CN219349823U - Pressure-sensitive foam and electronic equipment - Google Patents

Abstract

The application provides a pressure sensitive foam and electronic equipment relates to electric connection structure technical field, can avoid pressure sensitive foam to arouse antenna region's performance decline and spurious problem in the use. The pressure sensitive foam includes a multi-layer stack including a first conductive foam layer and a first pressure sensitive layer. Specifically, the first pressure-sensitive layer is laminated with the first conductive foam layer. When the voltage difference between one side of the first pressure-sensitive layer facing the first conductive foam layer and one side of the first pressure-sensitive layer facing away from the first conductive foam layer is smaller than a preset voltage, the first pressure-sensitive layer is insulated. When the voltage difference between one side of the first pressure-sensitive layer facing the first conductive foam layer and one side of the first pressure-sensitive layer facing away from the first conductive foam layer is greater than or equal to a preset voltage, the first pressure-sensitive layer is conductive. The pressure-sensitive foam is used for electrostatic protection or other electromagnetic protection.

Description

Pressure-sensitive foam and electronic equipment

Technical Field

The application relates to the technical field of electrical connection structures, in particular to pressure-sensitive foam and electronic equipment.

Background

In electronic devices such as mobile phones, televisions, displays, notebooks, palm computers, car navigation systems and the like, pressure-sensitive foam is often used for filling gaps on the electronic devices, which are used for communicating an external space of the electronic devices with an internal circuit space, and connecting with a reference ground to avoid external static electricity from interfering with the electronic devices, or is used for electrically connecting a metal shell or a metal cover of a structural member inside the electronic devices with the reference ground (such as a middle frame) so as to avoid electromagnetic interference (electromagnetic interference ) between the structural member and other structural members (such as antennas) inside the electronic devices, wherein the structural member can be an electronic component, a circuit board, a shell of the electronic devices and the like, and the structural member can be a conductive structure or a conductive surface on a non-conductive structure.

The pressure sensitive foam in electronic devices has a problem that it cannot be directly grounded due to limitations in functions, assembly and manufacturing processes, etc. If the existing pressure sensitive foam is used for grounding, other structural components around the pressure sensitive foam can be influenced, and the most important influence is to cause performance degradation of an antenna area and a spurious problem, namely, interference of new frequency signals generated in a receiving demodulation process to other systems. If the small gap is used for power skip and secondary discharge is produced, the purpose of avoiding static interference to the electronic equipment still cannot be achieved.

Disclosure of Invention

The embodiment of the application provides pressure-sensitive foam and electronic equipment, which can avoid the problem of stray of an antenna area caused by the pressure-sensitive foam in the use process.

In order to achieve the above purpose, the embodiments of the present application adopt the following technical solutions:

in a first aspect, the present application provides a pressure sensitive foam comprising a multi-layer stack comprising a first conductive foam layer and a first pressure sensitive layer. Specifically, the first pressure-sensitive layer is laminated with the first conductive foam layer. When the voltage difference between one side of the first pressure-sensitive layer facing the first conductive foam layer and one side of the first pressure-sensitive layer facing away from the first conductive foam layer is smaller than a preset voltage, the first pressure-sensitive layer is insulated. When the voltage difference between one side of the first pressure-sensitive layer facing the first conductive foam layer and one side of the first pressure-sensitive layer facing away from the first conductive foam layer is greater than or equal to a preset voltage, the first pressure-sensitive layer is conductive.

The pressure sensitive foam is arranged between the structural member and the reference ground, the structural member can be an electronic component, a shell of electronic equipment and a circuit board, and the structural member can be a conductive structure or a conductive surface on a non-conductive structure. When static electricity is accumulated on the structural member, the pressure-sensitive foam releases the static electricity to the outside of the electronic equipment through the reference ground in a conductive state, and the static electricity accumulated on the structural member is prevented from generating electromagnetic interference on other structural members. When static electricity is not arranged on the structural member, the pressure-sensitive foam is in an insulating state. The influence on the antenna performance in the static-free conduction state is avoided, and when the structural member and the reference ground are in the conduction state, the stray of the antenna area, namely the interference of new frequency signals generated in the receiving and demodulating process to other systems, is caused. By arranging the first pressure-sensitive layer, the pressure-sensitive foam is in an insulating state when no static electricity exists, and the antenna performance of the electronic equipment is better ensured.

In one possible implementation, the preset voltage difference is greater than or equal to 50V and less than or equal to 100V. When static electricity on the structural member is accumulated to 50V, the first pressure-sensitive layer is in a conductive state. At this point, static electricity on the structural member is transferred to the reference ground through the pressure sensitive foam. When the static electricity on the structural member is smaller than 50V, the first pressure-sensitive layer is in an insulating state, and the antenna performance of the electronic equipment is better ensured.

In one possible implementation, the thickness of the first pressure-sensitive layer is greater than or equal to 50 microns and less than or equal to 300 microns in the direction of lamination of the first conductive foam layer and the first pressure-sensitive layer. When the thickness of the first pressure-sensitive layer is in the range, the performance of the pressure-sensitive foam and the miniaturization of the electronic equipment can be considered, and the comprehensive performance of the electronic equipment can be better ensured.

In one possible implementation, the multi-layer stack structure further includes a first glue layer disposed between the first conductive foam layer and the first pressure sensitive layer, the first conductive foam layer and the first pressure sensitive layer being bonded by the first glue layer. The first conductive foam layer and the first pressure-sensitive layer are connected into a whole through the first adhesive layer, so that current transmission is facilitated, and miniaturization development of electronic equipment is further promoted.

In one possible implementation, the multi-layer stacked structure further includes a second conductive foam layer, the second conductive foam layer is located on a side of the first pressure-sensitive layer facing away from the first conductive foam layer, and the second conductive foam layer is disposed in layer-on-layer relationship with the first pressure-sensitive layer. In the manufacturing and assembly processes of electronic equipment, certain manufacturing tolerances and assembly tolerances exist between adjacent parts. Through setting up the cotton layer of first electrically conductive bubble and the cotton layer of second electrically conductive bubble and filling the clearance between structure and the reference ground, the cotton layer of first electrically conductive bubble and the cotton layer of second electrically conductive bubble are better laminating between structure and the reference ground under self elasticity effect. Static electricity can be completely transmitted to the reference ground through the first conductive foam layer and the second conductive foam layer, and static electricity release of electronic equipment is facilitated.

In one possible implementation, the multi-layer stack structure further includes a second glue layer disposed between the second conductive foam layer and the first pressure sensitive layer, the second conductive foam layer being bonded to the first pressure sensitive layer by the second glue layer. The second conductive foam layer and the first pressure-sensitive layer are connected into a whole through the second adhesive layer, so that current transmission is facilitated, and miniaturization development of electronic equipment is further promoted.

In one possible implementation, the first glue layer is a conductive glue. In the electrostatic transmission process, the static electricity can be transmitted along the shortest path on the pressure-sensitive foam, namely, the shortest distance along the pressure-sensitive foam in the vertical direction to the reference ground. The time for releasing static electricity is shortened, and the time for influencing the performance of the surrounding antenna area during static electricity release is shortened.

In one possible implementation, the first glue layer is a non-conductive glue and the second glue layer comprises a plurality of glue layer units. The plurality of glue layer units are arranged at intervals on the surface of the first pressure-sensitive layer, which is away from the first conductive foam layer, gaps are reserved between the adjacent glue layer units, and the second conductive foam layer is in contact with the first pressure-sensitive layer in the gap area and is electrically connected with the first pressure-sensitive layer. The second adhesive layer is arranged to be non-conductive adhesive, so that the conductive area of the pressure-sensitive foam is reduced, the use of conductive adhesive is avoided, the influence of the pressure-sensitive foam on the antenna area during conduction is further reduced, the antenna performance of the electronic equipment is further ensured, and the occurrence of stray phenomenon is reduced.

In one possible implementation, the multi-layer stack structure further includes a second pressure-sensitive layer, the second pressure-sensitive layer being located on a side of the first conductive foam layer facing away from the first pressure-sensitive layer, the second pressure-sensitive layer being disposed in layer-on-layer relationship with the first conductive foam layer. When the voltage difference at two sides of the first pressure-sensitive layer meets the electric conduction state, static electricity passes through the first pressure-sensitive layer and the first conductive foam layer. After the static electricity is transmitted to the first conductive foam layer, when the voltage difference at two sides of the second pressure-sensitive layer meets the electric conduction state, the static electricity is continuously transmitted through the second pressure-sensitive layer. The second pressure-sensitive layer provides a double switch for conducting static electricity, and the pressure-sensitive foam is in an electric conduction state only when the static electricity meets the voltage for conducting the first pressure-sensitive layer and the second pressure-sensitive layer at the same time. Further, the influence of the pressure-sensitive foam on the antenna area of the electronic equipment is avoided, and the stray phenomenon is reduced.

In one possible implementation, the multi-layer stack structure further includes a third adhesive layer disposed between the first conductive foam layer and the second pressure sensitive layer, the first conductive foam layer and the second pressure sensitive layer being bonded by the third adhesive layer. The first conductive foam layer and the second pressure-sensitive layer are connected into a whole through the third adhesive layer, so that current transmission is facilitated, and miniaturization development of electronic equipment is further promoted.

In one possible implementation, the multi-layer stack structure includes opposing first and second surfaces. The pressure-sensitive foam comprises a fourth adhesive layer, and the fourth adhesive layer is arranged on the first surface of the multi-layer stacked structure. The multi-layer stacked structure can be connected to a structural member of the electronic device through a fourth adhesive layer, and the fourth adhesive layer fixes the multi-layer stacked structure in a gap between the structural member and the reference ground. The multiple stacked structure fills the gap between the structural member and the reference ground, and the static electricity on the structural member is transmitted to the reference ground, so that the normal use of the electronic equipment is ensured.

In one possible implementation, a surface of the fourth glue layer facing away from the multilayer stack structure is provided with a first protective film, the first protective film being separable from the fourth glue layer. When the pressure-sensitive foam is produced and used independently, the first protective film covers the surface of the fourth adhesive layer, so that dust is prevented from adhering to the surface of the fourth adhesive layer. Further ensuring the adhesiveness of the pressure-sensitive foam.

In one possible implementation, the multi-layer stack structure includes opposing first and second surfaces. The pressure sensitive foam comprises a fifth adhesive layer, and the fifth adhesive layer is arranged on the second surface of the multi-layer stacked structure. The multi-layer stack structure may be connected to a reference ground of the electronic device by a fifth glue layer, the fifth glue layer fixing the multi-layer stack structure in a gap between the structural member and the reference ground. The multiple stacked structure fills the gap between the structural member and the reference ground, and the static electricity on the structural member is transmitted to the reference ground, so that the normal use of the electronic equipment is ensured.

In one possible implementation, the surface of the fifth adhesive layer facing away from the multilayer stack structure is provided with a second protective film, and the second protective film is separable from the fifth adhesive layer. When the pressure-sensitive foam is produced and used independently, the second protective film covers the surface of the fifth adhesive layer, so that dust is prevented from adhering to the surface of the fifth adhesive layer. Further ensuring the adhesiveness of the pressure-sensitive foam.

In a second aspect, the present application also provides a pressure sensitive foam comprising a foam body and a pressure sensitive layer. Specifically, the foam body includes opposite third and fourth surfaces, and a first side connected to the third and fourth surfaces. The pressure-sensitive layer comprises a first pressure-sensitive part, a second pressure-sensitive part and a third pressure-sensitive part which are sequentially connected, wherein the first pressure-sensitive part is arranged on the third surface, the third pressure-sensitive part is arranged on the fourth surface, and the second pressure-sensitive part is arranged on the first side surface. When the voltage difference between the side of the first pressure-sensitive part, which is away from the foam body, and the side of the third pressure-sensitive part, which is away from the foam body, is smaller than a preset voltage, the pressure-sensitive layers are insulated. When the voltage difference between the side of the first pressure-sensitive part, which is away from the foam body, and the side of the third pressure-sensitive part, which is away from the foam body, is greater than or equal to a preset voltage, the pressure-sensitive layer conducts electricity.

And when static electricity is accumulated on the structural member, the pressure-sensitive foam releases the static electricity to the outside of the electronic equipment through the reference ground in a conductive state, so that the static electricity accumulated on the structural member is prevented from damaging and interfering other structural members. When static electricity is not arranged on the structural member, the pressure-sensitive foam is in an insulating state. The influence on the antenna performance in the static-free conduction state is avoided, and when the structural member and the reference ground are in the conduction state, the stray of the antenna area, namely the interference of new frequency signals generated in the receiving and demodulating process to other systems, is caused. The pressure-sensitive layer is arranged to enable the pressure-sensitive foam to be in an insulating state when no static electricity exists, so that the antenna performance of the electronic equipment is better ensured.

In one possible implementation, the pressure sensitive layer further includes a fourth pressure sensitive portion connected between the third pressure sensitive portion and the first pressure sensitive portion. The foam body further comprises a second side surface, the second side surface is arranged opposite to the first side surface, the second side surface is connected between the third surface and the fourth surface, and the fourth pressure-sensitive part is arranged on the second side surface.

The transmission efficiency of static electricity is improved, the conductive time length of the pressure-sensitive foam is reduced, and the influence of the pressure-sensitive foam on the antenna area of the electronic equipment is further reduced.

In one possible implementation, the pressure sensitive layer further includes a fifth pressure sensitive portion connected between the third pressure sensitive portion and the first pressure sensitive portion. The foam main body further comprises a third side surface, the third side surface is located between the third surface and the fourth surface, the third side surface is located between the first side surface and the second side surface, the third side surface is connected to the third surface and the fourth surface, the third side surface is further connected to the first side surface and the second side surface, and the fifth pressure-sensitive portion is arranged on the third side surface. The current can be transmitted along the paths of the first pressure-sensitive part, the fifth pressure-sensitive part and the third pressure-sensitive part, so that the transmission efficiency of static electricity is improved, the conductive time length of the pressure-sensitive foam is reduced, and the influence of the pressure-sensitive foam on the antenna area of the electronic equipment is further reduced.

In one possible implementation, the pressure sensitive layer further includes a sixth pressure sensitive portion connected between the third pressure sensitive portion and the first pressure sensitive portion. The foam body further comprises a fourth side surface which is opposite to the third side surface and is connected to the third surface and the fourth surface, the fourth side surface is further connected to the first side surface and the second side surface, and the sixth pressure-sensitive part is arranged on the fourth side surface.

The current can be transmitted along the paths of the first pressure-sensitive part, the sixth pressure-sensitive part and the third pressure-sensitive part, so that the transmission efficiency of static electricity is improved, the conductive time length of the pressure-sensitive foam is reduced, and the influence of the pressure-sensitive foam on the antenna area of the electronic equipment is further reduced.

In one possible implementation, the pressure sensitive foam further comprises a glue layer disposed between the pressure sensitive layer and the foam body, the pressure sensitive layer and the foam body being bonded by the glue layer. The foam main body and the pressure sensitive layer are connected into a whole through the adhesive layer, which is favorable for current transmission and further promotes the miniaturization development of electronic equipment.

In one possible implementation, the foam body is a non-conductive structure. When the pressure-sensitive foam is in a conductive state, static electricity is transferred only through the pressure-sensitive layer, so that the influence of the pressure-sensitive foam on the antenna performance in a static electricity-free conductive state is further avoided, and the pressure-sensitive foam is in an insulating state when no static electricity exists through the pressure-sensitive layer, so that the antenna performance of the electronic equipment is better ensured.

In one possible implementation, the glue layer is a non-conductive glue. The non-conductive adhesive is used to further avoid the influence of the pressure-sensitive foam on the antenna performance in the static-free conduction state, so that the antenna performance of the electronic equipment is better ensured.

In a third aspect, the application further provides an electronic device, including a structural member, a reference ground, and a pressure-sensitive foam, where the reference ground is spaced from the structural member. The structural member can be an electronic component, a circuit board, a shell of an electronic device, and the like, and can be a conductive structure or a conductive surface on a non-conductive structure. The pressure-sensitive foam is the pressure-sensitive foam, the pressure-sensitive foam is arranged in a gap between the structural member and the reference ground, the lamination direction of the first conductive foam layer and the first pressure-sensitive layer is consistent with the arrangement direction of the structural member and the reference ground, one side surface of the pressure-sensitive foam is electrically communicated with one of the structural member and the reference ground in the lamination direction of the first conductive foam layer and the first pressure-sensitive layer, and the other side surface of the pressure-sensitive foam is electrically communicated with the other of the structural member and the reference ground.

Because the electronic device provided in the third aspect of the embodiment of the present application includes the pressure-sensitive foam according to any one of the above technical solutions, the two can solve the same technical problem and achieve the same effect.

In a fourth aspect, the application further provides an electronic device, including a structural member, a reference ground, and a pressure-sensitive foam, where the reference ground is spaced from the structural member. The structural member can be an electronic component, a circuit board, a shell of an electronic device, and the like, and can be a conductive structure or a conductive surface on a non-conductive structure. The pressure-sensitive foam is the pressure-sensitive foam, the pressure-sensitive foam is arranged in a gap between the structural member and the reference ground, the arrangement direction of the first pressure-sensitive part, the foam main body and the third pressure-sensitive part is consistent with that of the structural member and the reference ground, one of the first pressure-sensitive part and the third pressure-sensitive part is electrically conducted with the structural member, and the other of the first pressure-sensitive part and the third pressure-sensitive part is electrically conducted with the reference ground.

Because the electronic device provided by the embodiment of the fourth aspect of the application comprises the pressure-sensitive foam according to any one of the above technical schemes, the electronic device and the pressure-sensitive foam can solve the same technical problems and achieve the same effects.

Drawings

Fig. 1 is a perspective view of an electronic device provided in some embodiments of the present application;

FIG. 2 is an exploded view of the electronic device shown in FIG. 1;

FIG. 3 is a schematic view of the structure of FIG. 1 taken along line A-A;

fig. 4 is a schematic structural diagram of an assembly of pressure sensitive foam in an electronic device according to some embodiments of the present disclosure;

FIG. 5 is a schematic view of a structure of a pressure sensitive foam provided in some embodiments of the present application;

FIG. 6 is a graph of voltage versus current for a first pressure sensitive layer provided in some embodiments of the present application;

FIG. 7 is a schematic view of a pressure sensitive foam provided in some embodiments of the present application;

FIG. 8 is a schematic structural view of a pressure sensitive foam provided in some embodiments of the present application;

FIG. 9 is a schematic structural view of a pressure sensitive foam provided in some embodiments of the present application;

FIG. 10 is a schematic structural view of a pressure sensitive foam provided in some embodiments of the present application;

FIG. 11 is a schematic structural diagram of an arrangement of glue line units on a first pressure sensitive layer according to some embodiments of the present disclosure;

FIG. 12 is a schematic diagram of another exemplary arrangement of adhesive layer units on a first pressure sensitive layer according to some embodiments of the present disclosure;

FIG. 13 is a schematic view of a structure of a pressure sensitive foam provided in some embodiments of the present application;

FIG. 14 is a schematic view of a pressure sensitive foam provided in some embodiments of the present application;

FIG. 15 is a schematic view of a pressure sensitive foam provided in some embodiments of the present application;

FIG. 16 is a schematic view of a pressure sensitive foam provided in some embodiments of the present application;

FIG. 17 is a schematic view of a foam body according to some embodiments of the present disclosure;

FIG. 18 is a schematic view of a pressure sensitive foam provided in some embodiments of the present application;

fig. 19 is a schematic structural view of a pressure-sensitive foam according to some embodiments of the present application.

Detailed Description

In some embodiments, the terms "first," "second," "third," and "fourth" are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first", "a second", "a third", and "a fourth" may explicitly or implicitly include one or more such feature.

In some embodiments, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising one … …" does not exclude the presence of other like elements in a process, method, article, or apparatus that comprises the element.

It is to be understood that the above orientation or positional relationship as indicated by the terms "inner", "outer", etc. are based on the orientation or positional relationship shown in the drawings, are merely for convenience of description and to simplify the description, and are not indicative or implying that the apparatus or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore should not be construed as limiting the present utility model; the orientation word "inner and outer" refers to inner and outer relative to the contour of the respective component itself.

The present application provides an electronic device, which may be a User Equipment (UE) or a terminal device (terminal), or the like. For example, the electronic device may be a large screen display terminal, a personal digital assistant (personal digital assistant, PDA), a handheld device with wireless communication capability, a computing device, an in-vehicle device, a wearable device, a Virtual Reality (VR) terminal device, an augmented reality (augmented reality, AR) terminal device, a display terminal in industrial control (industrial control), a display terminal in unmanned (self driving), a display terminal in telemedicine (remote media), a display terminal in smart grid (smart grid), a display terminal in transportation security (transportation safety), a display terminal in smart city (smart city), a display terminal in smart home (smart home). The large-screen display terminal comprises, but is not limited to, a smart screen, a tablet personal computer (portable android device, PAD), a notebook computer, a desktop computer, a television, a projector and other devices.

Referring to fig. 1, fig. 1 is a perspective view of an electronic device 100 according to some embodiments of the present application. The present embodiment and the following embodiments are exemplary illustrations using the electronic device 100 as a mobile phone. The electronic device 100 is approximately rectangular plate-like. On this basis, in order to facilitate the description of the embodiments below, an XYZ coordinate system is established, the width direction of the electronic apparatus 100 is defined as the Y-axis direction, the length direction of the electronic apparatus 100 is defined as the Z-axis direction, and the thickness direction of the electronic apparatus 100 is defined as the X-axis direction. It is to be understood that the coordinate system of the electronic device 100 may be flexibly set according to actual needs, which is not specifically limited herein. In other embodiments, the shape of the electronic device 100 may be a square flat plate, a round flat plate, an oval flat plate, or the like, which is not particularly limited herein.

Referring to fig. 1 and fig. 2 together, fig. 2 is an exploded view of the electronic device 100 shown in fig. 1. In the present embodiment, the electronic device 100 includes the display screen 1 and the back case 20.

It is to be understood that fig. 1 and 2 only schematically illustrate some components included in the electronic device 100, and the actual shape, actual size, actual position, and actual configuration of these components are not limited by fig. 1 and 2.

With continued reference to fig. 2, the display screen 1 includes a cover 12 and a display module 11. The cover plate 12 is laminated with the display module 11. The cover plate 12 is mainly used for protecting and preventing dust of the display module 11. The material of the cover plate 12 includes, but is not limited to, glass. The cover 12 faces the user when the user uses the electronic device 100. The cover plate 12 has the functions of impact resistance, scratch resistance, oil stain resistance, fingerprint resistance, light transmittance enhancement, and the like.

The display module 11 is used for displaying images, videos, and the like. The display module 11 may be a flexible display screen or a rigid display screen. For example, the display module 11 includes a display panel, which may be an organic light-emitting diode (OLED) display panel, an active-matrix organic light-emitting diode (AMOLED) display panel, a mini-led (mini organic light-emitting diode) display panel, a micro-led (micro organic light-emitting diode) display panel, a micro-organic light-emitting diode (micro organic light-emitting diode) display panel, a quantum dot led (quantum dot light emitting diodes, QLED) display panel, and a liquid crystal display panel (liquid crystal display, LCD).

The back shell 20 forms a housing of the electronic device 100 for protecting the internal electronic components of the electronic device 100. The back shell 20 may include a back cover 21 and a bezel 22. The back cover 21 is located at one side of the display module 11 away from the cover plate 12, and is stacked with and spaced apart from the cover plate 12 and the display module 11. The frame 22 is located between the back cover 21 and the display screen 1. The frame 22 is fixed on the back cover 21, and the frame 22 may be fixedly connected to the back cover 21 by an adhesive, or the frame 22 and the back cover 21 may be integrally formed, i.e. the frame 22 and the back cover 21 are integrally formed. The cover plate 12 is fixed to the rim 22 by gluing. The cover plate 12, the back cover 21 and the frame 22 enclose a housing cavity 23 of the electronic device 100. The accommodation chamber 23 accommodates the display module 11, the circuit board, the camera, and the flash.

In some embodiments, the back shell 20 may further include a middle plate 24, where the middle plate 24 is disposed in the accommodating cavity 23, and the middle plate 24 is located on a side of the display module 11 away from the cover plate 12. The edge of the middle plate 24 is fixed to the rim 22. In some embodiments, the edge of the middle plate 24 is fixed to the frame 22 by gluing, and the middle plate 24 and the frame 22 may be integrally formed, i.e. the middle plate 24 and the frame 22 are integrally formed. The middle plate 24 divides the accommodating cavity into a first accommodating groove 231 and a fourth accommodating groove 232, and the display module 11 is located in the first accommodating groove 231. Other electronic components, such as batteries, circuit boards, are disposed within the fourth receiving slot 232. The back cover 21 is fixed on the frame 22 by foam rubber. The entirety of the middle plate 24 and the rim 22 may also be referred to as a middle frame 25.

Fig. 3 is a schematic view of the structure of fig. 1 taken along line A-A. The electronic device 100 further comprises a pressure sensitive foam 3. A gap 4 for communicating the external space of the mobile phone with the internal circuit space of the mobile phone is arranged between the edge of the display screen 1 and the frame 22, the pressure sensitive foam is arranged in the gap 4, and the pressure sensitive foam 3 is electrically connected with a reference. Illustratively, this reference ground is the metal portion 221 of the middle frame 2. Thus, the pressure-sensitive foam 3 is used as an electrostatic protection structure, and static electricity outside the mobile phone is introduced into the reference ground through the pressure-sensitive foam 3, so that the surface of the mobile phone and the static electricity outside the mobile phone are prevented from entering the internal circuit space of the mobile phone through a gap between the edge of the display screen 1 and the frame 22 to influence the internal circuit of the mobile phone.

Referring to fig. 4, fig. 4 is a schematic structural diagram illustrating an assembly of pressure-sensitive foam 3 in an electronic device according to some embodiments of the present disclosure. In some embodiments, the electronic device comprises a structural member 5, a circuit board 8, a metal shield 7, a pressure sensitive foam 3 and a reference ground 6, where the structural member 5 refers to an electronic component. The reference ground 6 may be a metal middle frame, a metal shell, a metal back shell, etc., and is not particularly limited herein. The structural member 5 is arranged on the circuit board 8, the metal shielding cover 7 is covered outside the structural member 5 and connected to the circuit board 8, and the metal shielding cover 7 and the reference ground 6 are arranged at intervals. The pressure-sensitive foam 3 is disposed in a gap between the metal shielding cover 7 and the reference ground 6, and the metal shielding cover 7 is electrically connected with the reference ground 6 through the pressure-sensitive foam 3. Thus, the metal shielding cover 7 is used for shielding and protecting the structural member 5, the metal shielding cover 7 is of an electromagnetic shielding structure, the pressure-sensitive foam 3 is of a grounding connection structure of the metal shielding cover 7, and the metal shielding cover 7 is connected with the reference ground 6 through the pressure-sensitive foam 3, so that the structural member 5 can be prevented from being subjected to electromagnetic interference.

Referring to fig. 5, fig. 5 is a schematic structural diagram of a pressure-sensitive foam 3 according to some embodiments of the present application. The application also provides a pressure-sensitive foam 3, and the pressure-sensitive foam 3 is the pressure-sensitive foam 3 in the electronic device 100. The pressure sensitive foam 3 comprises a multi-layer stack structure comprising a first conductive foam layer 31 and a first pressure sensitive layer 32. Specifically, the first pressure-sensitive layer 32 is laminated with the first conductive foam layer 31. That is, in the X-axis direction, the front projection of the first pressure-sensitive layer 32 in the X-axis direction overlaps with the front projection of the first conductive foam layer 31 in the X-axis direction.

In some embodiments, the area of the orthographic projection of the first pressure-sensitive layer 32 in the X-axis direction is equal to the area of the orthographic projection of the first conductive foam layer 31 in the X-axis direction. In other embodiments, the front projection of the first pressure sensitive layer 32 in the X-axis direction is greater than the front projection of the first conductive foam layer 31 in the X-axis direction with overlap. The first pressure-sensitive layer 32 covers the surface of the first conductive foam layer 31.

When the voltage difference between the side of the first pressure-sensitive layer 32 facing the first conductive foam layer 31 and the side of the first pressure-sensitive layer 32 facing away from the first conductive foam layer 31 is smaller than the preset voltage, the first pressure-sensitive layer 32 is insulated. When the voltage difference between the side of the first pressure-sensitive layer 32 facing the first conductive foam layer 31 and the side of the first pressure-sensitive layer 32 facing away from the first conductive foam layer 31 is greater than or equal to a preset voltage, the first pressure-sensitive layer 32 is conductive.

Referring to fig. 6, fig. 6 is a voltage-current relationship diagram of the first pressure sensitive layer 32 according to some embodiments of the present application. The first pressure sensitive layer 32 has a pressure sensitive property, i.e. the voltage and current of the first pressure sensitive layer 32 form a specific non-linear relationship. When the voltage applied across the first pressure-sensitive layer 32 is lower than the rated voltage value V1, the resistance value of the first pressure-sensitive layer 32 approaches infinity, and almost no current flows inside, and at this time, the first pressure-sensitive layer 32 is in an insulating state. When the voltage applied across the first voltage-sensitive layer 32 is slightly higher than the rated voltage V1, the first voltage-sensitive layer 32 will break down and conduct rapidly, and change from the high-resistance state to the low-resistance state, and the working current will increase, and at this time, the first voltage-sensitive layer 32 is in the electrically conductive state. When the voltage applied across the first pressure sensitive layer 32 is lower than the rated voltage value V1, the first pressure sensitive layer 32 is restored to the high-resistance state, and at this time, the first pressure sensitive layer 32 is restored to the insulating state.

The pressure-sensitive foam 3 is arranged between the structural member 5 and the reference ground 6, and the structural member can be an electronic component, a shell of electronic equipment and a circuit board, and can be a conductive structure or a conductive surface on a non-conductive structure. When static electricity is accumulated on the structural member 5, the pressure-sensitive foam 3 releases the static electricity to the outside of the electronic device 100 through the reference ground 6 in a conductive state, and prevents the static electricity from generating electromagnetic interference to other structural members 5. When no static electricity exists on the structural member 5, the pressure-sensitive foam 3 is in an insulating state, so that the influence on the antenna performance in a static electricity-free conduction state is avoided. Maintaining the conductive state of the traditional pressure sensitive foam at any time can cause the performance of the antenna to be reduced and stray, namely, the interference of new frequency signals generated in the receiving and demodulating process to other systems. By providing the first pressure-sensitive layer 32 such that the pressure-sensitive foam 3 is in an insulating state when there is no static electricity, the antenna performance of the electronic apparatus 100 is better ensured.

In some embodiments, the electronic device 100 is a mobile phone, and the preset voltage difference is greater than or equal to 50V and less than or equal to 100V. When static electricity on the structural member 5 builds up to 50V, the first pressure sensitive layer 32 is in a conductive state. At this time, static electricity on the structural member 5 is transmitted to the reference ground 6 through the pressure-sensitive foam 3. When the static electricity on the structural member 5 is smaller than 50V, the first pressure-sensitive layer 32 is in an insulating state, so that the antenna performance of the electronic device 100 is better ensured, and the stray of an antenna area is avoided.

In some embodiments, the thickness of the first pressure-sensitive layer 32 is greater than or equal to 50 micrometers and less than or equal to 300 micrometers in the lamination direction of the first conductive foam layer 31 and the first pressure-sensitive layer 32. The state of conduction of the first pressure sensitive layer 32 at what voltage is dependent on the thickness of the first pressure sensitive layer 32 and the doping element. In this embodiment, the electronic device 100 is taken as an example of a mobile phone, and the first pressure-sensitive layer 32 can give consideration to the performance of the pressure-sensitive foam 3 and the miniaturization of the electronic device 100 in the above thickness range, so as to better ensure the comprehensive performance of the electronic device 100.

Referring to fig. 7, fig. 7 is a schematic structural diagram of a pressure-sensitive foam 3 according to some embodiments of the present disclosure. In some embodiments, the multi-layer stack 30 further includes a first adhesive layer 33, the first adhesive layer 33 is disposed between the first conductive foam layer 31 and the first pressure sensitive layer 32, and the first conductive foam layer 31 and the first pressure sensitive layer 32 are bonded by the first adhesive layer 33. The first conductive foam layer 31 and the first pressure-sensitive layer 32 are integrally connected through the first adhesive layer 33, which is beneficial to current transmission and further promotes the miniaturization development of the electronic device 100.

Referring to fig. 8, fig. 8 is a schematic structural diagram of a pressure-sensitive foam 3 according to some embodiments of the present disclosure. In some embodiments, the multi-layer stack 30 further includes a second conductive foam layer 34, the second conductive foam layer 34 is located on a side of the first pressure sensitive layer 32 facing away from the first conductive foam layer 31, and the second conductive foam layer 34 is disposed in a stack with the first pressure sensitive layer 32. In the X-axis direction, the orthographic projection of the first pressure-sensitive layer 32 in the X-axis direction overlaps the orthographic projection of the second conductive foam layer 34 in the X-axis direction. In some embodiments, the area of the orthographic projection of the first pressure sensitive layer 32 in the X-axis direction is equal to the area of the orthographic projection of the second conductive foam layer 34 in the X-axis direction. In other embodiments, the front projection of the first pressure sensitive layer 32 in the X-axis direction is greater than the front projection of the second conductive foam layer 34 in the X-axis direction with overlap. Thus, the first pressure sensitive layer 32 covers the surface of the second conductive foam layer 34.

In this embodiment, the number of conductive foam layers is two, but this is not a specific limitation on the conductive foam layers. In other embodiments, the number of conductive foam layers may be three, four, or five, with a corresponding number of conductive foam layers being selected depending on the particular application of the conductive foam layers to the electronic device 100. For example, when the spacing between the structural member 5 and the reference ground 6 in the electronic device 100 is too large, a plurality of conductive foam layers may be optionally provided.

During the manufacturing and assembly process of electronic device 100, certain manufacturing and assembly tolerances exist between adjacent components. By arranging the first conductive foam layer 31 and the second conductive foam layer 34 to fill the gap 4 between the structural member 5 and the reference ground 6, the first conductive foam layer 31 and the second conductive foam layer 34 are better attached to the structural member 5 and the reference ground 6 under the self-elasticity effect. Static electricity can be completely transmitted to the reference ground 6 through the first conductive foam layer 31 and the second conductive foam layer 34, which is beneficial to static electricity discharge of the electronic device 100.

Referring to fig. 9, fig. 9 is a schematic structural diagram of a pressure-sensitive foam 3 according to some embodiments of the present disclosure. In some embodiments, the multi-layer stack 30 further includes a second glue layer 35, the second glue layer 35 being disposed between the second conductive foam layer 34 and the first pressure sensitive layer 32, the second conductive foam layer 34 being bonded to the first pressure sensitive layer 32 by the second glue layer 35. The second conductive foam layer 34 and the first pressure-sensitive layer 32 are integrally connected through the second adhesive layer 35, which is beneficial to current transmission and further promotes the miniaturization development of the electronic device 100.

In some embodiments, the first glue layer 33 may be a conductive glue. During the electrostatic transfer, the static electricity may be transferred along the shortest path on the pressure-sensitive foam 3, i.e., along the shortest distance of the pressure-sensitive foam 3 in the vertical direction (i.e., the X-axis direction) to the reference ground 6. The time for releasing static electricity is shortened, and the time for influencing the performance of the surrounding antenna area during static electricity release is shortened.

In some embodiments, the first and second glue layers 33, 35 may be non-conductive glue, and the first and second glue layers 33, 35 may include a plurality of glue layer units.

Referring to fig. 10, fig. 10 is a schematic structural diagram of a pressure-sensitive foam 3 according to some embodiments of the present disclosure. The second adhesive layer 35 is provided with a plurality of adhesive layer units as an example. The second glue layer 35 may include a plurality of glue layer units 351. The plurality of glue layer units 351 are arranged at intervals on the surface of the first pressure-sensitive layer 32, which faces away from the first conductive foam layer 31, gaps 321 are formed between the adjacent glue layer units 351, and the second conductive foam layer 34 is in contact with the first pressure-sensitive layer 32 in the regions of the gaps 321 and is electrically conducted. Referring to fig. 11, fig. 11 is a schematic structural diagram illustrating an arrangement of the glue layer units 351 on the first pressure sensitive layer 32 according to some embodiments of the present application. Specifically, the glue layer unit 351 may be configured as a square, a round or a special shape, which is not limited herein, and the embodiment is described by taking the square of the glue layer unit 351 as an example. The adhesive layer unit 351 may be disposed on the surface of the first pressure-sensitive layer 32 along a square array, or may be disposed on the surface of the first pressure-sensitive layer 32 along an annular array.

Referring to fig. 12, fig. 12 is a schematic diagram illustrating another structure of the arrangement of the glue layer units 351 on the first pressure sensitive layer 32 according to some embodiments of the present application. The adhesive layer unit 351 may also be provided in an elongated shape, and the elongated adhesive layer unit 351 is provided along an edge of the first pressure sensitive layer 32. The first pressure-sensitive layer 32 inside the adhesive layer unit 351 is a gap 4 region, and the second conductive foam layer 34 is electrically connected with the first pressure-sensitive layer 32 through the gap 4 region.

Setting the second adhesive layer 35 as a non-conductive adhesive reduces the conductive area of the pressure-sensitive foam 3, further reduces the influence of the pressure-sensitive foam 3 on the antenna area when conducting electricity, further ensures the antenna performance of the electronic device 100, and reduces the occurrence of spurious phenomena.

Referring to fig. 13, fig. 13 is a schematic structural diagram of a pressure-sensitive foam 3 according to some embodiments of the present disclosure. In some embodiments, the multi-layer stack 30 further includes a second pressure sensitive layer 36, the second pressure sensitive layer 36 being located on a side of the first conductive foam layer 31 facing away from the first pressure sensitive layer 32, the second pressure sensitive layer 36 being disposed in a stack with the first conductive foam layer 31. The orthographic projection of the second pressure-sensitive layer 36 in the X-axis direction overlaps the orthographic projection of the first conductive foam layer 31 in the X-axis direction. In some embodiments, the area of the orthographic projection of the second pressure-sensitive layer 36 in the X-axis direction is equal to the area of the orthographic projection of the first conductive foam layer 31 in the X-axis direction. In other embodiments, the orthographic projection of the second pressure sensitive layer 36 in the X-axis direction is greater than the orthographic projection of the first conductive foam layer 31 in the X-axis direction with overlap. Thus, the second pressure-sensitive layer 36 covers the surface of the first conductive foam layer 31.

The present embodiment is described taking an example in which the number of pressure-sensitive layers is two, but this is not a specific limitation on the pressure-sensitive layers. In other embodiments, the number of pressure sensitive layers may be three, four, or five, with a corresponding number of pressure sensitive layers being selected depending on the particular application of the pressure sensitive layers to the electronic device 100.

When the voltage difference between the two sides of the first pressure-sensitive layer 32 satisfies the electric conduction state, static electricity passes through the first pressure-sensitive layer 32 and the first conductive foam layer 31. After the static electricity is transferred to the first conductive foam layer 31, when the voltage difference at two sides of the second pressure sensitive layer 36 meets the electric conduction state, the static electricity continues to be transferred through the second pressure sensitive layer 36. The second pressure-sensitive layer 36 provides a double switch for the conduction of static electricity, which is the electrically conductive state of the pressure-sensitive foam 3 only when the voltage for conducting the first pressure-sensitive layer 32 and the second pressure-sensitive layer 36 is simultaneously satisfied. Further, the influence of the pressure-sensitive foam 3 on the antenna area of the electronic device 100 is avoided, and the stray phenomenon is reduced.

Referring to fig. 14, fig. 14 is a schematic structural diagram of a pressure-sensitive foam 3 according to some embodiments of the present disclosure. In some embodiments, the multi-layer stack 30 further includes a third adhesive layer 37, the third adhesive layer 37 being disposed between the first conductive foam layer 31 and the second pressure sensitive layer 36, the first conductive foam layer 31 and the second pressure sensitive layer 36 being bonded by the third adhesive layer 37. The first conductive foam layer 31 and the second pressure-sensitive layer 36 are integrally connected through the third adhesive layer 37, which is beneficial to current transmission and further promotes the miniaturization development of the electronic device 100.

Referring to fig. 15, fig. 15 is a schematic structural diagram of a pressure-sensitive foam 3 according to some embodiments of the present disclosure. In some embodiments, the multi-layer stack 30 includes opposing first and second surfaces 301, 302. The pressure sensitive foam 3 comprises a fourth glue layer 38, the fourth glue layer 38 being arranged on the first surface 301 of the multi-layer stack 30. The multi-layer stack 30 may be connected to the structural member 5 of the electronic device 100 by a fourth glue layer 38, the fourth glue layer 38 fixing the multi-layer stack 30 to the gap 4 between the structural member 5 and the reference ground 6. The multiple stacked structure fills the gap 4 between the structural member 5 and the reference ground 6, and transfers the static electricity on the structural member 5 to the reference ground 6, so as to ensure the normal use of the electronic device 100.

With continued reference to fig. 15, in some embodiments, a surface of the fourth adhesive layer 38 facing away from the multi-layer stack structure 30 is provided with a first protective film, and the first protective film and the fourth adhesive layer 38 are separable. When the pressure-sensitive foam 3 is produced and used alone, the first protective film covers the surface of the fourth adhesive layer 38, preventing dust from adhering to the surface of the fourth adhesive layer 38. Further ensuring the adhesion of the pressure sensitive foam 3.

With continued reference to fig. 15, in some embodiments, the multi-layer stack 30 includes opposing first and second surfaces 301, 302. The pressure sensitive foam 3 comprises a fifth glue layer arranged on the second surface 302 of the multi-layer stack 30. The multi-layer stack 30 may be connected to the reference ground 6 of the electronic device 100 by a fifth glue layer, which secures the multi-layer stack 30 to the gap 4 between the structural member 5 and the reference ground 6. The multiple stacked structure fills the gap 4 between the structural member 5 and the reference ground 6, and transfers the static electricity on the structural member 5 to the reference ground 6, so as to ensure the normal use of the electronic device 100.

With continued reference to fig. 15, in some embodiments, a surface of the fifth adhesive layer facing away from the multi-layer stack structure 30 is provided with a second protective film, and the second protective film and the fifth adhesive layer are separable. When the pressure-sensitive foam 3 is produced and used independently, the second protective film covers the surface of the fifth adhesive layer, and dust is prevented from adhering to the surface of the fifth adhesive layer. Further ensuring the adhesion of the pressure sensitive foam 3.

Referring to fig. 16, fig. 16 is a schematic structural diagram of a pressure-sensitive foam 3 according to some embodiments of the present disclosure. The present application also provides a pressure sensitive foam 3 comprising a foam body 90 and a pressure sensitive layer 91. Referring to fig. 17, fig. 17 is a schematic structural diagram of a foam main body 90 according to some embodiments of the present application. The foam body 90 includes opposed third and fourth surfaces 901, 902 and a first side 903 attached to the third and fourth surfaces 901, 902. The pressure-sensitive layer 91 includes a first pressure-sensitive portion 911, a second pressure-sensitive portion 912, and a third pressure-sensitive portion 913 connected in this order, the first pressure-sensitive portion 911 being provided on the third surface 901, the third pressure-sensitive portion 913 being provided on the fourth surface 902, the second pressure-sensitive portion 912 being provided on the first side 903.

When the voltage difference between the side of the first pressure-sensitive portion 911 facing away from the foam body 90 and the side of the third pressure-sensitive portion 913 facing away from the foam body 90 is less than a preset voltage, the pressure-sensitive layer 91 is insulated. When a voltage difference between a side of the first pressure-sensitive portion 911 facing away from the foam body 90 and a side of the third pressure-sensitive portion 913 facing away from the foam body 90 is greater than or equal to a preset voltage, the pressure-sensitive layer 91 is electrically conductive. In the conductive state, the pressure-sensitive foam 3 transmits current through the first pressure-sensitive portion 911, the second pressure-sensitive portion 912, and the third pressure-sensitive portion 913 in this order. Thus, static electricity is transferred to the reference ground 6 through the pressure sensitive layer 91.

And the pressure-sensitive foam 3 is arranged between the structural member 5 and the reference ground 6, when static electricity is accumulated on the structural member 5, the static electricity is released to the outside of the electronic equipment 100 through the reference ground 6 by the pressure-sensitive foam 3 in a conductive state, and the static electricity accumulated on the structural member 5 is prevented from generating electromagnetic interference on other structural members 5. When there is no static electricity on the structural member 5, the pressure-sensitive foam 3 is in an insulating state. The influence on the antenna performance in the static-free conduction state is avoided, and when the structural member 5 and the reference ground 6 are in a conductive state, the stray of an antenna area, namely the interference of new frequency signals generated in the receiving and demodulating process on other systems, is caused. By providing the pressure-sensitive layer 91 such that the pressure-sensitive foam 3 is in an insulating state when there is no static electricity, the antenna performance of the electronic apparatus 100 is better ensured.

Referring to fig. 18, fig. 18 is a schematic structural diagram of a pressure-sensitive foam 3 according to some embodiments of the present disclosure. In some embodiments, the pressure sensitive layer 91 further includes a fourth pressure sensitive portion 914, the fourth pressure sensitive portion 914 being connected between the third pressure sensitive portion 913 and the first pressure sensitive portion 911. With continued reference to fig. 18, the foam body 90 further includes a second side 904, the second side 904 is disposed opposite the first side 903, and the second side 904 is connected between the third surface 901 and the fourth surface 902, and the fourth pressure-sensitive portion 914 is disposed on the second side 904. When the pressure-sensitive foam 3 is in a conductive state, an electrostatic current can be transmitted along the pressure-sensitive layer 91 to the reference ground 6. Specifically, the electric current may be transmitted along the paths of the first pressure-sensitive portion 911 to the second pressure-sensitive portion 912 to the third pressure-sensitive portion 913, and may also be transmitted along the paths of the first pressure-sensitive portion 911 to the fourth pressure-sensitive portion 914 to the third pressure-sensitive portion 913. The transmission efficiency of static electricity is improved, the conduction time of the pressure-sensitive foam 3 is reduced, and the influence of the pressure-sensitive foam 3 on the antenna area of the electronic equipment 100 is further reduced.

In some embodiments, the pressure sensitive layer 91 further includes a fifth pressure sensitive portion connected between the third pressure sensitive portion 913 and the first pressure sensitive portion 911. The pressure-sensitive layer 91 may be a rectangular case or a cylindrical case, and the present application is described taking the case where the pressure-sensitive layer 91 is a rectangular case as an example, and the fifth pressure-sensitive portion is one side surface of the pressure-sensitive layer 91, which is not particularly limited to the present application. Accordingly, the shape of the foam body 90 corresponds to the shape of the pressure sensitive layer 91, and the foam body 90 is also illustrated as a rectangular case. With continued reference to fig. 18, the foam body 90 further includes a third side 905, the third side 905 is located between the third surface 901 and the fourth surface 902 and between the first side 903 and the second side 904, the third side 905 is connected to the third surface 901 and the fourth surface 902, the third side 905 is also connected to the first side 903 and the second side 904, and the fifth pressure-sensitive portion is disposed on the third side 905. The current can also be transmitted along the paths of the first pressure-sensitive part 911, the fifth pressure-sensitive part and the third pressure-sensitive part 913, so that the transmission efficiency of static electricity is improved, the conduction time of the pressure-sensitive foam 3 is reduced, and the influence of the pressure-sensitive foam 3 on the antenna area of the electronic device 100 is further reduced.

In some embodiments, the pressure sensitive layer 91 further includes a sixth pressure sensitive portion connected between the third pressure sensitive portion 913 and the first pressure sensitive portion 911. The present application describes an example in which the pressure-sensitive layer 91 is a rectangular case, and the sixth pressure-sensitive portion is one side surface of the pressure-sensitive layer 91. With continued reference to fig. 18, the foam body 90 further includes a fourth side 906, the fourth side 906 is disposed opposite to the third side 905, the fourth side 906 is connected to the third surface 901 and the fourth surface 902, the fourth side 906 is further connected to the first side 903 and the second side 904, and the sixth pressure-sensitive portion 91 is disposed on the fourth side 906. The current can also be transmitted along the paths of the first pressure-sensitive part 911, the sixth pressure-sensitive part and the third pressure-sensitive part 913, so that the transmission efficiency of static electricity is improved, the conduction time of the pressure-sensitive foam 3 is reduced, and the influence of the pressure-sensitive foam 3 on the antenna area of the electronic device 100 is further reduced.

Referring to fig. 19, fig. 19 is a schematic structural diagram of a pressure-sensitive foam 3 according to some embodiments of the present disclosure. In some embodiments, the pressure sensitive foam 3 further comprises a glue layer 92, the glue layer 92 being arranged between the pressure sensitive layer 91 and the foam body 90, the pressure sensitive layer 91 and the foam body 90 being connected by the glue layer 92. The foam body 90 and the pressure sensitive layer 91 are integrally connected by the adhesive layer 92, which is beneficial to current transmission and further promotes the miniaturization development of the electronic device 100.

In some embodiments, the foam body 90 is a non-conductive structure. When the pressure-sensitive foam 3 is in a conductive state, static electricity is transferred only through the pressure-sensitive layer 91, so that the influence of the pressure-sensitive foam 3 on the antenna performance in a static electricity-free conduction state is further avoided, and the pressure-sensitive foam 3 is in an insulating state in the static electricity-free state by arranging the pressure-sensitive layer 91, so that the antenna performance of the electronic equipment 100 is better ensured.

In some embodiments, the glue layer 92 is also provided in a non-conductive structure. Further, the influence of the pressure-sensitive foam 3 on the antenna performance in the static-free conduction state is avoided, and the antenna performance of the electronic equipment 100 is better ensured.

In the description of the present specification, a particular feature, structure, material, or characteristic may be combined in any suitable manner in one or more embodiments or examples.

Finally, it should be noted that: the above embodiments are only for illustrating the technical solution of the present application, and are not limiting thereof; although the present application has been described in detail with reference to the foregoing embodiments, it should be understood by those of ordinary skill in the art that: the technical scheme described in the foregoing embodiments can be modified or some technical features thereof can be replaced by equivalents; such modifications and substitutions do not depart from the spirit and scope of the corresponding technical solutions.

Claims (23)

1. A pressure sensitive foam comprising a multi-layer stack, the multi-layer stack comprising:

a first conductive foam layer;

the first pressure-sensitive layer is arranged on the first conductive foam layer in a laminated manner;

when the voltage difference between one side of the first pressure-sensitive layer facing the first conductive foam layer and one side of the first pressure-sensitive layer facing away from the first conductive foam layer is smaller than a preset voltage, the first pressure-sensitive layer is insulated;

when the voltage difference between one side of the first pressure-sensitive layer facing the first conductive foam layer and one side of the first pressure-sensitive layer facing away from the first conductive foam layer is greater than or equal to a preset voltage, the first pressure-sensitive layer is conductive.

2. The pressure sensitive foam of claim 1, wherein the predetermined voltage is greater than or equal to 50V and less than or equal to 100V.

3. The pressure-sensitive foam according to claim 1 or 2, wherein a thickness of the first pressure-sensitive layer is 50 micrometers or more and 300 micrometers or less in a lamination direction of the first conductive foam layer and the first pressure-sensitive layer.

4. The pressure sensitive foam of claim 1 or 2, wherein the multi-layer stack further comprises:

The first adhesive layer is arranged between the first conductive foam layer and the first pressure-sensitive layer, and the first conductive foam layer and the first pressure-sensitive layer are adhered through the first adhesive layer.

5. The pressure sensitive foam of claim 4, wherein the multi-layer stack further comprises:

the second conductive foam layer is positioned on one side of the first pressure-sensitive layer, which is away from the first conductive foam layer, and the second conductive foam layer is arranged on the first pressure-sensitive layer in a layer-by-layer manner.

6. The pressure sensitive foam of claim 5, wherein the multi-layer stack further comprises:

the second adhesive layer is arranged between the second conductive foam layer and the first pressure-sensitive layer, and the second conductive foam layer and the first pressure-sensitive layer are adhered through the second adhesive layer.

7. The pressure sensitive foam of claim 4, wherein the first adhesive layer is a conductive adhesive.

8. The pressure sensitive foam of claim 5, wherein the first adhesive layer comprises a plurality of adhesive layer units;

the plurality of glue layer units are arranged at intervals on the surface of the first pressure-sensitive layer, which is away from the first conductive foam layer, gaps are reserved between the adjacent glue layer units, and the second conductive foam layer is in contact with the first pressure-sensitive layer in a gap area and is electrically connected with the first pressure-sensitive layer.

9. The pressure sensitive foam of claim 1 or 2, wherein the multi-layer stack further comprises:

the second pressure-sensitive layer is positioned on one side of the first conductive foam layer, which is away from the first pressure-sensitive layer, and the second pressure-sensitive layer is arranged with the first conductive foam layer in a laminated way.

10. The pressure sensitive foam of claim 9, wherein the multi-layer stack further comprises:

the third adhesive layer is arranged between the first conductive foam layer and the second pressure-sensitive layer, and the first conductive foam layer and the second pressure-sensitive layer are adhered through the third adhesive layer.

11. A pressure sensitive foam according to claim 1 or 2, wherein,

the multi-layer stack structure includes opposing first and second surfaces;

the pressure sensitive foam comprises a fourth adhesive layer, and the fourth adhesive layer is arranged on the first surface of the multilayer stacking structure.

12. The foam of claim 11, wherein a surface of the fourth adhesive layer facing away from the multi-layer stack is provided with a first protective film, the first protective film being separable from the fourth adhesive layer.

13. A pressure sensitive foam according to claim 1 or 2, wherein,

The multi-layer stack structure includes opposing first and second surfaces;

the pressure sensitive foam includes a fifth glue layer disposed on the second surface of the multi-layer stacked structure.

14. The foam of claim 13, wherein a surface of the fifth adhesive layer facing away from the multi-layer stack is provided with a second protective film, the second protective film being separable from the fifth adhesive layer.

15. A pressure sensitive foam comprising:

a foam body comprising opposing third and fourth surfaces, and a first side connected to the third and fourth surfaces;

the pressure-sensitive layer comprises a first pressure-sensitive part, a second pressure-sensitive part and a third pressure-sensitive part which are sequentially connected, wherein the first pressure-sensitive part is arranged on the third surface, the third pressure-sensitive part is arranged on the fourth surface, and the second pressure-sensitive part is arranged on the first side surface;

when the voltage difference between the side of the first pressure-sensitive part, which is away from the foam main body, and the side of the third pressure-sensitive part, which is away from the foam main body, is smaller than a preset voltage, the pressure-sensitive layer is insulated;

When the voltage difference between the side of the first pressure-sensitive part, which is away from the foam body, and the side of the third pressure-sensitive part, which is away from the foam body, is greater than or equal to a preset voltage, the pressure-sensitive layer conducts electricity.

16. A pressure sensitive foam according to claim 15, wherein,

the pressure sensitive layer further includes a fourth pressure sensitive portion connected between the third pressure sensitive portion and the first pressure sensitive portion;

the foam body further comprises a second side surface which is opposite to the first side surface, the second side surface is connected between the third surface and the fourth surface, and the fourth pressure-sensitive part is arranged on the second side surface.

17. The pressure sensitive foam of claim 16, wherein,

the pressure sensitive layer further includes a fifth pressure sensitive portion connected between the third pressure sensitive portion and the first pressure sensitive portion;

the foam body further comprises a third side surface, the third side surface is located between the third surface and the fourth surface, the third side surface is located between the first side surface and the second side surface, the third side surface is connected to the third surface and the fourth surface, the third side surface is further connected to the first side surface and the second side surface, and the fifth pressure-sensitive portion is arranged on the third side surface.

18. The pressure sensitive foam of claim 17, wherein,

the pressure sensitive layer further includes a sixth pressure sensitive portion connected between the third pressure sensitive portion and the first pressure sensitive portion;

the foam body further comprises a fourth side surface which is opposite to the third side surface, the fourth side surface is connected to the third surface and the fourth surface, the fourth side surface is further connected to the first side surface and the second side surface, and the sixth pressure-sensitive part is arranged on the fourth side surface.

19. A pressure sensitive foam according to any one of claims 15-18, further comprising:

the adhesive layer is arranged between the pressure-sensitive layer and the foam main body, and the pressure-sensitive layer and the foam main body are bonded through the adhesive layer.

20. A pressure sensitive foam according to any of claims 15-18, wherein said foam body is of a non-conductive construction.

21. The pressure sensitive foam of claim 19, wherein the glue layer is a non-conductive glue.

22. An electronic device, comprising:

structural members;

the reference ground is arranged at intervals from the structural part;

A pressure-sensitive foam according to any one of claims 1 to 14, which is disposed in a gap between the structural member and the reference ground, and the lamination direction of the first conductive foam layer and the first pressure-sensitive layer is consistent with the arrangement direction of the structural member and the reference ground;

in the lamination direction of the first conductive foam layer and the first pressure-sensitive layer, one side surface of the pressure-sensitive foam is electrically communicated with one of the structural member and the reference ground, and the other side surface of the pressure-sensitive foam is electrically communicated with the other of the structural member and the reference ground.

23. An electronic device, comprising:

structural members;

the reference ground is arranged at intervals with the structural part;

a pressure-sensitive foam according to any one of claims 15 to 21, which is disposed in a gap between the structural member and the reference ground, and the arrangement direction of the first pressure-sensitive portion, the foam body, and the third pressure-sensitive portion is identical to the arrangement direction of the structural member and the reference ground;

one of the first and third pressure sensitive portions is in electrical communication with the structural member and the other of the first and third pressure sensitive portions is in electrical communication with the reference ground.

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