction plate 321, the heat conduction fin 322 and the heat dissipation fan 33;
the electric heating device 4, the temperature and humidity sensor 5, the cold end temperature sensor 6 and the hot end temperature sensor 7;
a semiconductor refrigerating sheet 8;
a first insulating member 91, a first accommodation site 911, a second insulating member 92, and a second accommodation site 921.
Detailed Description
Embodiments of the present utility model are described in detail below, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to like or similar elements or elements having like or similar functions throughout. The embodiments described below by referring to the drawings are illustrative only and are not to be construed as limiting the utility model.
The technical scheme provides a refrigerating capacity detection mechanism of a semiconductor refrigerating sheet, which comprises a sealing box 1, a cooling assembly 2, a cooling assembly 3, an electric heating device 4, a temperature and humidity sensor 5, a cold end temperature sensor 6 and a hot end temperature sensor 7;
the sealing box 1 is provided with a mounting position 101, the cooling component 2 is mounted on the sealing box 1 through the mounting position 101, a cooling outlet of the cooling component 2 faces the inside of the sealing box 1, the cooling component 3 is detachably mounted on the outside of the sealing box 1, the cooling component 3 is positioned at the top of the mounting position 101, and a cooling outlet of the cooling component 3 faces the outside of the sealing box 1; the semiconductor refrigeration piece 8 to be detected is arranged between the cooling component 2 and the cooling component 3, the cold end surface of the semiconductor refrigeration piece 8 is mutually attached to the upper surface of the cooling component 2, and the hot end surface of the semiconductor refrigeration piece 8 is mutually attached to the lower surface of the cooling component 3;
the electric heating device 4, the temperature and humidity sensor 5 and the cold end temperature sensor 6 are all arranged in the sealed box 1, the electric heating device 4 is positioned at the lower part of the sealed box 1, the temperature and humidity sensor 5 is positioned at the middle part of the sealed box 1, and the cold end temperature sensor 6 is arranged close to the cold dissipation assembly 2; the hot end temperature sensor 7 is installed outside the sealed box 1, and the hot end temperature sensor 7 is disposed close to the heat dissipation assembly 3.
In order to facilitate accurate measurement of the refrigerating capacity of the semiconductor refrigerating plate by an air enthalpy method, the technical scheme provides a refrigerating capacity detection mechanism of the semiconductor refrigerating plate, which is shown in fig. 1-5 and comprises a sealing box 1, a cooling assembly 2, a cooling assembly 3, an electric heating device 4, a temperature and humidity sensor 5, a cold end temperature sensor 6 and a hot end temperature sensor 7.
The working principle of the refrigerating capacity detection mechanism of the scheme is as follows: by controlling the current of the electric heating device 4, the temperature rise and the temperature fall are respectively carried out on the inside of the closed box 1, and a time-detection parameter change curve of the temperature rise and the temperature fall is formed, wherein the detection parameters at least comprise the temperature and the relative humidity of the inside of the closed box 1 detected by the temperature and humidity sensor 5, the cold end temperature of the semiconductor refrigeration piece 8 to be detected by the cold end temperature sensor 6, and the hot end temperature of the semiconductor refrigeration piece 8 to be detected by the hot end temperature sensor 7. When the temperature difference between the cold end temperature sensor 6 and the hot end temperature sensor 7 is not changed in the heating and cooling process, two groups of detection parameters between the cold end temperature sensor 6 and the hot end temperature sensor 7 are taken from a heating and/or cooling time-detection parameter change curve, and the two groups of detection parameters are calculated through a conventional enthalpy difference method, so that the refrigerating capacity is obtained. In addition, in the scheme, two groups of detection parameters can be selected under a specific temperature difference, two groups of detection parameters in a specific heating/cooling time can be selected, two groups of detection parameters under a specific heating/cooling degree can be selected, and the like, so that a technician can detect the refrigerating capacity under a specific environment according to the actual use environment of the semiconductor refrigerating sheet, and the type selection of the semiconductor refrigerating sheet is convenient.
It should be noted that, the refrigerating capacity detection mechanism in this solution may further include a processor (not labeled in the figure), and the processor is electrically coupled to the electric heating device 4, the temperature and humidity sensor 5, the cold end temperature sensor 6 and the hot end temperature sensor 7, so that the processor is convenient to obtain and process corresponding detection parameters, and form a time-detection parameter variation curve. Because the processing method of the processor can be implemented by the existing algorithm, the present solution is not described herein.
In one embodiment of the present disclosure, the calculation of the refrigerating capacity may be performed based on a conventional enthalpy difference method by:
(1) Calculating the partial pressure e of water vapor by using the temperature t and the relative humidity H in the sealed box 1 detected by the temperature and humidity sensor 5 in the first group of data;
e＝0.61078*(H/100)*exp [t/(t+238.3)*17.2694]
wherein e is the partial pressure of water vapor, and the unit is kPa; h is relative humidity in units of; t is the temperature in degrees celsius; 0.61078 and 17.2694 are constant and do not change with changes in temperature and relative humidity; exp refers to the power of e;
(2) Calculating the moisture content d by using the partial pressure e of water vapor in the step (1);
d＝0.622*e/p
wherein d is the moisture content, and the unit is g/kg; e is the partial pressure of water vapor, and the unit is kPa; p is the atmospheric pressure, is a fixed value (one standard atmospheric pressure), and is measured in units of kPa;0.622 is the molar mass ratio of dry air to water vapor, i.e. 0.622=28.97/18.0213, constant;
(3) Calculating the air specific enthalpy value i of the first group of data by using the temperature t inside the sealed box 1 detected by the temperature and humidity sensor 5 in the first group of data and the moisture content d in the step (2) 1 ；
i 1 ＝1.01t+(2500+1.84t)d
Wherein i is 1 Air specific enthalpy in kJ/kg for the first set of data; t is the temperature in degrees celsius; d is the moisture content in g/kg;1.01 is the average constant pressure specific heat of dry air, 2500 is the vaporization latent heat of water at 0 ℃,1.84 is the average constant pressure specific heat of water vapor, and the constants are all constant values;
(4) Sequentially according to the steps (1), (2) and (3), calculating a second groupData specific enthalpy of air i 2 ；
(5) Air specific enthalpy value i according to the first set of data 1 And air specific enthalpy value i of the second set of data 2 Calculating the refrigerating capacity Q of the semiconductor refrigerating sheet;
Q＝m*|i 1 -i 2 |
wherein Q is the refrigerating capacity of the semiconductor refrigerating sheet, and the unit is kJ; m is the mass of air in kg, which can pass through the volume of the enclosure 1 (in m 3 ) The product of the air density and the air density is 1.292kg/m at normal temperature and pressure 3 Other states can be obtained by checking an air physical property table;
further, the refrigerating power P of the semiconductor refrigerating piece can be calculated through the refrigerating capacity Q of the semiconductor refrigerating piece;
P＝Q/T
wherein P is refrigeration power, and the unit is kW; q is the refrigerating capacity of the semiconductor refrigerating sheet, and the unit is kJ; t is the time in s required to reach the second set of data from the first set of data.
Further described, the heat-dissipating device further comprises a first heat-insulating member 91, wherein the first heat-insulating member 91 is detachably mounted on the outside of the seal box 1, and the first heat-insulating member 91 is positioned between the heat-dissipating component 2 and the heat-dissipating component 3;
the first insulating member 91 is provided with a first accommodating position 911, and the first accommodating position 911 is used for accommodating the semiconductor refrigeration piece 8 to be detected.
As shown in fig. 3, the refrigerating capacity detection mechanism in this solution further includes a first heat insulation member 91, specifically, the first heat insulation member 91 is located between the cooling assembly 2 and the cooling assembly 33, a first accommodating position 911 for installing the semiconductor refrigerating sheet 8 is provided in the middle of the first heat insulation member, which plays a role in positioning and installing the semiconductor refrigerating sheet 8, and meanwhile, heat and cold produced by the semiconductor refrigerating sheet 8 can be effectively prevented from being dissipated to the surrounding.
Preferably, the material of the first insulating member 91 may be a heat insulating sponge, etc., and is not limited herein.
Further describing, the cooling assembly 2 includes a cooling bracket 21, a cooling block 22 and a cooling fan 23, the cooling bracket 21 is U-shaped, and the cooling assembly 2 is mounted on the mounting location 101 through the cooling bracket 21; the cold guide block 22 is installed inside the cold dispersion bracket 21, the cold dispersion fan 23 is installed at the bottom of the cold dispersion bracket 21, and the air outlet direction of the cold dispersion fan 23 faces the inside of the seal box 1;
the cold end temperature sensor 6 is arranged close to the cold guide block 22.
In one embodiment of the present technical solution, the cooling assembly 2 includes a cooling bracket 21, a cooling block 22 and a cooling fan 23, and an air outlet direction of the cooling fan 23 (i.e. a cooling outlet of the cooling assembly 2) faces the interior of the seal box 1, and the cooling fan 23 can effectively accelerate air flow, so that the cooling capacity of the semiconductor cooling fin 8 is uniformly distributed in the interior of the seal box 1.
Further, the cold guide block 22 includes a cold guide seat 221, a cold guide plate 222 and a plurality of cold guide fins 223 sequentially connected from top to bottom; the cold guide seat 221 is protruded on the top of the cold guide plate 222, the cold end surface of the semiconductor refrigeration sheet 8 is attached to the upper surface of the cold guide seat 221, a plurality of cold guide fins 223 are protruded on the bottom of the cold guide plate 222 at intervals, and the cold guide fins 223 extend vertically.
The cold guide block 22 in the scheme is sequentially connected with a cold guide seat 221, a cold guide plate 222 and a plurality of cold guide fins 223 from top to bottom; the upper surface of the cold guide seat 221 is attached to the cold end surface, the lower surface of the cold guide plate 222 is provided with cold guide fins 223 which are arranged at intervals, and a through flow passage is formed among the plurality of cold guide fins 223 to guide air, so that the contact area between the air and the cold guide plate 222 is conveniently increased, and the cold guide effect is improved.
Further, since the cooling seat 221 with a boss structure is particularly arranged at the top of the cooling plate 222, the cooling assembly 2 and the cooling assembly 33 can be effectively separated, thereby avoiding the influence of the two assemblies on the detection accuracy of the temperature sensors (6 and 7) at two ends in the detection process.
As a preferred embodiment, the material of the cold guide block 22 is metal, and the heat conductivity coefficient of the metal is high, so that the cold is more easily and rapidly distributed in the sealed box 1.
Further illustrated, a second thermal insulation member 92 is further included, and the second thermal insulation member 92 is located between the cooling module 2 and the first thermal insulation member 91;
the second heat-insulating member 92 is provided with a second accommodating position 921, and the second accommodating position 921 is used for accommodating the cold guide seat 221.
As shown in fig. 3, the refrigerating capacity detection mechanism of the present embodiment is further provided with a second heat insulation member 92, specifically, the second heat insulation member 92 is located between the cooling assembly 2 and the first heat insulation member 91, and the second accommodation site 921 for installing the cooling seat 221 is provided in the middle part thereof, so that the cooling capacity generated by the semiconductor refrigerating sheet 8 can be effectively prevented from accumulating in the vacancy of the cooling block 22, thereby affecting the detection precision.
Preferably, the material of the second heat insulating member 92 may be a heat insulating sponge, and is not limited herein.
Further describing, the heat dissipating assembly 3 includes a heat dissipating bracket 31, a heat conducting block 32 and a heat dissipating fan 33, wherein the heat dissipating bracket 31 is in an inverted U shape, the heat conducting block 32 is mounted inside the heat dissipating bracket 31, the heat dissipating fan 33 is mounted on the top of the heat dissipating bracket 21, and the air outlet direction of the heat dissipating fan 23 faces away from the seal box 1;
the hot side temperature sensor 7 is disposed adjacent to the heat conducting block 32.
In another embodiment of the present technical solution, the heat dissipating assembly 3 includes the heat dissipating bracket 31, the heat conducting block 32 and the heat dissipating fan 33, and the air outlet direction of the heat dissipating fan 33 (i.e. the heat dissipating outlet of the heat dissipating assembly 3) faces away from the seal box 1, and the arrangement of the heat dissipating fan 33 can effectively accelerate the air flow, so that the heat of the semiconductor refrigerating sheet 8 is effectively dissipated, and the influence of the heat dissipation on the detection of the refrigerating capacity of the semiconductor refrigerating sheet 8 is avoided.
To further illustrate, the heat-conducting block 32 includes a heat-conducting plate 321 and a plurality of heat-conducting fins 322; the heat end surface of the semiconductor refrigeration sheet 8 is attached to the lower surface of the heat conducting plate 321, a plurality of heat conducting fins 322 are arranged on the top of the heat conducting plate 321 in a protruding mode at intervals, and the heat conducting fins 322 extend vertically.
Specifically, the heat conduction block 32 of this scheme includes heat conduction board 321 and a plurality of heat conduction fin 322, and the upper surface mounting of heat conduction board 321 has the heat conduction fin 322 that the interval set up, forms the through flow channel and water conservancy diversion air between a plurality of heat conduction fin 322, is convenient for increase the area of contact of air and heat conduction board 321, promotes the radiating effect.
To further explain, the cooling module 2 further includes a fastening rod 24, and the top of the fastening rod 24 sequentially passes through the cooling block 22, the second heat-insulating member 92, the first heat-insulating member 91, and the heat-conducting block 32, so that the semiconductor cooling fin 8 to be detected is clamped between the cooling module 2 and the cooling module 3.
In a preferred embodiment of the present technical solution, the cooling module 2 further includes a fastening rod 24, and the addition of the fastening rod 24 is beneficial to clamping the semiconductor refrigeration sheet 8 to be detected between the cooling module 2 and the cooling module 3, so that the effective transfer of heat and cold is more effectively ensured, and the detection accuracy is further improved.
Further, the wall of the sealed box 1 comprises an inner wall layer 11, an insulating layer 12 and an outer wall layer 13 from inside to outside, and the cooling bracket 21 is detachably mounted on the outer wall layer 13.
In another preferred embodiment of the present technical solution, the wall of the sealing box 1 of the detection mechanism is additionally provided with the heat insulation layer 12, and the heat insulation layer 12 can effectively prevent the loss of the cooling capacity inside the box body, thereby ensuring the detection precision of the cooling capacity of the detection mechanism. Note that, the insulating layer 12 in this embodiment may be formed by foaming a foaming material, which is not limited herein.
Further, the cold end temperature sensor 6 and the hot end temperature sensor 7 are thermocouple thermometers.
The specific use method of the semiconductor refrigerating capacity detection mechanism is described below through a specific scene.
By adjusting the current of the electric heating device 4, the temperature of the air in the sealed box 1 is raised to 50 ℃ (detected by the temperature and humidity sensor 5), at the moment, the cold end temperature of the semiconductor refrigeration sheet 8 to be detected is 40 ℃ (detected by the cold end temperature sensor 6), and the hot end temperature is 60 DEG CThe relative humidity is 50% (detected by a temperature and humidity sensor 5), the atmospheric pressure p is 101.3kPa, and the volume of the closed box 1 is 1m 3 。
By adjusting the current of the electric heating device 4, the temperature of the air in the sealed box 1 is raised to 51 ℃ (obtained by detecting by the temperature and humidity sensor 5) for 20 seconds, the cold end temperature of the semiconductor refrigeration piece 8 to be detected at this time is 40 ℃ (obtained by detecting by the cold end temperature sensor 6), the hot end temperature is 60 ℃ (obtained by detecting by the hot end temperature sensor 7), the temperature difference between the cold end temperature sensor 6 and the hot end temperature sensor 7 is not changed, and the relative humidity is 49% (obtained by detecting by the temperature and humidity sensor 5).
(1) Using the temperature t1 and the relative humidity H in the sealed box 1 detected by the temperature and humidity sensor 5 in the first set of data 1 Calculating the partial pressure e of water vapor 1 ；
e 1 ＝0.61078*(H 1 /100)*exp [t1/(t1+238.3)*17.2694] ＝0.61078*(50/100)*exp [50 /(50+238.3)*17.2694] ≈6.1(kPa)
(2) Using the partial pressure e of water vapor in step (1) 1 Calculating the moisture content d 1 ；
d 1 ＝0.622*e 1 /p＝0.622*6.1/101.3＝0.037(g/kg)
(3) Using the temperature t1 inside the sealed box 1 detected by the temperature and humidity sensor 5 in the first set of data and the moisture content d in step (2) 1 Calculating the air specific enthalpy value i of the first group of data 1 ；
i 1 ＝1.01t1+(2500+1.84t1)d 1 ＝1.01*50+(2500+1.84*50)*0.037
≈146.4(kJ/kg)
(4) Sequentially according to the steps (1), (2) and (3), calculating the air specific enthalpy value i of the second group of data 2 The method comprises the steps of carrying out a first treatment on the surface of the Wherein, the liquid crystal display device comprises a liquid crystal display device,
e 2 ＝0.61078*(H 2 /100)*exp [t2/(t2+238.3)*17.2694] ＝0.61078*(49/100)*exp [51 /(51+238.3)*17.2694] ≈6.28(kPa)
d 2 ＝0.622*e 2 /p＝0.622*6.28/101.3＝0.039(g/kg)
i 2 ＝1.01t2+(2500+1.84t2)d 2 ＝1.01*51+(2500+1.84*51)*0.039
≈152.7(kJ/kg)
(5) Air specific enthalpy value i according to the first set of data 1 And air specific enthalpy value i of the second set of data 2 Calculating the refrigerating capacity Q of the semiconductor refrigerating sheet;
Q＝m*|i 1 -i 2 |＝(1*1.292)*|146.4-152.7|＝8.14(kJ)
the refrigeration power P of the semiconductor refrigeration piece 8 to be detected at the temperature difference of 20 ℃ is as follows:
P＝Q/T＝8.14/20＝0.407kW＝407W。
it is noted that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of example embodiments in accordance with the present application. As used herein, the singular is also intended to include the plural unless the context clearly indicates otherwise, and furthermore, it is to be understood that the terms "comprises" and/or "comprising" when used in this specification are taken to specify the presence of stated features, steps, operations, devices, components, and/or combinations thereof.
The relative arrangement of the components and steps, numerical expressions and numerical values set forth in these embodiments do not limit the scope of the present utility model unless it is specifically stated otherwise. Meanwhile, it should be understood that the sizes of the respective parts shown in the drawings are not drawn in actual scale for convenience of description. Techniques, methods, and apparatus known to one of ordinary skill in the relevant art may not be discussed in detail, but should be considered part of the specification where appropriate. In all examples shown and discussed herein, any specific values should be construed as merely illustrative, and not a limitation. Thus, other examples of the exemplary embodiments may have different values. It should be noted that: like reference numerals and letters denote like items in the following figures, and thus once an item is defined in one figure, no further discussion thereof is necessary in subsequent figures.
In the description of the present utility model, it should be understood that the azimuth or positional relationships indicated by the azimuth terms such as "front, rear, upper, lower, left, right", "lateral, vertical, horizontal", and "top, bottom", etc., are generally based on the azimuth or positional relationships shown in the drawings, merely to facilitate description of the present utility model and simplify the description, and these azimuth terms do not indicate and imply that the apparatus or elements referred to must have a specific azimuth or be constructed and operated in a specific azimuth, and thus should not be construed as limiting the scope of protection of the present utility model; the orientation word "inner and outer" refers to inner and outer relative to the contour of the respective component itself.
Spatially relative terms, such as "above … …," "above … …," "upper surface at … …," "above," and the like, may be used herein for ease of description to describe one device or feature's spatial location relative to another device or feature as illustrated in the figures. It will be understood that the spatially relative terms are intended to encompass different orientations in use or operation in addition to the orientation depicted in the figures. For example, if the device in the figures is turned over, elements described as "above" or "over" other devices or structures would then be oriented "below" or "beneath" the other devices or structures. Thus, the exemplary term "above … …" may include both orientations of "above … …" and "below … …". The device may also be positioned in other different ways (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein interpreted accordingly.
In addition, the terms "first", "second", etc. are used to define the components, and are only for convenience of distinguishing the corresponding components, and the terms have no special meaning unless otherwise stated, and therefore should not be construed as limiting the scope of the present utility model.
It should be noted that the terms "first," "second," and the like in the description and claims of the present application and the above figures are used for distinguishing between similar objects and not necessarily for describing a particular sequential or chronological order. It is to be understood that the data so used may be interchanged where appropriate such that embodiments of the present application described herein may be implemented in sequences other than those illustrated or described herein.
The technical principle of the present utility model is described above in connection with the specific embodiments. The description is made for the purpose of illustrating the general principles of the utility model and should not be taken in any way as limiting the scope of the utility model. Other embodiments of the utility model will be apparent to those skilled in the art from consideration of this specification without undue burden.
Claims (10)
1. The utility model provides a semiconductor refrigeration piece refrigerating output detection mechanism which characterized in that: the cooling device comprises a sealing box, a cooling assembly, an electric heating device, a temperature and humidity sensor, a cold end temperature sensor and a hot end temperature sensor;
the sealing box is provided with a mounting position, the cooling assembly is mounted on the sealing box through the mounting position, a cooling outlet of the cooling assembly faces to the inside of the sealing box, the cooling assembly is detachably mounted on the outside of the sealing box, the cooling assembly is positioned at the top of the mounting position, and a cooling outlet of the cooling assembly faces to the outside of the sealing box; the semiconductor cooling plate to be detected is arranged between the cooling assembly and the heat dissipation assembly, the cold end surface of the semiconductor cooling plate is mutually attached to the upper surface of the cooling assembly, and the hot end surface of the semiconductor cooling plate is mutually attached to the lower surface of the heat dissipation assembly;
the electric heating device, the temperature and humidity sensor and the cold end temperature sensor are all arranged in the sealed box, the electric heating device is positioned at the lower part of the sealed box, the temperature and humidity sensor is positioned at the middle part of the sealed box, and the cold end temperature sensor is arranged close to the cooling assembly; the hot end temperature sensor is arranged outside the sealing box and is close to the heat dissipation assembly.
2. The semiconductor refrigeration capacity detection mechanism of claim 1, wherein: the heat-insulating device further comprises a first heat-insulating piece, wherein the first heat-insulating piece is detachably arranged outside the sealing box and is positioned between the cooling assembly and the heat dissipation assembly;
the first heat preservation piece is provided with a first containing position, and the first containing position is used for containing a semiconductor refrigerating sheet to be detected.
3. The semiconductor refrigeration capacity detection mechanism of claim 2, wherein: the cooling assembly comprises a cooling bracket, a cooling guide block and a cooling fan, wherein the cooling bracket is U-shaped, and the cooling assembly is arranged at the installation position through the cooling bracket; the cooling guide block is arranged in the cooling bracket, the cooling fan is arranged at the bottom of the cooling bracket, and the air outlet direction of the cooling fan faces to the inside of the sealing box;
the cold end temperature sensor is arranged close to the cold guide block.
4. A semiconductor refrigeration capacity sensing mechanism as claimed in claim 3, wherein: the cold guide block comprises a cold guide seat, a cold guide plate and a plurality of cold guide fins which are sequentially connected from top to bottom; the cold guide seat is arranged on the top of the cold guide plate in a protruding mode, the cold end face of the semiconductor refrigerating sheet is mutually attached to the upper surface of the cold guide seat, the cold guide fins are arranged on the bottom of the cold guide plate in a protruding mode at intervals, and the cold guide fins extend vertically.
5. The semiconductor refrigeration capacity detection mechanism of claim 4, wherein: the heat-insulating device further comprises a second heat-insulating piece, and the second heat-insulating piece is positioned between the cooling assembly and the first heat-insulating piece;
the second heat preservation piece is provided with a second containing position, and the second containing position is used for containing the cold guide seat.
6. The semiconductor refrigeration capacity detection mechanism of claim 5, wherein: the heat dissipation assembly comprises a heat dissipation support, a heat conduction block and a heat dissipation fan, wherein the heat dissipation support is in an inverted U shape, the heat conduction block is arranged in the heat dissipation support, the heat dissipation fan is arranged at the top of the heat dissipation support, and the air outlet direction of the heat dissipation fan is opposite to the sealing box;
the hot end temperature sensor is arranged close to the heat conducting block.
7. The semiconductor refrigeration capacity detection mechanism of claim 6, wherein: the heat conducting block comprises a heat conducting plate and a plurality of heat conducting fins; the heat end face of the semiconductor refrigerating sheet is mutually attached to the lower surface of the heat conducting plate, a plurality of heat conducting fins are arranged on the top of the heat conducting plate in a protruding mode at intervals, and the heat conducting fins extend vertically.
8. The semiconductor refrigeration capacity detection mechanism of claim 6, wherein: the cooling assembly further comprises a fastening rod, and the top of the fastening rod sequentially penetrates through the cooling guide block, the second heat preservation piece, the first heat preservation piece and the heat conduction block, so that the semiconductor refrigerating sheet to be detected is clamped between the cooling assembly and the cooling assembly.
9. A semiconductor refrigeration capacity sensing mechanism as claimed in claim 3, wherein: the wall of the sealing box comprises an inner wall layer, a heat preservation layer and an outer wall layer from inside to outside, and the cooling bracket is detachably arranged on the outer wall layer.
10. The semiconductor refrigeration capacity detection mechanism of claim 1, wherein: the cold end temperature sensor and the hot end temperature sensor are thermocouple thermometers.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320870046.3U CN219391178U (en) | 2023-04-18 | 2023-04-18 | Refrigerating capacity detection mechanism of semiconductor refrigerating sheet |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202320870046.3U CN219391178U (en) | 2023-04-18 | 2023-04-18 | Refrigerating capacity detection mechanism of semiconductor refrigerating sheet |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117571357A (en) * | 2024-01-15 | 2024-02-20 | 临沂市交通制冷工程有限公司 | Refrigerating capacity measuring device of refrigerator |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117571357A (en) * | 2024-01-15 | 2024-02-20 | 临沂市交通制冷工程有限公司 | Refrigerating capacity measuring device of refrigerator |
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