CN219350202U - Packaging module and smart card - Google Patents
Packaging module and smart card Download PDFInfo
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- CN219350202U CN219350202U CN202223440492.5U CN202223440492U CN219350202U CN 219350202 U CN219350202 U CN 219350202U CN 202223440492 U CN202223440492 U CN 202223440492U CN 219350202 U CN219350202 U CN 219350202U
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Abstract
The application relates to the technical field of semiconductors and discloses a packaging module which comprises a strip, an anti-stress sheet and a chip. Wherein, the strip is provided with a packaging groove; the anti-stress sheet is arranged in the packaging groove of the strip; wherein, the upper surface of the anti-stress sheet is lower than the notch surface of the packaging groove; the chip is arranged on the upper surface of the anti-stress sheet; in the case of a stress test, the stress-resistant tab provides resistance to the stress to the chip. Under the condition of thinning the packaging module, the stress resistance of the packaging module can be improved, and the yield is improved. The application also discloses a smart card.
Description
Technical Field
The present application relates to the field of semiconductor technology, for example, to a packaging module and a smart card.
Background
Currently, smart cards are designed to be thinner and thinner, so that chip package products mounted in the smart cards are also thinner and thinner. However, the stress resistance of the chip packaging product is an index for testing the quality of the chip packaging product, and after the chip packaging product passes through the test index, the chip packaging product can be effectively prevented from being stressed to bend and deform when the smart card is carried or used, so that the chip packaging product is damaged, and the smart card cannot be normally used.
However, with the increasing demands on the stress resistance of chip package products in recent years, the chip package products gradually have more defective products in three rounds of testing. But the main reason for defective products is that the stress resistance of the package structure of the chip and the strip is poor. For this purpose, a method and a system for manufacturing a module package patch are disclosed in the related art, including: dispensing the patch adhesive onto the strip; placing the chip on the tape; pressing the chip, and bonding the chip and the strip through the chip adhesive to form a module packaging patch; carrying out vacuum suction treatment on the module packaging patch; and (3) feeding the module packaging patch subjected to the vacuum suction treatment into a curing furnace for curing. Therefore, the chip and the strip can be uniformly bonded by the surface mount adhesive, and the production difficulty of the subsequent process and the stress concentration release risk are reduced.
In the process of implementing the embodiments of the present disclosure, it is found that at least the following problems exist in the related art:
by adopting the chip packaging structure, the stress concentration release risk is optimized to a certain extent, but the chip packaging product is thicker, which is contrary to the design concept of the ultrathin card; if the chip packaging product is thinned by changing the packaging structure of the chip and the strip, the chip and the strip are easy to damage in the stress resistance test, and defective products are further generated.
It should be noted that the information disclosed in the foregoing background section is only for enhancing understanding of the background of the present application and thus may include information that does not form the prior art that is already known to those of ordinary skill in the art.
Disclosure of Invention
The following presents a simplified summary in order to provide a basic understanding of some aspects of the disclosed embodiments. This summary is not an extensive overview, and is intended to neither identify key/critical elements nor delineate the scope of such embodiments, but is intended as a prelude to the more detailed description that follows.
The embodiment of the disclosure provides a packaging module and a smart card, which can improve the stress resistance of the packaging module under the condition of thinning the packaging module, thereby improving the yield.
In some embodiments, the package module includes a strap, a stress-resistant sheet, and a chip. Wherein, the strip is provided with a packaging groove; the anti-stress sheet is arranged in the packaging groove of the strip; wherein, the upper surface of the anti-stress sheet is lower than the notch surface of the packaging groove; the chip is arranged on the upper surface of the anti-stress sheet; in the case of a stress test, the stress-resistant tab provides resistance to the stress to the chip.
In some embodiments, a first set pitch is provided between the outer edge of the anti-stress sheet and the inner wall of the package groove, and the first set pitch has a value in the range of [100 μm,200 μm ].
In some embodiments, the stress-resistant sheet is bonded to the bottom of the package trench by a first adhesive layer.
In some embodiments, a second set pitch is provided between the outer edge of the chip and the outer edge of the stress-resistant sheet, the second set pitch having a value in the range of [100 μm,200 μm ].
In some embodiments, the die is bonded to the upper surface of the stress-resistant sheet by a second adhesive layer.
In some embodiments, the stress-resistant sheet comprises at least four sided polygonal or annular shims.
In some embodiments, one or more pins are arranged on the chip, pins corresponding to the number of the pins are arranged on the strip, the pins are positioned outside the packaging groove, and the pins are connected with the pins through bonding wires.
In some embodiments, the side of the strip on which the chip is disposed is encapsulated by a UV glue encapsulation layer.
In some embodiments, the material of the stress-resistant sheet comprises a hard resin.
In some embodiments, the smart card includes the packaging module described in the previous embodiments.
The packaging module and the smart card provided by the embodiment of the disclosure can realize the following technical effects:
compared with the original packaging structure of the strip and the chip, the packaging groove is formed in the strip, the anti-stress sheet is arranged in the packaging groove of the strip, the upper surface of the anti-stress sheet is lower than the notch surface of the packaging groove, and the chip is arranged on the anti-stress sheet in the packaging groove, so that the overall thickness of the strip and the chip is thinned; in addition, under the condition of stress test, the test equipment directly acts on the chip with pressure, and the chip transmits pressure to the anti-stress sheet, and the anti-stress sheet can provide anti-stress for the chip, namely provides fine supporting force and buffer force to improve the anti-stress capability of the packaging module, and then improve the yields in the test process.
The foregoing general description and the following description are exemplary and explanatory only and are not restrictive of the application.
Drawings
One or more embodiments are illustrated by way of example and not limitation in the figures of the accompanying drawings, in which like references indicate similar elements, and in which like reference numerals refer to similar elements, and in which:
fig. 1 is a schematic structural view of a package module provided in an embodiment of the present disclosure;
FIG. 2 is an exploded view of a stress-resistant sheet provided by an embodiment of the present disclosure;
FIG. 3 is a schematic structural view of a stress-resistant sheet provided by an embodiment of the present disclosure;
FIG. 4 is a front view of a package module provided by an embodiment of the present disclosure;
FIG. 5 is an exploded view of a packaging module provided by an embodiment of the present disclosure;
fig. 6 is a side view of a package module provided by an embodiment of the present disclosure;
fig. 7 is a second side view of a package module provided by an embodiment of the present disclosure.
Reference numerals:
10: a strap; 11: a packaging groove; 12: pins;
20: an anti-stress sheet; 21: a first adhesive layer; 22: a second adhesive layer;
30: a chip; 31: a pin; 32: welding wires;
40: and (5) UV plastic sealing layer.
Detailed Description
So that the manner in which the features and techniques of the disclosed embodiments can be understood in more detail, a more particular description of the embodiments of the disclosure, briefly summarized below, may be had by reference to the appended drawings, which are not intended to be limiting of the embodiments of the disclosure. In the following description of the technology, for purposes of explanation, numerous details are set forth in order to provide a thorough understanding of the disclosed embodiments. However, one or more embodiments may still be practiced without these details. In other instances, well-known structures and devices may be shown simplified in order to simplify the drawing.
The terms first, second and the like in the description and in the claims of the embodiments of the disclosure and in the above-described figures are used for distinguishing between similar objects and not necessarily for describing a particular sequential or chronological order. It is to be understood that the data so used may be interchanged where appropriate in order to describe embodiments of the present disclosure. Furthermore, the terms "comprise" and "have," as well as any variations thereof, are intended to cover a non-exclusive inclusion.
In the embodiments of the present disclosure, the terms "upper", "lower", "inner", "middle", "outer", "front", "rear", and the like indicate an azimuth or a positional relationship based on that shown in the drawings. These terms are used primarily to better describe embodiments of the present disclosure and embodiments thereof and are not intended to limit the indicated device, element, or component to a particular orientation or to be constructed and operated in a particular orientation. Also, some of the terms described above may be used to indicate other meanings in addition to orientation or positional relationships, for example, the term "upper" may also be used to indicate some sort of attachment or connection in some cases. The specific meaning of these terms in the embodiments of the present disclosure will be understood by those of ordinary skill in the art in view of the specific circumstances.
In addition, the terms "disposed," "connected," "secured" and "affixed" are to be construed broadly. For example, "connected" may be in a fixed connection, a removable connection, or a unitary construction; may be a mechanical connection, or an electrical connection; may be directly connected, or indirectly connected through intervening media, or may be in internal communication between two devices, elements, or components. The specific meaning of the above terms in the embodiments of the present disclosure may be understood by those of ordinary skill in the art according to specific circumstances.
The term "plurality" means two or more, unless otherwise indicated.
In the embodiment of the present disclosure, the character "/" indicates that the front and rear objects are an or relationship. For example, A/B represents: a or B.
The term "and/or" is an associative relationship that describes an object, meaning that there may be three relationships. For example, a and/or B, represent: a or B, or, A and B.
It should be noted that, without conflict, the embodiments of the present disclosure and features of the embodiments may be combined with each other.
As shown in connection with fig. 1, the disclosed implementation provides a package module including a tape 10, a stress-resistant sheet 20, and a chip 30. Wherein, the strip 10 is provided with a packaging groove 11; the anti-stress sheet 20 is arranged in the packaging groove 11 of the strip 10; wherein the upper surface of the stress resisting sheet 20 is lower than the notch surface of the packaging groove 11; a chip 30 disposed on the upper surface of the stress-resistant sheet 20; in the case of a stress test, the stress-resistant sheet 20 provides resistance to the stress for the chip 30.
Compared with the original packaging structure of the strip and the chip, the packaging module provided by the embodiment of the disclosure has the advantages that the packaging groove 11 is formed in the strip 10, the anti-stress sheet 20 is arranged in the packaging groove 11 of the strip 10, the upper surface of the anti-stress sheet 20 is lower than the notch surface of the packaging groove 11, and the chip 30 is arranged on the anti-stress sheet 20 in the packaging groove 11, so that the overall thickness of the strip 10 and the chip 30 is thinned; in addition, under the condition of stress test, the test equipment directly acts on the chip 30, the chip 30 transmits the pressure to the stress resisting sheet 20, and the stress resisting sheet 20 can provide stress resistance for the chip 30, namely good supporting force and buffer force, so that the stress resistance of the packaging module is improved, and the yield in the test process is further improved.
In order to make the smart card design thinner, the thickness of the package module is one of the important factors for determining the thickness of the smart card, and the connection structure of the chip and the strap is one of the important factors for determining the thickness of the package module. Therefore, by changing the connection structure of the chip and the strip, the packaging module can be thinner and thinner, and the smart card is thinner and thinner. Most of the packaging modules currently have a thickness of between 400 μm and 520 μm.
In the present embodiment, the tape 10 is provided with the package groove 11, and the position of the package groove 11 is the position where the chip 30 is placed on the tape 10. Since the packaging groove 11 has a certain depth, the anti-stress sheet 20 is arranged in the packaging groove 11, and the chip 30 is arranged on the anti-stress sheet 20 in the packaging groove 11, and the upper surface of the anti-stress sheet 20 is lower than the notch surface of the packaging groove 11, so that the overall thickness of the chip 30 and the strip 10 is reduced. In this way, the thickness of the packaging module can be varied without changing the thickness of the strip 10 itself. The structural shape of the packaging groove 11 may be designed according to the mounting manner, shape, size, etc. of the chip 30, for example, the cross section of the groove body of the packaging groove 11 is circular or square, etc., which is not limited herein.
Here, for easier understanding, the following examples are presented: for example, the original thickness of the strip 10 is a, the thickness of the chip 30 is b, and after the chip 30 and the strip 10 are packaged, the thickness of the packaging module is a+b; the thickness of the strip 10 in this embodiment is a, the depth of the package groove 11 is c, the thickness of the anti-stress sheet 20 is d, the thickness of the chip 30 is b, and the chip 30 is disposed on the upper surface of the anti-stress sheet 20 after the anti-stress sheet 20 is disposed in the package groove 11; after the chip 30 and the strip 10 are packaged, the thickness of the packaging module is a+b+d-c. Since the depth c of the package groove 11 is greater than the thickness d of the stress-resistant sheet 20, the thickness of the package module is smaller than a+b, so that the thickness of the package module can be thinned, and the thickness of the package module can be controlled to be 330 μm to 400 μm.
In the above embodiment, three rounds of stress test are required in the packaging process, and the three rounds of stress are directly applied to the chip 30, and the package groove 11 is subjected to a relatively large pressure, and the thickness of the strip at the bottom of the package groove 11 is relatively thin, so that the groove body of the package groove 11 is easily damaged, thereby reducing the yield of the chip packaged product. However, by providing the stress-resistant sheet 20 in the package groove 11, the stress-resistant sheet 20 can provide the chip 30 with a stress resistance to provide the chip 30 with a good supporting force and a buffering force. In this way, the stress resistance of the package module is also improved while the thickness of the package module is made thinner, and the package module can be prevented from being damaged when the stress test is performed.
As shown in connection with fig. 4, in some embodiments, the outer edge of the stress-resistant sheet 20 has a first set spacing L from the inner wall of the package trench 11 1 First set distance L 1 The value range of (2) is [100 μm,200 μm ]]。
In the present embodiment, in order to facilitate the placement of the anti-stress sheet 20 in the package groove 11, the size of the package groove 11 needs to be larger than the size of the anti-stress sheet 20; here, in order to be able to stably arrange the anti-stress sheet 20 within the anti-stress sheet 20, optionally, as shown in connection with fig. 2 and 3, in some embodiments, the anti-stress sheet 20 is bonded to the bottom of the package groove 11 by the first adhesive layer 21.
In the present embodiment, the stress-resistant sheet 20 is adhered to the bottom of the package groove 11 using the first adhesive layer 21. In order to facilitate bonding of the anti-stress sheet 20, the first adhesive layer 21 is provided with a first bonding groove having the same shape and structure as the anti-stress sheet 20 on one side close to the anti-stress sheet 20, the anti-stress sheet 20 is arranged in the first bonding groove, and the other side of the first adhesive layer 21 is firmly bonded to the bottom of the packaging groove 11, so that the movement of the anti-stress sheet 20 can be effectively prevented.
In connection with the above embodiment, since the stress-resistant sheet 20 is adhered to the bottom of the package groove 11 by the first adhesive layer 21; because ofThe stress-resistant sheet 20 has a first set distance L between its outer edge and the inner wall of the package groove 11 1 First set distance L 1 The value range of (2) is [100 μm,200 μm ]]. Optionally, the set pitch has a value in the range of [110 μm,190 μm]. Optionally, the first set distance L 1 The value range of (C) is [120 μm,180 μm)]. Optionally, the first set distance L 1 The value range of (C) is 130 μm and 170 μm]. Optionally, the first set distance L 1 The value range of (C) is [140 μm,160 μm]. Optionally, the first set distance L 1 The range of the values of (2) is 150 μm.
In one specific application, the outer edge of the anti-stress sheet 20 has a 150 μm spacing from the inner wall of the package trench 11. Of course, in other applications, the first set spacing L 1 Can be selected from [100 μm,200 μm ]]Any interval in the inner part is set according to actual needs.
As shown in connection with fig. 4, in some embodiments, the outer edge of the die 30 and the outer edge of the anti-stress sheet 20 have a second set spacing L therebetween 2 A second set interval L 2 The value range of (2) is [100 μm,200 μm ]]。
In the present embodiment, in order to facilitate the placement of the chip 30 on the upper surface of the stress-resistant sheet 20, the size of the stress-resistant sheet 20 needs to be larger than the size of the chip 30; here, in order to be able to stably dispose the chip 30 on the upper surface of the anti-stress sheet 20, alternatively, as shown in connection with fig. 2 and 3, in some embodiments, the chip 30 is adhered to the upper surface of the anti-stress sheet 20 by the second adhesive layer 22.
In this embodiment, the second adhesive layer 22 is used to adhere the chip 30 to the upper surface of the anti-stress sheet 20. In order to facilitate bonding of the chip 30, the second adhesive layer 22 is configured with a second bonding groove having the same shape and structure as the chip 30 on one side close to the chip 30, the chip 30 is disposed in the second bonding groove, and the other side of the second adhesive layer 22 is firmly bonded to the upper surface of the anti-stress sheet 20, so that the chip 30 can be effectively prevented from moving on the upper surface of the anti-stress sheet 20.
In connection with the above embodiment, since the chip 30 is adhered to the upper surface of the stress-resistant sheet 20 by the second adhesive layer 22The method comprises the steps of carrying out a first treatment on the surface of the Therefore, the second set distance L is provided between the outer edge of the chip 30 and the outer edge of the stress-resistant sheet 20 2 A second set interval L 2 The value range of (2) is [100 μm,200 μm ]]. Optionally, the set pitch has a value in the range of [110 μm,190 μm]. Optionally, the second set distance L 2 The value range of (C) is [120 μm,180 μm)]. Optionally, the second set distance L 2 The value range of (C) is 130 μm and 170 μm]. Optionally, the second set distance L 2 The value range of (C) is [140 μm,160 μm]. Optionally, the second set distance L 2 The range of the values of (2) is 150 μm.
In one specific application, the outer edge of the die 30 and the outer edge of the anti-stress sheet 20 have a 150 μm spacing therebetween. Of course, in other applications, the second set pitch L 2 Can be selected from [100 μm,200 μm ]]Any interval in the inner part is set according to actual needs.
In the above embodiment, the first adhesive layer 21 and the second adhesive layer 22 include chip glue. After the anti-stress sheet 20 is adhered to the bottom of the packaging groove 11 through the first adhesive layer 21, and the first adhesive layer 21 is baked and cured, the chip 30 is adhered to the upper surface of the anti-stress sheet 20 through the second adhesive layer 22, and the second adhesive layer 22 is baked and cured.
In some embodiments, the anti-stress tabs 20 comprise at least four sided polygonal or circular ring shaped shims.
In this embodiment, the anti-stress sheet 20 comprises a polygonal pad with at least four sides, since the anti-stress sheet 20 is required to provide the chip 30 with the anti-stress. Therefore, it is necessary to ensure that the structure of the anti-stress sheet 20 has a strong stability, and alternatively, the anti-stress sheet 20 is a polygonal gasket of a honeycomb structure; alternatively, the anti-stress sheet 20 is a polygonal pad of solid construction.
On the other hand, the area occupied by the stress-resistant sheet 20 and the area of the upper surface of the stress-resistant sheet 20 need to be considered; since most of the chips are square here, the stress-resistant sheet 20 comprises, for this purpose, a polygonal spacer with at least four sides. Thus, in the case where the stress-resistant sheet 20 occupies a smaller area, the square chip is placed on the square polygonal pad, which wastes less area.
Alternatively, the anti-stress sheet 20 may include a polygonal pad having four sides, five sides, six sides, and the like, which is not particularly limited herein.
Optionally, the anti-stress tabs 20 comprise annular gaskets. The circular ring structure is more convenient to process and the applicable chip 30 has more shapes compared with polygonal gaskets with a plurality of sides such as four sides, five sides, six sides and the like.
As shown in fig. 5 to 7, in some embodiments, one or more pins 31 are disposed on the chip 30, and pins 12 corresponding to the number of pins 31 are disposed on the strip 10, the pins 12 are located outside the package groove 11, and the pins 31 are connected to the pins 12 through bonding wires 32.
In the present embodiment, a pin 31 is provided on the chip 30, and the pin 31 of the chip 30 and the pin 12 of the strap 10 are connected by a bonding wire 32; alternatively, in the case of a chip provided with a pin 31, the strip 10 may also be provided with a pin 12 connected by a bonding wire 32; alternatively, in the case where the chip is provided with a plurality of pins 31, pins 12 corresponding to the number of pins 31 are also provided on the tape 10, and therefore, it is necessary to connect the plurality of pins 31 to the plurality of pins 12 through a plurality of bonding wires 32. For this reason, it is necessary to separate the plurality of bonding wires 32, to avoid the influence of mutual contact between the bonding wires 32,
in this embodiment, the integrated circuit within the chip 30 includes a plurality of functional modules, and accordingly, pins 31 of the chip 30 are connected to the functional modules. The chip 30 includes circuits of a plurality of functional modules, and the chip 30 includes a plurality of pins 31, and the pins 31 are connected to the functional modules one by one. Accordingly, the strip 10 includes a plurality of pins 12, and the pins 12 of the strip 10 are connected to pins 31 of the chip 30 one by one.
In some embodiments, the side of the tape 10 on which the chip 30 is disposed is encapsulated by a UV glue encapsulation layer 40.
In the present embodiment, a pin 31 is provided on the chip 30, and the pin 31 of the chip 30 and the pin 12 of the strap 10 are connected by a bonding wire 32; in order to protect the chip 30, the entire chip 30 can be molded to prevent the chip 30 from being exposed. After the pins 31 of the chip 30 are connected with the pins 12 of the strip 10, the side of the strip 10 having the chip 30 is subjected to plastic packaging by using a UV plastic packaging layer 40 to form a plastic packaging layer to complete the plastic packaging.
In this embodiment, the chip 30 is in a sealed state after packaging, and is not in contact with the outside, the strip 10 can be connected with an external device, so as to realize communication connection between the external device and the chip 30, and the chip 30 can control the external device.
In some embodiments, the material of the stress-resistant sheet 20 comprises a hard resin.
In this embodiment, since most of the materials of the strip 10 are epoxy glass cloth and copper foil, if the stress-resistant sheet 20 made of metal material is adopted, the strip cannot be well fused with the epoxy glass cloth and the copper foil; the hard resin material is adopted, so that the glass cloth can be well fused with the epoxy glass cloth and the copper foil, and meanwhile, the hard resin material also has certain hardness and can play a good supporting role. Optionally, the material of the stress-resistant sheet 20 comprises a hard epoxy.
The present disclosure further provides a smart card, including the package module in the foregoing embodiment.
In the embodiment of the disclosure, the smart card includes the above-mentioned packaging module, and thus, the smart card at least has the beneficial effects brought by the technical solutions of the above-mentioned embodiments, which are not described in detail herein.
The above description and the drawings illustrate embodiments of the disclosure sufficiently to enable those skilled in the art to practice them. Other embodiments may include structural and other modifications. The embodiments represent only possible variations. Individual components and functions are optional unless explicitly required, and the sequence of operations may vary. Portions and features of some embodiments may be included in, or substituted for, those of others. The embodiments of the present disclosure are not limited to the structures that have been described above and shown in the drawings, and various modifications and changes may be made without departing from the scope thereof. The scope of the present disclosure is limited only by the appended claims.
Claims (10)
1. A packaging module, comprising:
the strip is provided with a packaging groove;
the anti-stress sheet is arranged in the packaging groove of the strip; wherein, the upper surface of the anti-stress sheet is lower than the notch surface of the packaging groove;
the chip is arranged on the upper surface of the anti-stress sheet;
in the case of a stress test, the stress-resistant tab provides resistance to the chip.
2. The package module of claim 1, wherein a first set pitch is provided between an outer edge of the anti-stress sheet and a groove inner wall of the package groove, and the first set pitch has a value in a range of [100 μιη,200 μιη ].
3. The package module of claim 2, wherein the anti-stress tab is bonded to a bottom of the package cavity by a first adhesive layer.
4. The package module of claim 1, wherein a second set pitch is provided between an outer edge of the die and an outer edge of the stress-resistant sheet, the second set pitch having a value in a range of [100 μιη,200 μιη ].
5. The package module of claim 4, wherein the die is bonded to the upper surface of the stress-resistant sheet by a second adhesive layer.
6. The packaging module of any one of claims 1 to 5, wherein the stress-resistant sheet comprises at least four sided polygonal or circular gaskets.
7. The package module according to any one of claims 1 to 5, wherein one or more pins are provided on the chip, pins corresponding to the number of pins are provided on the strip, the pins are located outside the package groove, and the pins are connected to the pins by bonding wires.
8. The package module of claim 7, wherein the side of the strip on which the chip is disposed is encapsulated by a UV glue encapsulation layer.
9. The packaging module of any one of claims 1 to 5, wherein the stress-resistant sheet material comprises a hard resin.
10. A smart card comprising a packaging module as claimed in any one of claims 1 to 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202223440492.5U CN219350202U (en) | 2022-12-20 | 2022-12-20 | Packaging module and smart card |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202223440492.5U CN219350202U (en) | 2022-12-20 | 2022-12-20 | Packaging module and smart card |
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| CN219350202U true CN219350202U (en) | 2023-07-14 |
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| CN202223440492.5U Active CN219350202U (en) | 2022-12-20 | 2022-12-20 | Packaging module and smart card |
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| CN (1) | CN219350202U (en) |
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