CN219336453U

CN219336453U - Wafer fixing device for laser etching

Info

Publication number: CN219336453U
Application number: CN202223483182.1U
Authority: CN
Inventors: 倪裕林; 徐新志; 尹旺; 尹康
Original assignee: Kunshan Yunding Automation Technology Co ltd
Current assignee: Kunshan Yunding Automation Technology Co ltd
Priority date: 2022-12-22
Filing date: 2022-12-22
Publication date: 2023-07-14
Anticipated expiration: 2032-12-22

Abstract

The utility model belongs to the field of wafer fixing, in particular to a wafer fixing device for laser etching, which comprises a base, wherein a fixing column is fixedly connected to the top of the base, an objective table is fixedly connected to the top of the fixing column, a connecting cylinder is connected to the side wall of the fixing column in a sliding manner, and a plurality of groups of shaft seats I are fixedly connected to the side wall of the connecting cylinder; through placing the wafer in objective table top central authorities, start electric telescopic handle, electric telescopic handle pulling connecting cylinder gliding makes the connecting cylinder pass through pulling arm pulling slider, make multiunit slider be close to the wafer, the rotation bolt, make spring deformation diminish, make the stripper plate on the threaded rod lift up the extrusion at the wafer dome edge, make multiunit stripper plate one end all extrude wafer dome edge, reverse rotation bolt, make bolt extrusion stripper plate and spring, make the power grow of stripper plate extrusion wafer, can make the wafer fix on the objective table, this laser etching's wafer fixing device can fix the less wafer of specification, the suitability is good.

Description

Wafer fixing device for laser etching

Technical Field

The utility model relates to the field of wafer fixing, in particular to a wafer fixing device for laser etching.

Background

The wafer is a silicon wafer used for manufacturing a silicon semiconductor integrated circuit, and is called a wafer because the wafer is circular in shape, various circuit element structures can be manufactured on the silicon wafer to form an IC product with specific electrical functions, the wafer is formed by cutting silicon, the wafer can be manufactured through laser etching, the laser etching is to focus low-power laser (generally ultraviolet laser and optical fiber laser) with high beam quality on a very small light spot, high power density is formed on the focus, materials are instantaneously evaporated, holes, grooves and grooves are formed, the very small power density is formed, and the wafer is fixed on a fixing device during laser etching, so that the wafer quality is prevented from being influenced.

The prior wafer fixing device for laser etching mainly comprises a carrier plate, a strip-shaped pressing piece, an elastic piece and a supporting rod, for example, an utility model patent with the publication number of CN216213364U discloses a wafer fixing device which comprises the carrier plate and a clamp mechanism arranged on the carrier plate; the carrier plate is provided with a round groove for accommodating the wafer, and the clamp mechanism is arranged at the outer side of the round groove; the clamp mechanism comprises a strip-shaped clamping piece, an elastic piece, a supporting rod and a limiting piece; the support plate is provided with a guide groove, the bottom end of the support rod is connected with the guide groove in a guide way, the top end of the support rod is connected with the middle part between the two ends of the strip-shaped clamping piece through the rotating shaft, and the limiting piece is matched with the support rod and the guide groove to adjust the distance between the middle part of the strip-shaped clamping piece and the support plate; the strip clamping piece one end is the pressing end, and the elastic component butt is between pressing end and support plate, and the strip clamping piece other end is buckled downwards and is formed the contact end, and the accessible is pressed the end and is realized the contact end and is fixed to the wafer, and the high-efficient quick wafer of getting is put to convenient operation to adjustable size to wafer pressure, the universality is strong.

The wafer fixing device in the prior art is used for fixing the wafer on the carrier plate through the strip-shaped pressing sheets, the wafer with smaller specification cannot be fixed, when the smaller wafer is placed in the middle of the carrier plate, the plurality of groups of strip-shaped pressing sheets cannot contact the wafer, so that the smaller wafer cannot be fixed, the applicability is poor, and therefore, the wafer fixing device for laser etching is provided for the problems.

Disclosure of Invention

In order to overcome the defects in the prior art and solve the problems in the prior art, the utility model provides a wafer fixing device for laser etching.

The technical scheme adopted for solving the technical problems is as follows: the utility model discloses a wafer fixing device for laser etching, which comprises a base, wherein a fixing column is fixedly connected to the top of the base, an objective table is fixedly connected to the top of the fixing column, a connecting cylinder is connected to the side wall of the fixing column in a sliding manner, a plurality of groups of shaft seats I are fixedly connected to the side wall of the connecting cylinder, a plurality of groups of sliding grooves are formed in the top of the objective table, the sliding grooves penetrate through the objective table, sliding blocks are fixedly connected to the bottom of the sliding blocks in a sliding manner, shaft seats II are fixedly connected to the bottom of the sliding blocks, a pulling arm is hinged between the plurality of groups of shaft seats II and the plurality of groups of shaft seats I respectively, threaded rods are fixedly connected to the tops of the sliding blocks, springs are sleeved on the side walls of the threaded rods, extrusion plates are sleeved on the side walls of the threaded rods, the tops of the springs are fixedly connected to the bottoms of the extrusion plates, bolts are connected to the side walls of the threaded rods in a threaded manner, the bolts are positioned at the tops of the extrusion plates, the side walls of the connecting cylinder are fixedly connected to the pulling plates, the tops of the base are fixedly connected to electric telescopic rods, and the output ends of the electric telescopic rods are fixedly connected to the bottoms of the pulling plates.

Preferably, the first shaft seats are symmetrically arranged circumferentially, the second sliding grooves are symmetrically arranged circumferentially, and the second sliding grooves correspond to the first shaft seats.

Preferably, one end of the extrusion plate far away from the bolt is arc-shaped, and the pulling plate is positioned below the shaft seat.

Preferably, a plurality of groups of mounting holes are formed in the top of the base, and a plurality of groups of mounting holes penetrate through the base.

Preferably, a limiting block is fixedly connected to the top of the threaded rod, and the cross-sectional area of the limiting block is larger than that of the threaded rod.

Preferably, a rubber pad is glued at the bottom of the arc-shaped part of the extrusion plate, and the rubber pad is extruded at the top of the objective table.

Preferably, one end of the pulling arm is hinged to the first shaft seat, and the other end of the pulling arm is hinged to the second shaft seat.

Preferably, the plurality of groups of mounting holes are arranged symmetrically in circumference.

The utility model has the advantages that:

according to the wafer fixing device, the wafer is placed in the center of the top of the objective table, the electric telescopic rod is started, the connecting cylinder is pulled to slide downwards by the electric telescopic rod, the connecting cylinder pulls the sliding blocks through the pulling arms, multiple groups of sliding blocks are close to the wafer, the bolts are rotated, the deformation of the springs is reduced, the extrusion plates on the threaded rods are lifted and extruded on the edge of the top of the wafer, one ends of the multiple groups of extrusion plates are extruded on the edge of the top of the wafer, the bolts are rotated reversely, the bolts extrude the extrusion plates and the springs, the force of the extrusion plates extruding the wafer is increased, and therefore the wafer can be fixed on the objective table.

Drawings

In order to more clearly illustrate the embodiments of the utility model or the technical solutions of the prior art, the drawings which are used in the description of the embodiments or the prior art will be briefly described, it being obvious that the drawings in the description below are only some embodiments of the utility model, and that other drawings can be obtained from these drawings without inventive faculty for a person skilled in the art.

FIG. 1 is a schematic top view of the present utility model;

FIG. 2 is a schematic view of the bottom structure of the present utility model;

FIG. 3 is a schematic elevational view of the present utility model;

fig. 4 is a schematic view of the structure of the extrusion plate of the present utility model.

In the figure: 1. an objective table; 2. a base; 3. fixing the column; 4. an electric telescopic rod; 5. pulling a plate; 6. a connecting cylinder; 7. axle seat I; 8. a chute; 9. a slide block; 10. axle seat II; 11. a pulling arm; 12. a threaded rod; 13. a spring; 14. a bolt; 15. a limiting block; 16. an extrusion plate; 17. a rubber pad; 18. and (5) mounting holes.

Detailed Description

The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.

Referring to fig. 1-4, a wafer fixing device for laser etching includes a base 2, a fixing column 3 is fixedly connected to the top of the base 2, an objective table 1 is fixedly connected to the top of the fixing column 3, a connecting cylinder 6 is slidably connected to the side wall of the fixing column 3, a plurality of groups of shaft seats 7 are fixedly connected to the side wall of the connecting cylinder 6, a plurality of groups of sliding grooves 8 are formed in the top of the objective table 1, a plurality of groups of sliding grooves 8 penetrate through the objective table 1, a sliding block 9 is slidably connected in each of the plurality of groups of sliding grooves 8, a shaft seat two 10 is fixedly connected to the bottom of the sliding block 9, a pulling arm 11 is hinged between each of the plurality of groups of shaft seats two 10 and the corresponding one of the plurality of groups of shaft seats 7, a threaded rod 12 is fixedly connected to the top of the sliding block 9, a spring 13 is sleeved on the side wall of the threaded rod 12, a squeeze plate 16 is sleeved on the side wall of the threaded rod 12, a bolt 14 is screwed on the side wall of the connecting cylinder 6 and is fixedly connected to the threaded rod 5, an electric telescopic rod 4 is fixedly connected to the top of the base 2, and an output end of the electric telescopic rod 4 is fixedly connected to the threaded rod 5; during operation, the wafer fixing device in the prior art fixes the wafer on the carrier plate through the strip-shaped pressing sheets, the wafer with smaller specification cannot be fixed, when the smaller wafer is placed in the middle of the carrier plate, the plurality of groups of strip-shaped pressing sheets cannot contact the wafer, the smaller wafer cannot be fixed, and the applicability is poor.

The plurality of groups of shaft seat I7 are circumferentially and symmetrically arranged, the plurality of groups of sliding grooves 8 are circumferentially and symmetrically arranged, and the plurality of groups of sliding grooves 8 correspond to the plurality of groups of shaft seat I7; when in work, the first shaft seats 7 and the sliding grooves 8 are the same in number and correspond to each other one by one.

One end of the extrusion plate 16, which is far away from the bolt 14, is arc-shaped, and the pulling plate 5 is positioned below the shaft seat I7; when the wafer pressing machine works, the arc-shaped opening of the pressing plate 16 faces upwards, the arc-shaped bottom presses the wafer, and the pulling plate 5 does not influence the rotation of the pulling arm 11 in the shaft seat I7.

A plurality of groups of mounting holes 18 are formed in the top of the base 2, and a plurality of groups of mounting holes 18 penetrate through the base 2; in operation, the base 2 is installed through the installation opening.

A limiting block 15 is fixedly connected to the top of the threaded rod 12, and the cross section area of the limiting block 15 is larger than that of the threaded rod 12; in operation, the stop 15 prevents the bolt 14, the compression plate 16 and the spring 13 from being disengaged from the threaded rod 12.

A rubber pad 17 is glued at the bottom of the arc-shaped part of the extrusion plate 16, and the rubber pad 17 is extruded at the top of the objective table 1; in operation, the rubber pad 17 prevents the squeeze plate 16 from squeezing the damaged wafer.

One end of the pulling arm 11 is hinged to the first shaft seat 7, and the other end of the pulling arm 11 is hinged to the second shaft seat 10; during operation, the two ends of the pulling arm 11 are respectively and rotatably connected to the first shaft seat 7 and the second shaft seat 10.

A plurality of groups of mounting holes 18 are arranged symmetrically in circumference; in operation, the mounting holes 18 are arranged symmetrically in circumference to make the mounting of the base 2 more firm.

According to the working principle, a wafer is fixed on a carrier plate through strip-shaped pressing sheets in the wafer fixing device in the prior art, the smaller wafer can not be fixed, when the smaller wafer is placed in the middle of the carrier plate, a plurality of groups of strip-shaped pressing sheets can not be contacted with the wafer, the smaller wafer can not be fixed, the applicability is poor, the device is characterized in that the base 2 is fixed, the wafer is placed in the center of the top of the objective table 1, the electric telescopic rod 4 is started, the electric telescopic rod 4 pulls the connecting cylinder 6 to slide downwards, the connecting cylinder 6 pulls the sliding block 9 to slide in the sliding groove 8 through the pulling arm 11, the plurality of groups of sliding blocks 9 are simultaneously close to the wafer, after the sliding block 9 moves to an ideal position, the bolt 14 is rotated upwards, the deformation of the spring 13 is reduced, the arc-shaped bottom of the pressing plate 16 on the threaded rod 12 is lifted and pressed on the edge of the wafer dome, the rubber pad 17 prevents the pressing plate 16 from being pressed and damaging the wafer, the arc-shaped end bottom of the pressing plate 16 is pressed on the edge of the dome, the reverse rotation of the bolt 14 presses the pressing plate 16 and the spring 13, the force of the wafer is increased, and the wafer pressing force of the plate 16 is enabled to be fixed on the objective table 1, and the wafer can be fixed at the same time, and the wafer is good in the applicability and can be fixed.

The foregoing has shown and described the basic principles, principal features and advantages of the utility model. It will be understood by those skilled in the art that the present utility model is not limited to the embodiments described above, and that the above embodiments and descriptions are merely illustrative of the principles of the present utility model, and various changes and modifications may be made without departing from the spirit and scope of the utility model, which is defined in the appended claims.

Claims

1. The utility model provides a laser etching's wafer fixing device, includes base (2), base (2) top rigid coupling has fixed column (3), fixed column (3) top rigid coupling has objective table (1), its characterized in that: the utility model provides a fixed column (3) lateral wall sliding connection has connecting cylinder (6), connecting cylinder (6) lateral wall rigid coupling has multiunit axle bed one (7), multiunit spout (8) have been seted up at objective table (1) top, multiunit spout (8) all run through in objective table (1), multiunit equal sliding connection has slider (9) in spout (8), slider (9) bottom rigid coupling has axle bed two (10), multiunit axle bed two (10) respectively with multiunit axle bed one (7) between articulated have pulling arm (11), slider (9) top rigid coupling has threaded rod (12), threaded rod (12) lateral wall cover is equipped with spring (13), threaded rod (12) lateral wall cover is equipped with stripper plate (16), spring (13) top rigid coupling is in stripper plate (16) bottom, threaded rod (12) lateral wall threaded connection has bolt (14), bolt (14) are located stripper plate (16) top, connecting cylinder (6) lateral wall rigid coupling has pulling plate (5), base (2) top rigid coupling has electric telescopic handle (4), electric handle (4) bottom telescopic handle (5) rigid coupling in the telescopic handle (4).

2. The wafer holding apparatus for laser etching according to claim 1, wherein: the shaft seats I (7) are arranged symmetrically in circumference, the sliding grooves (8) are arranged symmetrically in circumference, and the sliding grooves (8) correspond to the shaft seats I (7).

3. A laser etched wafer holding apparatus according to claim 2, wherein: one end of the extrusion plate (16) far away from the bolt (14) is arc-shaped, and the pulling plate (5) is positioned below the shaft seat I (7).

4. A laser etched wafer holding apparatus according to claim 3, wherein: a plurality of groups of mounting holes (18) are formed in the top of the base (2), and the plurality of groups of mounting holes (18) penetrate through the base (2).

5. The wafer holding apparatus for laser etching according to claim 4, wherein: a limiting block (15) is fixedly connected to the top of the threaded rod (12), and the cross section area of the limiting block (15) is larger than that of the threaded rod (12).

6. The laser etched wafer holding apparatus of claim 5, wherein: a rubber pad (17) is glued at the bottom of the arc-shaped part of the extrusion plate (16), and the rubber pad (17) is extruded at the top of the objective table (1).

7. The wafer holding apparatus for laser etching according to claim 6, wherein: one end of the pulling arm (11) is hinged to the first shaft seat (7), and the other end of the pulling arm (11) is hinged to the second shaft seat (10).

8. The wafer holding apparatus for laser etching according to claim 7, wherein: the plurality of groups of mounting holes (18) are arranged symmetrically in circumference.