CN219328890U

CN219328890U - ESD module detection device

Info

Publication number: CN219328890U
Application number: CN202320134374.7U
Authority: CN
Inventors: 刘思; 骆乾峰; 赵龙; 金从龙
Original assignee: Jiangxi Zhao Chi Semiconductor Co Ltd
Current assignee: Jiangxi Zhao Chi Semiconductor Co Ltd
Priority date: 2023-01-17
Filing date: 2023-01-17
Publication date: 2023-07-11
Anticipated expiration: 2033-01-17

Abstract

The utility model provides an ESD module detection device, which is used for calibrating the electrostatic performance of an ESD module and comprises a PCB and an oscilloscope electrically connected with the PCB, wherein the PCB is provided with a first communication area and a second communication area, n/2 communication wires are arranged in the first communication area and the second communication area, n is an even number, one end of the n/2 communication wires in the first communication area is communicated with a first bus wire, the other ends of the n/2 communication wires in the first communication area are respectively electrically communicated with anodes of n/2 ESD modules, two ends of the n/2 communication wires in the second communication area are respectively electrically communicated with a second bus wire and cathodes of the n/2 ESD modules, the oscilloscope is electrically connected with a current probe, two ends of the test wire are respectively electrically connected with the first bus wire and the second bus wire. The ESD module detection device provided by the utility model can calibrate a plurality of ESD modules at the same time through one-time positioning, and the calibration efficiency of the modules is improved.

Description

ESD module detection device

Technical Field

The utility model relates to the field of module calibration, in particular to an ESD module detection device.

Background

The LED chip is a solid semiconductor device, is a core component of the LED lamp, and has the main function of converting electric energy into light energy. The LED semiconductor wafer mainly comprises a P-type semiconductor and an N-type semiconductor, when current is acted on the wafer through a wire, electrons are pushed from an N region to a P region, and electrons and holes are combined in the P region and then energy is emitted in the form of photons.

The LED chips have static electricity with different degrees in the environment, and as the area of each LED chip element is very small, the parasitic capacitance of each element is very small, and the voltage at two ends of the capacitance meets the following formula: u=q/C. According to the formula, when the capacitance is small, a small amount of static charge can generate high static voltage; in addition, the power flux resistance of each element is typically small, and thus, the electrostatic discharge on the LED chip can easily damage the chip. When the LED chip leaves the factory, an electrostatic discharge (ESD) module arranged in the LED chip tester is required to detect the antistatic capability of the LED chip, so that the accuracy of the antistatic detection of the LED chip is ensured. Before the antistatic detection, the ESD module needs to be calibrated.

Currently, the detection of an ESD module is mainly that a power supply probe of an oscilloscope is connected with two clamping hooks, the two clamping hooks are respectively connected with a positive electrode probe and a negative electrode probe of the ESD module for hooking, the oscilloscope captures electrostatic waveforms of the ESD module, and whether the ESD module meets requirements is judged by analyzing electrostatic waveform parameters of the ESD module. At present in the calibration process of ESD module, calibration has been accomplished a module at every turn, all needs to be manual take off clamp hook from last module then hook next module, and LED chip tester internal operation space is little, and the process of hooking the probe consumes a large amount of manpower and materials, and calibration efficiency is lower.

Disclosure of Invention

Based on this, the present utility model aims to provide an ESD module detection device, so as to solve the problems of low calibration efficiency and low accuracy of the ESD module in the prior art.

The utility model provides an ESD module detection device, which is used for calibrating the electrostatic performance of an ESD module and comprises a PCB and an oscilloscope electrically connected with the PCB, wherein a first communication area and a second communication area are arranged on the PCB, n/2 communication wires are symmetrically arranged in the first communication area and the second communication area, wherein n is an even number, one end of the n/2 communication wires in the first communication area is communicated with a first bus wire, the other ends of the n/2 communication wires in the first communication area are respectively and electrically communicated with the positive electrodes of the ESD module, one end of the n/2 communication wires in the second communication area is communicated with a second bus wire, the other ends of the n/2 communication wires in the second communication area are respectively and electrically communicated with the negative electrodes of the ESD module, the oscilloscope is electrically connected with a current probe, and two ends of the current probe are respectively and electrically connected with the first bus wire and the second bus wire.

The beneficial effects of the utility model are as follows: the utility model provides an ESD module detection device, which is used for calibrating the electrostatic performance of an ESD module, a first communication area and a second communication area are arranged on a PCB, n/2 communication wires are respectively arranged in the first communication area and the second communication area, one ends of the n/2 communication wires in the first communication area and the second communication area are respectively and electrically communicated with positive and negative electrode probes of the n/2 ESD modules, then the other ends of the n/2 communication wires in the two communication areas are respectively and electrically connected with two ends of a test wire on an oscilloscope power probe through two bus wires, and n/2 ESD modules can be calibrated through one-time positioning, so that the calibration efficiency of the ESD module is greatly improved.

Preferably, the current probe is provided with a wire through hole, and one end of the test wire passes through the wire through hole.

Preferably, the PCB board is further provided with an installation area, a first conducting strip and a second conducting strip are symmetrically arranged in the installation area, two ends of the first conducting strip are respectively and electrically connected with one end of the first bus wire and one end of the test wire, and two ends of the second conducting strip are respectively and electrically connected with the second bus wire and the other end of the test wire.

Preferably, a protective cover is arranged on the installation area, and the current probe is arranged in the protective cover.

Preferably, the protection cover comprises an opening shell fixedly arranged in the installation area and a cover plate arranged on the opening shell, wherein the opening shell comprises a first U-shaped fixing block far away from the oscilloscope and a second U-shaped fixing block close to the oscilloscope, and the opening ends of the first U-shaped fixing block and the second U-shaped fixing block are oppositely arranged.

Preferably, the PCB board, the first "U" shaped fixing block, the second "U" shaped fixing block, and the cover plate are fixedly connected in the mounting area through bolts.

Preferably, the end of the current probe is provided with a fixing protrusion, the first U-shaped fixing block is provided with a fixing hole, the size of the fixing protrusion is matched with the size of the fixing hole, and the second U-shaped fixing block is provided with an avoidance groove.

Preferably, n communication wires are symmetrically arranged on the PCB in a circumferential shape, and the first bus wire and the second bus wire are respectively and electrically connected with the end part of the communication wire, which is far away from the center of the circle.

Preferably, an insulating solder mask layer is arranged between the n connecting wires.

Preferably, the PCB comprises a substrate and an insulating layer arranged on the substrate, and the communication wire is arranged on the insulating layer.

Additional aspects and advantages of the utility model will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the utility model.

Drawings

FIG. 1 is a schematic diagram of an ESD module detection device according to the present utility model;

FIG. 2 is a schematic diagram of a calibration process of an ESD module detection device according to the present utility model;

FIG. 3 is a schematic diagram of a protection cover of an ESD module detection device according to the present utility model;

FIG. 4 is a schematic diagram illustrating an internal structure of a protection cover of an ESD module detection device according to the present utility model;

FIG. 5 is a schematic diagram illustrating the connection of the wires of the ESD module inspection device according to the present utility model;

fig. 6 is a schematic structural diagram of a power supply probe of an ESD module detection device according to the present utility model.

Description of main reference numerals:

the utility model will be further described in the following detailed description in conjunction with the above-described figures.

Detailed Description

In order that the utility model may be readily understood, a more complete description of the utility model will be rendered by reference to the appended drawings. Several embodiments of the utility model are presented in the figures. This utility model may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.

It will be understood that when an element is referred to as being "mounted" on another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "left," "right," and the like are used herein for illustrative purposes only.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this utility model belongs. The terminology used herein in the description of the utility model is for the purpose of describing particular embodiments only and is not intended to be limiting of the utility model. The term "and/or" as used herein includes any and all combinations of one or more of the associated listed items.

Specifically, as shown in fig. 1 to 6, the ESD module detection device provided in the embodiment of the present utility model is used for calibrating the electrostatic performance of the ESD module 30, and includes a PCB board 10 and an oscilloscope 20 electrically connected to the PCB board, specifically, a first communication area and a second communication area are provided at one end of the PCB board 10, n/2 communication wires 11 are symmetrically provided in the first communication area and the second communication area, where n is an even number, specifically, sixteen communication wires are provided on the front surface of the PCB, two ends of eight communication wires 11 in the first communication area are respectively electrically connected with the first bus wire 12 and positive probes of eight ESD modules 30, two ends of eight communication wires 11 in the second communication area are respectively electrically connected with the second bus wire 13 and negative probes of eight ESD modules 30, the oscilloscope 20 is electrically connected with a current probe 21 through wires, and specifically, in this embodiment, the current probe 21 can be connected with the oscilloscope 20 through a plugging manner. The current probe 21 is provided with a test wire 22, and two ends of the test wire 22 are respectively electrically connected with the first bus wire 12 and the second bus wire 13.

In addition, in this embodiment, the PCB board is disc-shaped, and includes a smooth substrate and an insulating layer disposed on the substrate, where the substrate may be one of a copper substrate, an aluminum substrate, or a ceramic substrate, and in this embodiment, the communication wire 11 is disposed on the insulating layer; the first communication area and the second communication area are respectively semicircular discs, sixteen communication wires 11 are symmetrically arranged on the disc-shaped PCB in a circumferential shape, eight semicircular first communication areas and eight semicircular second communication areas are respectively arranged in the semicircular first communication areas and the semicircular second communication areas, one ends of the sixteen communication wires 11 extend to the circumference of the circumferential PCB, the other ends of the sixteen communication wires are converged near the circle center and are not communicated with each other, and in the embodiment, insulating solder resists are arranged among the sixteen communication wires 11 to prevent short circuits among the communication wires 11. The first bus conductor 12 is in a circular arc shape, is arranged on the peripheral circumference of the first communication area, is communicated with the end part of the eight communication conductors in the first communication area, which is far away from the center of the circle, and similarly, the second bus conductor 13 is communicated with the end part of the eight communication conductors in the second communication area, which is far away from the center of the circle.

Further, in the present embodiment, as shown in fig. 4 and 6, a through hole 211 is formed in the current probe 21, and one end of the test wire 22 passes through the through hole 211, that is, the middle portion of the test wire 22 is disposed in the through hole 211, and two ends are respectively located on two sides of the through hole 211. Further, as shown in fig. 5, in this embodiment, an installation area is further provided on the PCB 10, and a first conductive strip 14 and a second conductive strip 15 are symmetrically provided on two sides of the installation area, where the first conductive strip 14 and the second conductive strip 15 are welded on the installation area, two ends of the first conductive strip 14 are respectively electrically connected with one ends of the first bus wire 12 and the test wire 22, two ends of the second conductive strip 15 are respectively electrically connected with the other ends of the second bus wire 13 and the test wire 22, so that in order to prevent the two ends of the first conductive strip 14 and the second conductive strip 15 from falling off, two ends of the first conductive strip 14 and the second conductive strip 15 can be respectively welded with the bus wire and the test wire, and the test wire and the bus wire can be conveniently conducted.

Further, in this embodiment, as shown in fig. 1 and 3, a protection cover 40 is further disposed above the installation area, the current probe 21 is disposed in the protection cover 40, and the protection cover 40 can well protect the current probe 21, and is dustproof and dampproof. Specifically, in this embodiment, the protection cover 40 includes an open housing 41 fixed in the installation area and a cover plate 42 disposed on the open housing 41, where the open housing 41 includes a first "U" shaped fixing block 411 far away from the oscilloscope 20 and a second "U" shaped fixing block 412 close to the oscilloscope 20, and open ends of the first "U" shaped fixing block 411 and the second "U" shaped fixing block 412 are disposed opposite to each other. The protective cover 40 is formed by several parts, so that the assembly efficiency of the device can be improved, specifically, in the embodiment, six threaded holes are formed in the mounting area and the cover plate 42, two threaded holes are formed in two sides of the first U-shaped fixing block 411 respectively, two threaded holes are formed in two sides of the second U-shaped fixing block 412 respectively, the PCB 10, the first U-shaped fixing block 411, the second U-shaped fixing block 412 and the cover plate 42 are connected through bolts, and in the embodiment, the bolts are M2 bolts.

In addition, in order to facilitate the installation and fixation of the current probe 21, a fixing protrusion 212 is provided at an end of the current probe 21, a fixing hole 413 adapted to the fixing protrusion 212 is provided on a first "U" shaped fixing block 411, a avoiding groove 414 is provided on a second "U" shaped fixing block 412 close to the oscilloscope 20, and a wire connected to the current probe 21 by the oscilloscope 20 passes through the avoiding groove 414. Specifically, when the protective cover 40 and the current probe 21 are installed on the safety area, the threaded hole of the first "U" shaped fixing block 411 may be aligned with the threaded hole of the installation area, then the fixing protrusion 411 on the current probe 21 is inserted into the fixing hole 412, then the threaded hole of the second "U" shaped fixing block 413 is aligned with the remaining threaded hole of the installation area, so that the open ends of the first "U" shaped fixing block 411 and the second "U" shaped fixing block 412 are oppositely arranged, and finally the cover plate 42, the first "U" shaped fixing block 411 and the second "U" shaped fixing block 412 are fixedly connected with the PCB board through the cover plate 42 and the bolts.

When the ESD module detection device provided by the embodiment of the utility model is calibrated, the ESD module detection device is firstly placed on a probe table of a testing machine, the vacuumizing function of the testing machine is started, so that the ESD module detection device is firmly adsorbed on the probe table, then eight pairs of positive and negative probes of eight ESD modules 30 are pressed down onto sixteen connecting wires 11 of a PCB board 10 through a controller, anodes of the eight ESD modules 30 are connected with the eight connecting wires in a first connecting area, cathodes of the eight ESD modules 30 are connected with the eight connecting wires 11 in a second connecting area, then one of the ESD modules 30 is controlled by a control panel to output static electricity, the static electricity output by the ESD modules 30 forms a loop through the connecting wires 11, the first bus wire 12, the first conductive strip 14, the testing wire 22, the second conductive strip 15, the second bus wire 13 and the connecting wires 11 in the first connecting area, a current probe 21 senses the current passing through the testing wire 22, the static waveform of the ESD modules 30 is captured by the current probe 21, and whether the waveform parameters of the static electricity are in a range of national standard jjjf 8-2010 or not is analyzed, and the ESD module is calibrated. When the next ESD module needs to be calibrated after the calibration of the ESD module is completed, the next ESD module is controlled to output static electricity only through the control panel. In this embodiment, through the location of pushing down once, can accomplish the calibration of eight ESD modules, reduce the step of artifical hook probe in the calibration process, improved the calibration time of ESD module, further, through the location of pushing down once of machine, can effectually guarantee the uniformity of each ESD module probe and the hookup location of intercommunication wire, improved the calibration result.

It should be noted that the foregoing implementation procedure is only for illustrating the feasibility of the present application, but this does not represent that the ESD module detection device of the present application has only one implementation procedure, and instead, the ESD module detection device of the present application can be incorporated into the feasible implementation of the present application as long as it can be implemented.

In the description of the present specification, a description referring to terms "one embodiment," "some embodiments," "examples," "specific examples," or "some examples," etc., means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the present utility model. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiments or examples. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

The foregoing examples illustrate only a few embodiments of the utility model, which are described in detail and are not to be construed as limiting the scope of the utility model. It should be noted that it will be apparent to those skilled in the art that several variations and modifications can be made without departing from the spirit of the utility model, which are all within the scope of the utility model. Accordingly, the scope of protection of the present utility model is to be determined by the appended claims.

Claims

1. An ESD module detection device is used for calibrating electrostatic performance of an ESD module and is characterized by comprising a PCB and an oscilloscope electrically connected with the PCB, wherein a first communication area and a second communication area are arranged on the PCB, n/2 communication wires are symmetrically arranged in the first communication area and the second communication area, n is an even number, one end of each of the n/2 communication wires in the first communication area is communicated with a first bus wire, the other ends of the n/2 communication wires in the first communication area are respectively electrically communicated with anodes of the ESD module, one end of each of the n/2 communication wires in the second communication area is communicated with a second bus wire, the other ends of the n/2 communication wires in the second communication area are respectively electrically communicated with cathodes of the ESD module, the oscilloscope is electrically connected with a current probe, and two ends of each of the test wires are respectively electrically connected with the first bus wire and the second bus wire.

2. The ESD module inspection apparatus of claim 1, wherein the current probe is provided with a wire through hole, and one end of the test wire passes through the wire through hole.

3. The ESD module detection device of claim 1, wherein the PCB board is further provided with an installation area, a first conductive strip and a second conductive strip are symmetrically arranged in the installation area, two ends of the first conductive strip are respectively and electrically connected with one ends of the first bus wire and the test wire, and two ends of the second conductive strip are respectively and electrically connected with the other ends of the second bus wire and the test wire.

4. The ESD module inspection apparatus of claim 3, wherein the mounting area is provided with a protective cover, and the current probe is disposed within the protective cover.

5. The ESD module inspection device of claim 4 wherein the protective cover comprises an open housing secured to the mounting area and a cover plate disposed on the open housing, the open housing comprising a first "U" shaped mounting block distal from the oscilloscope and a second "U" shaped mounting block proximal to the oscilloscope, the open ends of the first "U" shaped mounting block and the second "U" shaped mounting block being disposed opposite one another.

6. The ESD module inspection apparatus of claim 5, wherein the PCB, the first "U" shaped fixing block, the second "U" shaped fixing block, and the cover plate are fixedly connected in the mounting area by bolts.

7. The ESD module detection device of claim 5, wherein a fixing protrusion is arranged at an end of the current probe, a fixing hole is formed in the first U-shaped fixing block, the size of the fixing protrusion is matched with the size of the fixing hole, and an avoidance groove is formed in the second U-shaped fixing block.

8. The ESD module inspection device of claim 1, wherein n communication wires are symmetrically arranged on the PCB in a circumferential shape, and the first and second bus wires are electrically connected to ends of the communication wires away from a center of a circle, respectively.

9. The ESD module inspection apparatus of claim 1, wherein an insulating solder mask layer is provided between n of the communication wires.

10. The ESD module inspection apparatus of claim 1, wherein the PCB includes a substrate and an insulating layer disposed on the substrate, and the communication wire is disposed on the insulating layer.