CN217158126U - Scribing device for semiconductor processing - Google Patents

Scribing device for semiconductor processing Download PDF

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Publication number
CN217158126U
CN217158126U CN202220628306.1U CN202220628306U CN217158126U CN 217158126 U CN217158126 U CN 217158126U CN 202220628306 U CN202220628306 U CN 202220628306U CN 217158126 U CN217158126 U CN 217158126U
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base
scribing
semiconductor
fixedly mounted
semiconductor processing
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CN202220628306.1U
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Chinese (zh)
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章泽润
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Wuxi Xinkun Electronic Technology Co ltd
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Wuxi Xinkun Electronic Technology Co ltd
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    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02EREDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00Energy generation through renewable energy sources
    • Y02E10/50Photovoltaic [PV] energy

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Abstract

The utility model relates to a semiconductor processing device field discloses a scribing device for semiconductor processing, the on-line screen storage device comprises a base, base middle part slidable mounting has two sets of bilateral symmetry to distribute and the vertical gag lever post that passes the base, and the common fixed mounting in gag lever post upper end has horizontally backup pad, and back side fixed mounting has multiunit symmetry and evenly distributed's curb plate before the backup pad upper surface, and the curb plate rotates jointly and installs multiunit rotation axis along the support cylinder that fore-and-aft direction distributes and the outside surface is provided with V type groove, and the outside is two sets of the equal fixed mounting in curb plate upper surface has vertical electric telescopic handle. The utility model has the advantages that: the fixing of the semiconductor is realized, the semiconductor can be prevented from being damaged when the semiconductor is clamped, the follow-up operation is facilitated, the thickness of each scribing can be changed and determined, the scribing accuracy is guaranteed, the scribing can be continuously carried out, the secondary clamping is avoided, and the scribing efficiency is improved.

Description

Scribing device for semiconductor processing
Technical Field
The utility model relates to a semiconductor processing device field specifically is a scribing device for semiconductor processing.
Background
Semiconductors are used in the fields of integrated circuits, consumer electronics, communication systems, photovoltaic power generation, lighting, high-power conversion, etc., for example, diodes are devices fabricated using semiconductors. The importance of semiconductors is enormous, both from a technological and economic point of view. Most electronic products, such as computers, mobile phones or digital audio recorders, have a core unit closely related to a semiconductor.
Common semiconductor materials are silicon, germanium, gallium arsenide, etc., with silicon being one of the most influential of various semiconductor material applications. The application of semiconductor is very extensive, often need carry out the scribing to the semiconductor in semiconductor production and processing, separate out each chip that has independent electrical property through the scribing, but current scribing is difficult to clamp the semiconductor when using usually, and then can make the semiconductor activity when leading to follow-up scribing, thereby make the quality that reduces the scribing and lead to the material to scrap even, manufacturing cost has been increased, current semiconductor scribing device function singleness, lead to can not realizing drawing the semiconductor material of equidimension not, thereby make scribing efficiency reduce, be unfavorable for in-service use.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a scribing device for semiconductor processing to solve the problem that proposes in the above-mentioned background art.
In order to achieve the above object, the utility model provides a following technical scheme:
a scribing device for semiconductor processing comprises a base, wherein two sets of limiting rods which are symmetrically distributed in the left-right direction and vertically penetrate through the base are slidably mounted in the middle of the base, a horizontal supporting plate is fixedly mounted at the upper ends of the limiting rods together, a plurality of sets of symmetrical and uniformly distributed side plates are fixedly mounted on the front and back sides of the upper surface of the supporting plate, a plurality of sets of supporting rollers with rotating axes distributed along the front-back direction and V-shaped grooves arranged on the outer side surfaces are rotatably mounted on the side plates together, vertical electric telescopic rods are fixedly mounted on the upper surfaces of the two sets of outer side plates, and horizontally distributed top plates are fixedly mounted at the upper ends of the electric telescopic rods together, the base upper surface right side fixed mounting has the pillar of symmetric distribution around two sets of, and the common fixed mounting in pillar upper end has the mounting panel, and mounting panel upper surface left side is provided with along the gliding slider of fore-and-aft direction, and slider lower fixed surface installs the cutter.
As a further aspect of the present invention: the automatic lifting device is characterized in that a U-shaped support with an upward opening is fixedly mounted on the lower surface of the base, a first motor with an output shaft extending upwards is fixedly mounted in the middle of the upper surface of a horizontal section of the support, a vertical first lead screw is fixedly connected to the upper end of the output shaft of the first motor, a horizontal moving plate is rotatably connected to the upper end of the first lead screw and the base, and the left end and the right end of the moving plate are respectively and fixedly connected to the lower ends of the limiting rods.
As a further aspect of the present invention: the telescopic links of multiunit symmetric distribution are fixedly mounted to the outer side of the lower surface of the top plate, two sets of connecting plates symmetrically distributed around the front and back are fixedly mounted to the lower ends of the telescopic links, the upper rollers parallel to the supporting rollers are mounted to the connecting plates in a jointly rotating mode, springs distributed downwards around the telescopic links are fixedly mounted to the lower surface of the top plate, and the lower ends of the springs are fixedly connected to the connecting plates.
As a further aspect of the present invention: the utility model discloses a pneumatic power transmission device, including roof, servo motor output shaft, movable rack, horizontal segment, threaded rod, splint, the servo motor that the output shaft stretched out right is fixedly mounted in roof upper surface middle part left side, and servo motor output shaft right-hand member fixed connection has horizontal distribution's second lead screw, rotates on the second lead screw to install the U type removal frame that the opening is decurrent, removes a horizontal segment lower surface and roof upper surface sliding connection, removes vertical segment lower part threaded connection of frame and has the threaded rod that distributes along the fore-and-aft direction, and the one end that the threaded rod is close to each other all rotates and installs splint.
As a further aspect of the present invention: the gliding spout of confession slider is seted up in mounting panel lower surface left side, and slider lower surface fixed mounting has the U type link that the opening is decurrent, and mounting panel lower surface right side fixed mounting has the second motor that the output shaft stretches out left, and second motor output shaft left end fixed mounting has the disc that is located vertical plane, and disc left surface outside fixed mounting has horizontal connecting rod, and connecting rod slidable mounting is in the link.
As a further aspect of the present invention: a collecting box located right below the cutter is slidably mounted on the right side of the middle of the lower surface of the base.
Compared with the prior art, the beneficial effects of the utility model are that: through setting up supporting roller, last cylinder and spring, place the supporting roller with the semiconductor from the left side during use on, drive roof lapse through electric telescopic handle to make the upper roller contact and compression spring with the semiconductor downwards, compress tightly the semiconductor on supporting roller in the effect of spring, realized that the semiconductor is fixed and can avoid the semiconductor to receive the damage when pressing from both sides the dress, be favorable to subsequent operation.
Through setting up the removal frame, backup pad and cutter, will remove the frame and remove to the position of semiconductor left end on, thereby it removes semiconductor and removal frame fixed connection to drive the splint inboard through rotating the threaded rod, it removes to the right side to drive the semiconductor through servo motor, the semiconductor removes to the cutter below back, reciprocating motion is down in the drive of second motor to the cutter, thereby first motor drives the movable plate through first lead screw and rises and make the backup pad drive semiconductor rebound, thereby make the cutter carry out the scribing to the semiconductor, can change and confirm the thickness of scribing at every turn, the accuracy of scribing has been guaranteed, and can carry out the scribing in succession, avoid the secondary to press from both sides the dress, the efficiency of scribing has been improved.
Drawings
Fig. 1 is a schematic structural view of a dicing apparatus for semiconductor processing.
Fig. 2 is a front view of a dicing apparatus for semiconductor processing.
Fig. 3 is a left side view of a dicing apparatus for semiconductor processing.
Wherein: 1. a base; 2. a support plate; 3. a limiting rod; 4. moving the plate; 5. a support; 6. a first motor; 7. a first lead screw; 8. a side plate; 9. a support roller; 10. an electric telescopic rod; 11. a top plate; 12. a telescopic rod; 13. a spring; 14. a connecting plate; 15. an upper roller; 16. a servo motor; 17. a second lead screw; 18. a movable frame; 19. a threaded rod; 20. a splint; 21. a pillar; 22. mounting a plate; 23. a second motor; 24. a disc; 25. a connecting rod; 26. a slider; 27. a connecting frame; 28. a cutter; 29. and (4) collecting the box.
Detailed Description
It should be noted that, in the present invention, the embodiments and features of the embodiments may be combined with each other without conflict.
In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "lateral", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like, indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are used merely for convenience of description and for simplicity of description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore, should not be construed as limiting the present invention. Furthermore, the terms "first", "second", etc. are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first," "second," etc. may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless otherwise specified.
In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood by those of ordinary skill in the art through specific situations.
The present invention will be described in detail below with reference to the accompanying drawings in conjunction with embodiments.
Example one
Referring to fig. 1-3, a scribing device for semiconductor processing comprises a base 1, wherein two sets of limiting rods 3 which are bilaterally symmetrically distributed and vertically penetrate through the base 1 are slidably mounted in the middle of the base 1, a horizontal supporting plate 2 is fixedly mounted at the upper end of each limiting rod 3, a U-shaped support 5 with an upward opening is fixedly mounted on the lower surface of the base 1, a first motor 6 with an upward extending output shaft is fixedly mounted in the middle of the upper surface of the horizontal section of the support 5, a vertical first screw rod 7 is fixedly connected to the upper end of the output shaft of the first motor 6, the upper end of the first screw rod 7 is rotatably connected to the base 1, a horizontal moving plate 4 is rotatably connected to the first screw rod 7, and the left end and the right end of the moving plate 4 are respectively fixedly connected to the lower end of each limiting rod 3.
Side fixed mounting has curb plate 8 of multiunit symmetry and evenly distributed around 2 upper surfaces of backup pad, 8 common rotations of curb plate are installed multiunit axis of rotation and are provided with the supporting roll 9 in V type groove along fore-and-aft direction distribution and outside surface, the equal fixed mounting in 8 upper surfaces of two sets of curb plates in the outside has vertical electric telescopic handle 10, the common fixed mounting in 10 upper ends of electric telescopic handle has horizontal distribution's roof 11, 11 lower surface outside fixed mounting of roof has multiunit symmetric distribution's telescopic link 12, the common fixed mounting of 12 lower extremes of telescopic link has two sets of front and back symmetric distribution's connecting plate 14, connecting plate 14 rotates jointly and installs multiunit upper roll 15 that is on a parallel with supporting roll 9.
Fixed surface installs the multiunit around the spring 13 of telescopic link 12 downward distribution under roof 11, spring 13 lower extreme fixed connection is on connecting plate 14, 11 upper surface middle part left sides fixed mounting of roof has the output shaft to stretch out right servo motor 16, servo motor 16 output shaft right-hand member fixed connection has horizontal distribution's second lead screw 17, it installs the U type removal frame 18 that the opening is decurrent to rotate on the second lead screw 17, remove 18 horizontal segment lower surfaces of removal frame and 11 upper surface sliding connection of roof, remove 18 vertical section lower part threaded connection of removal frame and follow the threaded rod 19 of fore-and-aft direction distribution, the one end that threaded rod 19 is close to each other all rotates and installs splint 20.
The right side of the upper surface of the base 1 is fixedly provided with two groups of pillars 21 which are symmetrically distributed front and back, the upper ends of the pillars 21 are fixedly provided with a mounting plate 22 together, the left side of the upper surface of the mounting plate 22 is provided with a sliding block 26 which slides along the front and back direction, and the lower surface of the sliding block 26 is fixedly provided with a cutter 28.
Example two
On the basis of the first embodiment, a sliding groove for sliding a sliding block 26 is formed in the left side of the lower surface of the mounting plate 22, a U-shaped connecting frame 27 with a downward opening is fixedly mounted on the lower surface of the sliding block 26, a second motor 23 with an output shaft extending leftwards is fixedly mounted on the right side of the lower surface of the mounting plate 22, a disc 24 positioned in a vertical plane is fixedly mounted at the left end of the output shaft of the second motor 23, a transverse connecting rod 25 is fixedly mounted on the outer side of the left side surface of the disc 24, and the connecting rod 25 is slidably mounted in the connecting frame 27; a collecting box 29 positioned right below the cutter 28 is slidably arranged on the right side of the middle part of the lower surface of the base 1.
The utility model discloses a theory of operation is: when the semiconductor scribing tool is used, a semiconductor is placed on the supporting roller 9 from the left side, the top plate 11 is driven by the electric telescopic rod 10 to move downwards, the upper roller 15 is enabled to be in contact with the semiconductor downwards and compress the spring 13, the semiconductor is tightly pressed on the supporting roller 9 under the action of the spring 13, the moving frame 18 is moved to the position of the left end of the semiconductor, the clamping plate 20 is driven to move inwards by rotating the threaded rod 19 so as to fixedly connect the semiconductor with the moving frame 18, then the moving frame 18 is driven to move towards the right side by the servo motor 16 so as to enable the semiconductor to move towards the right side, the moving distance of the semiconductor at each time is controlled by the servo motor 16 so as to determine the thickness of the scribing at each time, the scribing accuracy is ensured, after the semiconductor moves to the lower part of the tool 28, the first motor 6 and the second motor 23 are started, the second motor 23 drives the sliding block 26 to reciprocate through the connecting rod 25 and the connecting frame 27 so as to enable the tool 28 to reciprocate, the first motor 6 drives the moving plate 4 to ascend through the first screw rod 7 so that the supporting plate 2 drives the semiconductor to move upwards, the cutter 28 conducts scribing on the semiconductor, after scribing is completed, the first motor 6 rotates reversely so that the supporting plate 2 returns to the original position, and scribing can be completed by repeating the steps.
Although the preferred embodiments of the present invention have been described in detail, the present invention is not limited to the above embodiments, and various changes can be made without departing from the spirit of the present invention within the knowledge of those skilled in the art.

Claims (6)

1. The scribing device for semiconductor processing comprises a base (1) and is characterized in that two groups of limiting rods (3) which are symmetrically distributed in the left-right direction and vertically penetrate through the base (1) are slidably mounted in the middle of the base (1), a horizontal supporting plate (2) is fixedly mounted at the upper end of each limiting rod (3) together, a plurality of groups of symmetrical and uniformly distributed side plates (8) are fixedly mounted on the front and rear sides of the upper surface of each supporting plate (2), a plurality of groups of supporting rollers (9) with rotating axes distributed in the front-rear direction and V-shaped grooves formed in the outer surface are rotatably mounted on the side plates (8) together, vertical electric telescopic rods (10) are fixedly mounted on the upper surfaces of the side plates (8) respectively, a horizontally distributed top plate (11) is fixedly mounted at the upper end of each electric telescopic rod (10) together, two groups of supporting columns (21) symmetrically distributed in the front-rear direction are fixedly mounted on the right side of the upper surface of the base (1), the upper ends of the pillars (21) are fixedly provided with a mounting plate (22) together, the left side of the upper surface of the mounting plate (22) is provided with a sliding block (26) which slides along the front-back direction, and the lower surface of the sliding block (26) is fixedly provided with a cutter (28).
2. The scribing device for semiconductor processing according to claim 1, wherein a U-shaped bracket (5) with an upward opening is fixedly installed on the lower surface of the base (1), a first motor (6) with an upward extending output shaft is fixedly installed in the middle of the upper surface of the horizontal section of the bracket (5), a vertical first lead screw (7) is fixedly connected to the upper end of the output shaft of the first motor (6), the upper end of the first lead screw (7) is rotatably connected to the base (1), a horizontal moving plate (4) is rotatably connected to the first lead screw (7), and the left end and the right end of the moving plate (4) are respectively fixedly connected to the lower end of the limiting rod (3).
3. The scribing device for semiconductor processing according to claim 1, wherein a plurality of groups of symmetrically distributed telescopic rods (12) are fixedly installed on the outer side of the lower surface of the top plate (11), two groups of front and back symmetrically distributed connecting plates (14) are fixedly installed at the lower ends of the telescopic rods (12) together, a plurality of groups of upper rollers (15) parallel to the supporting rollers (9) are rotatably installed on the connecting plates (14) together, a plurality of groups of springs (13) distributed downwards around the telescopic rods (12) are fixedly installed on the lower surface of the top plate (11), and the lower ends of the springs (13) are fixedly connected to the connecting plates (14).
4. The dicing device for semiconductor processing according to claim 1 or 3, wherein a servo motor (16) with an output shaft extending rightward is fixedly mounted on the left side of the middle of the upper surface of the top plate (11), a second lead screw (17) with a horizontal distribution is fixedly connected to the right end of the output shaft of the servo motor (16), a U-shaped moving frame (18) with a downward opening is rotatably mounted on the second lead screw (17), the lower surface of the horizontal section of the moving frame (18) is slidably connected with the upper surface of the top plate (11), threaded rods (19) distributed in the front-back direction are in threaded connection with the lower portion of the vertical section of the moving frame (18), and clamping plates (20) are rotatably mounted at one ends of the threaded rods (19) close to each other.
5. The scribing device for semiconductor processing according to claim 1, wherein a sliding groove for sliding the sliding block (26) is formed in the left side of the lower surface of the mounting plate (22), a U-shaped connecting frame (27) with a downward opening is fixedly mounted on the lower surface of the sliding block (26), a second motor (23) with an output shaft extending leftward is fixedly mounted on the right side of the lower surface of the mounting plate (22), a disc (24) positioned in a vertical plane is fixedly mounted at the left end of the output shaft of the second motor (23), a transverse connecting rod (25) is fixedly mounted on the outer side of the left side surface of the disc (24), and the connecting rod (25) is slidably mounted in the connecting frame (27).
6. The scribing device for semiconductor processing according to claim 1, wherein a collection box (29) located right below the cutter (28) is slidably mounted on the right side of the middle of the lower surface of the base (1).
CN202220628306.1U 2022-03-22 2022-03-22 Scribing device for semiconductor processing Active CN217158126U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202220628306.1U CN217158126U (en) 2022-03-22 2022-03-22 Scribing device for semiconductor processing

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202220628306.1U CN217158126U (en) 2022-03-22 2022-03-22 Scribing device for semiconductor processing

Publications (1)

Publication Number Publication Date
CN217158126U true CN217158126U (en) 2022-08-09

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CN (1) CN217158126U (en)

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