CN219390966U - Ultrasonic probe for detecting liquid level height by contact type of multiple wafers - Google Patents

Abstract

The utility model relates to an ultrasonic probe for detecting the liquid level height of a multi-wafer contact type, which comprises a wedge, a piezoelectric wafer, a damping block, a shell and an outgoing line, wherein the wedge, the piezoelectric wafer and the damping block are all positioned in the shell, the piezoelectric wafer is arranged on the wedge, the damping block is arranged on the piezoelectric wafer, one end of the outgoing line is connected with the piezoelectric wafer, the other end of the outgoing line is connected to an opening of the shell, three piezoelectric wafers are respectively arranged on the wedge, the piezoelectric wafer and the damping block, wherein the three piezoelectric wafers are different in model, a first piezoelectric wafer is arranged on a first wedge, a second piezoelectric wafer is arranged on a second wedge, a third piezoelectric wafer is arranged on a third wedge, a first damping block is arranged on the first piezoelectric wafer, a second damping block is arranged on the second piezoelectric wafer, and a third damping block is arranged on the third piezoelectric wafer. Compared with the prior art, the utility model has the advantages of being applicable to containers with different bottom wall thicknesses to realize liquid level measurement and the like.

Description

Ultrasonic probe for detecting liquid level height by contact type of multiple wafers

Technical Field

The present utility model relates to an ultrasonic probe, and more particularly, to a multi-wafer contact type ultrasonic probe for detecting a liquid level.

Background

The ultrasonic probe can be used for various application occasions such as thickness measurement, defect detection, distance detection and the like, the probe obtains voltage signals through the transmitting and receiving unit, and parameters such as thickness, defect, distance and the like are identified according to the time difference between the transmitted signals and the received signals. The basic structure of the probe can be divided into piezoelectric wafers, damping blocks, sound absorbing materials, inclined wedges, shells, outgoing lines and the like.

However, when measuring the liquid level in the container, because the current ultrasonic probe generally adopts a single crystal probe or a polycrystalline probe with the same model and specification, the wall thickness of the bottom of the container which can be applied to the ultrasonic probe is single, the liquid level can not be measured for containers with different bottom wall thicknesses, and the application range is limited.

Disclosure of Invention

The utility model aims to provide the ultrasonic probe for detecting the liquid level height by the contact type of the multiple wafers, and the three piezoelectric wafers are designed, so that the ultrasonic probe can be suitable for containers with different bottom wall thicknesses to realize liquid level measurement due to different penetrating capacities of the piezoelectric wafers with different types and specifications, and is more convenient to use and higher in accuracy compared with the traditional top-down measurement mode.

The aim of the utility model can be achieved by the following technical scheme:

the utility model provides an ultrasonic probe of contact type detection liquid level height of multichip, includes slide wedge, piezoelectric chip, damping piece, shell and lead-out wire, slide wedge, piezoelectric chip and damping piece all are located the shell, piezoelectric chip locates on the slide wedge, the damping piece is located on the piezoelectric chip, the one end of lead-out wire is connected the piezoelectric chip, and the other end is connected to the opening part of shell, slide wedge, piezoelectric chip and damping piece all are equipped with three, and wherein, the model of three piezoelectric chip is mutually different, and first piezoelectric chip is located on the first slide wedge, and second piezoelectric chip is located on the second slide wedge, and third piezoelectric chip is located on the third slide wedge, and first damping piece is located on the first piezoelectric chip, and second damping piece is located on the second piezoelectric chip, and third damping piece is located on the third piezoelectric chip.

The cross section of each wedge is a sector with an angle of 120 degrees, the cross section of each wedge after being combined is circular, the three piezoelectric wafers are rotationally symmetrical, and the rotational center of the rotational symmetry is the circle center of the circle.

The highest position of the wedge is located at the circle center.

Six lead wires are arranged in total and are equally divided into three groups corresponding to the three piezoelectric wafers one by one, each group is two, one end of each group of two lead wires is correspondingly connected to the positive electrode and the negative electrode of the corresponding piezoelectric wafer respectively, and the other end of each group of two lead wires is connected to the opening of the shell.

All outgoing lines connected to the positive electrode of the piezoelectric wafer are wrapped into one strand by the insulating wrapping layer, and all outgoing lines connected to the negative electrode of the piezoelectric wafer are wrapped into one strand by the insulating wrapping layer.

The shell is filled with sound absorption materials.

The cross section of the piezoelectric wafer is circular.

The side view of the wedge is triangular, and the angle between the wedge and the horizontal plane is 30 degrees.

The radius length of the bottom surface of the inclined wedge is 1.5cm, and the length, width and height of the damping block are 14mm, 14mm and 5mm respectively.

The diameter of the piezoelectric crystal is 1.5mm.

Compared with the prior art, the utility model has the following beneficial effects:

1. through the mode of designing three piezoelectric wafers, because the penetration capacities of the piezoelectric wafers of different model specifications are different, the device can be suitable for containers with different bottom wall thicknesses to realize liquid level measurement, and compared with the traditional measurement mode from top to bottom, the device is more convenient to use and higher in accuracy.

2. The cross section of the wedge is a sector with an angle of 120 degrees, and the wedge forms a complete circle, has a symmetrical structure, and reduces errors caused by overlarge position difference as far as possible.

3. All the positive electrode outgoing lines and the negative electrode outgoing lines are respectively integrated into one strand, so that the wiring is more convenient in actual use.

Drawings

FIG. 1 is a schematic diagram of the structure of the present utility model;

FIG. 2 is a schematic diagram of the distribution of three piezoelectric wafers according to the present utility model;

FIG. 3 is a schematic view of a damping mass;

wherein: 1. the device comprises a shell, 2, a first wedge, 3, a first piezoelectric wafer, 4, a first damping block, 5, an outgoing line, 6, a sound absorbing material, 7, a second wedge, 8, a second piezoelectric wafer, 9, a third wedge, 10 and a third piezoelectric wafer.

Detailed Description

The utility model will now be described in detail with reference to the drawings and specific examples. The present embodiment is implemented on the premise of the technical scheme of the present utility model, and a detailed implementation manner and a specific operation process are given, but the protection scope of the present utility model is not limited to the following examples.

The utility model provides an ultrasonic transducer of contact type detection liquid level height of multichip, as shown in fig. 1 and 2, including the slide wedge, the piezoelectricity wafer, damping piece, shell 1 and lead-out wire 5, the slide wedge, piezoelectricity wafer and damping piece all are located in shell 1, the piezoelectricity wafer is located on the slide wedge, the damping piece is located on the piezoelectricity wafer, the piezoelectricity wafer is connected to the one end of lead-out wire 5, the other end is connected to the opening part of shell 1, the slide wedge, piezoelectricity wafer and damping piece all are equipped with three, wherein, the model of three piezoelectricity wafer is different each other, first piezoelectricity wafer 3 is located on first slide wedge 2, second piezoelectricity wafer 8 is located on second slide wedge 7, third piezoelectricity wafer 10 is located on third slide wedge 9, first damping piece 4 is located on first piezoelectricity wafer 3, second damping piece is located on second piezoelectricity wafer 8, third damping piece is located on third piezoelectricity wafer 10.

Through the mode of designing three piezoelectric wafers, because the penetration capacities of the piezoelectric wafers of different model specifications are different, the device can be suitable for containers with different bottom wall thicknesses to realize liquid level measurement, and compared with the traditional measurement mode from top to bottom, the device is more convenient to use and higher in accuracy.

Specifically, in fig. 1, for making the picture clearer, only the first piezoelectric wafer 3, the first wedge 2 and the first damping block 4 are shown, and in fig. 2, the distribution of three piezoelectric wafers is shown, wherein the cross section of the wedge is a sector of 120 degrees, the cross section of the three combined wedges is a circle, the three piezoelectric wafers are rotationally symmetrical, and the center of rotation of the rotational symmetry is the center of the circle. The cross section of the wedge is a sector with an angle of 120 degrees, and the wedge forms a complete circle, has a symmetrical structure, and reduces errors caused by overlarge position difference as far as possible. In this embodiment, the highest position of the wedge is located at the center of the circle.

In this embodiment, six lead wires 5 are provided, and are equally divided into three groups corresponding to three piezoelectric wafers one by one, each group is two, one end of each group of two lead wires 5 is correspondingly connected to the positive electrode and the negative electrode of the corresponding piezoelectric wafer respectively, and the other end is connected to the opening of the housing 1. All outgoing lines 5 connected to the positive electrode of the piezoelectric wafer are wrapped into one strand by the insulating wrapping layer, and all outgoing lines 5 connected to the negative electrode of the piezoelectric wafer are wrapped into one strand by the insulating wrapping layer. All the positive electrode outgoing lines 5 and the negative electrode outgoing lines 5 are integrated into one strand respectively, so that the wiring is more convenient in actual use.

In addition, the inside of the housing 1 is filled with a sound absorbing material 6.

Specifically, the cross section of the piezoelectric wafer is circular.

In the present embodiment, the first piezoelectric wafer 3, the second piezoelectric wafer 8 and the third piezoelectric wafer 10 are respectively 1-3 type, 1-3 type and 2-2 type, have the same size, are cylindrical, have a diameter of 14mm and a height of 5mm, and have parameters as shown in Table 1

TABLE 1

And wherein the excitation frequency of the first piezoelectric wafer 3 is 200kHz, the excitation frequency of the second piezoelectric wafer 8 is 450kHz, and the excitation frequency of the third piezoelectric wafer 10 is 1200kHz.

The wedge is made of organic glass and the like, has a total of 3 blocks, is triangular in side view, has an angle of 30 degrees with a horizontal plane, has a fan-shaped top view, has a central angle of 120 degrees and has a radius length of 1.5cm. The wedge and the piezoelectric wafer are fixed by forming a round hole with the depth of 1.5mm and the diameter of 14mm on the wedge.

In this embodiment, the damping block is composed of polyether polyurethane, polyurethane and epoxy resin (TDE-85), the length, width and height of the damping block are 14mm, 14mm and 5mm respectively, the epoxy resin is bonded with the piezoelectric wafer, wherein the thickness of the epoxy resin is 1mm, the thickness of the polyether polyurethane is 2.35mm, and the thickness of the polyurethane is 1.65mm, and of course, other materials can be adopted.

In this embodiment, the material of the casing 1 is an aluminum alloy material, the sound absorbing material 6 is located between the wedge bottom and the casing 1 and other parts inside the casing 1, wherein the sound absorbing material 6 between the wedge bottom and the casing 1 is a hard fiberboard, and is mainly used for absorbing low-frequency sound signals, the resonance frequency is 100-150Hz, the sound absorbing coefficient is 0.3-0.5, the mass of the fiberboard is 5-20g, and the thickness is 1-1.5mm. The sound absorbing material 6 at other parts in the shell 1 is urethane foam plastic with pores of 0.01mm and density of 11.3-15g/m ³ Of course, other materials may be used in other embodiments.

The first piezoelectric wafer 3 can cover the liquid level test in the container wall with the thickness of 1.0-1.5cm, the second piezoelectric wafer 8 can cover the liquid level test in the container wall with the thickness of 0.5-1.0cm, the third piezoelectric wafer 10 can cover the liquid level test in the container wall with the thickness of 0.2-0.5cm, on the basis that the specific thickness of the container wall is not known, the control method is to sequentially apply excitation signals with the three frequencies on the positive electrode, the negative electrode is grounded, the application time is 10 cycles of each excitation frequency, the interval time is 2s, after receiving echo signals, the time difference t between the signals and the previous excitation signals is calculated, and then the liquid level height d=vt/2 is calculated according to the propagation speed v of ultrasonic waves in the liquid.

In this embodiment, it is further preferable that the ultrasonic probe further includes a controller connected to the three piezoelectric wafers, respectively, and configured to perform the steps of:

controlling the three piezoelectric wafers to work;

receiving feedback signals of the three piezoelectric wafers, and analyzing to obtain a liquid level value;

judging whether liquid level values corresponding to the three piezoelectric wafers are located in a preset range, outputting the liquid level value as a value if the liquid level value corresponding to only one piezoelectric wafer is located in the preset range, and taking the average value of all the liquid level values in the preset range as a measured value if the liquid level values corresponding to a plurality of piezoelectric wafers are located in the preset range.

By setting a reasonable wall thickness range as the basis of data screening, full-automatic liquid level value output can be realized, the calculated amount is greatly reduced, a controller with lower performance but higher reliability can be adopted, and the reliability is improved.

Claims (10)

1. The utility model provides an ultrasonic probe of contact type detection liquid level height of multichip, includes slide wedge, piezoelectric chip, damping piece, shell and lead-out wire, slide wedge, piezoelectric chip and damping piece all are located the shell, piezoelectric chip locates on the slide wedge, damping piece locates on the piezoelectric chip, the one end of lead-out wire is connected piezoelectric chip, and the other end is connected to the opening part of shell, its characterized in that, slide wedge, piezoelectric chip and damping piece all are equipped with three, and wherein, the model of three piezoelectric chip is mutually different, and first piezoelectric chip is located on the first slide wedge, and second piezoelectric chip is located on the second slide wedge, and third piezoelectric chip is located on the third slide wedge, and first damping piece is located on the first piezoelectric chip, and second damping piece is located on the second piezoelectric chip, and third damping piece is located on the third piezoelectric chip.

2. The ultrasonic probe for detecting the liquid level height by the contact type of multiple wafers according to claim 1, wherein the cross section of the inclined wedge is a sector with an angle of 120 degrees, the cross section of the three inclined wedges after combination is a circle, the three piezoelectric wafers are rotationally symmetrical, and the rotation center of the rotational symmetry is the circle center of the circle.

3. The ultrasonic probe for detecting the liquid level height of a multi-wafer contact type according to claim 2, wherein the highest position of said wedge is located at said center of a circle.

4. The ultrasonic probe for detecting the liquid level height by the contact type multi-wafer according to claim 1, wherein six outgoing lines are arranged in total and divided into three groups corresponding to three piezoelectric wafers one by one, each group comprises two outgoing lines, one end of each group of the two outgoing lines is correspondingly connected to the positive electrode and the negative electrode of the corresponding piezoelectric wafer respectively, and the other end of each group of the two outgoing lines is connected to the opening of the shell.

5. The ultrasonic probe for detecting a liquid level height by contact of a multichip according to claim 4, wherein all the lead wires connected to the positive electrode of the piezoelectric chip are wrapped in one strand by the insulating wrapping layer, and all the lead wires connected to the negative electrode of the piezoelectric chip are wrapped in one strand by the insulating wrapping layer.

6. The ultrasonic probe for detecting a liquid level height by contact of a plurality of wafers according to claim 1, wherein the housing is filled with a sound absorbing material.

7. The ultrasonic probe for detecting a liquid level height by contact of a plurality of wafers according to claim 1, wherein the cross section of the piezoelectric wafer is circular.

8. The ultrasonic probe for detecting the height of a liquid level by contact of a plurality of wafers according to claim 1, wherein the side view of the wedge is triangular, and the angle between the side view and the horizontal plane is 30 degrees.

9. The ultrasonic probe for detecting the liquid level height by the contact type multi-wafer according to claim 8, wherein the radius of the bottom surface of the inclined wedge is 1.5cm, and the length, the width and the height of the damping block are 14mm, 14mm and 5mm respectively.

10. The ultrasonic probe for detecting a liquid level height by contact type of a multichip according to claim 9, wherein the diameter of the piezoelectric crystal is 1.5mm.