CN219349823U - A pressure-sensitive foam and electronic equipment - Google Patents

Abstract

The application provides a pressure sensitive foam and electronic equipment relates to electric connection structure technical field, can avoid pressure sensitive foam to arouse antenna region's performance decline and spurious problem in the use. The pressure sensitive foam includes a multi-layer stack including a first conductive foam layer and a first pressure sensitive layer. Specifically, the first pressure-sensitive layer is laminated with the first conductive foam layer. When the voltage difference between one side of the first pressure-sensitive layer facing the first conductive foam layer and one side of the first pressure-sensitive layer facing away from the first conductive foam layer is smaller than a preset voltage, the first pressure-sensitive layer is insulated. When the voltage difference between one side of the first pressure-sensitive layer facing the first conductive foam layer and one side of the first pressure-sensitive layer facing away from the first conductive foam layer is greater than or equal to a preset voltage, the first pressure-sensitive layer is conductive. The pressure-sensitive foam is used for electrostatic protection or other electromagnetic protection.

Description

A pressure-sensitive foam and electronic equipment

technical field

The present application relates to the technical field of electrical connection structures, in particular to a pressure-sensitive foam and electronic equipment.

Background technique

In electronic devices such as mobile phones, TVs, monitors, notebooks, handheld computers, and car navigation systems, pressure-sensitive foam is often used to fill the gap between the external space of the electronic device and the internal circuit space on the electronic device and connect the reference ground to avoid external interference. Static electricity interferes with electronic equipment, or is used for the electrical connection between the metal shell or metal cover of the structural parts inside the electronic equipment and the reference ground (such as the middle frame), so as to prevent the structural parts from interacting with other structural parts in the electronic equipment (such as Antennas) generate electromagnetic interference (EMI). The structural parts here can be electronic components, circuit boards, and housings of electronic equipment. The structural parts can be conductive structures or conductive surfaces on non-conductive structures. .

Due to the limitations of function, assembly and manufacturing process, the pressure-sensitive foam in electronic equipment has the problem that it cannot be directly grounded. If the existing pressure-sensitive foam is used for grounding, it will have an impact on other structural parts around the pressure-sensitive foam. The main impact is to cause performance degradation in the antenna area and spurious problems. The stray is generated during the receiving demodulation process. Interference of new frequency signals to other systems. If a secondary discharge is created by using a small gap to jump, it still cannot achieve the purpose of avoiding static electricity from interfering with electronic equipment.

Utility model content

Embodiments of the present application provide a pressure-sensitive foam and an electronic device, which can avoid the problem of spuriousness in the antenna area caused by the pressure-sensitive foam during use.

In order to achieve the above object, the embodiments of the present application adopt the following technical solutions:

In a first aspect, the present application provides a pressure-sensitive foam, the pressure-sensitive foam includes a multi-layer stack structure, and the multi-layer stack structure includes a first conductive foam layer and a first pressure-sensitive layer. Specifically, the first pressure-sensitive layer is stacked with the first conductive foam layer. When the voltage difference between the side of the first pressure-sensitive layer facing the first conductive foam layer and the side of the first pressure-sensitive layer facing away from the first conductive foam layer is less than a preset voltage, the first pressure-sensitive layer is insulated. When the voltage difference between the side of the first pressure-sensitive layer facing the first conductive foam layer and the side of the first pressure-sensitive layer away from the first conductive foam layer is greater than or equal to the preset voltage, the first pressure-sensitive layer conduct electricity.

A pressure-sensitive foam is arranged between the structural member and the reference ground. The structural member can be an electronic component, the housing of an electronic device, and a circuit board. The structural member can be a conductive structure or a conductive surface on a non-conductive structure. When static electricity is accumulated on the structural parts, the pressure-sensitive foam releases the static electricity to the outside of the electronic equipment through the reference ground in a conductive state, preventing the static electricity accumulated on the structural parts from causing electromagnetic interference to other structural parts. Pressure sensitive foam is insulated when there is no static electricity on the structural part. It avoids the impact on the performance of the antenna in the non-static conduction state. When the structural parts and the reference ground are in a conductive state, it will cause strays in the antenna area. The strays are the interference of the new frequency signal generated by the receiving demodulation process on other systems. . By setting the first pressure-sensitive layer, the pressure-sensitive foam is in an insulating state when there is no static electricity, which better guarantees the performance of the antenna of the electronic device.

In a possible implementation manner, the preset voltage difference is greater than or equal to 50V and less than or equal to 100V. When the static electricity accumulated on the structural member reaches 50V, the first pressure-sensitive layer is in a conductive state. At this time, the static electricity on the structural parts is transmitted to the reference ground through the pressure-sensitive foam. When the static electricity on the structural member is less than 50V, the first pressure-sensitive layer is in an insulating state, which better guarantees the performance of the antenna of the electronic device.

In a possible implementation manner, in the stacking direction of the first conductive foam layer and the first pressure-sensitive layer, the thickness of the first pressure-sensitive layer is greater than or equal to 50 microns and less than or equal to 300 microns. When the thickness of the first pressure-sensitive layer is within this range, the performance of the pressure-sensitive foam and the miniaturization of the electronic device can be taken into account, and the comprehensive performance of the electronic device can be better guaranteed.

In a possible implementation manner, the multilayer stack structure further includes a first adhesive layer, the first adhesive layer is disposed between the first conductive foam layer and the first pressure-sensitive layer, and the first conductive foam layer and the first The pressure sensitive layer is bonded by the first adhesive layer. The first conductive foam layer and the first pressure-sensitive layer are connected as a whole through the first adhesive layer, which is beneficial to current transmission and further promotes the development of miniaturization of electronic equipment.

In a possible implementation manner, the multilayer stack structure further includes a second conductive foam layer, the second conductive foam layer is located on the side of the first pressure-sensitive layer away from the first conductive foam layer, and the second conductive foam layer The cotton layer is stacked with the first pressure-sensitive layer. In the manufacturing and assembly process of electronic equipment, there are certain manufacturing tolerances and assembly tolerances between adjacent components. By setting the first conductive foam layer and the second conductive foam layer to fill the gap between the structural member and the reference ground, the first conductive foam layer and the second conductive foam layer are in contact with the structural member and the reference ground under the action of their own elasticity. better fit between. Static electricity can be completely transmitted to the reference ground through the first conductive foam layer and the second conductive foam layer, which is beneficial to the discharge of static electricity of electronic equipment.

In a possible implementation manner, the multilayer stack structure further includes a second adhesive layer, the second adhesive layer is arranged between the second conductive foam layer and the first pressure-sensitive layer, and the second conductive foam layer and the first pressure-sensitive layer The pressure sensitive layer is bonded by a second adhesive layer. The second conductive foam layer and the first pressure-sensitive layer are connected as a whole through the second glue layer, which is beneficial to current transmission and further promotes the development of miniaturization of electronic equipment.

In a possible implementation manner, the first adhesive layer is conductive adhesive. During electrostatic transmission, static electricity can be transmitted along the shortest path on the pressure-sensitive foam, that is, along the shortest distance in the vertical direction of the pressure-sensitive foam to the reference ground. The discharge time of static electricity is shortened, which in turn shortens the duration of the impact of static electricity on the performance of the surrounding antenna area.

In a possible implementation manner, the first adhesive layer is non-conductive adhesive, and the second adhesive layer includes a plurality of adhesive layer units. A plurality of adhesive layer units are arranged at intervals on the surface of the first pressure sensitive layer away from the first conductive foam layer, there is a gap between adjacent adhesive layer units, and the second conductive foam layer is in contact with the first pressure sensitive layer in the gap area And conduct electricity. Setting the second adhesive layer as a non-conductive adhesive narrows the conductive area of the pressure-sensitive foam, avoids the use of conductive adhesive, and further reduces the influence of the pressure-sensitive foam on the antenna area when it conducts electricity, thereby ensuring that the antenna of the electronic device performance, reducing the appearance of spurious phenomena.

In a possible implementation manner, the multilayer stack structure further includes a second pressure-sensitive layer, the second pressure-sensitive layer is located on the side of the first conductive foam layer away from the first pressure-sensitive layer, and the second pressure-sensitive layer is connected to the first pressure-sensitive layer. A conductive foam layer is arranged in layers. When the voltage difference between the two sides of the first pressure sensitive layer satisfies the electrical conduction state, static electricity passes through the first pressure sensitive layer and the first conductive foam layer. After the static electricity is transmitted to the first conductive foam layer, when the voltage difference on both sides of the second pressure sensitive layer satisfies the state of electrical conduction, the static electricity continues to be transmitted through the second pressure sensitive layer. The second pressure-sensitive layer provides a double switch for the conduction of static electricity, and only when the static electricity satisfies the voltage for conducting the first pressure-sensitive layer and the second pressure-sensitive layer at the same time, the pressure-sensitive foam is in an electrically conductive state. It further avoids the influence of the pressure-sensitive foam on the antenna area of the electronic equipment, and reduces the stray phenomenon.

In a possible implementation manner, the multilayer stack structure further includes a third adhesive layer, the third adhesive layer is arranged between the first conductive foam layer and the second pressure-sensitive layer, and the first conductive foam layer and the second pressure-sensitive layer The pressure sensitive layer is bonded by a third adhesive layer. The first conductive foam layer and the second pressure-sensitive layer are connected as a whole through the third adhesive layer, which is beneficial to current transmission and further promotes the development of miniaturization of electronic equipment.

In a possible implementation manner, the multilayer stack structure includes a first surface and a second surface opposite to each other. The pressure-sensitive foam includes a fourth adhesive layer, and the fourth adhesive layer is disposed on the first surface of the multi-layer stacked structure. The multilayer stack structure can be connected to the structural component of the electronic device through the fourth adhesive layer, and the fourth adhesive layer fixes the multilayer stack structure in the gap between the structural component and the reference ground. The multi-stack structure fills the gap between the structural parts and the reference ground, and transfers the static electricity on the structural parts to the reference ground to ensure the normal use of electronic equipment.

In a possible implementation manner, the surface of the fourth adhesive layer facing away from the multilayer stack structure is provided with a first protective film, and the first protective film can be separated from the fourth adhesive layer. When the pressure-sensitive foam is produced and used alone, the first protective film covers the surface of the fourth adhesive layer to prevent dust from adhering to the surface of the fourth adhesive layer. Further ensure the adhesiveness of the pressure-sensitive foam.

In a possible implementation manner, the multilayer stack structure includes a first surface and a second surface opposite to each other. The pressure-sensitive foam includes a fifth adhesive layer, and the fifth adhesive layer is disposed on the second surface of the multi-layer stacked structure. The multilayer stack structure can be connected to the reference ground of the electronic device through the fifth glue layer, and the fifth glue layer fixes the multilayer stack structure in the gap between the structural component and the reference ground. The multi-stack structure fills the gap between the structural parts and the reference ground, and transfers the static electricity on the structural parts to the reference ground to ensure the normal use of electronic equipment.

In a possible implementation manner, the surface of the fifth adhesive layer facing away from the multilayer stack structure is provided with a second protective film, and the second protective film can be separated from the fifth adhesive layer. When the pressure-sensitive foam is produced and used alone, the second protective film covers the surface of the fifth adhesive layer to prevent dust from adhering to the surface of the fifth adhesive layer. Further ensure the adhesiveness of the pressure-sensitive foam.

In a second aspect, the present application also provides a pressure-sensitive foam, which includes a foam body and a pressure-sensitive layer. Specifically, the foam body includes a third surface and a fourth surface opposite to each other, and a first side connected to the third surface and the fourth surface. The pressure-sensitive layer includes a first pressure-sensitive part, a second pressure-sensitive part and a third pressure-sensitive part connected in sequence, the first pressure-sensitive part is arranged on the third surface, the third pressure-sensitive part is arranged on the fourth surface, and the second pressure-sensitive part is arranged on the fourth surface. The sensitive part is arranged on the first side. When the voltage difference between the side of the first pressure sensitive part facing away from the foam body and the side of the third pressure sensitive part facing away from the foam body is less than a preset voltage, the pressure sensitive layer is insulated. When the voltage difference between the side of the first pressure sensitive part facing away from the foam body and the side of the third pressure sensitive part facing away from the foam body is greater than or equal to a preset voltage, the pressure sensitive layer conducts electricity.

A pressure-sensitive foam is set between the structural part and the reference ground. When static electricity is accumulated on the structural part, the pressure-sensitive foam will release the static electricity to the outside of the electronic device through the reference ground in a conductive state, preventing the static electricity accumulated on the structural part from affecting the electronic equipment. Damage and interference to other structural parts. Pressure sensitive foam is insulated when there is no static electricity on the structural part. It avoids the impact on the performance of the antenna in the non-static conduction state. When the structural parts and the reference ground are in a conductive state, it will cause strays in the antenna area. The strays are the interference of the new frequency signal generated by the receiving demodulation process on other systems. . By setting the pressure-sensitive layer, the pressure-sensitive foam is in an insulating state when there is no static electricity, which better guarantees the performance of the antenna of the electronic device.

In a possible implementation manner, the pressure-sensitive layer further includes a fourth pressure-sensitive part connected between the third pressure-sensitive part and the first pressure-sensitive part. The foam body also includes a second side, the second side is disposed opposite to the first side, and the second side is connected between the third surface and the fourth surface, and the fourth pressure-sensitive part is disposed on the second side.

It improves the transmission efficiency of static electricity, reduces the conduction time of the pressure-sensitive foam, and further reduces the influence of the pressure-sensitive foam on the antenna area of the electronic device.

In a possible implementation manner, the pressure-sensitive layer further includes a fifth pressure-sensitive part connected between the third pressure-sensitive part and the first pressure-sensitive part. The foam body also includes a third side, the third side is located between the third surface and the fourth surface, and is also located between the first side and the second side, and the third side is connected to the third surface and the fourth surface, and the third side is connected to the third surface and the fourth surface. The three sides are also connected to the first side and the second side, and the fifth pressure-sensitive part is disposed on the third side. The current can also be transmitted along the path of the first pressure-sensitive part-the fifth pressure-sensitive part-the third pressure-sensitive part, which improves the transmission efficiency of static electricity, reduces the conduction time of the pressure-sensitive foam, and further reduces the impact of the pressure-sensitive foam on electrons. The effect of the antenna area of the device.

In a possible implementation manner, the pressure-sensitive layer further includes a sixth pressure-sensitive part connected between the third pressure-sensitive part and the first pressure-sensitive part. The foam body also includes a fourth side, the fourth side is opposite to the third side, and the fourth side is connected to the third surface and the fourth surface, the fourth side is also connected to the first side and the second side, and the sixth pressure The sensitive part is arranged on the fourth side.

The current can also be transmitted along the path of the first pressure-sensitive part - the sixth pressure-sensitive part - the third pressure-sensitive part, which improves the transmission efficiency of static electricity, reduces the conduction time of the pressure-sensitive foam, and further reduces the impact of the pressure-sensitive foam on electrons. The effect of the antenna area of the device.

In a possible implementation manner, the pressure-sensitive foam further includes an adhesive layer, the adhesive layer is disposed between the pressure-sensitive layer and the foam main body, and the pressure-sensitive layer and the foam main body are bonded through the adhesive layer. The foam main body and the pressure-sensitive layer are connected as a whole through the adhesive layer, which is beneficial to current transmission and further promotes the miniaturization of electronic equipment.

In a possible implementation manner, the foam body is a non-conductive structure. When the pressure-sensitive foam is in a conductive state, the static electricity is only transmitted through the pressure-sensitive layer, which further avoids the influence of the pressure-sensitive foam on the performance of the antenna in the non-static conduction state. It is in an insulating state at all times, which better protects the antenna performance of electronic equipment.

In a possible implementation manner, the adhesive layer is non-conductive adhesive. Regardless of whether the conductive adhesive is conductive or not, there may be non-linear risks. The use of non-conductive adhesive further avoids the impact of the pressure-sensitive foam on the antenna performance in the non-static conduction state, and better guarantees the antenna performance of electronic equipment.

In a third aspect, the present application also provides an electronic device, including a structural component, a reference ground, and pressure-sensitive foam, and the reference ground is arranged at a distance from the structural component. The structural parts here may be electronic components, circuit boards, housings of electronic equipment, etc., and the structural parts may be conductive structures, or conductive surfaces on non-conductive structures. The pressure-sensitive foam is the above-mentioned pressure-sensitive foam, and the pressure-sensitive foam is arranged in the gap between the structural member and the reference ground. The arrangement directions of the first conductive foam layer and the first pressure-sensitive layer are in the same stacking direction, one side surface of the pressure-sensitive foam is electrically connected to one of the structural member and the reference ground, and the other side of the pressure-sensitive foam The side surface is in electrical communication with the other of the structural member and the reference ground.

Since the electronic device provided by the third aspect of the embodiment of the present application includes the pressure-sensitive foam of any one of the above technical solutions, the two can solve the same technical problem and achieve the same effect.

In a fourth aspect, the present application also provides an electronic device, including a structural component, a reference ground, and pressure-sensitive foam, and the reference ground is spaced apart from the structural component. The structural parts here may be electronic components, circuit boards, housings of electronic equipment, etc., and the structural parts may be conductive structures, or conductive surfaces on non-conductive structures. The pressure-sensitive foam is the above-mentioned pressure-sensitive foam. The pressure-sensitive foam is arranged in the gap between the structural member and the reference ground. The arrangement direction and structure of the first pressure-sensitive part, the foam body and the third pressure-sensitive part The arrangement directions of the parts and the reference ground are consistent, one of the first pressure-sensitive part and the third pressure-sensitive part is electrically connected to the structural part, and the other of the first pressure-sensitive part and the third pressure-sensitive part is electrically connected to the reference ground.

Since the electronic device provided in the embodiment of the fourth aspect of the present application includes the pressure-sensitive foam of any one of the above technical solutions, the two can solve the same technical problem and achieve the same effect.

Description of drawings

FIG. 1 is a perspective view of an electronic device provided by some embodiments of the present application;

Figure 2 is an exploded view of the electronic device shown in Figure 1;

Fig. 3 is a schematic structural view cut along line A-A in Fig. 1;

Fig. 4 is a schematic structural diagram of the assembly of pressure-sensitive foam in electronic equipment provided by some embodiments of the present application;

Fig. 5 is a schematic structural view of the pressure-sensitive foam provided by some embodiments of the present application;

6 is a voltage-current relationship diagram of the first pressure-sensitive layer provided by some embodiments of the present application;

Fig. 7 is a schematic structural view of the pressure-sensitive foam provided by some embodiments of the present application;

Fig. 8 is a schematic structural view of the pressure-sensitive foam provided by some embodiments of the present application;

Fig. 9 is a schematic structural view of the pressure-sensitive foam provided by some embodiments of the present application;

Figure 10 is a schematic structural view of the pressure-sensitive foam provided by some embodiments of the present application;

Fig. 11 is a schematic structural view of the arrangement of adhesive layer units on the first pressure-sensitive layer provided by some embodiments of the present application;

Fig. 12 is another schematic structural view of the arrangement of adhesive layer units on the first pressure-sensitive layer provided in some embodiments of the present application;

Figure 13 is a schematic structural view of the pressure-sensitive foam provided by some embodiments of the present application;

Figure 14 is a schematic structural view of the pressure-sensitive foam provided by some embodiments of the present application;

Figure 15 is a schematic structural view of the pressure-sensitive foam provided by some embodiments of the present application;

Figure 16 is a schematic structural view of the pressure-sensitive foam provided by some embodiments of the present application;

Figure 17 is a schematic structural view of the foam body provided by some embodiments of the present application;

Figure 18 is a schematic structural view of the pressure-sensitive foam provided by some embodiments of the present application;

Fig. 19 is a schematic structural view of the pressure-sensitive foam provided by some embodiments of the present application.

Detailed ways

In some embodiments, the terms "first", "second", "third" and "fourth" are used for descriptive purposes only, and should not be construed as indicating or implying relative importance or implicitly indicating the indicated technical features quantity. Thus, features defined as "first", "second", "third" and "fourth" may expressly or implicitly include one or more of such features.

In some embodiments, the terms "comprises," "comprising," or any other variation thereof are intended to encompass a non-exclusive inclusion such that a process, method, article, or apparatus that includes a series of elements includes not only those elements, but also includes Other elements not expressly listed, or elements inherent in the process, method, article, or apparatus are also included. Without further limitations, an element defined by the phrase "comprising a ..." does not preclude the presence of additional identical elements in the process, method, article, or apparatus comprising that element.

It should be understood that the orientation or positional relationship indicated above, such as the terms "inner" and "outer", is based on the orientation or positional relationship shown in the accompanying drawings, which is only for the convenience of describing the utility model and simplifying the description, and It does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be construed as limiting the utility model; the orientation words "inside and outside" refer to the outline relative to each part itself inside and outside.

The present application provides an electronic device, and the electronic device may be a user equipment (user equipment, UE) or a terminal device (terminal). For example, the electronic device may be a large-screen display terminal, a personal digital assistant (PDA), a handheld device with a wireless communication function, a computing device, a vehicle-mounted device, a wearable device, a virtual reality (virtual reality, VR) terminal device, Augmented reality (augmented reality, AR) terminal equipment, display terminals in industrial control, display terminals in self driving, display terminals in remote medical, smart grid ), a display terminal in transportation safety, a display terminal in smart city, and a display terminal in smart home. Wherein, the large-screen display terminal includes but is not limited to devices such as smart screens, tablet computers (portable android device, PAD), notebook computers, desktop computers, television sets, and projectors.

Please refer to FIG. 1 . FIG. 1 is a perspective view of an electronic device 100 provided by some embodiments of the present application. This embodiment and the following embodiments are illustrated by taking the electronic device 100 as a mobile phone. The electronic device 100 is approximately in the shape of a rectangular plate. On this basis, in order to facilitate the description of the following embodiments, an XYZ coordinate system is established, and the width direction of the electronic device 100 is defined as the Y-axis direction, the length direction of the electronic device 100 is the Z-axis direction, and the thickness direction of the electronic device 100 is defined as X-axis direction. It can be understood that the setting of the coordinate system of the electronic device 100 can be flexibly set according to actual needs, which is not specifically limited here. In some other embodiments, the shape of the electronic device 100 may also be a square plate shape, a circular plate shape, an oval plate shape, etc., which are not specifically limited here.

Please refer to FIG. 1 and FIG. 2 together. FIG. 2 is an exploded view of the electronic device 100 shown in FIG. 1 . In this embodiment, the electronic device 100 includes a display screen 1 and a back shell 20 .

It can be understood that FIG. 1 and FIG. 2 only schematically show some components included in the electronic device 100 , and the actual shape, actual size, actual position and actual configuration of these components are not limited by FIG. 1 and FIG. 2 .

Please continue to refer to FIG. 2 , the display screen 1 includes a cover plate 12 and a display module 11 . The cover plate 12 is stacked with the display module 11 . The cover plate 12 is mainly used for protecting and dustproofing the display module 11 . The material of the cover plate 12 includes but not limited to glass. When the user uses the electronic device 100, the cover 12 faces the user. The cover plate 12 has functions such as impact resistance, scratch resistance, oil resistance, fingerprint resistance, and enhanced light transmittance.

The display module 11 is used for displaying images, videos and the like. The display module 11 can use a flexible display or a rigid display. For example, the display module 11 includes a display panel, and the display panel may be an organic light-emitting diode (OLED) display panel, an active-matrix organic light-emitting diode or an active-matrix organic light-emitting diode (active-matrix organic light) display panel. -emitting diode (AMOLED) display panel, mini organic light-emitting diode (mini organic light-emitting diode) display panel, micro organic light-emitting diode (micro organic light-emitting diode) display panel, micro organic light-emitting diode (micro organic light-emitting diode) display panel, Quantum dot light emitting diodes (quantum dot light emitting diodes, QLED) display panel, liquid crystal display panel (liquid crystal display, LCD).

The back case 20 forms a casing of the electronic device 100 for protecting internal electronic components of the electronic device 100 . The back case 20 may include a back cover 21 and a frame 22 . The back cover 21 is located on a side of the display module 11 away from the cover 12 , and is stacked with the cover 12 and the display module 11 and arranged at intervals. The frame 22 is located between the back cover 21 and the display screen 1 . The frame 22 is fixed on the back cover 21. Exemplarily, the frame 22 can be fixedly connected to the back cover 21 by glue, and the frame 22 can also be integrally formed with the back cover 21, that is, the frame 22 and the back cover 21 form a structure piece as a whole. The cover plate 12 is fixed on the frame 22 by gluing. The cover 12 , the back cover 21 and the frame 22 enclose an accommodating cavity 23 of the electronic device 100 . The accommodating cavity 23 accommodates the display module 11 , circuit board, camera and flashlight.

In some embodiments, the back shell 20 may further include a middle board 24 disposed in the above-mentioned accommodating cavity 23 , and the middle board 24 is located on a side of the display module 11 away from the cover 12 . Edges of the middle plate 24 are fixed to the frame 22 . In some embodiments, the edge of the middle plate 24 is fixed on the frame 22 by gluing, and the middle plate 24 and the frame 22 may also be integrally formed, that is, the middle plate 24 and the frame 22 are integrally formed as a structural member. The middle plate 24 divides the accommodating cavity into a first accommodating slot 231 and a fourth accommodating slot 232 , and the display module 11 is located in the first accommodating slot 231 . Other electronic components are disposed in the fourth receiving slot 232 , such as batteries and circuit boards. The back cover 21 is fixed on the frame 22 with foam glue. The whole formed by connecting the middle plate 24 and the frame 22 may also be called a middle frame 25 .

Fig. 3 is a schematic diagram of the structure cut along line A-A in Fig. 1 . The electronic device 100 also includes a pressure-sensitive foam 3 . Between the edge of the display screen 1 and the frame 22 there is a gap 4 connecting the external space of the mobile phone and the internal circuit space of the mobile phone. The pressure-sensitive foam is placed in the gap 4 and the pressure-sensitive foam 3 is electrically connected to the reference ground. Exemplarily, the reference ground is the metal part 221 of the middle frame 2 . In this way, the pressure-sensitive foam 3 is used as an electrostatic protection structure, and the static electricity outside the mobile phone is introduced into the reference ground through the pressure-sensitive foam 3, preventing the surface of the mobile phone and the external static electricity from entering the mobile phone through the gap between the edge of the display screen 1 and the frame 22. The internal circuit space of the mobile phone has an impact on the internal circuit of the mobile phone.

Please refer to FIG. 4 . FIG. 4 is a schematic structural diagram of the assembly of the pressure-sensitive foam 3 in the electronic device provided by some embodiments of the present application. In some embodiments, the electronic device includes a structural component 5 , a circuit board 8 , a metal shield 7 , a pressure-sensitive foam 3 and a reference ground 6 , where the structural component 5 refers to an electronic component. The reference ground 6 may be a metal middle frame, a metal casing, a metal back casing, etc., and is not specifically limited here. The structural component 5 is disposed on the circuit board 8 , the metal shield 7 is disposed outside the structural component 5 and connected to the circuit board 8 , and the metal shield 7 is spaced apart from the reference ground 6 . The pressure-sensitive foam 3 is disposed in the gap between the metal shield 7 and the reference ground 6 , and the metal shield 7 is electrically connected to the reference ground 6 through the pressure-sensitive foam 3 . In this way, the metal shield 7 is used to shield and protect the structural member 5. The metal shield 7 is an electromagnetic shielding structure, and the pressure-sensitive foam 3 is the grounding connection structure of the metal shield 7. The shielding cover 7 is connected to the reference ground 6, which can prevent the structural member 5 from being subjected to electromagnetic interference.

Please refer to FIG. 5 , which is a schematic structural diagram of the pressure-sensitive foam 3 provided in some embodiments of the present application. The present application also provides a pressure-sensitive foam 3 , which is the pressure-sensitive foam 3 in the above-mentioned electronic device 100 . The pressure-sensitive foam 3 includes a multi-layer stack structure, and the multi-layer stack structure includes a first conductive foam layer 31 and a first pressure-sensitive layer 32 . Specifically, the first pressure-sensitive layer 32 is stacked with the first conductive foam layer 31 . That is to say, in the X-axis direction, the orthographic projection of the first pressure-sensitive layer 32 in the X-axis direction overlaps with the orthographic projection of the first conductive foam layer 31 in the X-axis direction.

In some embodiments, the area of the orthographic projection of the first pressure-sensitive layer 32 in the X-axis direction is equal to the area of the orthographic projection of the first conductive foam layer 31 in the X-axis direction. In some other embodiments, the orthographic projection of the first pressure-sensitive layer 32 in the X-axis direction is larger than the orthographic projection of the first conductive foam layer 31 in the X-axis direction, and overlaps. The first pressure sensitive layer 32 covers the surface of the first conductive foam layer 31 .

When the voltage difference between the side of the first pressure sensitive layer 32 facing the first conductive foam layer 31 and the side of the first pressure sensitive layer 32 away from the first conductive foam layer 31 is less than a preset voltage, the first pressure sensitive Layer 32 is insulating. When the voltage difference between the side of the first pressure-sensitive layer 32 facing the first conductive foam layer 31 and the side of the first pressure-sensitive layer 32 away from the first conductive foam layer 31 is greater than or equal to the preset voltage, the first The pressure sensitive layer 32 is electrically conductive.

Please refer to FIG. 6 . FIG. 6 is a voltage-current relationship diagram of the first pressure-sensitive layer 32 provided by some embodiments of the present application. The first pressure-sensitive layer 32 has pressure-sensitive properties, that is, the voltage and current of the first pressure-sensitive layer 32 form a special nonlinear relationship. When the voltage applied across the first pressure-sensitive layer 32 is lower than the rated voltage value V1, the resistance value of the first pressure-sensitive layer 32 is close to infinity, and almost no current flows inside. At this time, the first pressure-sensitive layer 32 is insulating state. When the voltage applied to both ends of the first pressure-sensitive layer 32 is slightly higher than the rated voltage value V1, the first pressure-sensitive layer 32 will quickly break down and conduct, and change from a high-resistance state to a low-resistance state, and the operating current will also increase. At this time, the first pressure-sensitive layer 32 is in an electrical conduction state. When the voltage applied across the first pressure-sensitive layer 32 is lower than the rated voltage value V1, the first pressure-sensitive layer 32 returns to a high-resistance state, and at this time, the first pressure-sensitive layer 32 returns to an insulating state.

A pressure-sensitive foam 3 is arranged between the structural member 5 and the reference ground 6. The structural member can be an electronic component, the housing of an electronic device, and a circuit board. The structural member can be a conductive structure or a conductive surface on a non-conductive structure. . When static electricity is accumulated on the structural member 5 , the pressure-sensitive foam 3 discharges the static electricity to the outside of the electronic device 100 through the reference ground 6 in a conductive state, preventing the static electricity from generating electromagnetic interference to other structural members 5 . When there is no static electricity on the structural member 5, the pressure-sensitive foam 3 is in an insulating state, which avoids the influence on the performance of the antenna under the non-static conduction state. Keeping the traditional pressure-sensitive foam in a conductor state at all times will cause antenna performance degradation and spurs. The strays are the interference to other systems caused by the new frequency signal generated by the receiving demodulation process. By arranging the first pressure-sensitive layer 32 , the pressure-sensitive foam 3 is in an insulating state when there is no static electricity, which better guarantees the performance of the antenna of the electronic device 100 .

In some embodiments, the present application takes the electronic device 100 as an example for illustration, and the preset voltage difference is greater than or equal to 50V and less than or equal to 100V. When the static electricity accumulated on the structural member 5 reaches 50V, the first pressure-sensitive layer 32 is in a conductive state. At this time, the static electricity on the structural member 5 is transmitted to the reference ground 6 through the pressure-sensitive foam 3 . When the static electricity on the structural member 5 is less than 50V, the first pressure-sensitive layer 32 is in an insulating state, which better guarantees the performance of the antenna of the electronic device 100 and avoids causing stray in the antenna area.

In some embodiments, in the stacking direction of the first conductive foam layer 31 and the first pressure-sensitive layer 32 , the thickness of the first pressure-sensitive layer 32 is greater than or equal to 50 microns and less than or equal to 300 microns. The voltage at which the first pressure-sensitive layer 32 is in a conductive state is related to the thickness of the first pressure-sensitive layer 32 and doping elements. In this embodiment, the electronic device 100 is a mobile phone as an example for illustration. When the first pressure-sensitive layer 32 is in the above-mentioned thickness range, the performance of the pressure-sensitive foam 3 and the miniaturization of the electronic device 100 can be taken into account, and the electronic device 100 can be better guaranteed. comprehensive performance.

Please refer to FIG. 7 . FIG. 7 is a schematic structural diagram of the pressure-sensitive foam 3 provided by some embodiments of the present application. In some embodiments, the multilayer stack structure 30 further includes a first adhesive layer 33, the first adhesive layer 33 is disposed between the first conductive foam layer 31 and the first pressure-sensitive layer 32, the first conductive foam layer 31 It is bonded with the first pressure-sensitive layer 32 through the first adhesive layer 33 . The first conductive foam layer 31 and the first pressure-sensitive layer 32 are integrally connected through the first adhesive layer 33 , which facilitates current transmission and further promotes the miniaturization of the electronic device 100 .

Please refer to FIG. 8 , which is a schematic structural diagram of the pressure-sensitive foam 3 provided by some embodiments of the present application. In some embodiments, the multilayer stack structure 30 further includes a second conductive foam layer 34, the second conductive foam layer 34 is located on the side of the first pressure sensitive layer 32 away from the first conductive foam layer 31, and the second The conductive foam layer 34 is stacked with the first pressure sensitive layer 32 . In the X-axis direction, the orthographic projection of the first pressure-sensitive layer 32 in the X-axis direction overlaps with the orthographic projection of the second conductive foam layer 34 in the X-axis direction. In some embodiments, the area of the orthographic projection of the first pressure-sensitive layer 32 in the X-axis direction is equal to the area of the orthographic projection of the second conductive foam layer 34 in the X-axis direction. In some other embodiments, the orthographic projection of the first pressure-sensitive layer 32 in the X-axis direction is larger than the orthographic projection of the second conductive foam layer 34 in the X-axis direction, and overlaps. Therefore, the first pressure sensitive layer 32 covers the surface of the second conductive foam layer 34 .

This embodiment is described by taking two conductive foam layers as an example, but this is not a specific limitation on the conductive foam layers. In other embodiments, the number of conductive foam layers may be three, four or five, and the corresponding number of conductive foam layers is selected according to the specific conditions of the application of the conductive foam layers to the electronic device 100 . For example, when the distance between the structural component 5 and the reference ground 6 in the electronic device 100 is too large, multiple conductive foam layers may be selected.

During the manufacturing and assembly process of the electronic device 100 , there are certain manufacturing tolerances and assembly tolerances between adjacent components. By arranging the first conductive foam layer 31 and the second conductive foam layer 34 to fill the gap 4 between the structural member 5 and the reference ground 6, the first conductive foam layer 31 and the second conductive foam layer 34 act on their own elasticity The bottom is better fitted with the structural member 5 and the reference ground 6 . Static electricity can be completely transmitted to the reference ground 6 through the first conductive foam layer 31 and the second conductive foam layer 34 , which is beneficial to the static electricity discharge of the electronic device 100 .

Please refer to FIG. 9 . FIG. 9 is a schematic structural diagram of the pressure-sensitive foam 3 provided by some embodiments of the present application. In some embodiments, the multilayer stack structure 30 further includes a second adhesive layer 35, the second adhesive layer 35 is disposed between the second conductive foam layer 34 and the first pressure-sensitive layer 32, the second conductive foam layer 34 It is bonded with the first pressure-sensitive layer 32 through the second adhesive layer 35 . The second conductive foam layer 34 and the first pressure-sensitive layer 32 are integrally connected through the second adhesive layer 35 , which facilitates current transmission and further promotes the miniaturization of the electronic device 100 .

In some embodiments, the first adhesive layer 33 may be conductive adhesive. During the electrostatic transmission process, static electricity can be transmitted along the shortest path on the pressure-sensitive foam 3 , that is, along the shortest distance of the pressure-sensitive foam 3 in the vertical direction (that is, the X-axis direction) to the reference ground 6 . The discharge time of static electricity is shortened, which in turn shortens the duration of the impact of static electricity on the performance of the surrounding antenna area.

In some embodiments, the first adhesive layer 33 and the second adhesive layer 35 may be non-conductive adhesive, and the first adhesive layer 33 and the second adhesive layer 35 may include a plurality of adhesive layer units.

Please refer to FIG. 10 . FIG. 10 is a schematic structural diagram of the pressure-sensitive foam 3 provided by some embodiments of the present application. The following description will be made by taking the second adhesive layer 35 provided with multiple adhesive layer units as an example. The second glue layer 35 may include a plurality of glue layer units 351 . A plurality of adhesive layer units 351 are arranged at intervals on the surface of the first pressure sensitive layer 32 away from the first conductive foam layer 31, and there is a gap 321 between adjacent adhesive layer units 351, and the second conductive foam layer 34 and the first pressure sensitive layer 34 are arranged at intervals. The sensitive layer 32 is in contact with and electrically connected to the gap 321 . Please refer to FIG. 11 . FIG. 11 is a schematic structural view of the arrangement of glued layer units 351 on the first pressure sensitive layer 32 provided by some embodiments of the present application. Specifically, the adhesive layer unit 351 can be set in a square, circular or irregular shape, which is not specifically limited here. In this embodiment, the adhesive layer unit 351 is a square as an example for illustration. The adhesive layer units 351 can be arranged on the surface of the first pressure-sensitive layer 32 along a square array, or arranged on the surface of the first pressure-sensitive layer 32 along an annular array.

Please refer to FIG. 12 . FIG. 12 is another schematic structural view of the arrangement of the adhesive layer unit 351 on the first pressure-sensitive layer 32 provided by some embodiments of the present application. The adhesive layer unit 351 can also be arranged in a strip shape, and the strip-shaped adhesive layer unit 351 is arranged along the edge of the first pressure sensitive layer 32 . The first pressure-sensitive layer 32 inside the adhesive layer unit 351 is the area of the gap 4 , and the second conductive foam layer 34 is electrically connected to the first pressure-sensitive layer 32 through the area of the gap 4 .

Setting the second adhesive layer 35 as a non-conductive adhesive reduces the conductive area of the pressure-sensitive foam 3, and further reduces the influence of the pressure-sensitive foam 3 on the antenna area during conduction, thereby ensuring the performance of the antenna of the electronic device 100 and reducing the The emergence of spurious phenomena.

Please refer to FIG. 13 . FIG. 13 is a schematic structural diagram of the pressure-sensitive foam 3 provided by some embodiments of the present application. In some embodiments, the multilayer stack structure 30 further includes a second pressure sensitive layer 36, the second pressure sensitive layer 36 is located on the side of the first conductive foam layer 31 away from the first pressure sensitive layer 32, the second pressure sensitive layer 36 is stacked with the first conductive foam layer 31. The orthographic projection of the second pressure-sensitive layer 36 in the X-axis direction overlaps with the orthographic projection of the first conductive foam layer 31 in the X-axis direction. In some embodiments, the area of the orthographic projection of the second pressure-sensitive layer 36 in the X-axis direction is equal to the area of the orthographic projection of the first conductive foam layer 31 in the X-axis direction. In some other embodiments, the orthographic projection of the second pressure-sensitive layer 36 in the X-axis direction is larger than the orthographic projection of the first conductive foam layer 31 in the X-axis direction, and overlaps. Therefore, the second pressure sensitive layer 36 covers the surface of the first conductive foam layer 31 .

This embodiment is described by taking two pressure-sensitive layers as an example, but this is not a specific limitation on the pressure-sensitive layers. In other embodiments, the number of pressure-sensitive layers may be three, four or five, and the corresponding number of pressure-sensitive layers is selected according to the specific conditions of the application of the pressure-sensitive layers to the electronic device 100 .

When the voltage difference between the two sides of the first pressure sensitive layer 32 satisfies the electrical conduction state, static electricity passes through the first pressure sensitive layer 32 and the first conductive foam layer 31 . After the static electricity is transmitted to the first conductive foam layer 31 , when the voltage difference between the two sides of the second pressure sensitive layer 36 satisfies the electrical conduction state, the static electricity continues to be transmitted through the second pressure sensitive layer 36 . The second pressure-sensitive layer 36 provides a double switch for the conduction of static electricity. Only when the static electricity meets the voltage of conducting the first pressure-sensitive layer 32 and the second pressure-sensitive layer 36 at the same time, the pressure-sensitive foam 3 is in an electrically conductive state. The influence of the pressure-sensitive foam 3 on the antenna area of the electronic device 100 is further avoided, and stray phenomena are reduced.

Please refer to FIG. 14 . FIG. 14 is a schematic structural diagram of the pressure-sensitive foam 3 provided by some embodiments of the present application. In some embodiments, the multi-layer stack structure 30 further includes a third adhesive layer 37, the third adhesive layer 37 is disposed between the first conductive foam layer 31 and the second pressure-sensitive layer 36, the first conductive foam layer 31 It is bonded with the second pressure-sensitive layer 36 through the third adhesive layer 37 . The first conductive foam layer 31 and the second pressure-sensitive layer 36 are connected as a whole through the third adhesive layer 37 , which facilitates current transmission and further promotes the miniaturization of the electronic device 100 .

Please refer to FIG. 15 . FIG. 15 is a schematic structural diagram of the pressure-sensitive foam 3 provided in some embodiments of the present application. In some embodiments, the multilayer stack structure 30 includes a first surface 301 and a second surface 302 opposite to each other. The pressure-sensitive foam 3 includes a fourth adhesive layer 38 disposed on the first surface 301 of the multi-layer stack structure 30 . The multilayer stack structure 30 can be connected to the structural component 5 of the electronic device 100 through a fourth adhesive layer 38 , and the fourth adhesive layer 38 fixes the multilayer stack structure 30 in the gap 4 between the structural component 5 and the reference ground 6 . The multiple stacked structure fills the gap 4 between the structural component 5 and the reference ground 6 , and transfers the static electricity on the structural component 5 to the reference ground 6 to ensure the normal use of the electronic device 100 .

Please continue to refer to FIG. 15 , in some embodiments, the surface of the fourth adhesive layer 38 facing away from the multilayer stack structure 30 is provided with a first protective film, and the first protective film and the fourth adhesive layer 38 can be separated. When the pressure-sensitive foam 3 is produced and used alone, the first protective film covers the surface of the fourth adhesive layer 38 to prevent dust from adhering to the surface of the fourth adhesive layer 38 . Further ensure the adhesiveness of the pressure-sensitive foam 3 .

Please continue to refer to FIG. 15 , in some embodiments, the multilayer stack structure 30 includes a first surface 301 and a second surface 302 opposite to each other. The pressure-sensitive foam 3 includes a fifth adhesive layer, and the fifth adhesive layer is disposed on the second surface 302 of the multi-layer stack structure 30 . The multilayer stack structure 30 can be connected to the reference ground 6 of the electronic device 100 through a fifth adhesive layer, and the fifth adhesive layer fixes the multilayer stack structure 30 to the gap 4 between the structural component 5 and the reference ground 6 . The multiple stacked structure fills the gap 4 between the structural component 5 and the reference ground 6 , and transfers the static electricity on the structural component 5 to the reference ground 6 to ensure the normal use of the electronic device 100 .

Please continue to refer to FIG. 15 , in some embodiments, a second protective film is provided on the surface of the fifth adhesive layer facing away from the multilayer stack structure 30 , and the second protective film can be separated from the fifth adhesive layer. When the pressure-sensitive foam 3 is produced and used alone, the second protective film covers the surface of the fifth adhesive layer to prevent dust from adhering to the surface of the fifth adhesive layer. Further ensure the adhesiveness of the pressure-sensitive foam 3 .

Please refer to FIG. 16 . FIG. 16 is a schematic structural diagram of the pressure-sensitive foam 3 provided by some embodiments of the present application. The present application also provides a pressure-sensitive foam 3 , including a foam body 90 and a pressure-sensitive layer 91 . Please refer to FIG. 17 . FIG. 17 is a schematic structural diagram of a foam body 90 provided in some embodiments of the present application. The foam body 90 includes a third surface 901 and a fourth surface 902 opposite to each other, and a first side 903 connected to the third surface 901 and the fourth surface 902 . The pressure-sensitive layer 91 includes a first pressure-sensitive part 911, a second pressure-sensitive part 912 and a third pressure-sensitive part 913 connected in sequence, the first pressure-sensitive part 911 is arranged on the third surface 901, and the third pressure-sensitive part 913 is arranged on On the fourth surface 902 , the second pressure-sensitive portion 912 is disposed on the first side 903 .

When the voltage difference between the side of the first pressure sensitive portion 911 facing away from the foam body 90 and the side of the third pressure sensitive portion 913 facing away from the foam body 90 is less than a predetermined voltage, the pressure sensitive layer 91 is insulated. When the voltage difference between the side of the first pressure sensitive portion 911 facing away from the foam body 90 and the side of the third pressure sensitive portion 913 facing away from the foam body 90 is greater than or equal to a preset voltage, the pressure sensitive layer 91 conducts electricity. When the pressure-sensitive foam 3 is in a conductive state, the current is transmitted through the first pressure-sensitive part 911 , the second pressure-sensitive part 912 and the third pressure-sensitive part 913 in sequence. Therefore, static electricity is transmitted to the reference ground 6 through the pressure sensitive layer 91 .

A pressure-sensitive foam 3 is arranged between the structural member 5 and the reference ground 6. When static electricity is accumulated on the structural member 5, the pressure-sensitive foam 3 will discharge the static electricity to the outside of the electronic device 100 through the reference ground 6 in a conductive state, preventing The static electricity accumulated on the structural member 5 generates electromagnetic interference to other structural members 5 . When there is no static electricity on the structural member 5, the pressure-sensitive foam 3 is in an insulating state. It avoids the impact on the performance of the antenna in the state of non-static conduction. When the structural member 5 and the reference ground 6 are in a conductive state, it will cause strays in the antenna area. The strays are the new frequency signals generated by the receiving demodulation process that affect other systems. interference. By arranging the pressure-sensitive layer 91 , the pressure-sensitive foam 3 is in an insulating state when there is no static electricity, which better guarantees the performance of the antenna of the electronic device 100 .

Please refer to FIG. 18 . FIG. 18 is a schematic structural diagram of the pressure-sensitive foam 3 provided by some embodiments of the present application. In some embodiments, the pressure-sensitive layer 91 further includes a fourth pressure-sensitive portion 914 connected between the third pressure-sensitive portion 913 and the first pressure-sensitive portion 911 . Please continue to refer to FIG. 18 , the foam body 90 further includes a second side 904 , the second side 904 is opposite to the first side 903 , and the second side 904 is connected between the third surface 901 and the fourth surface 902 , the fourth The pressure sensitive portion 914 is disposed on the second side 904 . When the pressure-sensitive foam 3 is in a conductive state, the electrostatic current can be transmitted along the pressure-sensitive layer 91 to the reference ground 6 . Specifically, the current can be transmitted along the path of the first pressure sensitive part 911 - the second pressure sensitive part 912 - the third pressure sensitive part 913, or along the path of the first pressure sensitive part 911 - the fourth pressure sensitive part 914 - the third pressure sensitive part Sensitive part 913 path transmission. The electrostatic transmission efficiency is improved, the conduction time of the pressure-sensitive foam 3 is reduced, and the influence of the pressure-sensitive foam 3 on the antenna area of the electronic device 100 is further reduced.

In some embodiments, the pressure-sensitive layer 91 further includes a fifth pressure-sensitive portion connected between the third pressure-sensitive portion 913 and the first pressure-sensitive portion 911 . The pressure-sensitive layer 91 can be a rectangular shell or a cylindrical shell. This application takes the pressure-sensitive layer 91 as a rectangular shell as an example for illustration. The fifth pressure-sensitive part is a side of the pressure-sensitive layer 91, which is not a special restrictions. Correspondingly, the shape of the foam body 90 corresponds to the shape of the pressure-sensitive layer 91 , and the foam body 90 is also a rectangular shell as an example for illustration. Please continue to refer to FIG. 18 , the foam body 90 further includes a third side 905, the third side 905 is located between the third surface 901 and the fourth surface 902, and is also located between the first side 903 and the second side 904, and the third side 905 The three sides 905 are connected to the third surface 901 and the fourth surface 902 , the third side 905 is also connected to the first side 903 and the second side 904 , and the fifth pressure-sensitive part is disposed on the third side 905 . The current can also be transmitted along the path of the first pressure-sensitive part 911-the fifth pressure-sensitive part-the third pressure-sensitive part 913, which improves the transmission efficiency of static electricity, reduces the conduction time of the pressure-sensitive foam 3, and further reduces the pressure-sensitive foam 3. The effect of cotton 3 on the antenna area of the electronic device 100.

In some embodiments, the pressure-sensitive layer 91 further includes a sixth pressure-sensitive portion connected between the third pressure-sensitive portion 913 and the first pressure-sensitive portion 911 . In this application, the pressure-sensitive layer 91 is a rectangular casing as an example for illustration, and the sixth pressure-sensitive part is a side surface of the pressure-sensitive layer 91 . Please continue to refer to FIG. 18 , the foam body 90 further includes a fourth side 906 , the fourth side 906 is opposite to the third side 905 , and the fourth side 906 is connected to the third surface 901 and the fourth surface 902 , the fourth side 906 Also connected to the first side 903 and the second side 904 , the sixth pressure sensitive part 91 is disposed on the fourth side 906 . The current can also be transmitted along the path of the first pressure-sensitive part 911-sixth pressure-sensitive part-the third pressure-sensitive part 913, which improves the transmission efficiency of static electricity, reduces the conduction time of the pressure-sensitive foam 3, and further reduces pressure-sensitive foam. The effect of cotton 3 on the antenna area of the electronic device 100.

Please refer to FIG. 19 . FIG. 19 is a schematic structural diagram of the pressure-sensitive foam 3 provided by some embodiments of the present application. In some embodiments, the pressure-sensitive foam 3 further includes an adhesive layer 92 disposed between the pressure-sensitive layer 91 and the foam body 90 , and the pressure-sensitive layer 91 and the foam body 90 are connected through the adhesive layer 92 . The foam main body 90 and the pressure-sensitive layer 91 are connected as a whole through the adhesive layer 92 , which is beneficial to current transmission and further promotes the miniaturization of the electronic device 100 .

In some embodiments, the foam body 90 is a non-conductive structure. When the pressure-sensitive foam 3 is in a conductive state, the static electricity is only transmitted through the pressure-sensitive layer 91, which further avoids the influence of the pressure-sensitive foam 3 on the performance of the antenna in the non-static conduction state. By setting the pressure-sensitive layer 91, the pressure-sensitive foam The cotton 3 is in an insulating state when there is no static electricity, which better guarantees the performance of the antenna of the electronic device 100 .

In some embodiments, the adhesive layer 92 is also configured as a non-conductive structure. This further avoids the influence of the pressure-sensitive foam 3 on the performance of the antenna in the non-static conduction state, and better guarantees the performance of the antenna of the electronic device 100 .

In the description of this specification, specific features, structures, materials or characteristics may be combined in any one or more embodiments or examples in an appropriate manner.

Finally, it should be noted that: the above embodiments are only used to illustrate the technical solutions of the present application, rather than limiting them; although the present application has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that: it can still Modifications are made to the technical solutions described in the foregoing embodiments, or equivalent replacements are made to some of the technical features; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the spirit and scope of the technical solutions of the various embodiments of the present application.

Claims (23)

1. A pressure sensitive foam comprising a multi-layer stack, the multi-layer stack comprising:

a first conductive foam layer;

the first pressure-sensitive layer is arranged on the first conductive foam layer in a laminated manner;

when the voltage difference between one side of the first pressure-sensitive layer facing the first conductive foam layer and one side of the first pressure-sensitive layer facing away from the first conductive foam layer is smaller than a preset voltage, the first pressure-sensitive layer is insulated;

when the voltage difference between one side of the first pressure-sensitive layer facing the first conductive foam layer and one side of the first pressure-sensitive layer facing away from the first conductive foam layer is greater than or equal to a preset voltage, the first pressure-sensitive layer is conductive.

2. The pressure sensitive foam of claim 1, wherein the predetermined voltage is greater than or equal to 50V and less than or equal to 100V.

3. The pressure-sensitive foam according to claim 1 or 2, wherein a thickness of the first pressure-sensitive layer is 50 micrometers or more and 300 micrometers or less in a lamination direction of the first conductive foam layer and the first pressure-sensitive layer.

4. The pressure sensitive foam of claim 1 or 2, wherein the multi-layer stack further comprises:

The first adhesive layer is arranged between the first conductive foam layer and the first pressure-sensitive layer, and the first conductive foam layer and the first pressure-sensitive layer are adhered through the first adhesive layer.

5. The pressure sensitive foam of claim 4, wherein the multi-layer stack further comprises:

the second conductive foam layer is positioned on one side of the first pressure-sensitive layer, which is away from the first conductive foam layer, and the second conductive foam layer is arranged on the first pressure-sensitive layer in a layer-by-layer manner.

6. The pressure sensitive foam of claim 5, wherein the multi-layer stack further comprises:

the second adhesive layer is arranged between the second conductive foam layer and the first pressure-sensitive layer, and the second conductive foam layer and the first pressure-sensitive layer are adhered through the second adhesive layer.

7. The pressure sensitive foam of claim 4, wherein the first adhesive layer is a conductive adhesive.

8. The pressure sensitive foam of claim 5, wherein the first adhesive layer comprises a plurality of adhesive layer units;

the plurality of glue layer units are arranged at intervals on the surface of the first pressure-sensitive layer, which is away from the first conductive foam layer, gaps are reserved between the adjacent glue layer units, and the second conductive foam layer is in contact with the first pressure-sensitive layer in a gap area and is electrically connected with the first pressure-sensitive layer.

9. The pressure sensitive foam of claim 1 or 2, wherein the multi-layer stack further comprises:

the second pressure-sensitive layer is positioned on one side of the first conductive foam layer, which is away from the first pressure-sensitive layer, and the second pressure-sensitive layer is arranged with the first conductive foam layer in a laminated way.

10. The pressure sensitive foam of claim 9, wherein the multi-layer stack further comprises:

the third adhesive layer is arranged between the first conductive foam layer and the second pressure-sensitive layer, and the first conductive foam layer and the second pressure-sensitive layer are adhered through the third adhesive layer.

11. A pressure sensitive foam according to claim 1 or 2, wherein,

the multi-layer stack structure includes opposing first and second surfaces;

the pressure sensitive foam comprises a fourth adhesive layer, and the fourth adhesive layer is arranged on the first surface of the multilayer stacking structure.

12. The foam of claim 11, wherein a surface of the fourth adhesive layer facing away from the multi-layer stack is provided with a first protective film, the first protective film being separable from the fourth adhesive layer.

13. A pressure sensitive foam according to claim 1 or 2, wherein,

The multi-layer stack structure includes opposing first and second surfaces;

the pressure sensitive foam includes a fifth glue layer disposed on the second surface of the multi-layer stacked structure.

14. The foam of claim 13, wherein a surface of the fifth adhesive layer facing away from the multi-layer stack is provided with a second protective film, the second protective film being separable from the fifth adhesive layer.

15. A pressure sensitive foam comprising:

a foam body comprising opposing third and fourth surfaces, and a first side connected to the third and fourth surfaces;

the pressure-sensitive layer comprises a first pressure-sensitive part, a second pressure-sensitive part and a third pressure-sensitive part which are sequentially connected, wherein the first pressure-sensitive part is arranged on the third surface, the third pressure-sensitive part is arranged on the fourth surface, and the second pressure-sensitive part is arranged on the first side surface;

when the voltage difference between the side of the first pressure-sensitive part, which is away from the foam main body, and the side of the third pressure-sensitive part, which is away from the foam main body, is smaller than a preset voltage, the pressure-sensitive layer is insulated;

When the voltage difference between the side of the first pressure-sensitive part, which is away from the foam body, and the side of the third pressure-sensitive part, which is away from the foam body, is greater than or equal to a preset voltage, the pressure-sensitive layer conducts electricity.

16. A pressure sensitive foam according to claim 15, wherein,

the pressure sensitive layer further includes a fourth pressure sensitive portion connected between the third pressure sensitive portion and the first pressure sensitive portion;

the foam body further comprises a second side surface which is opposite to the first side surface, the second side surface is connected between the third surface and the fourth surface, and the fourth pressure-sensitive part is arranged on the second side surface.

17. The pressure sensitive foam of claim 16, wherein,

the pressure sensitive layer further includes a fifth pressure sensitive portion connected between the third pressure sensitive portion and the first pressure sensitive portion;

the foam body further comprises a third side surface, the third side surface is located between the third surface and the fourth surface, the third side surface is located between the first side surface and the second side surface, the third side surface is connected to the third surface and the fourth surface, the third side surface is further connected to the first side surface and the second side surface, and the fifth pressure-sensitive portion is arranged on the third side surface.

18. The pressure sensitive foam of claim 17, wherein,

the pressure sensitive layer further includes a sixth pressure sensitive portion connected between the third pressure sensitive portion and the first pressure sensitive portion;

the foam body further comprises a fourth side surface which is opposite to the third side surface, the fourth side surface is connected to the third surface and the fourth surface, the fourth side surface is further connected to the first side surface and the second side surface, and the sixth pressure-sensitive part is arranged on the fourth side surface.

19. A pressure sensitive foam according to any one of claims 15-18, further comprising:

the adhesive layer is arranged between the pressure-sensitive layer and the foam main body, and the pressure-sensitive layer and the foam main body are bonded through the adhesive layer.

20. A pressure sensitive foam according to any of claims 15-18, wherein said foam body is of a non-conductive construction.

21. The pressure sensitive foam of claim 19, wherein the glue layer is a non-conductive glue.

22. An electronic device, comprising:

structural members;

the reference ground is arranged at intervals from the structural part;

A pressure-sensitive foam according to any one of claims 1 to 14, which is disposed in a gap between the structural member and the reference ground, and the lamination direction of the first conductive foam layer and the first pressure-sensitive layer is consistent with the arrangement direction of the structural member and the reference ground;

in the lamination direction of the first conductive foam layer and the first pressure-sensitive layer, one side surface of the pressure-sensitive foam is electrically communicated with one of the structural member and the reference ground, and the other side surface of the pressure-sensitive foam is electrically communicated with the other of the structural member and the reference ground.

23. An electronic device, comprising:

structural members;

the reference ground is arranged at intervals with the structural part;

a pressure-sensitive foam according to any one of claims 15 to 21, which is disposed in a gap between the structural member and the reference ground, and the arrangement direction of the first pressure-sensitive portion, the foam body, and the third pressure-sensitive portion is identical to the arrangement direction of the structural member and the reference ground;

one of the first and third pressure sensitive portions is in electrical communication with the structural member and the other of the first and third pressure sensitive portions is in electrical communication with the reference ground.

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