CN219385359U - Surface treatment device for electroplating process - Google Patents
Surface treatment device for electroplating process Download PDFInfo
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- CN219385359U CN219385359U CN202223504534.7U CN202223504534U CN219385359U CN 219385359 U CN219385359 U CN 219385359U CN 202223504534 U CN202223504534 U CN 202223504534U CN 219385359 U CN219385359 U CN 219385359U
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- placing
- frame
- fixedly arranged
- sliding
- surface treatment
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P10/00—Technologies related to metal processing
- Y02P10/20—Recycling
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Abstract
The utility model discloses a surface treatment device for an electroplating process, which comprises a processing table and a mounting frame, wherein a placing frame is fixedly arranged at the top of the processing table, an electric push rod is fixedly arranged at the inner top of the mounting frame, cleaning mechanisms are fixedly arranged on the side walls of the placing frame, placing mechanisms are connected to the side walls of two ends of the placing frame in a penetrating and sliding manner, two placing mechanisms penetrate through the side walls of the mounting frame and are connected with the side walls in a sliding manner, driving mechanisms are arranged on the opposite inner side walls of the mounting frame, the two driving mechanisms are connected with the opposite placing mechanisms in a meshed manner, adsorption mechanisms are arranged on the side walls of two ends of a telescopic rod of the electric push rod, and polishing mechanisms are arranged at the telescopic ends of the electric push rod. The polishing device is reasonable in structural design, and can automatically discharge the metal placed in the placement frame after polishing the metal, so that an operator can conveniently fetch the metal to polish the metal.
Description
Technical Field
The utility model relates to the technical field of metal surface treatment devices, in particular to a surface treatment device for an electroplating process.
Background
The electroplating process is a method of laying a layer of metal on an electric conductor by utilizing the principle of electrolysis. The electroplating is a surface processing method for forming a plating layer by taking a plated base metal as a cathode in a salt solution containing the pre-plated metal and depositing cations of the pre-plated metal in the plating solution on the surface of the base metal through electrolysis.
In the prior art, when polishing the metal surface, generally, firstly, the metal is placed in a limiting groove on a processing table for limiting and fixing, then a polishing device is used for polishing the metal surface, after polishing is completed, an operator takes out the metal in the limiting groove, but the metal surface is smoother, and when taking out, the operator is difficult to take out the metal, so that a surface treatment device for an electroplating process is designed to solve the problems.
Disclosure of Invention
The utility model aims to solve the problems in the prior art and provides a surface treatment device for an electroplating process.
In order to achieve the above purpose, the present utility model adopts the following technical scheme:
the utility model provides a surface treatment device for electroplating process, includes processing platform and mounting bracket, the top fixed mounting of processing platform has places the frame, the interior top fixed mounting of mounting bracket has electric putter, the lateral wall fixed mounting of placing the frame has clean mechanism, place the both ends lateral wall of frame and all run through sliding connection and have placing mechanism, two place the lateral wall that the mechanism all runs through the mounting bracket and rather than sliding connection, the inside wall that the mounting bracket is relative all is equipped with drive mechanism, two drive mechanism all with relative placing mechanism meshing connection, electric putter's telescopic link both ends lateral wall all is equipped with adsorption mechanism, electric putter's telescopic link is equipped with grinding machanism.
Preferably, the cleaning mechanism comprises a mounting frame fixedly mounted on the placement frame, and a fan is mounted in the mounting frame.
Preferably, the placing mechanism comprises a placing plate which penetrates through the placing frame and is in sliding connection with the placing frame, a baffle is fixedly arranged at the bottom of the placing plate, a sliding rod is fixedly arranged on the side wall of the placing plate, the sliding rod penetrates through the mounting frame and is in sliding connection with the mounting frame, and a first rack is fixedly arranged at the top of the sliding rod.
Preferably, the driving mechanism comprises a sliding plate which is connected to the side wall of the mounting frame in a sliding manner, a second magnetic block is fixedly arranged at the top of the sliding plate, a second rack is fixedly arranged at the bottom of the sliding plate, a gear is arranged on the side wall of the mounting frame, the second rack is connected with the gear in a meshed manner, and the gear is connected with the opposite first rack in a meshed manner.
Preferably, the adsorption mechanism comprises a fixed plate fixedly arranged on the side wall of the telescopic rod on the electric push rod, a first magnetic block is fixedly arranged at the bottom of the fixed plate, and the bottom of the first magnetic block is opposite to the top magnetic pole of the opposite second magnetic block.
Preferably, the polishing mechanism comprises a longitudinal electric sliding rail device fixedly mounted on the telescopic end of the electric push rod, a transverse electric sliding rail device is mounted on the longitudinal electric sliding rail device, and a polishing device is mounted on the transverse electric sliding rail device.
Compared with the prior art, the utility model has the beneficial effects that:
1. through electric putter, adsorption equipment, placing mechanism and driving mechanism's setting, it can be after polishing the metal, will place the metal of placing in the frame automatically and lift off, makes things convenient for operating personnel to get and puts the metal and polish processing to it.
2. Through the setting of clean mechanism, it can blow off the piece that scatters on metal surface after polishing completion, guarantees the cleanness of metal.
In summary, the polishing device is reasonable in structural design, and can automatically discharge the metal placed in the placement frame after polishing the metal, so that an operator can conveniently fetch and place the metal to polish the metal.
Drawings
FIG. 1 is a schematic diagram of a surface treatment apparatus for electroplating process according to the present utility model;
FIG. 2 is an enlarged view of the structure at A in FIG. 1;
FIG. 3 is an enlarged view of the structure at B in FIG. 1;
fig. 4 is an enlarged view of the structure at C in fig. 1.
In the figure: the device comprises a processing table 1, a mounting frame 2, an electric push rod 3, a fixing plate 4, a first magnetic block 5, a sliding plate 6, a second magnetic block 7, a polishing device 8, a placing frame 9, a mounting frame 10, a fan 11, a placing plate 12, a baffle 13, a sliding rod 14, a first rack 15, a second rack 16, a gear 17, a longitudinal electric sliding rail device 18 and a transverse electric sliding rail device 19.
Detailed Description
The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments.
Referring to fig. 1 to 4, a surface treatment device for an electroplating process comprises a processing table 1 and a mounting frame 2, wherein a placement frame 9 is fixedly arranged at the top of the processing table 1, an electric push rod 3 is fixedly arranged at the inner top of the mounting frame 2, a cleaning mechanism is fixedly arranged on the side wall of the placement frame 9, the cleaning mechanism comprises a mounting frame 10 which is fixedly arranged on the placement frame 9 in a penetrating manner, a fan 11 is arranged in the mounting frame 10, and fragments scattered on the surface of metal after polishing can be blown down by the arrangement of the cleaning mechanism, so that the cleaning of the metal is ensured;
the two end side walls of the placing frame 9 are respectively connected with a placing mechanism in a penetrating and sliding manner, the two placing mechanisms are respectively connected with the side walls of the mounting frame 2 in a penetrating and sliding manner, each placing mechanism comprises a placing plate 12 which is connected with the placing frame 9 in a penetrating and sliding manner, a baffle 13 is fixedly arranged at the bottom of each placing plate 12, a sliding rod 14 is fixedly arranged on the side wall of each placing plate 12, each sliding rod 14 penetrates the mounting frame 2 and is connected with the corresponding sliding rod in a sliding manner, and a first rack 15 is fixedly arranged at the top of each sliding rod 14;
the opposite inner side walls of the mounting frame 2 are respectively provided with a driving mechanism, the two driving mechanisms are respectively connected with the opposite placing mechanisms in a meshed manner, each driving mechanism comprises a sliding plate 6 which is connected to the side wall of the mounting frame 2 in a sliding manner, a second magnetic block 7 is fixedly arranged at the top of each sliding plate 6, a second rack 16 is fixedly arranged at the bottom of each sliding plate 6, a gear 17 is arranged on the side wall of the mounting frame 2, the second racks 16 are connected with the corresponding gears 17 in a meshed manner, and the gears 17 are connected with the corresponding first racks 15 in a meshed manner;
the two end side walls of the telescopic rod of the electric push rod 3 are respectively provided with an adsorption mechanism, each adsorption mechanism comprises a fixed plate 4 fixedly arranged on the side wall of the telescopic rod on the electric push rod 3, the bottom of each fixed plate 4 is fixedly provided with a first magnetic block 5, the bottom of each first magnetic block 5 is opposite to the top magnetic pole of the corresponding second magnetic block 7, and after the metal is polished, the metal placed in the placement frame 9 can be automatically detached through the arrangement of the electric push rod 3, the adsorption mechanism, the placement mechanism and the driving mechanism, so that an operator can conveniently pick and place the metal to polish the metal;
the telescopic end of the electric push rod 3 is provided with a polishing mechanism, the polishing mechanism comprises a longitudinal electric slide rail device 18 fixedly arranged on the telescopic end of the electric push rod 3, a transverse electric slide rail device 19 is arranged on the longitudinal electric slide rail device 18, and a polishing device 8 is arranged on the transverse electric slide rail device 19.
The utility model can explain its functional principle by the following modes of operation:
when the metal needs to be polished, firstly, an operator places the metal in the placing frame 9 so that the bottom of the metal is propped against the tops of the two placing plates 12, then the electric push rod 3 is started to drive the polishing device 8 to move downwards so that the polishing end of the bottom of the polishing device 8 is propped against the top of the metal, when the electric push rod 3 moves downwards, the electric push rod 3 drives the first magnetic block 5 on the fixed plate 4 to move downwards, when the polishing end of the polishing device 8 is propped against the top of the metal, the bottoms of the first magnetic block 5 and the tops of the opposite second magnetic blocks 7 are mutually adsorbed, then the polishing device 8 is started, the polishing device 8 polishes the top of the metal, the longitudinal electric slide rail device 18 and the transverse electric slide rail device 19 are started, and the longitudinal electric slide rail device 18 and the transverse electric slide rail device 19 drive the polishing device 8 to move back and forth and left and right to polish the top of the metal, after finishing polishing the metal by the polishing device 8, controlling the electric push rod 3 to drive the polishing device 8 to reset, when the electric push rod 3 resets, driving the first magnetic block 5 on the fixed plate 4 to reset, driving the sliding plate 6 to move upwards by the second magnetic block 7 adsorbed by the first magnetic block 5, driving the second rack 16 to move upwards by the sliding plate 6, driving the gear 17 to rotate by the second rack 16, driving the first rack 15 to slide by the gear 17, driving the placing plate 12 by the first rack 15 through the sliding rod 14, enabling the placing plate 12 to break away from the blocking to the bottom of the metal, enabling the metal in the placing frame 9 to fall to the top of the processing table 1 under the action of gravity, when the electric push rod 3 completely resets, enabling the sliding plate 6 to slide to the top of the mounting frame 2, enabling the sliding plate 5 and the second magnetic block 7 to break away from adsorption, the sliding plate 6 resets under the action of gravity, and then drives to place the board 12 and reset, and when the metal falls on the processing platform 1, start fan 11, the air current that fan 11 rotated and produced blows off the piece at metal top, guarantees the cleanness of metal, then takes off the metal after polishing, will be the next metal of waiting to polish place in place frame 9 can.
The foregoing is only a preferred embodiment of the present utility model, but the scope of the present utility model is not limited thereto, and any person skilled in the art, who is within the scope of the present utility model, should make equivalent substitutions or modifications according to the technical scheme of the present utility model and the inventive concept thereof, and should be covered by the scope of the present utility model.
Claims (6)
1. The utility model provides a surface treatment device for electroplating process, includes processing platform (1) and mounting bracket (2), its characterized in that, the top fixed mounting of processing platform (1) has places frame (9), the interior top fixed mounting of mounting bracket (2) has electric putter (3), the lateral wall fixed mounting of placing frame (9) has clean mechanism, the both ends lateral wall of placing frame (9) all runs through sliding connection has placing mechanism, two placing mechanism all runs through the lateral wall of mounting bracket (2) and rather than sliding connection, the inside wall that mounting bracket (2) is relative all is equipped with drive mechanism, two drive mechanism all is connected with relative placing mechanism meshing, the telescopic link both ends lateral wall of electric putter (3) all is equipped with adsorption mechanism, the telescopic link of electric putter (3) is equipped with grinding machanism.
2. A surface treatment device for an electroplating process according to claim 1, wherein the cleaning mechanism comprises a mounting frame (10) fixedly mounted on the placement frame (9), and a fan (11) is mounted in the mounting frame (10).
3. The surface treatment device for the electroplating process according to claim 1, wherein the placing mechanism comprises a placing plate (12) penetrating through and connected to the placing frame (9) in a sliding manner, a baffle plate (13) is fixedly arranged at the bottom of the placing plate (12), a sliding rod (14) is fixedly arranged on the side wall of the placing plate (12), the sliding rod (14) penetrates through the mounting frame (2) and is connected with the mounting frame in a sliding manner, and a first rack (15) is fixedly arranged at the top of the sliding rod (14).
4. A surface treatment device for an electroplating process according to claim 3, wherein the driving mechanism comprises a sliding plate (6) slidingly connected to the side wall of the mounting frame (2), a second magnetic block (7) is fixedly arranged at the top of the sliding plate (6), a second rack (16) is fixedly arranged at the bottom of the sliding plate (6), a gear (17) is arranged on the side wall of the mounting frame (2), the second rack (16) is in meshed connection with the gear (17), and the gear (17) is in meshed connection with the opposite first rack (15).
5. The surface treatment device for electroplating process according to claim 4, wherein the adsorption mechanism comprises a fixed plate (4) fixedly arranged on the side wall of the telescopic rod on the electric push rod (3), a first magnetic block (5) is fixedly arranged at the bottom of the fixed plate (4), and the bottom of the first magnetic block (5) is opposite to the top magnetic pole of an opposite second magnetic block (7).
6. The surface treatment device for the electroplating process according to claim 1, wherein the polishing mechanism comprises a longitudinal electric sliding rail device (18) fixedly arranged on the telescopic end of the electric push rod (3), a transverse electric sliding rail device (19) is arranged on the longitudinal electric sliding rail device (18), and a polishing device (8) is arranged on the transverse electric sliding rail device (19).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202223504534.7U CN219385359U (en) | 2022-12-28 | 2022-12-28 | Surface treatment device for electroplating process |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202223504534.7U CN219385359U (en) | 2022-12-28 | 2022-12-28 | Surface treatment device for electroplating process |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219385359U true CN219385359U (en) | 2023-07-21 |
Family
ID=87194112
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202223504534.7U Active CN219385359U (en) | 2022-12-28 | 2022-12-28 | Surface treatment device for electroplating process |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN219385359U (en) |
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2022
- 2022-12-28 CN CN202223504534.7U patent/CN219385359U/en active Active
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