CN219328145U

CN219328145U - Wearing equipment

Info

Publication number: CN219328145U
Application number: CN202223503312.3U
Authority: CN
Inventors: 李世勇; 田俊; 缪特
Original assignee: Midea Group Co Ltd; GD Midea Air Conditioning Equipment Co Ltd
Current assignee: Midea Group Co Ltd; GD Midea Air Conditioning Equipment Co Ltd
Priority date: 2022-12-27
Filing date: 2022-12-27
Publication date: 2023-07-11
Anticipated expiration: 2032-12-27

Abstract

The utility model belongs to the technical field of electric appliances, and particularly relates to wearing equipment. The wearable device includes: the temperature rising and reducing assembly comprises a first shell, a semiconductor and a first fan, wherein a cavity is formed in the first shell, a first air inlet communicated with the cavity and a first air outlet communicated with the cavity, the semiconductor is arranged on the first shell and comprises a first working part and a second working part, the first working part is exposed out of the first shell, the second working part is located in the cavity, the first fan is arranged in the first shell, so that air enters the first shell from the first air inlet, exchanges heat with the second working part and then is discharged from the first air outlet. The wearable device can ensure the refrigerating or heating effect and ensure the user experience.

Description

Wearing equipment

Technical Field

The application belongs to the technical field of electrical appliances, and particularly relates to wearing equipment.

Background

The semiconductor refrigeration sheet, also called thermoelectric refrigeration sheet, is a heat pump. The dual-purpose refrigerator has the advantages that the dual-purpose refrigerator has no sliding parts, is applied to occasions with limited space, high reliability and no refrigerant pollution, can absorb heat and release heat respectively at two ends of a couple when direct current passes through the couple formed by connecting two different semiconductor materials in series, and can realize the purpose of refrigeration.

However, in the prior art, the device using the semiconductor refrigeration sheet for refrigeration has a poor refrigeration effect.

Disclosure of Invention

In order to solve the technical problems, the utility model provides a wearable device, which aims to solve the technical problem that the refrigeration effect of the device for refrigerating a semiconductor refrigeration piece is poor at least to a certain extent.

The technical scheme of the utility model is as follows:

a wearable device, characterized by comprising: the temperature raising and reducing assembly comprises a first shell, a semiconductor and a first fan, wherein the first shell is provided with a cavity, a first air inlet communicated with the cavity and a first air outlet communicated with the cavity, the semiconductor is arranged on the first shell and comprises a first working part and a second working part, the first working part is exposed out of the first shell, the second working part is positioned in the cavity, and the first fan is arranged in the first shell so that air enters the first shell from the first air inlet and is discharged from the first air outlet after exchanging heat with the second working part; the normal temperature wind component comprises a second shell and a second fan, wherein the second shell is connected with the first shell, a second air inlet and a second air outlet are formed in the second shell, and the second fan is arranged in the second shell, so that air enters the second shell from the second air inlet and is discharged from the second air outlet.

Because the first shell is provided with the cavity, the first air inlet communicated with the cavity and the first air outlet communicated with the cavity, the semiconductor is arranged on the first shell and comprises a first working part and a second working part, the first working part is exposed out of the first shell, the second working part is arranged in the cavity, the first fan is arranged in the first shell so that air enters the first shell from the first air inlet and is discharged from the first air outlet after exchanging heat with the second working part, the second shell is connected with the first shell, the second shell is provided with the second air inlet and the second air outlet, the second fan is arranged in the second shell so that the air enters the second shell from the second air inlet and is discharged from the second air outlet, therefore, when a user needs to send air, the second fan is started, and the second fan pumps the air into the second shell through the second air inlet, then the air flow on the surface of the human body is accelerated through the second air outlet to achieve the purposes of perspiration and cooling, the coverage area is ensured, the cooling effect is good, the user experience is improved, at the moment, the semiconductor and the first fan are not started to save electric quantity, the endurance is ensured, when the user needs to refrigerate, the semiconductor, the first fan and the second fan are started, the first working part refrigerates, the second working part heats, the first working part and the human body directly refrigerates the human body, the surface temperature of the human body is reduced, the cooling effect is good, the user experience is improved, meanwhile, the first fan extracts air into the cavity through the first air inlet, the air exchanges heat with the second working part in the cavity to form hot air, the hot air is discharged through the first air outlet to realize the heat dissipation of the semiconductor, the safety of the semiconductor is ensured, the hot air is not blown to the human body, and the user experience is further improved, the second fan draws air into the second shell through the second air inlet, then blow human body surface through the second air outlet, accelerate human body surface air flow, reach the perspiration, the cooling purpose, guarantee the coverage, the cooling effect is good, improve user experience, form through semiconductor and second fan combine together, the cooling effect is good, improve user experience, when the user needs to heat, start semiconductor and first fan, close the second fan, change the current direction of leading semiconductor, first working portion heats, second working portion refrigerates, first working portion pastes with the human body, heat directly to the human body, improve human body surface temperature, the heating effect is good, improve user experience, simultaneously, first fan draws the wind into the cavity through first air inlet, wind exchanges heat with second working portion in the cavity, form cold wind, cold wind is discharged through first air outlet, thereby realizing the heat dissipation of semiconductor, guarantee the safety of semiconductor, and do not blow to the human body, user experience has further been improved.

In some embodiments, the temperature raising and lowering assembly further comprises a heat conducting piece arranged outside the first shell, the heat conducting piece is attached to the first working portion, coverage is guaranteed, cooling effect is good, and user experience is improved.

In some embodiments, the heat conductive member is connected to the first housing to ensure stability of installation of the heat conductive member.

In some embodiments, the second housing is disposed obliquely on the first housing, ensuring comfort of use by a user.

In some embodiments, the cross-sectional shape of the end of the first housing facing away from the second housing is arc-shaped, ensuring comfort for the user.

In some embodiments, the first housing is provided with a through groove, and the first working portion is penetrated in the through groove so as to be exposed out of the first housing, so that the first working portion is guaranteed to be attached to a human body or a heat conducting piece.

In some embodiments, the through groove and the first air outlet are arranged on two opposite sides of the first shell, so that air discharged from the first air outlet is prevented from blowing to a human body.

In some embodiments, the temperature raising and lowering assembly further comprises a support disposed within the housing, the semiconductor being disposed on the support to support the semiconductor.

In some embodiments, the temperature raising and lowering assembly further includes a heat exchanger disposed in the housing, the heat exchanger contacting the second working portion and being located between the first fan and the second working portion, ensuring a heat exchanging effect.

In some embodiments, the wearable device further comprises a wearing piece provided on the first housing or the second housing, for facilitating wearing by a user.

In some embodiments, the wearing part comprises a hook part arranged on the first shell, and the hook part and the first working part are positioned on two opposite sides of the first shell, so that the wearing part is convenient for a user to wear.

The beneficial effects of the utility model at least comprise:

the hanging type wearable cooling equipment in the current market mainly comprises the following two types:

1, the refrigerating sheet is attached to the body by utilizing the semiconductor refrigerating principle, the refrigerating mode is contact refrigeration, however, the refrigerating sheet adopts micro-area contact refrigeration, only a small part of the back of a human body can be refrigerated, the cooling area is very limited, the cooling effect is poor, and the body feeling is poor in the sweating state of the body of a user.

2, a back-hanging fan is adopted, but only ambient air can be blown, the refrigerating function is not realized, and when the ambient temperature exceeds 35 ℃, the user feel is poor.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings that are needed in the description of the embodiments will be briefly described below, and it is obvious that the drawings in the following description are some embodiments of the present application, and other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.

Fig. 1 is a main view of a wearable device of the present embodiment;

FIG. 2 is a cross-sectional view taken along A-A of the wearable device of FIG. 1;

FIG. 3 is a side view of the wearable device of FIG. 1;

fig. 4 is a bottom view of the wearable device of fig. 1;

FIG. 5 is a rear view of the wearable device of FIG. 1;

fig. 6 is a schematic diagram of a semiconductor arrangement of the wearable device of fig. 1;

FIG. 7 is a state of use diagram of the wearable device of FIG. 1;

fig. 8 is a side view of the wearable device of fig. 7;

FIG. 9 is a first flowchart of the control method of the present embodiment;

fig. 10 is a second flowchart of the control method of the present embodiment.

In the accompanying drawings:

the temperature raising and lowering assembly 10 comprises a first shell 101, a chamber 1011, a first air inlet 1012, a first air outlet 1013, a through groove 1014, a semiconductor 102, a first working part 1021, a second working part 1022, a first fan 103, a heat conducting member 104, a supporting member 105 and a heat exchanger 106;

The room temperature air assembly 20, the second shell 201, the second air inlet 2011, the second air outlet 2012 and the second fan 202;

wearing member 30, hook member 301;

and a control assembly 40.

Detailed Description

The following description of the embodiments of the present utility model will be made clearly and fully with reference to the accompanying drawings, in which it is evident that the embodiments described are only some, but not all embodiments of the utility model. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.

It should be noted that all the directional indicators in the embodiments of the present utility model are only used to explain the relative positional relationship, movement conditions, etc. between the components in a specific posture, and if the specific posture is changed, the directional indicators are correspondingly changed.

In the present utility model, unless specifically stated and limited otherwise, the terms "connected," "affixed," and the like are to be construed broadly, and for example, "affixed" may be a fixed connection, a removable connection, or an integral body; can be mechanically or electrically connected; either directly or indirectly, through intermediaries, or both, may be in communication with each other or in interaction with each other, unless expressly defined otherwise. The specific meaning of the above terms in the present utility model can be understood by those of ordinary skill in the art according to the specific circumstances.

Furthermore, descriptions such as those referred to as "first," "second," and the like, are provided for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implying an order of magnitude of the indicated technical features in the present disclosure. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include at least one such feature. In addition, the technical solutions of the embodiments may be combined with each other, but it is necessary to base that the technical solutions can be realized by those skilled in the art, and when the technical solutions are contradictory or cannot be realized, the combination of the technical solutions should be considered to be absent and not within the scope of protection claimed in the present utility model.

The present application is described below with reference to specific embodiments in conjunction with the accompanying drawings:

the wearable device provided by the embodiment aims at solving the technical problems that the coverage area of the device for refrigerating the semiconductor refrigerating sheet is small and the user experience is affected to a certain extent.

Fig. 1 is a main view of a wearable device of the present embodiment; fig. 2 is a cross-sectional view of the wearable device of fig. 1 in the A-A direction. With reference to fig. 1 and 2, the wearable device of the present embodiment includes: a temperature raising and lowering assembly 10 and a normal temperature wind assembly 20. The temperature raising and lowering assembly 10 includes a first housing 101, a semiconductor 102 and a first fan 103, the first housing 101 is provided with a chamber 1011, a first air inlet 1012 communicated with the chamber 1011 and a first air outlet 1013 communicated with the chamber 1011, the semiconductor 102 is arranged on the first housing 101, the semiconductor 102 includes a first working part 1021 and a second working part 1022, the first working part 1021 is exposed outside the first housing 101, the second working part 1022 is arranged in the chamber 1011, the first fan 103 is arranged in the first housing 101, so that air enters the first housing 101 from the first air inlet 1012, exchanges heat with the second working part 1022, and is discharged from the first air outlet 1013. The normal temperature wind assembly 20 comprises a second casing 201 and a second fan 202, the second casing 201 is connected with the first casing 101, a second air inlet 2011 and a second air outlet 2012 are formed in the second casing 201, and the second fan 202 is arranged in the second casing 201, so that air enters the second casing 201 from the second air inlet 2011 and is discharged from the second air outlet 2012.

The first housing 101 is provided above the second housing 201.

The semiconductor 102 is in the form of a sheet.

The first working unit 1021 and the second working unit 1022 are opposite to each other, and when a first current is supplied to the semiconductor 102, the first working unit 1021 is cooled, and when a second current is supplied to the semiconductor 102, the second working unit 1022 is heated, and when the first current is supplied to the semiconductor 102, the first working unit 1021 is heated, and the second working unit 1022 is cooled, and the flow direction of the first current is opposite to the flow direction of the second current.

The number of the first air inlets 1012 may be one or more, and the number of the first air outlets 1013 may be one or more. The number of the second air inlets 2011 may be one or more, and the number of the second air outlets 2012 may be one or more.

1, the refrigerating sheet is attached to the body by utilizing the semiconductor 102 refrigerating principle, the refrigerating mode is contact refrigeration, however, the refrigerating sheet adopts micro-area contact refrigeration, only a small part of the back of a human body can be refrigerated, the cooling area is very limited, the cooling effect is poor, and the body feeling is poor in the sweating state of the body of a user.

Since the first housing 101 is provided with the chamber 1011, the first air inlet 1012 communicated with the chamber 1011 and the first air outlet 1013 communicated with the chamber 1011, the semiconductor 102 is arranged on the first housing 101, the semiconductor 102 comprises the first working part 1021 and the second working part 1022, the first working part 1021 is exposed out of the first housing 101, the second working part 1022 is positioned in the chamber 1011, the first fan 103 is arranged in the first housing 101 so that air enters the first housing 101 from the first air inlet 1012, exchanges heat with the second working part 1022, and is discharged from the first air outlet 1013, the second housing 201 is connected with the first housing 101, the second housing 201 is provided with the second air inlet 2011 and the second air outlet 2012, the second fan 202 is arranged in the second housing 201 so that air enters the second housing 201 from the second air inlet 2011 and is discharged from the second air outlet 2012, therefore, when a user needs to send air, the second fan 202 is started, the second fan 202 draws air into the second housing 201 through the second air inlet 2011, then blows the air into the body surface through the second air outlet 2012, accelerates the air flow on the body surface, achieves the purposes of perspiration and cooling, ensures the coverage area and good cooling effect, improves the user experience, at this time, the semiconductor 102 and the first fan 103 are not started to save electric quantity and ensure the cruising, when the user needs to refrigerate, the semiconductor 102, the first fan 103 and the second fan 202 are started, the first working part 1021 refrigerates, the second working part 1022 heats, the first working part 1021 is attached to the human body, directly refrigerates the human body, reduces the temperature of the body surface, has good cooling effect, improves the user experience, meanwhile, the first fan 103 draws the air into the chamber 1011 through the first air inlet 1012, exchanges heat with the second working part 1022 in the chamber 1011 to form hot air, the hot air is discharged through the first air outlet 1013, the semiconductor device has the advantages that the heat dissipation of the semiconductor device 102 is achieved, the safety of the semiconductor device 102 is guaranteed, hot air is not blown to a human body, the user experience is further improved, the second fan 202 extracts air into the second shell 201 through the second air inlet 2011, then the air is blown to the surface of the human body through the second air outlet 2012, the air flow on the surface of the human body is accelerated, the purpose of perspiration and cooling is achieved, the coverage area is guaranteed, the cooling effect is good, the user experience is improved, the semiconductor device 102 and the first fan 103 are started when the user needs to heat, the second fan 202 is closed, the current direction of the semiconductor device 102 is changed, the first working part 1021 heats, the second working part 1022 refrigerates, the first working part 1021 is attached to the human body, the human body is directly heated, the surface temperature of the human body is improved, the heating effect is good, the user experience is improved, meanwhile, the first fan 103 extracts air into the chamber 1011 through the first air inlet 1012, the air exchanges heat with the second working part 1022 in the chamber 1011, cold air is formed, the cold air 1013 is discharged, the semiconductor device 102 is enabled to be discharged through the first air outlet 1013, and the safety of the user is guaranteed, and the user does not need to blow the semiconductor device 102.

In some embodiments, in order to make the wind sense of the wind blown onto the human body strong, the second fan 202 is a centrifugal fan, which has a good ventilation effect, and can ensure that the wind pressure discharged by the second air outlet 2011 is large, so that the human body generates stronger wind sense, and the user experience is improved. Moreover, when the centrifugal fan is operated, the generated noise is small, and the user experience is further improved.

In some embodiments, to ensure the air exhaust effect, the first fan 103 is a centrifugal fan, which has a good ventilation effect, and can ensure that the air in the chamber 1011 is quickly exhausted, so as to ensure the safety of the semiconductor 102. Moreover, when the centrifugal fan is operated, the generated noise is small, and the user experience is further improved.

In some embodiments, the temperature raising and lowering assembly 20 employs a semiconductor 102, the semiconductor 102 also known as a thermoelectric cooling fin, which is a heat pump. Its advantages are no slide parts, limited space, high reliability and no pollution to refrigerant. By utilizing the Peltier effect of the semiconductor materials, when direct current passes through a couple formed by connecting two different semiconductor materials in series, heat can be absorbed and released at two ends of the couple respectively, and the purpose of refrigeration can be realized. The semiconductor 102 is a refrigeration technology that produces negative thermal resistance and is characterized by no moving parts and relatively high reliability.

Referring to fig. 1 and 2, in some embodiments, the first housing 101 and the second housing 102 are integrally formed, so as to ensure that the first housing 101 and the second housing 102 are firmly connected, and avoid the first housing 101 and the second housing 102 from being separated.

Fig. 6 is a semiconductor arrangement schematic diagram of the wearable device of fig. 1. In combination with fig. 1, 2 and 6, in some embodiments, in order to improve the coverage area, the temperature raising and reducing assembly 10 further includes a heat conducting member 104 disposed outside the first housing 101, where the heat conducting member 104 is attached to the first working portion 1021, and an end surface of the heat conducting member 104 facing away from the first working portion 1021 is attached to a human body, so that the coverage area is ensured, and the temperature raising or reducing effect is good, and the user experience is improved. In the present embodiment, the area of the heat conductive member 104 is larger than the area of the first working portion 1021.

In this embodiment, when the user needs to refrigerate, the semiconductor 102 is started, the first working part 1021 refrigerates, the second working part 1022 heats, the first working part 1021 is attached to the heat conducting member 104 and transfers heat to the heat conducting member 104, and the heat conducting member 104 is attached to the human body to refrigerate the human body directly, so that the surface temperature of the human body is reduced, the coverage area is ensured by the heat conducting member 104, the cooling effect is good, and the user experience is improved. When the user needs to heat, start semiconductor 102, first working portion 1021 heats, second working portion 1022 refrigerates, first working portion 1021 pastes with heat conduction spare 104 to give heat transfer to heat conduction spare 104, and heat conduction spare 104 and human laminating, directly heat the human body, improve human body surface temperature, guarantee the coverage through heat conduction spare 104, it is effectual to heat up, improve user experience. In this embodiment, the heat conducting member 104 may be made of metal, such as iron, copper, and aluminum.

In this embodiment, in order to ensure the stability of the installation of the heat conducting member 104, the heat conducting member 104 is connected to the first working portion 1021 to avoid the separation of the heat conducting member 104 from the first working portion 1021. In the present embodiment, the heat conducting member 104 may be connected to the first working portion 1021 by an adhesive, but in other embodiments, the heat conducting member 104 may be connected to the first working portion 1021 by a connecting member such as a bolt.

In the present embodiment, in order to secure the stability of the installation of the heat conductive member 104, the heat conductive member 104 is connected to the first housing 101 to avoid the heat conductive member 104 from being separated from the first housing 101. In the present embodiment, the heat conducting member 104 may be connected to the first housing 101 by an adhesive, but in other embodiments, the heat conducting member 104 may be connected to the first housing 101 by a connecting member such as a bolt.

Fig. 3 is a side view of the wearable device of fig. 1. In combination with fig. 2 and fig. 3, in some embodiments, in order to ensure comfort of use by a user, the second housing 201 is obliquely disposed on the first housing 101, that is, an included angle is formed between the second housing 201 and the first housing 101, so that the arrangement of the second housing 201 and the first housing 101 accords with ergonomics, and when the user uses the heat conducting member 104 on the first housing 101 is attached to a human body, a heating effect is ensured, and user experience is improved. In this embodiment, the angle between the second housing 201 and the first housing 101 may be 135 ° -150 °.

In some embodiments, as the first housing 101 is disposed above the second housing 201 and is attached to the back of the user, that is, the end of the first housing 101 facing away from the second housing 201 is close to the neck of the user, in order to avoid the first housing 101 interfering with the movement of the neck or the head of the user, the cross-sectional shape of the end of the first housing 101 facing away from the second housing 201 is arc-shaped, so as to avoid the neck or the head of the user, which can ensure the comfort of the user.

Referring to fig. 2, in some embodiments, in order to ensure that the first working portion 1021 can be attached to the human body or the heat conducting member 104, the first housing 101 is provided with a through groove 1014, and the first working portion 1021 is disposed through the through groove 1014 so as to be exposed outside the first housing 101, that is, an end surface of the first working portion 1021 facing away from the second working portion 1022 is leaked outside the first housing 101 or is flush with an outer surface of the first housing 101, so that the first working portion 1021 can be attached to the human body or the heat conducting member 104, thereby ensuring normal heat transfer.

In this embodiment, in order to avoid blowing the air exhausted from the first air outlet 1013 to the human body, the through slot 1014 and the first air outlet 1013 are disposed on opposite sides of the first housing 101, that is, the first air outlet 1013 is opposite to the first working portion 1021, so that the air direction after exchanging heat with the second working portion 1022 is blown out in a direction away from the human body, avoiding blowing to the human body, avoiding disturbing refrigeration or heating, and improving the comfort of the user. Meanwhile, the first air outlet 1013 is formed in the upper portion of the first shell 101, so that clothes are prevented from shielding the first air outlet 1013, and smooth air outlet is ensured.

Referring to fig. 3, in this embodiment, since the first working portion 1021 faces the human body, and the first air outlet 1013 is opposite to the first working portion 1021, and the first housing 101 is placed in the clothes, in order to ensure that wind energy enters the chamber 1011, the first air inlet 1012 is formed in the side portion of the first housing 101, and the first housing 101 itself has a thickness, so that the clothes can be supported, the clothes can be prevented from blocking the first air inlet 1012, and wind can be ensured to enter the chamber 1011 through the first air inlet 1012, so as to realize heat exchange with the second working portion 1022, ensure smooth air inlet, and ensure the safety of the semiconductor 102.

Referring to fig. 3, in this embodiment, since the second housing 201 is attached to a human body, in order to ensure that wind energy enters the second housing 201, the second air inlet 2011 is opened at a side portion of the second housing 201, and the second housing 201 itself has a thickness, so that clothes can be supported, the clothes are prevented from blocking the second air inlet 2011, and wind can enter the second housing 201 through the second air inlet 2011, so that smooth air intake is ensured. Fig. 4 is a bottom view of the wearable device of fig. 1, and fig. 5 is a rear view of the wearable device of fig. 1. In combination with fig. 4 and 5, in order to avoid clothes to block the second air outlet 2012, the second air outlet 2012 is formed in the bottom of the second shell 201, so that the air exhausted from the second air outlet 2012 can be normally blown to a human body, smooth air outlet is ensured, air flow on the surface of the human body is accelerated, sweat discharging and cooling purposes are achieved, coverage is ensured, cooling effect is good, and user experience is improved.

FIG. 7 is a state of use diagram of the wearable device of FIG. 1; fig. 8 is a side view of the wearable device of fig. 7. Referring to fig. 7 and 8, in this embodiment, when air supply is required, a micro-environmental circulation system is formed between the normal temperature air component 20 and the clothes of the human body, the second fan 202 is started, the second fan 202 draws air into the second housing 201 through the second air inlet 2011, and then blows the air to the upper torso surface of the human body through the second air outlet 2012 to perform heat exchange, thereby achieving the purpose of cooling the human body.

In some embodiments, in conjunction with fig. 2, since the semiconductor 102 is smaller in size and the first housing 101 is larger in size, in order to support the semiconductor 102, the temperature raising and lowering assembly 10 further includes a support member 105 disposed in the housing, the semiconductor 102 is disposed on the support member 105, and the semiconductor 102 is supported by the support member 105, so as to ensure stability of supporting the semiconductor 102 and also ensure stability of mounting the semiconductor 102 on the first housing 101. In the present embodiment, the support member 105 has a circular cross-sectional shape, and the second working portion 1022 may be provided inside the chamber 1011, and the first working portion 1021 may be provided outside the first casing 101.

In some embodiments, referring to fig. 2, to ensure the heat exchanging effect, the temperature raising and lowering assembly 10 further includes a heat exchanger 106 disposed in the housing, the heat exchanger being in contact with the second working portion 1022 and located between the first fan 103 and the second working portion 1022.

In this embodiment, when the first fan 103 is started, the first fan 103 draws the air into the chamber 1011 through the first air inlet 1012, at this time, the second working portion 1022 exchanges heat with the heat exchanger 106, and the heat exchanger 106 exchanges heat with the air entering the chamber 1011, so that the air fully contacts with the heat exchanger 106, the heat exchange area is increased, the heat exchange effect is ensured, and finally, the air is exhausted through the first air outlet 1013, so as to avoid affecting the temperature rise and fall of the human body, and meanwhile, the safety of the semiconductor 102 is ensured.

In connection with fig. 2, in some embodiments, for convenience of wearing by the user, the wearing device further includes a wearing member 30 provided on the first case 101 or the second case 201, that is, the wearing member 30 may be connected to the first case 101 or may be connected to the second case 201.

Referring to fig. 2, in this embodiment, in order to achieve the user wearing, the wearing piece 30 includes the hook piece 301 disposed on the first housing 101, the hook piece 301 and the first working portion 1021 are located on opposite sides of the first housing 101, and the hook piece 301 hooks the neckline of the garment, so that the user wearing can be completed, and meanwhile, the hook piece 301 and the first working portion 1021 are located on opposite sides of the first housing 101, so that the first housing 101 supports the garment, and the garment is prevented from shielding the first air inlet 1012 and the second air inlet 2012. The hook 301 is disposed below the first air outlet 1013 to avoid the clothes from shielding the first air outlet 1013.

Of course, in other embodiments, the wearing member 30 may be a flexible connection member, and the material may be rubber, cloth, leather, etc., such as a strap, a brace, etc. The user can wear the wearing member 30 on the back according to the use requirement. It will be appreciated that the user may also wear the wearing article 30 on the neck, legs, waist, etc. depending on the use requirements.

In conjunction with fig. 3, in some embodiments, to control the start-stop and power of the semiconductor 102, the first blower 103, the second blower 202, the heat exchanger 106, the wearable device further includes a control assembly 40 electrically connected with the semiconductor 102, the first blower 103, the second blower 202, the heat exchanger 106.

In this embodiment, the control assembly 40 includes a controller and a plurality of control electronic components, and the user sends corresponding control instructions to the controller by controlling the electronic components, and the controller controls the start, stop and power of the semiconductor 102, the first fan 103, the second fan 202 and the heat exchanger 106 according to the corresponding control instructions.

In this embodiment, in order to implement starting of the semiconductor 102, the first fan 103, the second fan 202, and the heat exchanger 106, the wearable device further includes a power source connected to the controller, where the power source is electrically connected to the semiconductor 102, the first fan 103, the second fan 202, and the heat exchanger 106 through the controller, so as to supply power to the semiconductor 102, the first fan 103, the second fan 202, and the heat exchanger 106. In this embodiment, the power source may be a charger, a secondary battery, or a dry cell.

FIG. 9 is a first flowchart of the control method of the present embodiment; fig. 10 is a second flowchart of the control method of the present embodiment. With reference to fig. 9 and 10, based on the same inventive concept, the present application further provides a control method applied to a wearable device, the wearable device further including a controller connected to the semiconductor 102, the first fan 103, and the second fan 202, the control method including the steps of:

step S11, the controller obtains an operation control signal of the wearable device.

Specifically, after the wearable device is powered on, the controller is in a standby state. The controller determines whether an operation control signal is received, where the operation control signal is a cooling signal or a heating signal sent by a user, for example, the user clicks a cooling electronic control component or a heating electronic control component on the electronic control component of the control assembly 40, or the user clicks a cooling electronic control component or a heating electronic control component on the mobile terminal. Other implementations are not exhaustive herein.

In step S12, when the operation control signal is a cooling signal, the controller controls the first working portion 1021 to cool and the second working portion 1022 to heat, and simultaneously controls the first fan 103 to start so that air sequentially enters the first housing 101 from the first air inlet 1012, exchanges heat with the second working portion 1022, and then is discharged from the first air outlet 1013, and simultaneously controls the second fan 202 to start so that air sequentially enters the second housing 201 from the second air inlet 2011 and is discharged from the second air outlet 2012.

Specifically, if the external temperature reaches the set temperature or the user feels hot, the controller obtains a refrigeration signal, the controller controls the first working part 1021 to refrigerate and the second working part 1022 to heat according to the refrigeration signal, the first working part 1021 is attached to the human body to directly refrigerate the human body, the surface temperature of the human body is reduced, the cooling effect is good, the user experience is improved, the controller controls the first fan 103 to start according to the refrigeration signal, the first fan 103 extracts wind into the cavity 1011 through the first air inlet 1012, the wind exchanges heat with the second working part 1022 in the cavity 1011 to form hot air, the hot air is discharged through the first air outlet 1013 to realize heat dissipation of the semiconductor 102, the safety of the semiconductor 102 is ensured, the hot air is not blown to the human body, and the user experience is further improved. The controller controls the second fan 202 to start according to the refrigerating signal, and the second fan 202 draws wind into the second casing 201 through the second air intake 2011, then blows human trunk surface through the second air outlet 2012, accelerates human surface air flow, reaches the perspiration, the cooling purpose, guarantees the coverage, and the cooling is effectual, improves user experience.

In step S13, when the operation control signal is a heating signal, the controller controls the first working portion 1021 to heat and the second working portion 1022 to cool, and simultaneously controls the first fan 103 to start, so that air sequentially enters the first housing 101 from the first air inlet 1012, exchanges heat with the second working portion 1022, and is discharged from the first air outlet 1013, and the controller simultaneously controls the second fan 202 to stop.

Specifically, the controller obtains the heating signal, and the controller heats and the refrigeration of second work portion 1022 according to heating signal control first work portion 1021, and first work portion 1021 is pasted with the human body, heats the human body directly, improves human body surface temperature, and it is effectual to heat up, improves user experience. The controller controls the first fan 103 to start according to the heating signal, the first fan 103 extracts wind into the chamber 1011 through the first air inlet 1012, the wind exchanges heat with the second working part 1022 in the chamber 1011 to form cold air, and the cold air is discharged through the first air outlet 1013 to realize the heat dissipation of the semiconductor 102, ensure the safety of the semiconductor 102, and the cold air is not blown to the human body, thereby further improving the user experience. The controller controls the second fan 202 to stop according to the heating signal, so that the second fan 202 is prevented from blowing air to the surface of the human body trunk, and user experience is prevented from being influenced.

In this embodiment, when the controller obtains the cooling instruction, the semiconductor 102 is supplied with a first current, the first working portion 1021 is cooled, the second working portion 1022 is heated, when the controller obtains the cooling instruction, the semiconductor 102 is supplied with a second current, the first working portion 1021 is heated, the second working portion 1022 is cooled, and the flow direction of the first current is opposite to the flow direction of the second current.

In some embodiments, the wearable device further comprises a first temperature sensor for detecting an ambient temperature and connected to the controller, the control method comprising the steps of:

in step S111, the controller obtains a first temperature value detected by the first temperature sensor.

Specifically, the first temperature sensor detects an ambient temperature and transmits the detected first temperature value to the controller.

In step S112, when the operation control signal is a cooling signal, the controller adjusts the power of the first fan 103 and the power of the semiconductor 102 so that the first temperature value is positively correlated with the power of the first fan 103, and the first temperature value is positively correlated with the power of the semiconductor 102.

Specifically, the higher the first temperature value, the higher the power of the first fan 103 and the semiconductor 102 is controlled by the controller to ensure the cooling effect. The lower the first temperature value is, the lower the power of the first fan 103 and the semiconductor 102 is controlled by the controller, so as to save electric quantity and ensure cruising. The environment heat load, the human body heat comfort and the heat sensitivity requirements are considered, the refrigerating capacity and the air supply capacity are reasonably designed and distributed, and the whole machine endurance performance is considered while the cooling experience is ensured.

In step S113, when the operation control signal is a heating signal, the controller adjusts the power of the first fan 103 and the power of the semiconductor 102, the first temperature value is inversely related to the power of the first fan 103, and the first temperature value is inversely related to the power of the semiconductor 102.

Specifically, the lower the first temperature value, the higher the power of the first fan 103 and the semiconductor 102 is controlled by the controller to ensure the heating effect. The higher the first temperature value is, the lower the power of the first fan 103 and the semiconductor 102 is controlled by the controller, so as to save electric quantity and ensure cruising. The environment heat load, the human body heat comfort and the heat sensitivity requirements are considered, the heating quantity and the air supply quantity are reasonably designed and distributed, and the whole machine endurance performance is considered while the heating experience is ensured.

In this embodiment, the refrigeration signal includes a first refrigeration sub-signal and a second refrigeration sub-signal, and the control method includes the steps of:

in step S1121, when the first temperature value is greater than or equal to the first preset temperature value and less than the second preset temperature value, the controller generates a first refrigeration sub-signal, and the controller controls the first fan 103 to be at the first power and the semiconductor 102 to be at the second power according to the first refrigeration sub-signal.

Specifically, the controller compares the first temperature value detected by the first temperature sensor with the first preset temperature value and the second preset temperature value, if the first temperature value is greater than or equal to the first preset temperature value and smaller than the second preset temperature value, the controller generates a first refrigerating sub-signal, the controller controls the semiconductor 102 to be at the second power according to the first refrigerating sub-signal, the first working part 1021 refrigerates, the first working part 1021 is attached to a human body, the human body is directly refrigerated, the surface temperature of the human body is reduced, the cooling effect is good, the user experience is improved, the second working part 1022 heats, the controller controls the first fan 103 to be at the first power according to the first refrigerating sub-signal, the first fan 103 draws air into the cavity 1011 through the first air inlet 1012, the air exchanges heat with the second working part 1022 in the cavity 1011 to form hot air, and the hot air is discharged through the first air outlet 1013 to realize heat dissipation of the semiconductor 102, and the safety of the semiconductor 102 is ensured.

In step S1122, when the first temperature value is equal to or greater than the second preset temperature value, the controller generates a second refrigeration sub-signal, and the controller controls the first fan 103 to be at the third power and the semiconductor 102 to be at the fourth power according to the second refrigeration sub-signal.

Specifically, the controller compares the first temperature value detected by the first temperature sensor with the second preset temperature value, if the first temperature value is greater than or equal to the second preset temperature value, the controller generates a second refrigeration sub-signal, the controller controls the semiconductor 102 to be at a fourth power according to the second refrigeration sub-signal, the first working part 1021 refrigerates, the first working part 1021 is attached to a human body to directly refrigerate the human body, the surface temperature of the human body is reduced, the cooling effect is good, the user experience is improved, the second working part 1022 heats, the fourth power is greater than the second power, the refrigerating capacity of the first working part 1021 is increased, the controller controls the first fan 103 to be at a third power according to the second refrigeration sub-signal, the third power is greater than the first power, the first fan 103 draws wind into the chamber 1011 through the first air inlet 1012, the wind exchanges heat with the second working part 1022 in the chamber 1011 to form hot wind, and the hot wind is discharged through the first air outlet 1013 to realize heat dissipation of the semiconductor 102, and the safety of the semiconductor 102 is ensured.

In this embodiment, considering the environmental thermal load, the thermal comfort of the human body, and the thermal sensitivity requirement, the controller controls the first fan 103 to switch between the first power and the third power, and the controller controls the semiconductor 102 to switch between the second power and the fourth power, so as to reasonably design the distributed air volume and the refrigerating capacity, and give consideration to the whole machine endurance performance while ensuring the cooling experience.

In this embodiment, the heating signal includes a first heating sub-signal and a second heating sub-signal, and the control method includes the following steps:

in step S1131, when the first temperature value is greater than or equal to the third preset temperature value, the controller generates a first heating sub-signal, and the controller controls the first fan 103 to be at the first power and the semiconductor 102 to be at the second power according to the first heating sub-signal.

Specifically, the controller compares the first temperature value detected by the first temperature sensor with the third preset temperature value, if the first temperature value is greater than or equal to the third preset temperature value, the controller generates a first heating sub-signal, the controller controls the semiconductor 102 to be at the third power according to the first heating sub-signal, the first working part 1021 heats, the first working part 1021 is attached to a human body to directly heat the human body, the surface temperature of the human body is improved, the heating effect is good, the user experience is improved, the second working part 1022 refrigerates, the controller controls the first fan 103 to be at the first power according to the first heating sub-signal, the first fan 103 pumps air into the cavity 1011 through the first air inlet 1012, the air exchanges heat with the second working part 1022 to form cold air, and the cold air is discharged through the first air outlet 1013 to realize heat dissipation of the semiconductor 102.

In step S1132, if the first temperature value is smaller than the third preset temperature value, the controller generates a second heating sub-signal, and the controller is at the third power and the semiconductor 102 is at the fourth power according to the second heating sub-signal.

Specifically, the controller compares the first temperature value detected by the first temperature sensor with the third preset temperature value, if the first temperature value is smaller than the third preset temperature value, the controller generates a second heating sub-signal, the controller controls the semiconductor 102 to be at a fourth power according to the second heating sub-signal, the first working part 1021 heats, the first working part 1021 is attached to a human body to directly heat the human body, the surface temperature of the human body is improved, the heating effect is good, the user experience is improved, the second working part 1022 refrigerates, the fourth power is larger than the second power, the heating amount of the first working part 1021 is increased, the controller controls the first fan 103 to be at the third power according to the second heating sub-signal, the third power is larger than the first power, the first fan 103 draws air into the chamber 1011 through the first air inlet 1012, the air exchanges heat with the second working part 1022 in the chamber 1011 to form cold air, the cold air is discharged through the first air outlet 1013 to realize heat dissipation of the semiconductor 102, and the safety of the semiconductor 102 is ensured.

In this embodiment, considering the environmental thermal load, thermal comfort and thermal sensitivity requirements of the human body, the controller controls the first fan 103 to switch between the first power and the third power, and the controller controls the semiconductor 102 to switch between the second power and the fourth power, so as to reasonably design the distributed air volume and the heating amount, and give consideration to the whole machine endurance performance while ensuring the heating experience.

In some embodiments, the control method further comprises the steps of:

in step S114, when the operation control signal is a cooling signal, the controller controls the second fan 202 to be at maximum power according to the cooling signal.

Specifically, if the external temperature reaches the set temperature or the user feels hot, the controller obtains a refrigeration signal, and the controller controls the second fan 202 to be at the maximum power according to the refrigeration signal, the second fan 202 draws the wind into the second shell 201 through the second air inlet 2011, and then blows the wind to the body surface through the second air outlet 2012, so as to accelerate the air flow on the body surface, achieve the purposes of perspiration and cooling, ensure the coverage range, achieve good cooling effect and improve the user experience.

In this embodiment, considering the environmental heat load, the thermal comfort and the thermal sensitivity of the human body, the controller controls the second fan 202 to be at the maximum power, and reasonably designs the distributed air quantity and the heating quantity, so as to ensure the temperature rising experience and give consideration to the endurance performance of the whole machine.

In some embodiments, the control method further comprises the steps of:

in step S14, when the operation control signal is the air supply signal, the controller controls the second fan 202 to start, so that air sequentially enters the second housing 201 from the second air inlet 2011 and is discharged from the second air outlet 2012, and simultaneously controls the first fan 103 to stop.

Specifically, if the external temperature does not reach the set temperature or the user does not feel very hot, the controller controls the semiconductor 102 and the first fan 103 to be turned off according to the air supply signal, so as to save electric quantity, ensure endurance, and the controller controls the second fan 202 to be started according to the air supply signal, the second fan 202 pumps air into the second shell 201 through the second air inlet 2011, and then blows the air to the surface of the human body trunk through the second air outlet 2012, so that air flow on the surface of the human body is accelerated, sweat discharging and cooling are achieved, coverage area is ensured, cooling effect is good, and user experience is improved.

In this embodiment, the wearable device further includes a first temperature sensor for detecting an ambient temperature and connected to the controller, and the control method includes the following steps:

in step S141, the controller obtains a first temperature value detected by the first temperature sensor.

In step S142, when the operation control signal is the air supply signal, the first temperature value is positively correlated with the power of the second fan 202.

Specifically, the higher the first temperature value, the higher the power of the second fan 202 is controlled by the controller to ensure the air supply effect. The lower the first temperature value is, the lower the power of the second fan 202 is controlled by the controller so as to save electric quantity and ensure continuous voyage. Considering the requirements of environmental heat load, human body heat comfort and heat sensitivity, the score distribution air quantity is reasonably designed, and the whole machine endurance performance is considered while the cooling experience is ensured.

In this embodiment, the air supply signal includes a first air supply sub-signal, a second air supply sub-signal, and a third air supply sub-signal, and the control method includes the following steps:

in step S1421, when the first temperature value is greater than or equal to the fourth preset temperature value and less than the first preset temperature value, the controller generates a first air supply sub-signal, and the controller controls the second fan 202 to be at the fifth power according to the first air supply sub-signal.

Specifically, the controller compares the first temperature value detected by the first temperature sensor with the fourth preset temperature value and the first preset temperature value, if the first temperature value is greater than or equal to the fourth preset temperature value and smaller than the first preset temperature value, the controller generates a first air supply sub-signal, the controller controls the second fan 202 to be at the fifth power according to the first air supply sub-signal, the second fan 202 extracts air into the second shell 201 through the second air inlet 2011, and then blows the air to the surface of the human body through the second air outlet 2012, so that the air flow of the surface of the human body is accelerated, sweat is discharged, the cooling purpose is achieved, the coverage area is ensured, the cooling effect is good, and the user experience is improved.

In step S1422, when the first temperature value is greater than or equal to the fifth preset temperature value and less than the fourth preset temperature value, the controller generates a second air supply sub-signal, and the controller controls the second fan 202 to be at the sixth power according to the second air supply sub-signal.

Specifically, the controller compares the first temperature value detected by the first temperature sensor with the fifth preset temperature value and the fourth preset temperature value, if the first temperature value is greater than or equal to the fifth preset temperature value and smaller than the fourth preset temperature value, the controller generates a second air supply sub-signal, the controller controls the second fan 202 to be at sixth power according to the second air supply sub-signal, the sixth power is smaller than the fifth power, the rotation speed of the second fan 202 is reduced, the second fan 202 extracts air into the second shell 201 through the second air inlet 2011, and then blows the air to the body surface through the second air outlet 2012, so that the air flow on the body surface is accelerated, perspiration is achieved, the purpose of cooling is guaranteed, the coverage area is guaranteed, the cooling effect is good, the user experience is improved, meanwhile, the consumed electric quantity is small, and the duration is guaranteed.

In step S1423, if the first temperature value is less than the fifth preset temperature value, the controller generates a third air supply sub-signal, and the controller controls the second fan 202 to be at the seventh power according to the third air supply sub-signal.

Specifically, the controller compares the first temperature value detected by the first temperature sensor with the fifth preset temperature value and the first preset temperature value, if the first temperature value is greater than or equal to the fifth preset temperature value and smaller than the first preset temperature value, the controller generates a second air supply sub-signal, the controller controls the second fan 202 to be at seventh power according to the second air supply sub-signal, the seventh power is larger than sixth power, the rotation speed of the second fan 202 is reduced, the second fan 202 extracts air into the second shell 201 through the second air inlet 2011, and then blows the air to the body surface through the second air outlet 2012, so that the air flow on the body surface is accelerated, perspiration and cooling purposes are achieved, coverage area is guaranteed, cooling effect is good, user experience is improved, meanwhile, consumed electric quantity is small, and cruising duration is guaranteed.

In this embodiment, considering the environmental heat load, the thermal comfort of the human body, and the thermal sensitivity requirement, the controller controls the second fan 202 to switch among the fifth power, the sixth power, and the seventh power, and reasonably designs the distributed air volume, so as to ensure the cooling experience and give consideration to the whole machine endurance performance.

In some embodiments, the control method further comprises the steps of:

in step S15, the controller obtains a shutdown instruction.

Specifically, the controller determines whether a power-on instruction is received, where the power-on instruction is a power-on instruction sent by a user, for example, the user clicks the power-on electronic component on the electronic component of the control assembly 40, or the user clicks the power-on electronic component on the mobile terminal. Other implementations are not exhaustive herein. And obtaining an operation control signal of the wearable equipment as a refrigerating signal or a heating signal according to the shutdown instruction at the controller.

In step S16, the controller obtains a delayed shutdown signal according to the shutdown instruction, and controls the first fan 103 to be turned off according to the delayed shutdown signal, so that the first fan 103 is turned off in a delayed manner, the damage caused by instantaneous heat accumulation of the semiconductor 102 is prevented, and the service life of the semiconductor 102 is ensured.

In this embodiment, the wearable device further includes a timer connected to the controller, and the control method includes:

in step S17, the controller obtains the closing time value timed by the timer, and compares the closing time value with the preset closing time value.

Specifically, when the controller obtains a shutdown instruction, the timer starts to count, and the counted shutdown time value is sent to the controller, and the controller compares the shutdown time value with a preset shutdown time value.

Step S18, the controller generates a delay closing signal under the condition that the closing time value is larger than or equal to a preset closing time value.

Specifically, the controller controls the first fan 103 to be turned off according to the delay turn-off signal, so that the first fan 103 is turned off in a delay manner, the damage caused by instantaneous heat accumulation of the semiconductor 102 is prevented, and the service life of the semiconductor 102 is ensured.

In some embodiments, the control method further comprises the steps of:

in step S19, the controller obtains a forced shutdown signal.

In step S20, the controller controls the semiconductor 102 to be turned off according to the forced shutdown signal, that is, the controller controls the semiconductor 102 to be turned off according to the forced shutdown signal, so as to turn off the semiconductor 102, and prevent abnormal burning of the semiconductor 102 caused by poor heat dissipation due to the stalling, etc. of the first fan 103, so as to ensure the service life of the semiconductor 102.

In this embodiment, the wearable device further includes a second temperature sensor for detecting a temperature of the first working part 1021 and a third temperature sensor for detecting a temperature of the second working part 1022, which are connected to the controller, and the control method includes:

and S21, when the operation control signal is a refrigeration signal, the controller obtains a second temperature value detected by the second temperature sensor and compares the second temperature value with a sixth preset temperature value, and if the second temperature value is larger than the sixth preset temperature value, the controller generates a forced shutdown signal.

Specifically, the controller compares the second temperature value detected by the second temperature sensor with a sixth preset temperature value, if the second temperature value is greater than or equal to the sixth preset temperature value, the controller generates a forced shutdown signal, and the controller controls the semiconductor 102 to be powered off according to the forced shutdown signal, so that the semiconductor 102 is closed, and the semiconductor 102 burning abnormality caused by the heat dissipation failure due to the first fan 103 blocking, stopping and the like is prevented, so that the service life of the semiconductor 102 is ensured.

Step S22, when the operation control signal is a heating signal, the controller obtains a third temperature value detected by a third temperature sensor and compares the third temperature value with a sixth preset temperature value, and if the third temperature value is larger than the sixth preset temperature value, the controller generates a forced shutdown signal.

Specifically, the controller compares the third temperature value detected by the third temperature sensor with a sixth preset temperature value, if the third temperature value is greater than or equal to the sixth preset temperature value, the controller generates a forced shutdown signal, and the controller controls the semiconductor 102 to be powered off according to the forced shutdown signal, so that the semiconductor 102 is closed, and the semiconductor 102 burning abnormality caused by the heat dissipation failure due to the first fan 103 blocking, stopping and the like is prevented, so that the service life of the semiconductor 102 is ensured.

In the description of the present application, it should be understood that the terms "center," "longitudinal," "transverse," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," etc. indicate or are based on the orientation or positional relationship shown in the drawings, merely for convenience of description and to simplify the description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the present application.

In addition, descriptions such as those related to "first," "second," and the like, are provided for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated in this application. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include at least one such feature. In addition, the technical solutions of the embodiments may be combined with each other, but it is necessary to base that the technical solutions can be realized by those skilled in the art, and when the technical solutions are contradictory or cannot be realized, the combination of the technical solutions should be regarded as not exist and not within the protection scope of the present application.

In the description of the present utility model, unless explicitly stated and limited otherwise, a first feature "above" or "below" a second feature may include both the first and second features being in direct contact, or may include both the first and second features not being in direct contact but being in contact by another feature therebetween. Moreover, a first feature being "above," "over" and "on" a second feature includes the first feature being directly above and obliquely above the second feature, or simply indicating that the first feature is higher in level than the second feature. The first feature being "under", "below" and "beneath" the second feature includes the first feature being directly under and obliquely below the second feature, or simply means that the first feature is less level than the second feature.

In the description of the present specification, a description referring to terms "one embodiment," "some embodiments," "examples," "specific examples," or "some examples," etc., means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the present application. In this specification, schematic representations of the above terms are not necessarily directed to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Further, one skilled in the art can engage and combine the different embodiments or examples described in this specification.

While the preferred embodiments of the present application have been described, additional variations and modifications in those embodiments may occur to those skilled in the art once they learn of the basic inventive concepts. It is therefore intended that the following claims be interpreted as including the preferred embodiments and all such alterations and modifications as fall within the scope of the application.

It will be apparent to those skilled in the art that various modifications and variations can be made in the present application without departing from the spirit or scope of the application. Thus, if such modifications and variations of the present application fall within the scope of the claims and the equivalents thereof, the present application is intended to cover such modifications and variations.

Claims

1. A wearable device, comprising:

the temperature raising and reducing assembly comprises a first shell, a semiconductor and a first fan, wherein the first shell is provided with a cavity, a first air inlet communicated with the cavity and a first air outlet communicated with the cavity, the semiconductor is arranged on the first shell and comprises a first working part and a second working part, the first working part is exposed out of the first shell, the second working part is positioned in the cavity, and the first fan is arranged in the first shell so that air enters the first shell from the first air inlet and is discharged from the first air outlet after exchanging heat with the second working part;

The normal temperature wind component comprises a second shell and a second fan, wherein the second shell is connected with the first shell, a second air inlet and a second air outlet are formed in the second shell, and the second fan is arranged in the second shell, so that air enters the second shell from the second air inlet and is discharged from the second air outlet.

2. The wearable device according to claim 1, wherein the warming assembly further comprises a heat conducting member disposed outside the first housing, the heat conducting member being attached to the first working portion.

3. The wearable device according to claim 2, wherein the heat conducting member is connected with the first housing.

4. A wearable device according to any of claims 1-3, wherein the second housing is arranged obliquely to the first housing.

5. A wearable device according to any of claims 1-3, wherein the cross-sectional shape of the end of the first housing facing away from the second housing is arc-shaped.

6. A wearable device according to any one of claims 1-3, wherein the first housing is provided with a through slot, and the first working portion is disposed through the through slot so as to be exposed out of the first housing.

7. The wearable device of claim 6, wherein the through slot and the first air outlet are open on opposite sides of the first housing.

8. A wearable device according to any of claims 1-3, wherein the warming assembly further comprises a support provided within the housing, the semiconductor being provided on the support.

9. A wearable device according to any of claims 1-3, wherein the warming assembly further comprises a heat exchanger disposed within the housing, the heat exchanger being in contact with the second working portion and located between the first blower and the second working portion.

10. A wearable device according to any of claims 1-3, further comprising a wearing piece provided on the first or second housing.